JP5784055B2 - Image forming apparatus and circuit board - Google Patents

Description

  The present invention relates to an image forming apparatus and a circuit board.

  There is an image forming apparatus in which a developer image visualized by supplying a developer (developer) to a latent image corresponding to image light is heated to fix the developer image to a sheet (thermal fixing).

  In order to heat-fix the developer image on the sheet, a lot of electric power is required. Further, in order to form a latent image, it is necessary to apply a voltage of several hundred volts to the photoconductor that holds the latent image. The latent image is prepared for four colors of three color component images according to subtractive color mixture and a black image for clearly outputting black.

  In order to form a latent image for four colors, for example, a high voltage transformer is used. In addition, a fixing device used for thermal fixing uses a circuit component including a contact that allows a large current capacity. In addition, according to the request | requirement which reduces a wiring material (electric wire) and a connector (connection member) today, the contact connection which contacts a contact and the terminal of a counterpart component or a contact directly is also used for the electrical connection of a contact. Moreover, in the circuit board holding circuit components for contact connection, the mounting surface on which the components are mounted is on the inner side when viewed from the apparatus main body. In other words, circuit boards are often arranged such that the solder surface opposite to the mounting surface faces the outside of the apparatus main body.

JP 2002-158408 A

  In a circuit board in which the solder surface opposite to the mounting surface faces the outside of the apparatus main body, a connector and a harness (electric wire material) are used to connect between the boards or between the board and a component such as a power supply unit.

  In this case, in the connector on the circuit board side, since the terminal portion used for connection with the circuit board is a solder surface, the connection portion connected to the mating connector is located on the mounting surface of the circuit board.

  Therefore, there is a problem that the worker cannot easily see and insert the connector position (terminal portion) (the workability of the worker is not good). This is a cause of poor insertion of the connector, that is, incomplete electrical connection.

  An object of the present invention is to provide a circuit board that suppresses incomplete electrical connection due to the position of the circuit board side connection portion of the circuit board including contact connection, and an image forming apparatus having the circuit board. That is.

The image forming apparatus according to the embodiment includes a substrate body, a charging unit, a latent image forming unit, and a developing power source unit. The board body includes a circuit board, first connection means, and visualization means. The circuit board includes a device main body or a component that makes contact connection with a counterpart component at a predetermined position of the device main body. The first connecting means is located on a first surface of the circuit board. The visualizing means makes the connection state with the second connecting means connected to the first connecting means visible from the second surface side which is the back surface of the first surface. The charging unit applies a predetermined potential to the image carrier based on electric power supplied from the substrate body. The latent image forming unit forms a latent image on the image carrier. The developing power supply means supplies predetermined power to developing means for visualizing a latent image held by the image carrier based on power supplied from the substrate body.
The image forming apparatus according to the embodiment includes a substrate body, a charging unit, a latent image forming unit, and a developing power source unit. The substrate main body includes an apparatus main body or first and second receiving portions for receiving first and second positioning members of a counterpart component located at a predetermined position of the apparatus main body, and at least one of the counterpart components. And a third receiving unit that receives a guide mechanism including the third receiving unit. The charging unit applies a predetermined potential to the image carrier based on the power supplied from the substrate body. The latent image forming unit forms a latent image on the image carrier. The developing power supply means supplies predetermined power to the developing means for visualizing the latent image held by the image carrier based on the power supplied from the substrate body.

1 illustrates an example of an image forming apparatus according to an embodiment. 1 illustrates an example (control block) of an image forming apparatus according to an embodiment. 1 illustrates an example (circuit board) of an image forming apparatus according to an embodiment. 1 illustrates an example (circuit board support unit) of an image forming apparatus according to an embodiment. 1 shows an example of an image forming apparatus according to an embodiment (circuit board <notch>). 1 illustrates an example of an image forming apparatus according to an exemplary embodiment (an action of a notch).

