JPH0172313U - - Google Patents
Info
- Publication number
- JPH0172313U JPH0172313U JP1987168755U JP16875587U JPH0172313U JP H0172313 U JPH0172313 U JP H0172313U JP 1987168755 U JP1987168755 U JP 1987168755U JP 16875587 U JP16875587 U JP 16875587U JP H0172313 U JPH0172313 U JP H0172313U
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- low melting
- flat plate
- metal layer
- point metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920006015 heat resistant resin Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
第１図は本考案の第１の実施例の断面図、第２
図は本考案の第１の実施例の使用方法を説明する
ための断面図、第３図は本考案の第２の実施例の
断面図である。
１，１Ａ……金属製平板、２，２Ａ……低融点
金属層、３，３Ａ……耐熱性樹脂層、４……樹脂
板、１０，１０Ａ……積層鏡板。
FIG. 1 is a sectional view of the first embodiment of the present invention;
The figure is a cross-sectional view for explaining how to use the first embodiment of the present invention, and FIG. 3 is a cross-sectional view of the second embodiment of the present invention. 1,1A...metal flat plate, 2,2A...low melting point metal layer, 3,3A...heat resistant resin layer, 4...resin plate, 10,10A...laminated mirror plate.
Claims (1)
上に形成された低融点金属層と、該低融点金属層
を覆つて形成され低融点金属層を前記金属製平板
上に保持する耐熱性樹脂層とから成ることを特徴
とする多層印刷配線板用積層鏡板。 A metal flat plate with a flat surface, a low melting point metal layer formed on the metal flat plate, and a heat resistance that is formed to cover the low melting point metal layer and hold the low melting point metal layer on the metal flat plate. A laminated end plate for a multilayer printed wiring board, characterized by comprising a resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168755U JPH0172313U (en) | 1987-11-02 | 1987-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168755U JPH0172313U (en) | 1987-11-02 | 1987-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0172313U true JPH0172313U (en) | 1989-05-16 |
Family
ID=31458213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987168755U Pending JPH0172313U (en) | 1987-11-02 | 1987-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0172313U (en) |
-
1987
- 1987-11-02 JP JP1987168755U patent/JPH0172313U/ja active Pending
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