JPH0221794U - - Google Patents
Info
- Publication number
- JPH0221794U JPH0221794U JP10162088U JP10162088U JPH0221794U JP H0221794 U JPH0221794 U JP H0221794U JP 10162088 U JP10162088 U JP 10162088U JP 10162088 U JP10162088 U JP 10162088U JP H0221794 U JPH0221794 U JP H0221794U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- horizontal plane
- heat
- generating electronic
- upper half
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案に係る発熱電子部品の放熱装置
の一実施例を示す斜視図、第２図はこの第１図に
示された本考案に係る放熱板の展開図、第３図及
び第４図は従来の発熱電子部品の放熱装置の夫々
異なる例を示す斜視図、第５図は第４図に示され
た従来の放熱板の展開図である。
２１；放熱板、２２；第１の平板部、２２′；
第１の水平面、２３；第２の平板部、２３′；第
２の水平面、２５；発熱電子部品。
FIG. 1 is a perspective view showing an embodiment of the heat dissipation device for heat generating electronic components according to the present invention, FIG. 2 is a developed view of the heat dissipation plate according to the present invention shown in FIG. 1, and FIGS. 4 is a perspective view showing different examples of conventional heat radiating devices for heat generating electronic components, and FIG. 5 is a developed view of the conventional heat radiating plate shown in FIG. 4. 21; heat sink, 22; first flat plate portion, 22';
First horizontal surface, 23; Second flat plate portion, 23'; Second horizontal surface, 25; Heat generating electronic component.
Claims (1)
電子部品の放熱装置に於いて、 平面Ｌ字状の金属板から成る放熱板の第１の平
板部の略々上半部を水平に折曲して第１の水平面
とすると共に第２の平板部の略々上半部を前記第
１の水平面上に位置するように折曲して第２の水
平面とし、 前記第１と第２の水平面間には適宜空間を設け
て成る発熱電子部品の放熱装置。[Claims for Utility Model Registration] In a heat dissipation device for heat-generating electronic components such as power ICs or power transistors, substantially the upper half of the first flat plate portion of a heat dissipation plate made of a flat L-shaped metal plate is horizontally disposed. to form a first horizontal plane, and bend approximately the upper half of the second flat plate part to be located on the first horizontal plane to form a second horizontal plane; A heat dissipation device for a heat generating electronic component, in which an appropriate space is provided between two horizontal planes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10162088U JPH0221794U (en) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10162088U JPH0221794U (en) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221794U true JPH0221794U (en) | 1990-02-14 |
Family
ID=31330780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10162088U Pending JPH0221794U (en) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221794U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015145626A (en) * | 2014-01-31 | 2015-08-13 | 株式会社鶴見製作所 | Automatic operation type water channel submerged pump |
-
1988
- 1988-07-28 JP JP10162088U patent/JPH0221794U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015145626A (en) * | 2014-01-31 | 2015-08-13 | 株式会社鶴見製作所 | Automatic operation type water channel submerged pump |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0221794U (en) | ||
| JPS58175641U (en) | Semiconductor component mounting equipment | |
| JPH01127295U (en) | ||
| JPS6210496U (en) | ||
| JPS5939942U (en) | Heat generating electronic component mounting structure | |
| JPH029445U (en) | ||
| JPS63102292U (en) | ||
| JPS61119396U (en) | ||
| JPS59189248U (en) | Heatsink for electrical elements | |
| JPH0160545U (en) | ||
| JPH0233445U (en) | ||
| JPS63193896U (en) | ||
| JPS6073295U (en) | Mounting device for heat generating parts | |
| JPS5981041U (en) | Integrated circuit heat dissipation device | |
| JPS6226041U (en) | ||
| JPS60172350U (en) | Heat dissipation device in IC socket | |
| JPS63128741U (en) | ||
| JPS5911452U (en) | Electronic component equipment with heat sink | |
| JPH0338693U (en) | ||
| JPS5895056U (en) | Mounting structure of heat generating parts | |
| JPS58147256U (en) | power hybrid integrated circuit | |
| JPH03106752U (en) | ||
| JPH01172290U (en) | ||
| JPS5929095U (en) | electronic equipment | |
| JPS6452248U (en) |