JPH0238748U - - Google Patents
Info
- Publication number
- JPH0238748U JPH0238748U JP11701988U JP11701988U JPH0238748U JP H0238748 U JPH0238748 U JP H0238748U JP 11701988 U JP11701988 U JP 11701988U JP 11701988 U JP11701988 U JP 11701988U JP H0238748 U JPH0238748 U JP H0238748U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- semiconductor device
- insulating sheet
- thermal conductivity
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 2
Description
第１図は本考案の一実施例による半導体装置の
放熱構造を示す斜視図、第２図は従来の半導体装
置の放熱構造を示す斜視図である。
図において、１は半導体装置、２は放熱器、３
は絶縁シート、４は取着具、１５は熱伝導板、を
示す。
FIG. 1 is a perspective view showing a heat dissipation structure of a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a heat dissipation structure of a conventional semiconductor device. In the figure, 1 is a semiconductor device, 2 is a heat sink, and 3 is a semiconductor device.
4 indicates an insulating sheet, 4 indicates a fixture, and 15 indicates a heat conductive plate.
Claims (1)
の面に半導体装置１の装着面を形成した熱伝導性
の優れた放熱器２と、 耐電圧性と熱伝導性が優れた絶縁シート３と、 上記半導体装置１の取着面より大きな寸法で、
少なくとも該半導体装置１の発熱量に対応した熱
伝導面積を有する熱伝導率の高い熱伝導板１５と
を備え、 熱伝導性の優れた密着剤により上記放熱器２の
前記装着面に上記絶縁シート３を貼着し、該絶縁
シート３と該半導体装置１の間に前記密着剤を両
面に塗布した上記熱伝導板１５が介在するよう構
成してなることを特徴とする半導体装置の放熱構
造。[Claims for Utility Model Registration] A heat sink 2 with excellent thermal conductivity in which a plurality of heat radiation fins are arranged on one surface and a mounting surface for a semiconductor device 1 is formed on the other surface, and voltage resistance and heat resistance. An insulating sheet 3 with excellent conductivity and a size larger than the mounting surface of the semiconductor device 1,
a heat conductive plate 15 having high thermal conductivity and having a heat conductive area corresponding to at least the amount of heat generated by the semiconductor device 1; and the insulating sheet is attached to the mounting surface of the heat sink 2 using an adhesive having excellent thermal conductivity. 3, and the heat conductive plate 15 coated with the adhesive on both sides is interposed between the insulating sheet 3 and the semiconductor device 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11701988U JPH0238748U (en) | 1988-09-05 | 1988-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11701988U JPH0238748U (en) | 1988-09-05 | 1988-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238748U true JPH0238748U (en) | 1990-03-15 |
Family
ID=31360087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11701988U Pending JPH0238748U (en) | 1988-09-05 | 1988-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238748U (en) |
-
1988
- 1988-09-05 JP JP11701988U patent/JPH0238748U/ja active Pending
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