JPH048464U - - Google Patents
Info
- Publication number
- JPH048464U JPH048464U JP4943990U JP4943990U JPH048464U JP H048464 U JPH048464 U JP H048464U JP 4943990 U JP4943990 U JP 4943990U JP 4943990 U JP4943990 U JP 4943990U JP H048464 U JPH048464 U JP H048464U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- forming
- base substrate
- circuit conductor
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000004760 aramid Substances 0.000 claims 1
- 229920003235 aromatic polyamide Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図ないし第５図は本考案に係る金属ベース
基板の第１実施例を示し、第１図、第２図、第３
図、第４図は製造工程順の垂直断面図、第５図は
完成後の金属ベース基板の垂直断面図である。第
６図ないし第８図は本考案に係る金属ベース基板
の第２実施例を示し、第６図及び第７図は製造工
程順の垂直断面図、第８図は完成後の金属ベース
基板の垂直断面図である。
１……金属板、２……絶縁層、３……無電解め
つき層、５……電解めつき層、７……回路導体、
１１……回路導体。
1 to 5 show a first embodiment of the metal base substrate according to the present invention, and FIGS.
4 are vertical cross-sectional views of the manufacturing process, and FIG. 5 is a vertical cross-sectional view of the completed metal base substrate. 6 to 8 show a second embodiment of the metal base substrate according to the present invention, FIGS. 6 and 7 are vertical sectional views in the order of manufacturing steps, and FIG. 8 is a completed metal base substrate. FIG. DESCRIPTION OF SYMBOLS 1... Metal plate, 2... Insulating layer, 3... Electroless plating layer, 5... Electrolytic plating layer, 7... Circuit conductor,
11...Circuit conductor.
Claims (1)
らなる絶縁層を形成し、該絶縁層の表面に回路導
体をめつき処理にて所望のパターンに形成したこ
とを特徴とする金属ベース基板。 1. A metal base substrate, comprising: forming an insulating layer made of an epoxy resin-impregnated aramid base material on the surface of a metal plate; and forming a circuit conductor into a desired pattern on the surface of the insulating layer by plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4943990U JPH048464U (en) | 1990-05-11 | 1990-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4943990U JPH048464U (en) | 1990-05-11 | 1990-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH048464U true JPH048464U (en) | 1992-01-27 |
Family
ID=31567132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4943990U Pending JPH048464U (en) | 1990-05-11 | 1990-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048464U (en) |
-
1990
- 1990-05-11 JP JP4943990U patent/JPH048464U/ja active Pending