JPS6223452U - - Google Patents

Info

Publication number
JPS6223452U
JPS6223452U JP11508885U JP11508885U JPS6223452U JP S6223452 U JPS6223452 U JP S6223452U JP 11508885 U JP11508885 U JP 11508885U JP 11508885 U JP11508885 U JP 11508885U JP S6223452 U JPS6223452 U JP S6223452U
Authority
JP
Japan
Prior art keywords
substrate
guide
side wall
lead
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11508885U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11508885U priority Critical patent/JPS6223452U/ja
Publication of JPS6223452U publication Critical patent/JPS6223452U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のハイブリツド集積回路の基板
の側壁付近の形状を示す図、第2図及び第3図は
本考案の他の実施例、第4図はハイブリツド集積
回路の全体図、第5図は従来のハイブリツド集積
回路の基板の側壁付近の形状を示す図である。 11……基盤、12……リードピン、13……
側壁、14……ランド。
FIG. 1 is a diagram showing the shape of the vicinity of the side wall of the substrate of the hybrid integrated circuit of the present invention, FIGS. 2 and 3 are other embodiments of the present invention, FIG. 4 is an overall diagram of the hybrid integrated circuit, and FIG. The figure shows the shape of the vicinity of the side wall of a substrate of a conventional hybrid integrated circuit. 11...Base, 12...Lead pin, 13...
Side wall, 14...land.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子や回路素子を同一基板に設けるハイ
ブリツド集積回路において、前記基板の側壁にリ
ードピンのガイドを設け、このガイドに合わせて
前記リードビンを前記基板に取り付けることを特
徴とするハイブリツド集積回路。
A hybrid integrated circuit in which semiconductor elements and circuit elements are provided on the same substrate, characterized in that a lead pin guide is provided on the side wall of the substrate, and the lead bin is attached to the substrate in line with the guide.
JP11508885U 1985-07-29 1985-07-29 Pending JPS6223452U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11508885U JPS6223452U (en) 1985-07-29 1985-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11508885U JPS6223452U (en) 1985-07-29 1985-07-29

Publications (1)

Publication Number Publication Date
JPS6223452U true JPS6223452U (en) 1987-02-13

Family

ID=30998422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11508885U Pending JPS6223452U (en) 1985-07-29 1985-07-29

Country Status (1)

Country Link
JP (1) JPS6223452U (en)

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