JPH0320464U - - Google Patents
Info
- Publication number
- JPH0320464U JPH0320464U JP8112189U JP8112189U JPH0320464U JP H0320464 U JPH0320464 U JP H0320464U JP 8112189 U JP8112189 U JP 8112189U JP 8112189 U JP8112189 U JP 8112189U JP H0320464 U JPH0320464 U JP H0320464U
- Authority
- JP
- Japan
- Prior art keywords
- copper paste
- power supply
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 2
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は従来の銅ペースト基板を上から見た図
である。第２図は本考案基板を上から見た図であ
る。第１図のＡの斜線の部分が銅ペーストを覆つ
ていない部分で、Ｂはランド部分である。第２図
のＣの斜線部が銅ペーストを覆つていない部で、
Ｄはランド部分である。
FIG. 1 is a top view of a conventional copper paste substrate. FIG. 2 is a top view of the substrate of the present invention. The shaded area A in FIG. 1 is the area that does not cover the copper paste, and B is the land area. The shaded area C in Figure 2 is the area that does not cover the copper paste.
D is a land portion.
Claims (1)
ンの一部を銅ペーストにて覆わずのこした基板。 As shown in FIG. 2, a part of each signal line and power supply line is left uncovered with copper paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8112189U JPH0320464U (en) | 1989-07-10 | 1989-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8112189U JPH0320464U (en) | 1989-07-10 | 1989-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320464U true JPH0320464U (en) | 1991-02-28 |
Family
ID=31626780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8112189U Pending JPH0320464U (en) | 1989-07-10 | 1989-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320464U (en) |
-
1989
- 1989-07-10 JP JP8112189U patent/JPH0320464U/ja active Pending