JPH04162552A - Mounting structure of heat sink - Google Patents
Mounting structure of heat sinkInfo
- Publication number
- JPH04162552A JPH04162552A JP2288795A JP28879590A JPH04162552A JP H04162552 A JPH04162552 A JP H04162552A JP 2288795 A JP2288795 A JP 2288795A JP 28879590 A JP28879590 A JP 28879590A JP H04162552 A JPH04162552 A JP H04162552A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- heat
- lsi case
- lsi
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000000078 claw Anatomy 0.000 claims abstract description 21
- 239000004065 semiconductor Substances 0.000 claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 238000005476 soldering Methods 0.000 abstract description 6
- 238000007689 inspection Methods 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体素子が搭載されたＬＳＩケースにヒー
トシンクを取り付けるヒートシンクの取付構造に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat sink mounting structure for mounting a heat sink to an LSI case in which a semiconductor element is mounted.
第５図に従来のこの種のＬＳＩケースへのヒートシンク
の取付構造を示す。第５図において半導体素子４３を搭
載したＬＳＩケース４１がプリント板４２に取り付けら
れ、銀粒子などの良熱伝導性フィラーの入った接着剤４
７でＬＳＩケース４１にヒートシンク４６を接着してい
た。FIG. 5 shows a conventional mounting structure of a heat sink to this type of LSI case. In FIG. 5, an LSI case 41 mounting a semiconductor element 43 is attached to a printed board 42, and an adhesive 4 containing a filler with good thermal conductivity such as silver particles is attached to the printed board 42.
7, the heat sink 46 was glued to the LSI case 41.
また、第６図（ａ）に従来の他のヒートシンクの取付構
造を示す。半導体素子５３を搭載したＬＳＩケース５１
はプリント板５７に取り付けられ、ＬＳＩケース５１の
伝熱板５２にスタッド５４を設け、スタッド５４の側面
にヒートシンク５６を圧接させていた（例えば特開昭５
８−２５２４９）。第４図（ｂ）はヒートシンク５６の
平面図である。また、スタッドにねじを切ってヒートシ
ンクをねじ止めしているものもあった。Further, FIG. 6(a) shows another conventional heat sink mounting structure. LSI case 51 equipped with semiconductor element 53
was attached to a printed board 57, a stud 54 was provided on the heat transfer plate 52 of the LSI case 51, and a heat sink 56 was pressed against the side surface of the stud 54 (for example, in
8-25249). FIG. 4(b) is a plan view of the heat sink 56. There were also some that had screws cut into the studs to which the heat sink was attached.
上述した従来のヒートシンクの取付構造は、第５図に示
す接着の場合、ヒートシンクの取りはすしができないた
め、フラットパックなどの表面実装型部品のプリント板
両面搭載時の組立工程において、片面に部品を搭載した
後の裏面搭載時にヒートシンクによる凹凸によりプリン
ト板の保持が難かしく、ヒートシンクが部品装着、半田
付時の障害となる。In the conventional heat sink mounting structure described above, when the heat sink is bonded as shown in Figure 5, the heat sink cannot be removed. It is difficult to hold the printed board due to the unevenness caused by the heat sink when mounting the back side after mounting the board, and the heat sink becomes an obstacle during component mounting and soldering.
また、半導体素子の高集積化、高速化による発熱量増大
に対しヒートシンクが大型化しており、ヒートシンクの
熱容量が大きくなったため半田付工程で加熱むらが生じ
、半田付時の障害となっている。In addition, heat sinks have become larger in response to increased heat generation due to higher integration and faster speeds of semiconductor devices, and the increased heat capacity of heat sinks has caused uneven heating during the soldering process, which has become an obstacle during soldering.
組立後のプリント板の配線パターン改造時にもヒートシ
ンクがあることにより、パターンカットや布線追加の作
業が困難となる。Even when modifying the wiring pattern of a printed circuit board after assembly, the presence of the heat sink makes it difficult to cut the pattern or add additional wiring.
