JPH01120393U - - Google Patents

Info

Publication number
JPH01120393U
JPH01120393U JP1988016640U JP1664088U JPH01120393U JP H01120393 U JPH01120393 U JP H01120393U JP 1988016640 U JP1988016640 U JP 1988016640U JP 1664088 U JP1664088 U JP 1664088U JP H01120393 U JPH01120393 U JP H01120393U
Authority
JP
Japan
Prior art keywords
generating component
heat generating
heat
case
dissipation structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988016640U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988016640U priority Critical patent/JPH01120393U/ja
Publication of JPH01120393U publication Critical patent/JPH01120393U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による一実施例の放熱器の斜視
図、第２図は第１図の放熱器の実装状態を示す斜
視図、第３図は第２図を上から見た断面図、第４
図は従来技術による汎用放熱器の斜視図、第５図
は第４図の汎用放熱器の実装状態を示す斜視図、
第６図は従来の他の放熱器の要部側断面図、であ
る。 図において、１は放熱器、１ａは通風孔、１ｂ
は固着面、２は回路ユニツト、３はシールドケー
ス、３ａはケース内壁面、３ｂはケースカバー、
４は回路基板、５は発熱部品（ＬＳＩ）、５ａは
頭部をそれぞれを示す。 FIG. 1 is a perspective view of a heatsink according to an embodiment of the present invention, FIG. 2 is a perspective view showing the mounting state of the heatsink of FIG. 1, and FIG. 3 is a sectional view of FIG. 2 viewed from above. Fourth
The figure is a perspective view of a general-purpose heatsink according to the prior art, and FIG. 5 is a perspective view showing the mounting state of the general-purpose heatsink of FIG.
FIG. 6 is a side sectional view of a main part of another conventional heat radiator. In the figure, 1 is a heat sink, 1a is a ventilation hole, 1b
is the fixed surface, 2 is the circuit unit, 3 is the shield case, 3a is the case inner wall surface, 3b is the case cover,
4 is a circuit board, 5 is a heat generating component (LSI), and 5a is a head.

Claims (1)

【実用新案登録請求の範囲】 発熱部品５を搭載した回路基板４をケース３に
収納してなる回路ユニツト２の放熱構造において
、 高熱伝導性柱状ブロツクに並行する複数の通風
孔１ａを所定間隔で貫通備えてなる放熱器１を上
記発熱部品５の頭部５ａに通風孔１ａの向きを気
流の流れる方向に向けて固着するとともに、通風
孔１ａのない他の面を上記ケース内面３ａに当接
させてなることを特徴とする発熱部品の放熱構造
。[Scope of Claim for Utility Model Registration] In the heat dissipation structure of the circuit unit 2, which has a circuit board 4 mounted with a heat generating component 5 housed in a case 3, a plurality of ventilation holes 1a are arranged in parallel to a highly thermally conductive columnar block at predetermined intervals. A heat radiator 1 having a through hole is fixed to the head 5a of the heat generating component 5 with the ventilation hole 1a facing the direction of air flow, and the other surface without the ventilation hole 1a is brought into contact with the inner surface 3a of the case. A heat dissipation structure for a heat generating component characterized by:
JP1988016640U 1988-02-09 1988-02-09 Pending JPH01120393U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988016640U JPH01120393U (en) 1988-02-09 1988-02-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988016640U JPH01120393U (en) 1988-02-09 1988-02-09

Publications (1)

Publication Number Publication Date
JPH01120393U true JPH01120393U (en) 1989-08-15

Family

ID=31229746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988016640U Pending JPH01120393U (en) 1988-02-09 1988-02-09

Country Status (1)

Country Link
JP (1) JPH01120393U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4833924U (en) * 1971-08-30 1973-04-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4833924U (en) * 1971-08-30 1973-04-24

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