JPH0395676U - - Google Patents
Info
- Publication number
- JPH0395676U JPH0395676U JP216390U JP216390U JPH0395676U JP H0395676 U JPH0395676 U JP H0395676U JP 216390 U JP216390 U JP 216390U JP 216390 U JP216390 U JP 216390U JP H0395676 U JPH0395676 U JP H0395676U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- layer
- pattern layer
- insulating
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図は実施例の説明断面図、第２図は従来例
の説明断面図である。
１……金属基板、２……絶縁層、３……回路パ
ターン層、３１，３２……異種金属からなる層、
４……絶縁樹脂を充填してなる絶縁部。
FIG. 1 is an explanatory sectional view of an embodiment, and FIG. 2 is an explanatory sectional view of a conventional example. 1... Metal substrate, 2... Insulating layer, 3... Circuit pattern layer, 31, 32... Layer made of different metals,
4...Insulating part filled with insulating resin.
Claims (1)
を有してなり、その回路パターン層が異種金属の
重畳層からなると共に、パターンを形成する回路
間が絶縁樹脂の充填により絶縁処理されているこ
とを特徴とする回路基板。 A circuit pattern layer is provided on a metal substrate via an insulating layer, and the circuit pattern layer is made of superimposed layers of different metals, and the circuits forming the pattern are insulated by filling with an insulating resin. A circuit board characterized by:
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP216390U JPH0395676U (en) | 1990-01-12 | 1990-01-12 | |
| GB9100480A GB2240663A (en) | 1990-01-12 | 1991-01-10 | Metal base wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP216390U JPH0395676U (en) | 1990-01-12 | 1990-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395676U true JPH0395676U (en) | 1991-09-30 |
Family
ID=31506043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP216390U Pending JPH0395676U (en) | 1990-01-12 | 1990-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395676U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006187882A (en) * | 2004-12-28 | 2006-07-20 | Chinsei Enami | Saddle stitching bookbinding device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61254039A (en) * | 1985-05-02 | 1986-11-11 | Sony Corp | Forming method for circuit pattern |
| JPS622591A (en) * | 1985-06-28 | 1987-01-08 | 電気化学工業株式会社 | Manufacture of metal base hybrid integrated circuit board |
-
1990
- 1990-01-12 JP JP216390U patent/JPH0395676U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61254039A (en) * | 1985-05-02 | 1986-11-11 | Sony Corp | Forming method for circuit pattern |
| JPS622591A (en) * | 1985-06-28 | 1987-01-08 | 電気化学工業株式会社 | Manufacture of metal base hybrid integrated circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006187882A (en) * | 2004-12-28 | 2006-07-20 | Chinsei Enami | Saddle stitching bookbinding device |
| JP4515250B2 (en) * | 2004-12-28 | 2010-07-28 | 鎭生 江浪 | Saddle stitch bookbinding device |