フラットパック型ＬＳＩケースの場合、半田付と検査の
ためにリードを目視する必要があり、ＬＳＩケースより
も大きくリードを隠すような大型のヒートシンクを取り
つけることができながった。In the case of flat-pack LSI cases, it is necessary to visually inspect the leads for soldering and inspection, making it impossible to install a large heat sink that is larger than the LSI case and hides the leads.
第６図に示すようにＬＳＩケースにスタッドやねじを設
けた場合でも、スタッドやねじによる凹凸がプリント＆
両面搭載時の組立時の障害となる。また、フラットパッ
クなどの表面実装部品では、リートピッチ微細化のため
プリント基板への装着を自動装着機にて行なうようにな
っており、自動装着機がＬＳＩケースを扱うために吸着
やクランプを行なってＬＳＩケースを保持するが、どち
らの場合もスタッドやねじの突起がＬＳＩケースの保持
に対し障害となる。As shown in Figure 6, even when studs and screws are provided on the LSI case, the unevenness caused by the studs and screws will be printed and
This becomes an obstacle during assembly when both sides are mounted. In addition, surface mount components such as flat packs are now mounted on printed circuit boards using automatic mounting machines in order to miniaturize the lead pitch, and automatic mounting machines handle LSI cases by suction and clamping. However, in either case, the protrusions of studs and screws become obstacles to holding the LSI case.
本発明のヒートシンクの取付構造は、内部に半導体素子
が搭載されたＬＳＩケースの放熱面上に設置されたヒー
トシンクと、前記ＬＳＩケースの側面に設けられたひさ
しに爪を引掛けた固定板と、この固定板に設けられたね
じ穴に螺合し前記ヒートシンクを前記ＬＳＩケースに取
り付けるとともに前記爪を前記ひさしに押し付けさせて
前記ヒートシンクおよび前記固定板を前記ＬＳＩケース
に固定するねじとを有している。The heat sink mounting structure of the present invention includes: a heat sink installed on the heat dissipation surface of an LSI case in which a semiconductor element is mounted; a fixing plate hooked with a claw on a canopy provided on the side surface of the LSI case; and a screw that is screwed into a screw hole provided in the fixing plate to attach the heat sink to the LSI case and press the claw against the eaves to fix the heat sink and the fixing plate to the LSI case. There is.
本発明のヒートシンクの取付構造は、内部に半導体素子
が搭載されたＬＳＩケースの放熱面上に設置されたヒー
トシンクと、前記ＬＳＩケースノ側面に設けられたひさ
しに爪を引掛けた固定板と、この固定板に設けられ前記
ヒートシンクを前記ＬＳＩケースに取り付けるとともに
前記爪を前記ひさしに押し付けさせて前記ヒートシンク
および前記固定板を前記ＬＳＩケースに固定するねじと
を有している。The heat sink mounting structure of the present invention consists of a heat sink installed on the heat dissipation surface of an LSI case in which a semiconductor element is mounted, a fixing plate with a claw hooked to an eaves provided on the side surface of the LSI case, and The fixing plate includes screws that are provided on the fixing plate to attach the heat sink to the LSI case and press the claws against the eaves to fix the heat sink and the fixing plate to the LSI case.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は、本発明の第１の実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of a first embodiment of the invention.
ＬＳＩケース１の内部に金属製の伝熱板２の凸部が埋め
込まれている。ＬＳＩケース１のリード１１はプリント
板１２にはんだ付けされている。A convex portion of a metal heat transfer plate 2 is embedded inside an LSI case 1. Leads 11 of the LSI case 1 are soldered to a printed board 12.
