JPH0412657U - - Google Patents
Info
- Publication number
- JPH0412657U JPH0412657U JP5244690U JP5244690U JPH0412657U JP H0412657 U JPH0412657 U JP H0412657U JP 5244690 U JP5244690 U JP 5244690U JP 5244690 U JP5244690 U JP 5244690U JP H0412657 U JPH0412657 U JP H0412657U
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- semiconductor device
- view
- outer frame
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000000605 extraction Methods 0.000 description 1
Description
第１図及び第２図は本考案に係る電力半導体装
置の一実施例を示し、第１図は電力半導体装置の
装着状態を示す一部破断正面図、第２図は同平面
図、第３図乃至第１１図は本考案に係る電力半導
体装置の他の各種実施例を示し、第３図は電力半
導体装置の装着状態を示す一部破断正面図、第４
図は第３図に示す電力半導体装置の一部破断平面
図、第５図は電力半導体装置の装着状態を示す一
部破断正面図、第６図は第５図に示す電力半導体
装置の一部破断平面図、第７図は電力半導体装置
の装着状態を示す一部破断正面図、第８図は第７
図に示す電力半導体装置の一部破断平面図、第９
図は電力半導体装置の装着状態を示す一部破断正
面図、第１０図は第９図に示す電力半導体装置の
平面図、第１１図は電力半導体装置の平面図、第
１２図は従来の電力半導体装置の装着状態を示す
一部破断正面図、第１３図は同平面図、第１４図
は他の従来の半導体装置の装着状態を示す一部破
断正面図、第１５図は従来の半導体装置の装着状
態を示す正面図である。
１……電力半導体装置、２……電極取り出し用
端子、３……放熱用絶縁基板、４……外枠、５…
…樹脂部、６……装置固定用雌ネジ部。
1 and 2 show an embodiment of the power semiconductor device according to the present invention, FIG. 1 is a partially cutaway front view showing the installed state of the power semiconductor device, FIG. 2 is a plan view of the same, and FIG. 11 show various other embodiments of the power semiconductor device according to the present invention, FIG. 3 is a partially cutaway front view showing the installed state of the power semiconductor device, and FIG.
The figure is a partially cutaway plan view of the power semiconductor device shown in FIG. 3, FIG. 5 is a partially cutaway front view showing the installed state of the power semiconductor device, and FIG. 6 is a part of the power semiconductor device shown in FIG. 7 is a partially cutaway front view showing the installed state of the power semiconductor device, and FIG.
Partially cutaway plan view of the power semiconductor device shown in FIG.
10 is a plan view of the power semiconductor device shown in FIG. 9, FIG. 11 is a plan view of the power semiconductor device, and FIG. 12 is a conventional power semiconductor device. FIG. 13 is a partially cutaway front view showing the mounted state of a semiconductor device, FIG. 14 is a partially cutaway front view showing the mounted state of another conventional semiconductor device, and FIG. 15 is a conventional semiconductor device. FIG. 3 is a front view showing the installed state. DESCRIPTION OF SYMBOLS 1... Power semiconductor device, 2... Terminal for electrode extraction, 3... Insulating substrate for heat dissipation, 4... Outer frame, 5...
...Resin part, 6...Female screw part for fixing the device.
Claims (1)
板上に前記素子等を囲むように外枠が接着される
とともに、該外枠内に樹脂が充填されて前記素子
等が樹脂封止されてなる電力半導体装置において
、 前記放熱用絶縁基板の適所に装置固定用雌ネジ
部が前記樹脂部と連通しないように形成されたこ
とを特徴とする電力半導体装置。[Claims for Utility Model Registration] An outer frame is adhered to a heat dissipating insulating substrate on which a power semiconductor element, etc. is mounted, so as to surround the element, and the outer frame is filled with resin, so that the element A power semiconductor device in which a device fixing female screw portion is formed at a proper position of the heat dissipation insulating substrate so as not to communicate with the resin portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5244690U JPH0412657U (en) | 1990-05-18 | 1990-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5244690U JPH0412657U (en) | 1990-05-18 | 1990-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412657U true JPH0412657U (en) | 1992-01-31 |
Family
ID=31572757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5244690U Pending JPH0412657U (en) | 1990-05-18 | 1990-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412657U (en) |
-
1990
- 1990-05-18 JP JP5244690U patent/JPH0412657U/ja active Pending
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