JP4590090B2 - Printed circuit board and image forming apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed circuit board of a high-voltage power supply unit of an image forming apparatus such as a printer. When the printed circuit board is attached to the apparatus main body, the printed circuit board to which a contact on the apparatus main body side and a contact on the substrate side are connected The present invention relates to an image forming apparatus including a substrate.
[0002]
[Prior art]
FIGS. 15 and 16 show the configuration of a tandem type laser beam printer as an image forming apparatus using a printed circuit board which is an image of the present invention.
[0003]
The image forming operation of the laser beam printer will be described based on these drawings.
The tandem type image forming apparatus includes an image forming unit for each color of a yellow image (Y), a magenta image (M), a cyan (C), and a black image (Bk) image.
[0004]
Each image forming unit includes a photosensitive drum 18 (18a to 18d), a primary charger 16 (16a to 16d) for uniformly charging the photosensitive drum, and a scanner unit for forming a latent image on the photosensitive drum. 11 (11a to 11d), a developing device 14 (14a to 14d) that develops the latent image into a visible image, a transfer device 19 (19a to 19d) that transfers the visible image to transfer paper, and a residual toner on the photoconductor A cleaning device 15 (15a to 15d) and the like for removing water are disposed.
[0005]
In FIG. 16, reference numeral 101 denotes an image signal (VD0 signal) which is input to the laser unit 102 in the scanner unit 11. A laser beam 103 is on / off modulated by the laser unit 102. Reference numeral 104 denotes a scanner motor, which rotates a rotating polygon mirror (polygon mirror) 105 in a steady manner. An imaging lens 106 focuses the laser beam 107 changed by the polygon mirror on the photosensitive drum 18 that is the surface to be scanned.
[0006]
Accordingly, the laser beam 103 modulated by the image signal 101 is horizontally scanned on the photosensitive drum 18 (scanning in the main scanning direction) to form a latent image on the photosensitive drum 18.
[0007]
Reference numeral 109 denotes a beam detection port, which takes in a beam from a slit-shaped entrance. The laser beam entering from the entrance is guided to the photoelectric conversion element 111 through the optical fiber 110. The laser beam converted into an electric signal by the photoelectric conversion element 111 is amplified by an amplifier circuit (not shown) and then becomes a horizontal synchronization signal.
[0008]
A transfer sheet 112 is a transfer material, and is fed from the cassette 22. The fed transfer paper 112 waits at the registration roller 21 in order to take timing with the image forming unit.
[0009]
Further, a first (1st) registration sensor (hereinafter abbreviated as a registration sensor) 24 for detecting the leading edge of the fed transfer paper is provided in the vicinity of the registration roller 21. The image forming control unit that controls the image forming unit detects the timing when the leading edge of the paper reaches the registration roller 21 based on the detection result of the first registration sensor 24, and displays an image of the first color (yellow color in the example in the figure). It is formed on the photosensitive drum 18a as a carrier, and the heater (not shown) temperature of the fixing device 23 is controlled to be a predetermined temperature.
[0010]
Reference numeral 29 denotes a suction roller, which applies a suction bias to the shaft of the roller to electrostatically attract the transfer paper onto the transport belt 20.
[0011]
The transfer sheet waiting on the registration roller 21 is transported on the transfer belt 20 arranged so as to penetrate each color image forming unit at the timing of the detection result of the first registration sensor 24 and the image forming process. The first color image is transferred onto the transfer paper by the container 19a.
[0012]
Similarly, the image of the second color (magenta in the illustrated example) is transferred onto the transfer paper conveyed on the transfer belt 20 at the timing of the detection result of the second (2nd) registration sensor 25 and the second color image forming process. Are superimposed and transferred onto the image of the eleventh color. Similarly, the image of the third color (cyan in the example in the figure) is based on the detection result of the third (3rd) registration sensor 26, and the image of the fourth color (black in the example in the figure) is based on the detection result of the fourth (4th) registration sensor 27. In addition, the images are sequentially superimposed and transferred onto the transfer paper at the timing of each image forming process.