半導体素子３は伝熱板２に直接ボンディングされ、半導
体素子３で発生した熱を伝熱板２１に伝える。伝熱板２
の半導体素子３が搭載される面の反対面は、平坦でＬＳ
Ｉケース１の外側に出ており、伝熱板２の放熱面４とな
っている。放熱面４の側面に放熱面４と平行な方向に突
き出たひさし５が設けられている。ヒートシンク６は、
放熱面４の上に置かれ、放熱面４と接触しゃすいように
、放熱面４と向がい合って接触する面が平坦になってい
る。固定板７は、はぼコの字型で伝熱板２とヒートシン
ク６を覆うような形状を有し、伝熱板２のひさし５にひ
っかかるような爪８が設けられている。固定板７には、
ねじ穴９が設けられている。The semiconductor element 3 is directly bonded to the heat exchanger plate 2, and the heat generated in the semiconductor element 3 is transferred to the heat exchanger plate 21. Heat exchanger plate 2
The surface opposite to the surface on which the semiconductor element 3 is mounted is flat and LS
It protrudes to the outside of the I case 1 and serves as the heat radiation surface 4 of the heat exchanger plate 2. An eaves 5 is provided on the side surface of the heat dissipation surface 4 and projects in a direction parallel to the heat dissipation surface 4. The heat sink 6 is
It is placed on the heat dissipation surface 4, and the surfaces facing and in contact with the heat dissipation surface 4 are flat so as to easily come into contact with the heat dissipation surface 4. The fixing plate 7 has a box-shaped shape that covers the heat exchanger plate 2 and the heat sink 6, and is provided with claws 8 that can be caught on the eaves 5 of the heat exchanger plate 2. The fixed plate 7 has
A screw hole 9 is provided.
ＬＳＩケース１の伝熱板２とその上に置かれたヒートシ
ンク６に固定板７を被せ、ひさし５に爪８がひっかかる
ようにする。固定板７のねじ穴９にねじ１０をねじ込む
とねじ１０の先端がヒートシンク６を押して伝熱板２の
放熱面４へ押し付ける。このねじ１０のねじ込みにより
、反対に固定板７が押し上げられるが、固定板７は爪８
がひさし５にひっかかるため、ヒートシンク６を放熱面
４の密着させることができ、ＬＳＩケース１にヒートシ
ンク６が固定される。A fixing plate 7 is placed over the heat transfer plate 2 of the LSI case 1 and the heat sink 6 placed thereon, so that the claw 8 is caught on the eaves 5. When a screw 10 is screwed into the screw hole 9 of the fixed plate 7, the tip of the screw 10 pushes the heat sink 6 and presses it against the heat radiation surface 4 of the heat transfer plate 2. By screwing in this screw 10, the fixing plate 7 is pushed up, but the fixing plate 7 is pushed up by the claw 8.
Since the heat sink 6 is caught on the eaves 5, the heat sink 6 can be brought into close contact with the heat radiation surface 4, and the heat sink 6 is fixed to the LSI case 1.
半導体素子３で発生した熱は伝熱板２を通り、放熱面４
と接触したヒートシンク６に伝わり空気中へ放熱される
。The heat generated in the semiconductor element 3 passes through the heat exchanger plate 2 and reaches the heat radiation surface 4.
The heat is transmitted to the heat sink 6 in contact with and radiated into the air.
ヒートシンク６はねじ１０で固定されているだけである
から取りはずしは簡単に行なうことができる。また、半
導体素子３の発熱量に合わせているいろな大きさのヒー
トシンクを取りつけることが可能である。Since the heat sink 6 is only fixed with screws 10, it can be easily removed. Furthermore, it is possible to attach heat sinks of various sizes to match the amount of heat generated by the semiconductor element 3.
本実施例では、伝熱板２の側面を放熱面４と水平方向に
突き出させてひさし５を設けているが、伝熱板２の側面
に溝を切ってひさし５と同様の役割を持たせることもで
きる。本実施例では放熱面４とヒートシンク６を直接接
触させたが、その間に良熱伝導性のシリコーンコンパウ
ンドや、シリコーンゴムシートを用いて伝熱させても良
い。In this embodiment, the side surface of the heat exchanger plate 2 is made to protrude horizontally to the heat radiation surface 4 to provide the eaves 5, but a groove is cut in the side surface of the heat exchanger plate 2 to have the same role as the eaves 5. You can also do that. In this embodiment, the heat radiation surface 4 and the heat sink 6 are brought into direct contact with each other, but a silicone compound or a silicone rubber sheet with good thermal conductivity may be used between them to transfer heat.