  Hereinafter, embodiments will be described with reference to the drawings.

  An image forming apparatus (multi-function peripherals, MFP (hereinafter simply referred to as MFP)) 1 shown in FIG. 1 includes an image forming unit 3, an image reading unit 5, and a signal processing / operation control unit (circuit). Substrate portion) 7 at least. Note that an operation unit (display panel) 9 is located at a predetermined position of the MFP 1.

  The image forming unit 3 forms a visible image corresponding to the image data on a sheet that is paper or a resin sheet. The image data may be, for example, data generated by the image reading unit 5 or data from the outside. The data from the outside may be data supplied from a storage (portable) medium such as a semiconductor memory, or data supplied from a network supply source via the interface 71 (see FIG. 2).

  The image reading unit 5 acquires characters and images of the reading object as light brightness and darkness, and generates image data corresponding to light and darkness.

  The image reading unit 5 includes at least a document table (document glass) 5a, an illumination device, and an image sensor. The image sensor converts illumination light output from the illumination device into reflected image light (image information) reflected by the document (reading target) supported by the document table 5a into an image signal. The image sensor is, for example, a CCD sensor or a complementary metal-oxide semiconductor (CMOS) sensor.

  The signal processing / operation control unit 7 converts the image signal generated by the image reading unit 5 into image data suitable for image formation by the image forming unit 3. As shown in an example in FIG. 2, the signal processing / operation control unit 7 performs, for example, character identification, contour correction, color tone correction (color conversion, RGB) for an output image (printout) on the image signal from the image sensor. → CMY, density), halftone (gradation), γ characteristic (input density value vs. output density), and the like are applied. The image signal and the image data are stored in a storage device (not shown) such as a hard disk drive (HDD) or a semiconductor memory that can be taken out from the MFP 1.

  The image forming unit 3 includes first to fourth monochrome image forming stations (visible image forming units) 30a, 30b, 30c and 30d, and first to fourth photosensitive drums (image carriers) 31a, 31b, 31c. And 31d, first to fourth charging devices 32a, 32b, 32c and 32d, first to fourth exposure devices 33a, 33b, 33c and 33d, and the like.

  The image forming unit 3 also includes an intermediate transfer belt (visible image holding (primary transfer) unit) 34, a sheet transfer device (secondary transfer unit) 35, and first to fourth waste toner collecting mechanisms 36a, 36b, and 36c. And 36d, an intermediate transfer belt cleaner 37, a waste toner collecting device 38, a fixing device 40, and the like.

  Each of the photosensitive drums 31a, 31b, 31c, and 31d holds, as a latent image, a change corresponding to the intensity of the image light of the potential held by itself. Each of the exposure apparatuses 33a, 33b, 33c and 33d includes, for example, an LED head (LED element array), and is an image obtained by converting image data from the image processing unit 73 of the signal processing / operation control unit 7 into light intensity. Output light. That is, the potentials of the photosensitive drums 31a, 31b, 31c, and 31d of the respective image forming stations 30a, 30b, 30c, and 30d change according to the intensity of the image light from the LED head, and the potential difference becomes a latent image (static image). Image).

  In this way, the individual image forming stations 30a, 30b, 30c, and 30d receive the latent images corresponding to the image light from the exposure devices 33a, 33b, 33c, and 33d, and the corresponding photosensitive drums 31a, 31b, 31c, and 31d. The image is visualized by a developing device for each color component, and the visualized image is moved (transferred) to the intermediate transfer belt 34.

  The individual image forming stations 30a, 30b, 30c, and 30d have colors of C (cyan), M (magenta, magenta), Y (yellow, yellow), and K (black, black), respectively. Form a visible image. The developing device supplies toner to the latent images held by the individual photosensitive drums 31a, 31b, 31c, and 31d and develops the toner. The transfer device moves the toner images (visible images) held by the individual photoconductive drums 31 a, 31 b, 31 c and 31 d to the intermediate transfer belt 34.