[0013]
The transfer paper onto which the four color toner images have been transferred is melt-fixed by a fixing device 23 incorporating a halogen heater and discharged outside the apparatus.
[0014]
Next, a high-voltage circuit board, which is an example of a printed board that the present invention uses as an image, will be described with reference to FIGS.
[0015]
FIG. 17 is a schematic diagram illustrating a connection example for connecting the image forming apparatus main body and a high-voltage contact on a high-voltage substrate. 18 is an explanatory diagram of the position of the high-voltage contact when the high-voltage board is viewed from the component mounting surface, FIG. 19 is the high-voltage contact plate, and FIG. 20 is the solder surface of the high-voltage board (solder on the component leads). It is the figure seen from the surface to attach.
[0016]
At least three types of high-voltage voltages, that is, a charging bias, a developing bias, and a transfer bias, are supplied from a high-voltage power supply circuit to the primary charger 16, the developing device 14, and the transfer device 19, respectively. In the image forming apparatus having the tandem configuration, four image forming units are provided. Therefore, when different voltages are required for each image forming unit, 12 types (= 3 × 4) of high-voltage output voltages are required. .
[0017]
For this reason, at least 12 types of contacts are required to be connected from the high-voltage power supply substrate on the high-voltage power supply circuit side to each of the four image forming units of the image forming apparatus main body. If a cable is connected between the high-voltage power supply substrate and the image forming apparatus main body in order to connect these contacts, the assemblability is poor and the cost of the high-voltage cable is increased. For this reason, there may be a method in which a contact is provided on the high-voltage power supply substrate without using a cable, and the high-voltage contact is directly connected by assembling the high-voltage power supply substrate to the main body of the image forming apparatus.
[0018]
FIG. 17 shows an example of the connection form.
[0019]
The high-voltage board 371 is assembled at a position indicated by a broken line in FIG.
[0020]
Reference numeral 377 (377a to 377l) denotes a coil spring-like contact provided on the image forming apparatus main body, and is connected to the charger 16, the developing device 14, and the transfer device 19 of each image forming unit. The contact support member 376 (376a to 376l) is made of an insulating member, holds the spring contact 377, and prevents the main body side surface and a board mounting component (not shown) such as a transformer from interfering with each other. It also serves as a spacer that keeps a constant distance between 371.
[0021]
FIG. 18 shows an example of a high-voltage board. On the component surface on the high-voltage board 371, for example, a charging bias output 373 (373a to 373d), a developing bias output 374 (374a to 374d), and a transfer bias output 375 (375a to 375d) are provided. For each image forming unit, contact plates 373 to 375 are arranged on a substantially straight line.
[0022]
As shown in FIG. 19, the contact plates 373 to 375 have two legs and can be mounted on a component mounting surface of the high-voltage power supply board 371 (a surface on which components are mounted and a surface opposite to the solder surface). It has a shape like this.
[0023]
If the contact plates 373 to 375 are provided on the substrate in this manner, the high voltage power supply substrate 371 can be assembled to the image forming apparatus main body, and at the same time, the high voltage contact can be connected, thereby improving the assemblability . Conversely, it becomes easy to remove the substrate when recycling the image forming apparatus.
[0024]
[Problems to be solved by the invention]
However, such a connection method between the high-voltage power supply substrate and the contacts has the following problems.
[0025]
When the high-voltage board 371 is assembled to the image forming apparatus, the solder surface of the board is located outside the image forming apparatus. Therefore, as shown in FIG. .
[0026]
For this reason, it has been difficult to confirm the contact state between the spring contact 377 and the contact plates 373-375.
[0027]
FIG. 20 is a view of the spring contact 377 and the contact plates 373 to 375 as viewed from the solder surface of the high-voltage board 371, and the broken lines are hidden by the high-voltage board 371 and indicate that they are not actually seen.
[0028]
For this reason, even if the spring contact 377 and the contact plates 373 to 375 are non-conductive, it cannot be visually confirmed after the board is assembled. Therefore, it is determined whether or not the contacts are conductive until a test image is formed. I can't judge.
