JPS63172166U - - Google Patents
Info
- Publication number
- JPS63172166U JPS63172166U JP6609987U JP6609987U JPS63172166U JP S63172166 U JPS63172166 U JP S63172166U JP 6609987 U JP6609987 U JP 6609987U JP 6609987 U JP6609987 U JP 6609987U JP S63172166 U JPS63172166 U JP S63172166U
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- insulating substrate
- thermally conductive
- aluminum
- conductive plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 3
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図、第２図は、本考案実施例の断面図であ
る。第１図において１はニツケルからなる熱伝導
性板材、２はその片面に形成されたクロムメツキ
層、第２図において、１はアルミニウムからなる
熱伝導性板材、１１は銅メツキ層、１２はニツケ
ル層、２はニツケル層１２上に形成されたクロム
メツキ層である。
1 and 2 are cross-sectional views of an embodiment of the present invention. In Fig. 1, 1 is a thermally conductive plate made of nickel, 2 is a chrome plating layer formed on one side of the plate, and in Fig. 2, 1 is a thermally conductive plate made of aluminum, 11 is a copper plating layer, and 12 is a nickel layer. , 2 is a chrome plating layer formed on the nickel layer 12.
Claims (1)
ることを特徴とする絶縁基板用材料。 ２ 熱伝導性板材料がアルミニウムである実用新
案登録請求の範囲第１項に記載の絶縁基板用材料
。 ３ アルミニウムの片面に順次銅メツキ層、ニツ
ケルメツキ層を有し、さらにその上にクロムメツ
キ層を有する実用新案登録請求の範囲第２項に記
載の絶縁基板用材料。[Claims for Utility Model Registration] 1. A material for an insulating substrate, characterized by having a chrome plating layer on one side of a thermally conductive plate material. 2. The material for an insulating substrate according to claim 1, wherein the thermally conductive plate material is aluminum. 3. The insulating substrate material according to claim 2, which has a copper plating layer and a nickel plating layer on one side of aluminum, and further has a chrome plating layer thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6609987U JPS63172166U (en) | 1987-04-30 | 1987-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6609987U JPS63172166U (en) | 1987-04-30 | 1987-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172166U true JPS63172166U (en) | 1988-11-09 |
Family
ID=30903784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6609987U Pending JPS63172166U (en) | 1987-04-30 | 1987-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172166U (en) |
-
1987
- 1987-04-30 JP JP6609987U patent/JPS63172166U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63172166U (en) | ||
| JPS63172167U (en) | ||
| JPS6320496U (en) | ||
| JPH0264032U (en) | ||
| JPS63172165U (en) | ||
| JPS62158900U (en) | ||
| JPS58150230U (en) | push switch | |
| JPS6133466U (en) | Electroplated insulated metal substrate | |
| JPH01169069U (en) | ||
| JPS5953726U (en) | Planar switch device | |
| JPS6398653U (en) | ||
| JPH0242467U (en) | ||
| JPH01171065U (en) | ||
| JPH0252350U (en) | ||
| JPH048464U (en) | ||
| JPH0345679U (en) | ||
| JPH01115273U (en) | ||
| JPS6374802U (en) | ||
| JPS6365261U (en) | ||
| JPH03106775U (en) | ||
| JPS6133465U (en) | insulated metal substrate | |
| JPS62149867U (en) | ||
| JPS6387860U (en) | ||
| JPS60133690U (en) | Substrate for electronic components | |
| JPS62202606U (en) |