  Note that the arrangement (position) of each of the image forming stations 30a, 30b, 30c, and 30d, that is, the color order, is determined according to the image forming process and the characteristics of the toner.

  The intermediate transfer belt 34 holds and conveys toner images (visible images) formed by the individual stations 30a, 30b, 30c and 30d.

  The sheet transfer device 35 moves the toner image conveyed by the intermediate transfer belt 34 to a sheet (paper).

  The fixing device 40 fixes (fixes) the toner, that is, the toner image, which has been moved from the intermediate transfer belt 34 to the sheet by the sheet transfer device 35.

  The waste toner collecting mechanism 36 does not move from the photosensitive drum removed by the cleaner to the intermediate transfer belt 34 in the vicinity of the transfer device (primary transfer unit) of each of the stations 30a, 30b, 30c, and 30d (individual photosensitive drums). The remaining transfer toner (excess toner) remaining on the body drum is collected by the waste toner collecting device 38 so as to be collected (held).

  In the vicinity of the sheet transfer device (secondary transfer unit) 35, the intermediate transfer belt cleaner 37 removes untransferred (excess) toner remaining on the intermediate transfer belt 34 without moving from the intermediate transfer belt 34 to the sheet, as waste toner. The collection device 38 collects the data so as to be collected (held).

  The waste toner collecting device 38 collects the transfer residual toner collected by the waste toner collecting mechanism 36 and the transfer residual toner collected by the intermediate transfer belt cleaner 37.

  The image forming unit 3 also includes an automatic duplex unit (ADU) 41, at least one sheet cassette 42, a sheet feeding mechanism 43 attached to each sheet cassette, a transport mechanism 44, and an aligning mechanism 45. Note that a manual feed tray 46 and a paper feed mechanism 47 attached to the manual feed tray are positioned in front of the aligning mechanism 45. The sheet cassette 42 can be used in a plurality of stages.

  The sheet feeding mechanism 42 pulls out the sheet from the sheet cassette 42 at a predetermined timing corresponding to the image forming operation in each of the image forming stations 30a, 30b, 30c and 30d. The sheet from the paper cassette 42 moves (the sheet) to the transfer position where the conveyance mechanism 44 contacts the intermediate transfer belt 34 and the sheet transfer device 35. The timing at which the sheet moves to the transfer position (position where the intermediate transfer belt 34 and the sheet transfer device 35 are in contact) corresponds to the image forming operation of the aligning mechanism 45 in each of the image forming stations 30a, 30b, 30c and 30d. Set.

  The fixing device 40 heats the sheet and the toner electrostatically attached to the sheet, applies pressure, and fixes the toner to the sheet.

  The sheet holding the toner (toner image) fixed by the fixing device 40 is moved as an output image (printout) to a space between the image reading unit 5 and the image forming unit 3 or an ADU (automatic duplex unit) 41. To do.

  The ADU 41 reverses the front and back of the sheet so that the toner can move to the second surface which is the back of the first surface of the sheet having the toner image in close contact with the first surface. Move (position) to.

  An example of the signal processing / operation control unit 7 is shown in FIG. 2, but includes an image input unit (input interface) 71, an image processing unit 73, a modulation circuit (exposure signal generation unit) 75, a CPU (Central Processing Unit, a main control unit). ) 77, an image detection circuit (exposure timing detection unit) 79, and the like.

  The input interface 71 accepts image data supplied from an external device such as a personal computer (PC) or via a network.

  The image processing unit 73 performs predetermined processing on the image signal generated by the image reading unit 5 or the image data from the input interface 71 for character identification, contour correction, tone correction, γ characteristics, and the like.

  The exposure signal generation unit 75 converts the image data processed by the image processing unit 73 into a modulation signal (exposure signal) for use as exposure light by the first to fourth exposure apparatuses 33a, 33b, 33c, and 33d.