[0029]
Further, it is not possible to confirm a contact state where the contacts are not properly in contact with each other and a part of the spring contact 377 is in contact with a part of the contact plates 373 to 375.
[0030]
Furthermore, the greater the number of high-voltage contacts on the high-voltage board, the higher the probability that a contact contact failure will occur. Therefore, a means for easily confirming a contact connection failure is required.
[0031]
The present invention provides a printed circuit board capable of visually confirming a connection state between contact members even after assembly of the circuit boards without increasing the cost, and an image forming apparatus including the printed circuit board.
[0032]
[Means for Solving the Problems]
The present invention, by assembly of the image forming apparatus main body, in a printed circuit board having a contact member to come in contact with respect to the contacts provided in the image forming apparatus main body side, of the image forming apparatus body side contact and with the contact member It characterized in that the contact state can be confirmed through hole provided on the printed circuit board.
[0033]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
1 to 3 show a first embodiment of the present invention.
[0034]
FIG. 1 shows a front view of a high-voltage power supply board, which is used in a tandem type laser printer as in the conventional example.
[0035]
Since the image forming operation of the image forming apparatus and the method of attaching the image forming apparatus main body and the substrate are as described in the conventional example, the description thereof is omitted.
[0036]
In the present embodiment, a confirmation hole is provided at a position where a part of the contact of the image forming apparatus is visible between the printed board and the contact on the printed board.
[0037]
Figure 1 is an example of a high-voltage power supply board, the component side of the high-voltage power supply board 271, for example, contact plate 273 is a contact member for charge bias output (273a~273d), is the contact member for developing bias output A contact plate 274 (274a to 274d) and a contact plate 275 (275a to 275d) as a contact member for transferring bias output are provided for each image forming unit, and these contact plates 273 to 275 are arranged on a substantially straight line. It has been. As shown in FIG. 2, the contact plates 273 to 275 have two legs L1 and L2 on both sides of the contact plate main body on the flat plate of the contact plate so that they can be mounted on the component mounting surface of the high-voltage board 271. It has become a shape.
[0038]
In addition, a confirmation hole 278 is formed in a flat portion of the contact plate body of the contact plates 273 to 275.
[0039]
FIG. 3 is a view of the spring contact 277 and the contact plates 273 to 275 as seen from the solder surface of the high-voltage power supply board 271, and the broken line is hidden behind the high-voltage power supply board 271 and shows that it is not actually visible.
[0040]
Reference numeral 279 denotes a confirmation hole formed on the printed circuit board of the high-voltage power supply board 271, and when the spring contact 277 is correctly connected, a part of the spring contact 277 is passed through the confirmation holes 278 on the contact plates 273 to 275. It is formed at a position where it can be seen.
[0041]
Needless to say, the size of the confirmation hole 279 needs to be substantially the same as or slightly larger than the confirmation hole 278 on the contact plates 273 to 275.
[0042]
Furthermore, although the confirmation hole 279 is larger in size, the confirmation is easier, but the contact area between the contacts becomes smaller and the substrate strength of the contact portion becomes weaker.
[0043]
With such a structure, after assembling of the high-pressure radical source board, checking the check hole 279 from the direction of A in FIG. 17, if the visible part of the spring contact 277 from the confirmation hole 279, properly connected If the spring contact 277 is not visible from the confirmation hole 279, it can be determined that the connection is not correct.
[0044]
Therefore, after the high-voltage board is assembled, the connection state between the contact of the image forming apparatus and the contact of the high-voltage board can be visually confirmed.
[0045]
(Second Embodiment)
4 and 6 show a second embodiment of the present invention.
[0046]
FIG. 4 is a front view of a high-voltage power supply board, and it is used for a tandem type laser printer as in the conventional example.
[0047]
Since the image forming operation of the image forming apparatus and the method of attaching the image forming apparatus main body and the substrate are as described in the conventional example, the description thereof is omitted.
