JPH0338696U - - Google Patents
Info
- Publication number
- JPH0338696U JPH0338696U JP9882689U JP9882689U JPH0338696U JP H0338696 U JPH0338696 U JP H0338696U JP 9882689 U JP9882689 U JP 9882689U JP 9882689 U JP9882689 U JP 9882689U JP H0338696 U JPH0338696 U JP H0338696U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- circuit board
- connecting block
- casing
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000020169 heat generation Effects 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案による一実施例の要部側断面図
、第２図は第１図の回路基板を抜き出した状態を
示す要部斜視図、第３図は第１図の連結板の分解
斜視図、第４図は第３図の組立状態を下方から見
た平面図、第５図は従来技術による要部側断面図
、第６図は第５図の連結ブロツクの組立状態を示
す要部側面図、第７図は第６図の連結ブロツクの
分解斜視図、である。
図において、１……筐体、２……回路基板、５
……ヒートシンク、５ａ……放熱フイン、７……
連結ブロツク、８……ヒートパイプ、８ａ……吸
熱端、８ｂ……放熱端、１０……高発熱電子部品
（ＬＳＩ）を示す。
Fig. 1 is a side sectional view of the main part of an embodiment of the present invention, Fig. 2 is a perspective view of the main part showing the circuit board of Fig. 1 taken out, and Fig. 3 is an exploded view of the connecting plate of Fig. 1. 4 is a plan view of the assembled state shown in FIG. 3 seen from below, FIG. 5 is a side sectional view of the main part according to the prior art, and FIG. 6 is a main view showing the assembled state of the connecting block shown in FIG. 5. FIG. 7 is an exploded perspective view of the connecting block of FIG. 6. In the figure, 1... Housing, 2... Circuit board, 5
... Heat sink, 5a ... Heat dissipation fin, 7 ...
Connection block, 8...heat pipe, 8a...heat absorption end, 8b...heat radiation end, 10...high heat generation electronic component (LSI).
Claims (1)
発熱電子部品１０を実装した回路基板２と、該回
路基板２の上端部に取着し暖気を筐体外部に案内
排出する方向に向けた複数枚の放熱フイン５ａを
並列して有するヒートシンク５と、該ヒートシン
ク５と前記高発熱電子部品１０に接続した連結ブ
ロツク７との間に軸心を鉛直方向にして配設し一
方の吸熱端８ａを前記連結ブロツク７に接続する
とともに他方の放熱端８ｂを前記ヒートシンク５
に接続するヒートパイプ８とからなることを特徴
とする高発熱回路の放熱構造。 A circuit board 2 on which high heat generation electronic components 10 are mounted is arranged in parallel with the mounting surface in the vertical direction in the casing 1, and a circuit board 2 is attached to the upper end of the circuit board 2 in a direction to guide and discharge warm air to the outside of the casing. A heat sink 5 having a plurality of heat dissipating fins 5a arranged in parallel, and a connecting block 7 connected to the heat sink 5 and the high heat generation electronic component 10, with their axes aligned vertically, are disposed so that one side absorbs heat. The end 8a is connected to the connecting block 7, and the other heat dissipating end 8b is connected to the heat sink 5.
A heat dissipation structure for a high heat generation circuit characterized by comprising a heat pipe 8 connected to a heat pipe 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9882689U JPH0338696U (en) | 1989-08-23 | 1989-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9882689U JPH0338696U (en) | 1989-08-23 | 1989-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338696U true JPH0338696U (en) | 1991-04-15 |
Family
ID=31647907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9882689U Pending JPH0338696U (en) | 1989-08-23 | 1989-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338696U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007532854A (en) * | 2004-04-09 | 2007-11-15 | エーヴィッド サーモロイ エルエルシー | Multiple evaporator heat pipe assisted heat sink |
-
1989
- 1989-08-23 JP JP9882689U patent/JPH0338696U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007532854A (en) * | 2004-04-09 | 2007-11-15 | エーヴィッド サーモロイ エルエルシー | Multiple evaporator heat pipe assisted heat sink |
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