第２図は本発明の第２の実施例の縦断面図で、ＰＧＡタ
イプのＬＳＩケース２１にヒートシンク２６を取り付け
る場合を示す。第１図に示す実施例では伝熱板２にひさ
し５を設けているが、第２図に示す実施例では、ＬＳＩ
ケース２１の外周部をひさし２５として利用することが
可能であり、伝熱板２の有無にかかわらす固定板２７に
よりヒートシンク２６を固定することが可能である。FIG. 2 is a longitudinal sectional view of a second embodiment of the present invention, showing a case where a heat sink 26 is attached to a PGA type LSI case 21. In the embodiment shown in FIG. 1, the eaves 5 are provided on the heat exchanger plate 2, but in the embodiment shown in FIG.
The outer circumference of the case 21 can be used as the eaves 25, and the heat sink 26 can be fixed by the fixing plate 27 with or without the heat transfer plate 2.
第２図においては、半導体素子２３を搭載したＬＳＩケ
ース２１のリード３１がプリント板３２にはんだ付けさ
れている。ＬＳＩケース２１の上面にヒートシンク２６
が取り付けられ、ひさし２５に爪２８をひっ掛けた固定
板２７のねじ穴に螺合するねじ３０をねじ込ｊ・ことに
よりヒートシンク２６をＬＳＩケース２１上に固定して
いる。In FIG. 2, leads 31 of an LSI case 21 on which a semiconductor element 23 is mounted are soldered to a printed board 32. As shown in FIG. A heat sink 26 is placed on the top surface of the LSI case 21.
is attached, and the heat sink 26 is fixed on the LSI case 21 by screwing in a screw 30 that engages with a screw hole in the fixing plate 27 with a claw 28 hooked on the eaves 25.
第３図は本発明の第３の実施例の縦断面図である。ヒー
トシンク６は放熱面４の上に置かれ、固定板１３はコの
字型で、伝熱板２とヒートシンク６を覆うような形状を
有し、伝熱板２のひさし５にひっかかるような爪８が設
けられている。固定板１３には、ばね９が設けられてい
る。FIG. 3 is a longitudinal sectional view of a third embodiment of the invention. The heat sink 6 is placed on the heat dissipation surface 4, and the fixed plate 13 is U-shaped and has a shape that covers the heat transfer plate 2 and the heat sink 6, and has a claw that catches on the eaves 5 of the heat transfer plate 2. 8 is provided. A spring 9 is provided on the fixed plate 13.
ＬＳＩケース１の伝熱板２とその上に置かれたヒートシ
ンク６に固定板１３を被せ、ひさし５に爪８がひっかか
るようにする。このとき固定板１３のばね１４はヒート
シンク６を押して伝熱板２の放熱面４へ押し付け、爪８
をひさし５へ押し付けるため、ＬＳＩケース１上にヒー
トシンク６を固定し、ヒートシンク６を放熱面４と密着
させる。A fixing plate 13 is placed over the heat transfer plate 2 of the LSI case 1 and the heat sink 6 placed thereon, so that the claw 8 is caught on the eaves 5. At this time, the spring 14 of the fixed plate 13 pushes the heat sink 6 against the heat radiation surface 4 of the heat transfer plate 2, and the claw 8
In order to press the heat sink 6 against the eaves 5, a heat sink 6 is fixed on the LSI case 1, and the heat sink 6 is brought into close contact with the heat radiation surface 4.