  A CPU (main control device) 77 controls processing of image data in the image processing unit 73.

  The image detection circuit (exposure timing detection unit) 79 detects the inclination (that can be managed as the exposure timing) of each color image formed in each of the image forming stations 30a, 30b, 30c, and 30d based on the output of the image sensor 39. To do.

  The signal processing / operation control unit 7 is also connected to a main control unit (MPU, Main Processing Unit) 101 that controls the overall operation of the MFP 1 including the image processing unit 73 (CPU 77), the image forming unit 3, and the image reading unit 5. A control signal is transferred between them, and an image reading operation, an image forming operation, and the like are controlled.

  The MPU 101 controls each unit (element) of the MFP 1 in accordance with a control input from a control panel (operation unit) 9 that receives an instruction (operation) input to the MFP 1.

  The MPU 101 also supplies a predetermined voltage to each element described below of the image forming unit 3, such as a high voltage transformer for a charging device. The MPU 101 includes, for example, charging power supply devices (high voltage units) 181a, 181b, 181c, and 181d that supply predetermined voltages and currents so that the individual charging devices 32a, 32b, 32c, and 32d output predetermined voltages. Control the output. In addition, the MPU 101 supplies a predetermined voltage and current so that each of the developing devices that develop (visualize) the latent images held by the individual photosensitive drums 31a, 31b, 31c, and 31d outputs a predetermined voltage. The output of the developing power supply device (developing bias unit / bias power supply) 183a, 183b, 183c and 183d is controlled.

  The operation unit 9 includes a display unit 9a. The display unit 9a displays the state of each unit of the MFP 1 by a display (user interface) known as a character string or a symbol (pictogram, pictogram / icon, icon), for example. The display unit 9 a also functions as a touch panel, and displays the above-described display and the like according to the instruction (control) input from the user, the display of the received input, and the control of the MPU 101.

  The signal processing / operation control unit 7 also includes a ROM (Read Only Memory) 111, a RAM (Random Access Memory) 113, an NVM (Non-volatile Memory) 115, A page memory (work memory) 117 used for image processing in the image processing unit 73, an I / O port 119 for inputting output from sensors of each unit to the MPU 101, and the like are included.

  The MPU 101 is connected to a motor driver 121 that controls the rotation of arbitrary motors 131, 134,. The motor 131 drives, for example, the first to fourth image forming stations 30a, 30b, 30c and 30d, the intermediate transfer belt 34, and the like. The motor 134 drives elements between a cassette related to sheet conveyance and the fixing device 40 (ADU 41), such as a sheet feeding mechanism 42, a conveyance mechanism 44, an aligning mechanism 45, and a sheet transfer device 35. Note that the fixing device 40 is independently driven by, for example, a motor 139.

  The MPU 101 is also connected to a heater control device 123 that drives a heater that sets the temperature of the fixing device 40.

  The signal processing / operation control unit 7 is connected to a commercial power supply via a secondary circuit (inverter) 161 and a power supply circuit 151.

  That is, the power supply circuit 151 receives a commercial power supply, and a predetermined DC voltage and current suitable for the operation of each unit of the MFP 1, that is, DC power, and an AC predetermined voltage and current to be applied to the heater of the fixing device 40, for example. (AC power) is output. The secondary circuit 161 includes, for example, a voltage conversion circuit (DC-DC inverter), and supplies the DC voltage (and current) output from the power supply circuit 151 to the charging device 32 (ad) with a predetermined voltage and current. It converts into the predetermined voltage and electric current suitable for the input to the high voltage | pressure unit 181 (ad). Further, the secondary circuit 161 converts the voltage into a predetermined voltage and current suitable for input to the developing power supply device 183 (ad) that supplies predetermined power (voltage and current) to the developing device, for example.