[0048]
The difference between the second embodiment and the first embodiment is that the contact member is changed from a contact plate to a jumper wire. Since the jumper wire can be automatically mounted when a component is mounted, there is a cost merit that the component cost and the mounting cost are lower than the contact sheet metal that requires manual mounting.
[0049]
As shown in FIG. 4, for example, the charging bias output contact 473 (473a to 473d), the development bias output contact 474 (474a to 474d), and the transfer bias output contact are formed on the component surface on the high-voltage power supply board. As in 475 (475a to 475d), contacts 473 to 475 by a plurality of jumper wires are arranged on a substantially straight line for each image forming unit. The contact points 473 to 475 using a plurality of jumper wires form one contact point with two jumper wires in order to increase the contact area with the spring contact on the main body side.
[0050]
FIG. 5 is a view of the spring contact 277 and the contact plates 473 to 475 as seen from the solder surface of the high-voltage power supply board 471. The broken lines are hidden by the high-voltage power supply board 471 and do not actually appear. That is, in the case shown in FIG. 5, the connection state between the contacts cannot be confirmed.
[0051]
In order to improve this, in this embodiment, as shown in FIG. 6, a confirmation hole 479 is formed on the printed board of the high-voltage power supply board 471.
[0052]
The confirmation hole 479 is formed at a position where a part of the spring contact 277 can be seen through the confirmation hole 479 when the spring contact 277 is correctly connected.
[0053]
The larger the confirmation hole 479 is, the easier it is to confirm. However, since the strength of the substrate at the contact portion is weakened, the confirmation hole 479 is appropriately sized.
[0054]
With this configuration, after the high-voltage power supply board is assembled to the image forming apparatus main body, the confirmation hole 479 is checked from the direction of FIG. 17A, and a part of the spring contact 277 is visible from the confirmation hole 279. If the spring contact 277 is not visible through the confirmation hole 279, it can be determined that the connection is not correct.
[0055]
Therefore, after the high-voltage board is assembled, the connection state between the contact of the image forming apparatus and the contact of the high-voltage board can be visually confirmed.
[0056]
(Third embodiment)
FIG. 7 shows a third embodiment of the present invention.
[0057]
The difference between the third embodiment and the second embodiment is the shape of the confirmation hole.
[0058]
The confirmation hole 480 of this embodiment is opened in a slit shape at a position where a part of the spring contact 277 can be seen when the spring contact 277 is correctly connected, and two places of the spring contact 277 can be confirmed. it can. The larger the area of the confirmation hole 480 is, the easier it is to confirm. However, the substrate strength of the contact portion becomes weak, so that the area is set to an appropriate size.
[0059]
With this configuration, after the high-voltage power supply board is assembled, if the confirmation hole 480 is checked from the direction of A in FIG. 17 and a part of the spring contact 277 is seen from the confirmation hole 480 as specified, If it is determined that the spring contact 277 is not seen from the confirmation hole 480 as determined, it can be determined that the connection is not correct.
[0060]
If the spring contact 277 is slightly displaced in the length direction of the slit-shaped confirmation hole 480 as a result of the contact check, a tool is inserted into the confirmation hole 480 without removing the substrate 471 from the image forming apparatus main body. The spring contact 277 can be modified to move to a predetermined position.
[0061]
Therefore, after the high-voltage electric board is assembled, the connection state between the contact of the image forming apparatus main body and the high-voltage electric board can be visually confirmed and corrected.
[0062]
(Fourth embodiment)
FIG. 8 shows a fourth embodiment of the present invention.
[0063]
The difference between the fourth embodiment and the third embodiment described above is the shape of the confirmation hole.
[0064]
Reference numeral 481 denotes a high voltage capacitor used for the high voltage power supply substrate 471, and a slit 482 is generally provided on the substrate 471 in order to ensure a creepage distance between patterns connected to the leads of the capacitor 481.
[0065]
In the present embodiment shown in FIG. 8, the length of the slit 482 formed for the high-voltage capacitor 481 is extended and a part thereof is used as a confirmation hole.
