JPS62158900U - - Google Patents
Info
- Publication number
- JPS62158900U JPS62158900U JP4676886U JP4676886U JPS62158900U JP S62158900 U JPS62158900 U JP S62158900U JP 4676886 U JP4676886 U JP 4676886U JP 4676886 U JP4676886 U JP 4676886U JP S62158900 U JPS62158900 U JP S62158900U
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- laminated
- shielding plate
- electromagnetic shielding
- aluminum substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１，２図は本考案の実施例を示す断面構造図
、第３図は他の実施例の使用状態を示す斜視図で
ある。
１０……電気絶縁層、１１……基板、１２……
銅メツキ層、１３……ニツケルメツキ層。
1 and 2 are cross-sectional structural views showing an embodiment of the present invention, and FIG. 3 is a perspective view showing another embodiment in use. 10... Electric insulating layer, 11... Substrate, 12...
Copper plating layer, 13...nickel plating layer.
Claims (1)
キ層及びニツケルメツキ層を積層形成してあるこ
とを特徴とする電磁遮蔽板。 ２ アルミニウム基板の一面に銅メツキ層及びニ
ツケルメツキ層を積層形成してあり、その一辺縁
での支持により自立性を有する電磁遮蔽板。[Claims for Utility Model Registration] 1. An electromagnetic shielding plate characterized in that a copper plating layer and a nickel plating layer are laminated on at least one surface of an aluminum substrate. 2. An electromagnetic shielding plate in which a copper plating layer and a nickel plating layer are laminated on one side of an aluminum substrate, and is self-supporting by being supported at one edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4676886U JPS62158900U (en) | 1986-03-28 | 1986-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4676886U JPS62158900U (en) | 1986-03-28 | 1986-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62158900U true JPS62158900U (en) | 1987-10-08 |
Family
ID=30866737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4676886U Pending JPS62158900U (en) | 1986-03-28 | 1986-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62158900U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56130999A (en) * | 1979-10-31 | 1981-10-14 | Illinois Tool Works | Multilayer high attenuation shielding structure |
-
1986
- 1986-03-28 JP JP4676886U patent/JPS62158900U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56130999A (en) * | 1979-10-31 | 1981-10-14 | Illinois Tool Works | Multilayer high attenuation shielding structure |
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