  FIG. 3 shows, for example, a developing power supply device (developing bias unit) that supplies a predetermined voltage and current to each developing device that develops (visualizes) a latent image held by the photosensitive drum, and a predetermined potential of the photosensitive drum. 1 shows a main part of a circuit board including a high-voltage unit for supplying a predetermined voltage and current to a charging device for charging. 3 shows a state where the MFP shown in FIG. 1 is viewed from the back side, and shows a state in which the circuit board is extracted (an outer cover of the MFP (and a contact prevention member or the like for preventing an operator from touching the circuit board)). The removed state).

  The circuit board 201 includes a power feeding jumper, a connection terminal, or a power feeding member 211 that is fixed in advance by soldering or the like. The power feeding jumper, the connection terminal, or the power feeding member 211 enables electrical conduction by contact connection that contacts the counterpart device or terminal at a predetermined pressure.

  The circuit board 201 also holds an electronic component fixed to the circuit board 201 such as a resistor, a capacitor, or a transistor (fixed in advance by soldering or the like).

  The circuit board 201 further includes a high-voltage unit (181a-d) or a connection end 281a-281d connected to the contact (connection end) of the charging devices 32a, 32b, 32c and 32d schematically shown in FIG. The developing power supply device (183a to 183d) connected to the developing device or its connection ends 282a, 282b, 282c and 282d are held. The high-voltage unit (181) or its connection ends 281a to 281d, the developing power supply device (183a to d) or its connection ends 282a, 282b, 282c, and 282d are integrated with the circuit board 201 by soldering or the like. In the circuit board 201, the surface on which the high-voltage unit (181a-d) or its connection end 281a-281d, the developing power supply device (183a-d) or its connection end 282a, 282b, 282c, and 282d is located is “mounted”. Referred to as “face”. Further, the surface on the side where the projecting portion of the component leg portion or the connector (board side) fixing portion can be seen which is the back surface of the “mounting surface” is referred to as a “solder surface”.

  Further, the circuit board 201 has guide holes (positioning holes) 201A and 201B for positioning with the counterpart guide pins (positioning bosses) held by the MFP 1 main body, auxiliary parts for connection or another circuit board, or the like. And 201C.

  The individual guide holes 201A, 201B, and 201C have different shapes (diameters or diagonal lengths and the number thereof) and lengths, and the MFP 1 main body or auxiliary components for connection or another circuit board (hereinafter referred to as counterpart components). ) And the circuit board 201 are prevented from being mistaken in attachment position and direction. Note that the number of guide holes (and guide pins) may be four or more.

  The circuit board 201 also easily positions the positional relationship between the board support portion 1a and the circuit board 201 by using the movement in the direction of gravity due to its own weight (as shown in FIG. 4A). It has a mounting guide 202 that can be used. In addition, the board | substrate support part 1a is located in the predetermined position of the other party component electrically connected by the contact connection by contact. The mounting guide 202 facilitates temporary fixing (temporary positioning) using the self-weight of the circuit board 201 along the board support portion 1a at the time of attaching the circuit board 201 to a predetermined position of the counterpart component.

  In other words, by positioning the mounting guide 202 on the substrate support portion 1a, the weight of the circuit board 201 acts in the direction of gravity, thereby realizing temporary fixing to the substrate support portion 1a. By this temporary fixing, it is possible to prevent the weight of the circuit board 201 from affecting the positioning operation (of the circuit board 201), and workability can be improved.

  The mounting guide 202 has a shape in a state viewed from a direction orthogonal to the board surface of the circuit board 201 (a direction parallel to the direction in which the board support portion 1a extends). It has a shape such as a polygon defined in the reverse direction or a combination of a plurality of straight lines obtained by cutting the polygon at an arbitrary position. The mounting guide 202 may also be a curve in which the approximate center of the curved portion of the arc is defined in the direction opposite to the direction of gravity or a combination thereof, or an ellipse and an ellipse cut at an arbitrary position.

