JPH0252350U - - Google Patents

Info

Publication number
JPH0252350U
JPH0252350U JP1988129712U JP12971288U JPH0252350U JP H0252350 U JPH0252350 U JP H0252350U JP 1988129712 U JP1988129712 U JP 1988129712U JP 12971288 U JP12971288 U JP 12971288U JP H0252350 U JPH0252350 U JP H0252350U
Authority
JP
Japan
Prior art keywords
heat sink
adhesive layer
separator
thermally conductive
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988129712U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988129712U priority Critical patent/JPH0252350U/ja
Publication of JPH0252350U publication Critical patent/JPH0252350U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図はそれぞれ本考案の放熱体の
一例について、その断面の概要を示す図である。 １……放熱板、２……粘着剤層、３……放熱シ
ート、４……粘着剤層、５……セパレーター、６
……放熱フイン。 FIGS. 1 and 2 are diagrams each showing an outline of a cross section of an example of the heat sink of the present invention. 1... Heat dissipation plate, 2... Adhesive layer, 3... Heat dissipation sheet, 4... Adhesive layer, 5... Separator, 6
...Heat dissipation fin.

Claims (1)

【実用新案登録請求の範囲】 １ 熱伝導性電気絶縁シートの一方の表面に粘着
剤層を介してセパレーターを設け他方の表面を粘
着剤層もしくは接着剤層を介して放熱板に固定し
てなることを特徴とする放熱体。 ２ 放熱板が放熱フインを有することを特徴とす
る請求項１記載の放熱体。[Claims for Utility Model Registration] 1 A separator is provided on one surface of a thermally conductive electrical insulating sheet via an adhesive layer, and the other surface is fixed to a heat sink via an adhesive layer or an adhesive layer. A heat sink characterized by: 2. The heat sink according to claim 1, wherein the heat sink has heat sink fins.
JP1988129712U 1988-10-03 1988-10-03 Pending JPH0252350U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988129712U JPH0252350U (en) 1988-10-03 1988-10-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988129712U JPH0252350U (en) 1988-10-03 1988-10-03

Publications (1)

Publication Number Publication Date
JPH0252350U true JPH0252350U (en) 1990-04-16

Family

ID=31384241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988129712U Pending JPH0252350U (en) 1988-10-03 1988-10-03

Country Status (1)

Country Link
JP (1) JPH0252350U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60157244A (en) * 1984-11-10 1985-08-17 Denki Kagaku Kogyo Kk Insulation heat-dissipating sheet with adhesive

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60157244A (en) * 1984-11-10 1985-08-17 Denki Kagaku Kogyo Kk Insulation heat-dissipating sheet with adhesive

Similar Documents

Publication Publication Date Title
JPH0252350U (en)
JPH0381640U (en)
JPH0264032U (en)
JPS6018550U (en) Heat dissipation structure
JPS6350138U (en)
JPH0238748U (en)
JPS6448095U (en)
JPS61203595U (en)
JPS61111157U (en)
JPH02102452U (en)
JPS62174341U (en)
JPS61117275U (en)
JPS61171259U (en)
JPS63172166U (en)
JPH01123398U (en)
JPH03104793U (en)
JPS58133939U (en) Heat sink for semiconductor parts
JPH0167046U (en)
JPS60163738U (en) semiconductor equipment
JPS6230353U (en)
JPS61151392U (en)
JPS61144697U (en)
JPS6420792U (en)
JPH0425288U (en)
JPS61114898U (en)