JPS6188251U - - Google Patents

Info

Publication number
JPS6188251U
JPS6188251U JP17324384U JP17324384U JPS6188251U JP S6188251 U JPS6188251 U JP S6188251U JP 17324384 U JP17324384 U JP 17324384U JP 17324384 U JP17324384 U JP 17324384U JP S6188251 U JPS6188251 U JP S6188251U
Authority
JP
Japan
Prior art keywords
cooling
cooling fin
semiconductor
semiconductor device
fin member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17324384U
Other languages
Japanese (ja)
Other versions
JPH039337Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984173243U priority Critical patent/JPH039337Y2/ja
Publication of JPS6188251U publication Critical patent/JPS6188251U/ja
Application granted granted Critical
Publication of JPH039337Y2 publication Critical patent/JPH039337Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例における分解斜視図
、要部の正断面図、第２図は本考案の他の実施例
のおける絶縁板の斜視図、要部の正断面図、第３
図は本考案の別の実施例の正断面図、第４図は従
来例の説明図である。 １……冷却フイン部材、２……平形半導体素子
、３……電極面、４……クランプ部品、５……冷
却風、６……電気的絶縁板、７……座ぐり、８…
…グリース、９……溝、１０……冷却フイン、１
１……電極のリード、１２……バネ。 Fig. 1 is an exploded perspective view of an embodiment of the present invention, and a front sectional view of the main parts; Fig. 2 is a perspective view of an insulating plate and a front sectional view of the main parts in another embodiment of the invention;
The figure is a front sectional view of another embodiment of the present invention, and FIG. 4 is an explanatory diagram of a conventional example. DESCRIPTION OF SYMBOLS 1... Cooling fin member, 2... Flat semiconductor element, 3... Electrode surface, 4... Clamp component, 5... Cooling air, 6... Electrical insulating plate, 7... Counterbore, 8...
...Grease, 9...Groove, 10...Cooling fin, 1
1... Electrode lead, 12... Spring.

Claims (1)

【実用新案登録請求の範囲】 複数の冷却フインを有する冷却部材の間に平形
半導体素子をきよう着するものにおいて、 半導体素子の外径より大きな径の座ぐりを素子
取付面に施した一対の冷却フイン部材と、 冷却フイン部材の間に挿入された柔軟性のある
電気的絶縁板と、それぞれ具え、 半導体素子と冷却フイン部材とにより形成され
る空間部に絶縁性の高熱伝導グリースを充填した
ことを特徴とする半導体の冷却装置。[Scope of Utility Model Registration Claim] In a device in which a flat semiconductor device is mounted between a cooling member having a plurality of cooling fins, a pair of counterbores with a diameter larger than the outside diameter of the semiconductor device are provided on the device mounting surface. The cooling fin member is provided with a flexible electrical insulating plate inserted between the cooling fin members, and the space formed by the semiconductor element and the cooling fin member is filled with insulating and highly thermally conductive grease. A semiconductor cooling device characterized by:
JP1984173243U 1984-11-15 1984-11-15 Expired JPH039337Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984173243U JPH039337Y2 (en) 1984-11-15 1984-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984173243U JPH039337Y2 (en) 1984-11-15 1984-11-15

Publications (2)

Publication Number Publication Date
JPS6188251U true JPS6188251U (en) 1986-06-09
JPH039337Y2 JPH039337Y2 (en) 1991-03-08

Family

ID=30730901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984173243U Expired JPH039337Y2 (en) 1984-11-15 1984-11-15

Country Status (1)

Country Link
JP (1) JPH039337Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009026780A (en) * 2007-07-17 2009-02-05 Hitachi Ltd Electronic control device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5547729U (en) * 1978-09-21 1980-03-28

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5547729B2 (en) * 1973-11-09 1980-12-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5547729U (en) * 1978-09-21 1980-03-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009026780A (en) * 2007-07-17 2009-02-05 Hitachi Ltd Electronic control device

Also Published As

Publication number Publication date
JPH039337Y2 (en) 1991-03-08

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