JPH01139474U - - Google Patents
Info
- Publication number
- JPH01139474U JPH01139474U JP3617788U JP3617788U JPH01139474U JP H01139474 U JPH01139474 U JP H01139474U JP 3617788 U JP3617788 U JP 3617788U JP 3617788 U JP3617788 U JP 3617788U JP H01139474 U JPH01139474 U JP H01139474U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring board
- multilayer wiring
- substrate
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図ａ〜ｅは本考案に係る多層配線基板を製
造する工程を示す説明図、第２図ａ〜ｄは従来の
多層配線基板を製造する工程を示す説明図である
。
１……絶縁基板、２……導体層、３，８……放
熱層。
1A to 1E are explanatory diagrams showing the steps of manufacturing a multilayer wiring board according to the present invention, and FIGS. 2A to 2D are explanatory diagrams showing the steps of manufacturing a conventional multilayer wiring board. 1... Insulating substrate, 2... Conductor layer, 3, 8... Heat dissipation layer.
Claims (1)
基板上に抵抗体層がその一部を上記導体層と重合
するように形成された多層配線基板において、 前記抵抗体層の少なくとも片面側に放熱層が設
けられたことを特徴とする多層配線基板。[Claims for Utility Model Registration] A multilayer wiring board in which a conductor layer is formed in a predetermined pattern on a substrate, and a resistor layer is formed on the substrate so that a part of the resistor layer overlaps with the conductor layer, A multilayer wiring board characterized in that a heat dissipation layer is provided on at least one side of a body layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3617788U JPH01139474U (en) | 1988-03-17 | 1988-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3617788U JPH01139474U (en) | 1988-03-17 | 1988-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139474U true JPH01139474U (en) | 1989-09-22 |
Family
ID=31262793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3617788U Pending JPH01139474U (en) | 1988-03-17 | 1988-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139474U (en) |
-
1988
- 1988-03-17 JP JP3617788U patent/JPH01139474U/ja active Pending