JPS63188593U - - Google Patents
Info
- Publication number
- JPS63188593U JPS63188593U JP8145487U JP8145487U JPS63188593U JP S63188593 U JPS63188593 U JP S63188593U JP 8145487 U JP8145487 U JP 8145487U JP 8145487 U JP8145487 U JP 8145487U JP S63188593 U JPS63188593 U JP S63188593U
- Authority
- JP
- Japan
- Prior art keywords
- element chip
- light emitting
- emitting element
- light receiving
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
Landscapes
- Optical Radar Systems And Details Thereof (AREA)
Description
第１図は本考案の光学式物体検出センサの実施
例を示した反射型センサの断面図、第２図は本考
案の他の実施例の透過型センサの断面図、第３図
は従来の光学式物体検出センサの断面図である。
３，３１，３２……プリント基板、４……駆動
回路部、５…処理回路部、６……ケース、７……
コネクタ、８……物体、９……発光素子チツプ、
１０……受光素子チツプ、１１，１２……光学レ
ンズ、１３……金属細線、１４……リードピン。
Fig. 1 is a sectional view of a reflective type sensor showing an embodiment of the optical object detection sensor of the present invention, Fig. 2 is a sectional view of a transmission type sensor of another embodiment of the present invention, and Fig. 3 is a sectional view of a conventional sensor. FIG. 2 is a cross-sectional view of an optical object detection sensor. 3, 31, 32...Printed circuit board, 4...Drive circuit section, 5...Processing circuit section, 6...Case, 7...
Connector, 8...Object, 9...Light emitting element chip,
10... Light receiving element chip, 11, 12... Optical lens, 13... Fine metal wire, 14... Lead pin.
Claims (1)
よび受光素子チツプと、同発光素子チツプおよび
受光素子チツプの各々の直上に配置された光学レ
ンズを備えるとともに前記発光素子チツプおよび
受光素子チツプと前記プリント基板に形成された
配線層とが金属細線で電気的に接続されたことを
特徴とする光学式物体検出センサ。 A light emitting element chip and a light receiving element chip placed on a printed circuit board, an optical lens disposed directly above each of the light emitting element chip and the light receiving element chip, and the light emitting element chip, the light receiving element chip, and the printed circuit board. An optical object detection sensor characterized in that a wiring layer formed on the substrate is electrically connected with a thin metal wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8145487U JPS63188593U (en) | 1987-05-28 | 1987-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8145487U JPS63188593U (en) | 1987-05-28 | 1987-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63188593U true JPS63188593U (en) | 1988-12-02 |
Family
ID=30933209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8145487U Pending JPS63188593U (en) | 1987-05-28 | 1987-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63188593U (en) |
-
1987
- 1987-05-28 JP JP8145487U patent/JPS63188593U/ja active Pending
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