JPH01171065U - - Google Patents
Info
- Publication number
- JPH01171065U JPH01171065U JP6788088U JP6788088U JPH01171065U JP H01171065 U JPH01171065 U JP H01171065U JP 6788088 U JP6788088 U JP 6788088U JP 6788088 U JP6788088 U JP 6788088U JP H01171065 U JPH01171065 U JP H01171065U
- Authority
- JP
- Japan
- Prior art keywords
- solder plating
- integrated circuit
- hybrid integrated
- plating layer
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の分割半田メツキを実施した混
成集積回路の裏面図、第２図は第１図のＡ―Ａ線
断面図、第３図は従来の半田めつきを実施した混
成集積回路の裏面図、第４図は第３図のＢ―Ｂ線
断面図である。
１……混成集積回路、２……裏面導体、３……
分割した半田めつき層、４……全面に形成した半
田めつき層。
Figure 1 is a back view of a hybrid integrated circuit that has undergone split solder plating according to the present invention, Figure 2 is a sectional view taken along line A--A in Figure 1, and Figure 3 is a rear view of a hybrid integrated circuit that has undergone conventional solder plating. 4 is a cross-sectional view taken along the line BB in FIG. 3. 1... Hybrid integrated circuit, 2... Back conductor, 3...
Divided solder plating layer, 4...Solder plating layer formed on the entire surface.
Claims (1)
なる混成集積回路において、前記半田めつき層を
、前記導体の略全面にわたつて分割状態に配設し
た等面積の複数個の半田めつき層で構成したこと
を特徴とする混成集積回路。 In a hybrid integrated circuit in which a solder plating layer is formed on a conductor formed on the back surface, the solder plating layer is divided into a plurality of solder plating layers having equal areas and arranged over substantially the entire surface of the conductor. A hybrid integrated circuit characterized by being composed of layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6788088U JPH01171065U (en) | 1988-05-23 | 1988-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6788088U JPH01171065U (en) | 1988-05-23 | 1988-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171065U true JPH01171065U (en) | 1989-12-04 |
Family
ID=31293223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6788088U Pending JPH01171065U (en) | 1988-05-23 | 1988-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171065U (en) |
-
1988
- 1988-05-23 JP JP6788088U patent/JPH01171065U/ja active Pending