半導体素子３で発生した熱は、伝熱板２を通り、放熱面
４と接触したヒートシンク６に伝わり、空気中へ放熱さ
れる。Heat generated in the semiconductor element 3 passes through the heat transfer plate 2, is transmitted to the heat sink 6 in contact with the heat radiation surface 4, and is radiated into the air.
ヒートシンク６は固定板１３のばね１４で押し付けられ
ているだけであるから取りはずしは簡単に行なうことが
できる。Since the heat sink 6 is only pressed by the spring 14 of the fixing plate 13, it can be easily removed.
第４図は本発明の第４の実施例の縦断面図で、ＰＧＡタ
イプのＬＳＩケース２１にヒートシンクを取る付ける場
合を示す。この実施例では、固定板３３に爪２８とばね
３４を設け、ＬＳＩケース２１の外周部をひさし２５と
して利用することが可能であり、伝熱板２の有無にかか
わらず、固定板３３の爪２８をひさし２５にひっ掛け、
固定板３３のばね３４の押し付は力によりヒートシンク
２６を固定することが可能である。FIG. 4 is a longitudinal cross-sectional view of a fourth embodiment of the present invention, showing a case where a heat sink is attached to a PGA type LSI case 21. In this embodiment, the fixed plate 33 is provided with claws 28 and springs 34, and the outer circumference of the LSI case 21 can be used as the eaves 25. Hang 28 on the eaves 25,
The heat sink 26 can be fixed by pressing the spring 34 of the fixing plate 33 with force.
以上説明したように本発明は、ＬＳＩケースに設けたひ
さしに爪を引掛けた固定板でヒートシンクをＬＳＩケー
スに固定することにより、ヒートシンクの取りはずしが
簡単になる。As explained above, according to the present invention, the heat sink can be easily removed by fixing the heat sink to the LSI case using a fixing plate with hooks hooked onto the eaves provided on the LSI case.
ヒートシンクの取りはずしが簡単にできるため、ＬＳＩ
ケースをプリント板に半田付けする時や検査時、プリン
ト板のパターン改造時などにヒートシンクが障害となる
ことはない。また、フラットパックなどの表面実装部品
においても、リードが隠れるような大型のヒートシンク
を取り付けることができる。Since the heat sink can be easily removed, LSI
The heat sink does not become an obstacle when soldering the case to the printed circuit board, during inspection, or when modifying the printed circuit board pattern. Furthermore, a large heat sink that hides the leads can be attached to surface mount components such as flat packs.
用が容易に可能となる。This makes it easy to use.
来のヒートシンクの取付構造の縦断面図およびヒートシ
ンク５６の平面図である。FIG. 6 is a vertical cross-sectional view of a conventional heat sink mounting structure and a plan view of a heat sink 56. FIG.
１・・・ＬＳＩケース、２・・・伝熱板、３・・・半導
体素子、４・・・放熱面、６・・・ひさし、６・・・ヒ
ートシンク、７・・・固定板、８・・・爪、９・・・ね
じ穴、１０・・・ねじ、１１・・・リード、１２・・・
プリント板、１３・・・固定板、１４・・・ばね、２１
・・・ＬＳＩケース、２３・・・半導体素子、２５・・
・ひさし、２６・・・ヒートシンク、２７・・・固定板
、２８・・・爪、２９・・・ねじ穴、３０・・・ねじ、
３１・・・リード、３２・・・プリント板、３３・・・
固定板、３４・・・ばね、４１・・・ＬＳＩケース、４
３・・・半導体素子、４６・・・ヒートシンク、４７・
・・接着剤、５１・・・ＬＳＩケース、５２川伝熱板、
５３・・・半導体素子、５４・・・スタフ）’、５８・
・・ヒートシンク。DESCRIPTION OF SYMBOLS 1... LSI case, 2... Heat exchanger plate, 3... Semiconductor element, 4... Heat radiation surface, 6... Eaves, 6... Heat sink, 7... Fixed plate, 8... ...Claw, 9...Screw hole, 10...Screw, 11...Lead, 12...