[0066]
The portion where the slit 482 is used as a confirmation hole is where the spring contact 277 is partially visible when the spring contact 277 is correctly connected.
[0067]
The larger the area of the slit 482 is, the easier it is to confirm, but the substrate strength of the contact portion becomes weak, so that the size is set to an appropriate size.
[0068]
With such a configuration, it is possible to visually check the connection state between the contact of the image forming apparatus main body and the contact of the high voltage power supply board after the high voltage power supply board is assembled.
[0069]
In this embodiment, the slit provided between the leads of the high-voltage capacitor is used for the confirmation hole, but it is needless to say that it can also be realized by a slit provided between the leads of the high-voltage resistor or the high-voltage diode.
[0070]
(Fifth embodiment)
FIG. 9 shows a fifth embodiment of the present invention.
[0071]
The difference between the fifth embodiment and the third embodiment lies in the shape and arrangement of the confirmation holes.
[0072]
Reference numerals 483a to 483d are rectangular check holes. When the spring contacts 277 are correctly connected, the spring contacts 277 have a 90 ° phase angle shift on the substrate where the spring contacts 277 cannot be seen at all. Are provided on the same circumference centered on the center of the normal position.
[0073]
Although the confirmation holes 483a to 483d are larger in size, the confirmation is easier, but the strength of the substrate at the contact portion is weakened.
[0074]
With this configuration, after assembling the high-voltage board, check holes 483 are checked from the direction of FIG. 17A, and if a part of the spring contact 277 is not visible from all the check holes 483, the connection is made correctly. If a part of the spring contact 277 is visible from the confirmation hole 480, it can be determined that the connection is not correct.
[0075]
Therefore, after the high-voltage power supply board is assembled, the connection state between the contact of the image forming apparatus and the contact of the high-voltage power supply board can be visually confirmed.
[0076]
(Sixth embodiment)
10 and 12 show a sixth embodiment of the present invention.
[0077]
FIG. 10 shows a front view of a high-voltage power supply board, which is used in a tandem type laser printer as in the conventional example.
[0078]
Since the image forming operation of the image forming apparatus, the method of attaching the image forming apparatus main body and the substrate, and the shape of the contact plate are as described in the conventional example, the description thereof is omitted.
[0079]
The difference between the sixth embodiment and the first to fifth embodiments described above is that the high-voltage contact is provided on the solder surface, not on the component surface.
[0080]
On the component surface on the high-voltage board 771, as shown in FIG. 10, for example, a contact 773 (773a to 773d) for charging bias output, a contact 774 (774a to 774d) for developing bias output, and a transfer bias output A plurality of these contact points 773 to 775 are arranged on a substantially straight line as a set of three contact points for each image forming unit, such as contact points 775 (775a to 775d). These contacts are copper foil contacts made by stripping the resist on the solder surface, and the copper foil may be plated as necessary to improve the reliability of the contacts.
[0081]
The merit of providing the contact on the solder surface in this way is that when the image forming apparatus main body and the high-voltage power supply board are assembled, the solder surface is on the main body side, so that components on the board hardly interfere with the main body side. For this reason, parts costs can be reduced by shortening the contact support member on the main body side.
[0082]
If this substrate 771 is directly passed through the solder bath, the contacts 773 to 775 are positioned on the solder surface, so that solder or flux adheres to the copper foil portion and the conductivity is lowered.
[0083]
For this reason, the reliability of the contact when the substrate 771 is assembled to the main body of the image forming apparatus is significantly reduced.
[0084]
Therefore, before flowing into the flow tank, as shown in FIG. 10B, a masking tape 778 is applied to the solder surface of the substrate 771 so as to completely cover the contacts 773 to 775, Prevents adhesion of flux.
[0085]
FIG. 11 is a view of the spring contact 277 and the copper foil contacts 773 to 775 viewed from the component surface of the high-voltage power supply board 771, and the broken line is hidden by the high-voltage board 471 and represents that it is not actually visible. That is, in the case shown in FIG. 11, the connection state between the contacts cannot be confirmed.
[0086]
In order to improve this, in the sixth embodiment, as shown in FIG. 12, a confirmation hole 779 is formed on the printed board of the high-voltage power supply board.
[0087]
The confirmation hole 779 is opened at a position where a part of the spring contact 277 can be seen through the confirmation hole 779 when the spring contact 277 is correctly connected.
[0088]
The larger the confirmation hole 779 is, the easier it is to confirm, but since the strength of the substrate of the contact portion is weakened, the confirmation hole 779 is set to an appropriate size.
[0089]
With this configuration, after assembling the high-voltage power supply board, the confirmation hole 779 is checked from the direction of FIG. 17A, and if a part of the spring contact 277 is visible from the confirmation hole 779, the connection is correctly made. If the spring contact 277 is not visible from the confirmation hole 779, it can be determined that the connection is not correct. Therefore, after the high-voltage board is assembled, the connection state between the contact of the image forming apparatus and the contact of the high-voltage board can be visually confirmed.
[0090]
(Seventh embodiment)
13 and 14 show a seventh embodiment of the present invention.
[0091]
The present embodiment shows an example in which the contact shape on the image forming apparatus main body side is different.
[0092]
FIG. 13 shows an example in which the coil spring-like contact point 377 of FIG. 17 described in the conventional example is changed to a wire-like contact point 577.
[0093]
One end of the contact 577 is bent into a semicircular shape so as to have a spring property, and contacts the contacts 273 to 275 on the high voltage power supply board 271 when the high voltage power supply board is assembled to the main body.
[0094]
The other ends of the contacts 577 (577a to 577l) are connected to the charger 16, the developing device 14, and the transfer device 19 of each image forming unit, respectively.
[0095]
The contact support member 276 (276a to 276l) is made of an insulating member, holds the spring contact 577 (577a to 577l), and includes a side surface of the image forming apparatus main body and a board mounting component (not shown) such as a transformer. It also serves as a spacer that keeps the image forming apparatus main body and the high-voltage power supply substrate 271 at a constant distance so as not to interfere with each other.
[0096]
The contact 577 (577a to 577l) as described above can also realize the first to sixth embodiments described above, and after the high-voltage power supply board is assembled, the contact of the image forming apparatus. And the connection state of the contact of the high-voltage power supply board can be visually confirmed.
[0097]
FIG. 14 shows an example in which the coil spring-like contact point 377 of FIG. 17 described in the conventional example is changed to a plate-like contact point 677.
[0098]
One end of the contact 677 (677a to 677b) is bent so as to have a spring property, and contacts the contacts 273 to 275 on the high voltage power supply board 271 when the high voltage power supply board 271 is assembled to the main body.
[0099]
Such a contact 577 can also be applied to the first to sixth embodiments. After the high-voltage power supply board is assembled, the connection state between the contact of the image forming apparatus and the contact of the high-voltage power supply board is visually checked. Can be confirmed.
[0100]
In the above-described embodiment, the confirmation hole has a shape such as a circle, a slit, or a rectangle, but may be an ellipse or the like.
[0101]
【The invention's effect】
According to the present invention, for example, after the printed circuit board is assembled to the main body of the image forming apparatus as the attached body, the connection state of the contact members can be visually confirmed through the confirmation hole as the through hole. Can be improved.
[0102]
Further, it is possible to confirm a contact state where the contacts are not properly in contact with each other and a part of the contact of the image forming apparatus main body is in contact with a part of the contact on the high voltage substrate.
