JPH0196613U - - Google Patents

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Publication number
JPH0196613U
JPH0196613U JP19434087U JP19434087U JPH0196613U JP H0196613 U JPH0196613 U JP H0196613U JP 19434087 U JP19434087 U JP 19434087U JP 19434087 U JP19434087 U JP 19434087U JP H0196613 U JPH0196613 U JP H0196613U
Authority
JP
Japan
Prior art keywords
conductive
conductive elastic
elastic
adhesive
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19434087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19434087U priority Critical patent/JPH0196613U/ja
Publication of JPH0196613U publication Critical patent/JPH0196613U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の導電性弾性板の一実施例を示
す断面図、第2図は第1図の接着剤層を省略した
構成の実施例を示す断面図、第3図は導電面の反
対側の面に粘着性接着用層を有する構成の実施例
を示す断面図、第4図a,bは第3図に示した導
電性弾性板の使用状態を示す斜視図、第5図は導
電性層が均一に形成された実施例を示す斜視図、
第6図は導電性層が金属等からなるメツシユで形
成された実施例を示す断面図、第7図は従来例を
示す概略説明図である。 1……導電性弾性板、2……弾性を有する基体
、3……接着用処理面、4……接着剤層、5……
導電性層、6……粘着性接着用層、7……剛性部
材、8……導電性処理した部材、9……管状部材
、10……導電性処理層、11……剛性部材、1
2……電気的リード、13……金属のリング。
Fig. 1 is a sectional view showing an embodiment of the conductive elastic plate of the present invention, Fig. 2 is a sectional view showing an embodiment of the structure in which the adhesive layer of Fig. 1 is omitted, and Fig. 3 is a sectional view showing an embodiment of the conductive elastic plate of the present invention. 4a and 4b are perspective views showing the state in which the conductive elastic plate shown in FIG. 3 is used, and FIG. A perspective view showing an example in which a conductive layer is uniformly formed,
FIG. 6 is a sectional view showing an embodiment in which the conductive layer is formed of a mesh made of metal or the like, and FIG. 7 is a schematic explanatory view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Conductive elastic board, 2... Elastic base, 3... Adhesive treated surface, 4... Adhesive layer, 5...
Conductive layer, 6... Adhesive adhesive layer, 7... Rigid member, 8... Conductively treated member, 9... Tubular member, 10... Conductive treated layer, 11... Rigid member, 1
2...Electrical lead, 13...Metal ring.

Claims (1)

【実用新案登録請求の範囲】 (1) 弾性を有する基体の表面に導電性金属箔ま
たは導電性金属製のメツシユよりなる導電性層を
積層してなることを特徴とする導電性弾性板。 (2) 該板の片面が接着性または粘着性を有する
実用新案登録請求の範囲第1項記載の導電性弾性
板。 (3) 導電性層の厚さが100Å〜1mmである実
用新案登録請求の範囲第1項記載の導電性弾性板
。 (4) 全体の厚みが0.1〜50mmである実用新
案登録請求の範囲第1項記載の導電性弾性板。
[Claims for Utility Model Registration] (1) A conductive elastic board characterized by having a conductive layer made of conductive metal foil or conductive metal mesh laminated on the surface of an elastic substrate. (2) The conductive elastic board according to claim 1, wherein one side of the board has adhesive or adhesive properties. (3) The conductive elastic board according to claim 1, wherein the conductive layer has a thickness of 100 Å to 1 mm. (4) The conductive elastic plate according to claim 1, which has a total thickness of 0.1 to 50 mm.
JP19434087U 1987-12-21 1987-12-21 Pending JPH0196613U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19434087U JPH0196613U (en) 1987-12-21 1987-12-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19434087U JPH0196613U (en) 1987-12-21 1987-12-21

Publications (1)

Publication Number Publication Date
JPH0196613U true JPH0196613U (en) 1989-06-27

Family

ID=31485071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19434087U Pending JPH0196613U (en) 1987-12-21 1987-12-21

Country Status (1)

Country Link
JP (1) JPH0196613U (en)

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