JPH0233494U - - Google Patents
Info
- Publication number
- JPH0233494U JPH0233494U JP11250188U JP11250188U JPH0233494U JP H0233494 U JPH0233494 U JP H0233494U JP 11250188 U JP11250188 U JP 11250188U JP 11250188 U JP11250188 U JP 11250188U JP H0233494 U JPH0233494 U JP H0233494U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- lead terminal
- line package
- screw hole
- widening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図a,bは、本考案の実施例1の正面図、
側面図、第1図cは、実施例1の放熱器取付図、
第2図a,bは、本考案の実施例2の正面図、側
面図、第2図cは実施例2の放熱器取付図、第3
図a,bは従来のシングル イン ライン パツ
ケージの正面図、側面図である。
1……モールド樹脂、2……チツプ、3……チ
ツプマウント部、4……リード端子、5……ネジ
穴付リード端子、6……ネジ穴、7……基板、8
……放熱器、9……絶縁板、10……ネジ、11
……放熱フイン。
FIGS. 1a and 1b are front views of Embodiment 1 of the present invention,
A side view, FIG. 1c is a radiator installation diagram of Example 1,
Figures 2a and b are a front view and side view of Embodiment 2 of the present invention, Figure 2c is an installation diagram of the radiator of Embodiment 2, and Figure 3
Figures a and b are front and side views of a conventional single-in-line package. DESCRIPTION OF SYMBOLS 1...Mold resin, 2...Chip, 3...Chip mount part, 4...Lead terminal, 5...Lead terminal with screw hole, 6...Screw hole, 7...Substrate, 8
... Heatsink, 9 ... Insulating plate, 10 ... Screw, 11
...heat dissipation fin.
Claims (1)
、チツプマウント部と一体となつているリード端
子を有し、かつそのリード端子の幅を広げ中央に
ネジ穴をあけることによつて放熱器をとりつける
放熱フインとしたことを特徴とする放熱フイン付
シングル イン ライン パツケージ。 A single in-line package is characterized by having a lead terminal that is integrated with the chip mount part, and by widening the width of the lead terminal and drilling a screw hole in the center, it becomes a heat dissipation fin to which a heat dissipation device can be attached. Single in-line package with heat dissipation fins.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11250188U JPH0233494U (en) | 1988-08-26 | 1988-08-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11250188U JPH0233494U (en) | 1988-08-26 | 1988-08-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0233494U true JPH0233494U (en) | 1990-03-02 |
Family
ID=31351495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11250188U Pending JPH0233494U (en) | 1988-08-26 | 1988-08-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0233494U (en) |
-
1988
- 1988-08-26 JP JP11250188U patent/JPH0233494U/ja active Pending
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