  The individual positioning bosses (guide pins) have different lengths so as to be fitted into the corresponding guide holes 201A, 201B, and 201C in a predetermined order as shown in FIG. 4B. In the example shown in FIG. 4B, the length of the positioning boss 11A corresponding to the guide hole 201A is the longest, and the positioning boss 11B corresponding to the guide hole 201B and the positioning boss 11C corresponding to the guide hole 201C are in this order. Are combined to shorten. Further, the outer diameters of the positioning bosses are different.

  In the example shown in FIG. 4B, first, the positioning boss 11A comes into contact with the guide hole 201A of the circuit board 201 and engages with the guide hole 201A. Subsequently, the positioning boss 11B comes into contact with the guide hole 201B of the circuit board 201 and engages with the guide hole 201B. Since the circuit board 201 is temporarily fixed by the mounting guide 202 shown in FIG. 4A by movement in the direction of gravity along the board support portion 1a, the operator can connect the guide hole and the positioning boss to each other. Focus on alignment.

  When the circuit board 201 is further pressed (moved) to the counterpart component side, the positioning boss 11C comes into contact with the guide hole 201C and is fitted into the guide hole 201C.

  That is, the circuit board 201 contacts the positioning bosses 11A, 11B, and 11C in order according to the length of each positioning boss 11A, 11B, and 11C. Accordingly, it is possible to prevent the position of the contact of the counterpart component to be electrically connected, for example, the spring part α and the spring part β, from being displaced by the contact connection that contacts the circuit board 201. As a result, the power feeding jumper, the connection terminal, or the power feeding member 211 held by the circuit board 201 and the spring part α and the spring part β are in contact with each other in a correctly positioned state. Thereby, the screw position for fixation also becomes a predetermined position, and the assembly efficiency is improved.

  5 and 6B illustrate connection of the connector 171 located at the end of the harness (electric wire material) from the secondary circuit 161 to the connector 271 located on the circuit board 201. FIG.

  As shown in FIG. 5, the circuit board 201 has a notch (connector viewing portion) 205 that allows the connection end of the connector 271 located on the mounting surface on the back side of the solder surface schematically shown in FIG. Have

  The notch 205 is a mark (insertion amount marker) that serves as a guide for the operator to check how much the connector 171 has been inserted into the connector 271, that is, the amount of insertion (insertion) of the connector 171. 205a.

  The insertion amount marker 205a may be a protrusion that can be formed integrally with the notch 205 of the circuit board 201 (in the same process), for example. Further, the insertion amount marker 205a may be a line segment prepared by screen printing or the like, or a solder surface pattern formed so that the solder adheres and becomes visible during solder processing in a solder bath. The insertion amount checker 205a is orthogonal to the insertion direction of the connector 171 in the notch 205 so that the connector 171 is incompletely connected, for example, when it is connected to the connector 271 with an inclination. It is preferable to be located on two sides.

  That is, as shown in FIG. 6B, when connecting the connector 171 of the harness from the secondary circuit 161 and the connector 271 of the circuit board 201, the position of the connector 171 can be viewed from the solder surface side (of the circuit board 201). As shown in FIG. 6A, it is possible to prevent the connection state between the connectors from becoming incomplete.

  Further, when the shape of the insertion amount marker 205a is a protrusion, the amount of protrusion of the protrusion-like region (the size of the protrusion-like region) is optimized so that it slightly touches, for example, the end of the harness-side connector 171. By doing so, a function as a stopper that can prevent the connector 171 from undesirably falling off can be expected. When it is necessary to release the connector 171 from the connection with the connector 271 (remove the connector 171), the connector 171 is moved in a direction orthogonal to the mounting surface and the solder surface of the circuit board 201, so that the difference is obtained. The contact between the insertion amount marker 205a and the connector 171 can be easily released.

Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.
Hereinafter, the invention described in the scope of claims at the beginning of the application of the present application will be added.
[1]
A circuit board having a device main body or a component to be contact-connected to a counterpart component located at a predetermined position of the device main body;
First connection means located on a first surface that is non-front in the circuit board;
Visualization means for allowing the connection state of the second connection means to be connected to the first connection means to be visible from the second surface side which is the back surface of the first surface;
A substrate body comprising:
Charging means for applying a predetermined potential to the image carrier based on electric power supplied from the substrate body;
Latent image forming means for forming a latent image on the image carrier;
A developing power supply means for supplying predetermined power to a developing means for visualizing a latent image held by the image carrier based on power supplied from the substrate body;
An image forming apparatus comprising:
[2]
The image forming apparatus according to [1], wherein the visualizing unit includes a connection amount visualizing unit that makes it possible to identify that the second connecting unit is incompletely connected to the first connecting unit.
[3]
The image forming apparatus according to [1] or [2], wherein the connection amount visualization unit has a function of preventing the second connection unit from being disconnected from the first connection unit.
[4]
The image forming apparatus according to any one of [1] to [3], wherein the first surface is an inner surface side of the apparatus main body when the circuit board is exposed.
[5]
A circuit board having a device main body or a component to be contact-connected to a counterpart component located at a predetermined position of the device main body;
First connection means located on a first surface that is non-front in the circuit board;
Visualization means for allowing the connection state of the second connection means to be connected to the first connection means to be visible from the second surface side which is the back surface of the first surface;
A circuit board that supplies predetermined power to the image forming apparatus according to any one of [1] to [4].

  DESCRIPTION OF SYMBOLS 1 ... MFP (image forming apparatus), 3 ... Image forming part, 7 ... Control (signal processing / operation control) part, 30a, 30b, 30c and 30d ... Monochromatic image forming station (visible image forming part), 31a, 31b , 31c and 31d ... image carrier (photosensitive drum), 33a, 33b, 33c and 33d ... exposure device (LED head), 34 ... intermediate transfer belt, 35 ... sheet transfer device, 40 ... fixing device, 77 ... CPU, 101 ... MPU (main control unit), 151 ... power supply circuit, 161 ... secondary circuit (inverter), 171 ... harness side connector (connection terminal), 181a, 181b, 181c and 181d ... charging power supply device (high voltage unit), 183a, 183b, 183c and 183d ... power supply for development (development bias unit / bias power supply), 201 ... circuit board, 205 ... off Outs (connector visual part), 205a ... insertion amount marker (connection weight visualizing means), 271 ... circuit board connector (mating connection terminal).

Claims (5)

A circuit board having a device main body or a component that contacts and connects with a counterpart component at a predetermined position of the device main body;
First connection means located on a first surface of the circuit board;
Visualization means for allowing the connection state of the second connection means to be connected to the first connection means to be visible from the second surface side which is the back surface of the first surface;
A substrate body comprising:
Charging means for applying a predetermined potential to the image carrier based on electric power supplied from the substrate body;
Latent image forming means for forming a latent image on the image carrier;
A developing power supply means for supplying predetermined power to a developing means for visualizing a latent image held by the image carrier based on power supplied from the substrate body;
An image forming apparatus comprising:   The image forming apparatus according to claim 1, wherein the visualizing unit includes a connection amount visualizing unit that makes it possible to identify that the second connecting unit is incompletely connected to the first connecting unit. The image forming apparatus according to claim 2 , wherein the connection amount visualization unit has a function of preventing the second connection unit from being disconnected from the first connection unit.   The image forming apparatus according to claim 1, wherein the first surface is an inner surface side of the apparatus main body when the circuit board is exposed. Have a device main body or a predetermined mating part and contacting parts of the position of the apparatus main body, a circuit board for supplying a predetermined amount of electric power to the image forming apparatus,
First connection means located on a first surface of the circuit board;
Visualization means for allowing the connection state of the second connection means to be connected to the first connection means to be visible from the second surface side which is the back surface of the first surface;
A circuit board comprising:

Images