[Brief description of the drawings]
FIG. 1 is a front view of a component mounting surface side of a high-voltage power supply board showing a first embodiment of the present invention. FIG. 2 is a perspective view of contacts provided on the board of FIG. FIG. 4 is a front view of a component mounting surface side of a high-voltage power supply board showing a second embodiment of the present invention. FIG. 5 is a diagram illustrating a problem corresponding to the second embodiment. FIG. 6 is a view of the contact state of the contact in the second embodiment as seen from the confirmation hole. FIG. 7 is a view of the contact state of the contact as seen from the confirmation hole in the third embodiment. FIG. 8 shows the fourth embodiment, and shows the contact state from the confirmation hole. FIG. 9 shows the fifth embodiment, and shows the contact state from the confirmation hole. 10 shows a high-voltage power supply substrate according to a sixth embodiment, where (a) is a view as seen from the solder surface, and (b) is a state where a masking tape is attached to the contact of (a). FIG. 11 is a diagram for explaining a problem corresponding to the sixth embodiment. FIG. 12 is a diagram showing contact connection states in the sixth embodiment as viewed from a confirmation hole. FIG. 14 is a perspective view of a contact shape on the image forming apparatus main body side showing a modification of the seventh embodiment. FIG. 15 is a perspective view of a contact shape on the image forming apparatus main body side showing a modification of the seventh embodiment. FIG. 16 is a perspective view of the image exposure optical system in FIG. 15. FIG. 17 is a perspective view showing a connection configuration of contacts in a conventional high-voltage power supply board. FIG. 18 is a front view of the high-voltage board in FIG. 19 is a perspective view of a contact provided on the substrate of FIG. 17. FIG. 20 is a view of the substrate of FIG. 17 as viewed from the solder surface side.
271, 371, 471, 771 High voltage power supply board
273 (273a to 273d), 274 (274a to 274d), 275 (275a to 275d) contacts
276a ~ 276l Contact support member
278 Contact check hole
279 PCB check hole
473 (473a to 473d), 474 (474a to 474d), 475 (475a to 475d) contacts
479, 480, 482, 483a to 483d, 779 PCB check hole
773 (773a to 773d), 774 (774a to 774d), 775 (775a to 775d)
778 Masking tape
577 (577a to 577l), 677 (677a to 677l) contacts

Claims (11)

In a printed circuit board having a contact member that comes into contact with a contact provided on the image forming apparatus main body by assembly to the image forming apparatus main body,
The printed circuit board, wherein the contact state between the contact on the image forming apparatus main body side and the contact member can be confirmed through a hole provided in the printed circuit board. 2. The print according to claim 1, wherein the hole is provided at a position where a part of the contact on the image forming apparatus main body side that is correctly in contact with the contact member through the hole can be seen. substrate. The contact member is a printed circuit board according to claim 1 or 2, characterized in that a jumper wire. The printed circuit board according to claim 1, wherein the contact on the image forming apparatus main body side is a spring contact. The hole of the printed circuit board is formed in a slit shape, a printed circuit board according to claim 4, wherein the identifiable der Rukoto two places of the spring contact. The hole of the printed circuit board, printed circuit board according to any one of claims 1 to 5, characterized in that it comprises a slit formed in the substrate in order to secure the creepage distance between the pattern on the substrate. A plurality of holes in the printed circuit board are formed,
In the state in which the contact on the image forming apparatus main body side is correctly in contact with the contact member, the holes of the plurality of printed circuit boards pass through any of the plurality of holes of the printed circuit board. The printed circuit board according to claim 1, wherein the contact on the apparatus main body side can not be seen . The holes of the plurality of printed circuit boards are provided on the same circumference centering on the center of the contact on the image forming apparatus main body side that is correctly in contact with the contact member. 8. The printed circuit board according to 7. The contact member is a contact plate having a planar portion, the said plane part, printed circuit board according to claim 1 or 2, characterized in that holes overlapping with the hole of the printed circuit board is formed. It has a printed circuit board according to any one of claims 1 to 9, the image forming apparatus and forming a toner image on the recording material. There are a plurality of contacts on the image forming apparatus main body side. These contacts are charging means for uniformly charging the image carrier, developing means for developing a latent image on the image carrier with toner, and the image. 11. The image forming apparatus according to claim 10 , wherein the image forming apparatus is connected to transfer means for transferring the toner image on the carrier to a recording material.

Images