Printed board, 13... Fixed plate, 14... Spring, 21
...LSI case, 23...semiconductor element, 25...
・Eave, 26...Heat sink, 27...Fixing plate, 28...Claw, 29...Screw hole, 30...Screw,
31... Lead, 32... Printed board, 33...
Fixed plate, 34... Spring, 41... LSI case, 4
3... Semiconductor element, 46... Heat sink, 47.
...Adhesive, 51...LSI case, 52 River heat transfer plate,
53...Semiconductor element, 54...Stuff)', 58.
··heat sink.
Claims (1)
面上に設置されたヒートシンクと、前記ＬＳＩケースの
側面に設けられたひさしに爪を引掛けた固定板と、この
固定板に設けられたねじ穴に螺合し前記ヒートシンクを
前記ＬＳＩケースに取り付けるとともに前記爪を前記ひ
さしに押し付けさせて前記ヒートシンクおよび前記固定
板を前記ＬＳＩケースに固定するねじとを含むことを特
徴とするヒートシンクの取付構造。 ２、内部に半導体素子が搭載されたＬＳＩケースの放熱
面上に設置されたヒートシンクと、前記ＬＳＩケースの
側面に設けられたひさしに爪を引掛けた固定板と、この
固定板に設けられ前記ヒートシンクを前記ＬＳＩケース
に取り付けるとともに前記爪を前記ひさしに押し付けさ
せて前記ヒートシンクおよび前記固定板を前記ＬＳＩケ
ースに固定するねじとを含むことを特徴とするヒートシ
ンクの取付構造。[Scope of Claims] 1. A heat sink installed on the heat dissipation surface of an LSI case in which a semiconductor element is mounted, a fixing plate with a claw hooked to an eaves provided on the side of the LSI case, and The heat sink is screwed into a screw hole provided in a fixing plate to attach the heat sink to the LSI case, and the nail is pressed against the eaves to fix the heat sink and the fixing plate to the LSI case. Mounting structure of heat sink. 2. A heat sink installed on the heat dissipation surface of an LSI case in which a semiconductor element is mounted; a fixing plate with a claw hooked to the eaves provided on the side of the LSI case; A heat sink mounting structure comprising: a screw that attaches the heat sink to the LSI case and presses the claw against the eaves to fix the heat sink and the fixing plate to the LSI case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2288795A JP2806622B2 (en) | 1990-10-25 | 1990-10-25 | Heat sink mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2288795A JP2806622B2 (en) | 1990-10-25 | 1990-10-25 | Heat sink mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04162552A true JPH04162552A (en) | 1992-06-08 |
| JP2806622B2 JP2806622B2 (en) | 1998-09-30 |
Family
ID=17734831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2288795A Expired - Fee Related JP2806622B2 (en) | 1990-10-25 | 1990-10-25 | Heat sink mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2806622B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6071666A (en) * | 1996-05-13 | 2000-06-06 | Sumitomo Bakelite Company, Ltd. | Positive type photosensitive resin composition and semiconductor device using the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6280340U (en) * | 1985-11-11 | 1987-05-22 | ||
| JPH02214146A (en) * | 1989-02-14 | 1990-08-27 | Nec Corp | Structure for attaching heat sink |
-
1990
- 1990-10-25 JP JP2288795A patent/JP2806622B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6280340U (en) * | 1985-11-11 | 1987-05-22 | ||
| JPH02214146A (en) * | 1989-02-14 | 1990-08-27 | Nec Corp | Structure for attaching heat sink |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6071666A (en) * | 1996-05-13 | 2000-06-06 | Sumitomo Bakelite Company, Ltd. | Positive type photosensitive resin composition and semiconductor device using the same |
| US6235436B1 (en) | 1996-05-13 | 2001-05-22 | Sumitomo Bakelite Company Limited | Semiconductor device using positive photosensitive resin composition and process for preparation thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2806622B2 (en) | 1998-09-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |