JPH04752U - - Google Patents
Info
- Publication number
- JPH04752U JPH04752U JP4028690U JP4028690U JPH04752U JP H04752 U JPH04752 U JP H04752U JP 4028690 U JP4028690 U JP 4028690U JP 4028690 U JP4028690 U JP 4028690U JP H04752 U JPH04752 U JP H04752U
- Authority
- JP
- Japan
- Prior art keywords
- signal line
- insulating layer
- metal layer
- constant potential
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は本考案の一実施例に係る配線構造の断
面説明図、第２図は本考案の別の実施例に係る配
線構造の断面説明図、第３図は従来のイメージセ
ンサの等価回路図、第４図は従来の多層配線の断
面説明図、第５図ａ，ｂはそれぞれ従来の信号線
間にシールド線を有する多層配線の平面説明図と
断面説明図である。
１１……受光素子アレイ、１２……電荷転送部
、１３……多層配線、１４……共通信号線、１５
……駆動用ＩＣ、１６……出力線、２１……基板
、３１……下部信号線、３２……上部信号線、３
３……絶縁層、３４……コンタクトホール、３７
……シールド線、４１……信号線、４２……シー
ルド層、４３……コンタクト部。
FIG. 1 is a cross-sectional explanatory diagram of a wiring structure according to one embodiment of the present invention, FIG. 2 is a cross-sectional explanatory diagram of a wiring structure according to another embodiment of the present invention, and FIG. 3 is an equivalent circuit of a conventional image sensor. 4 are explanatory cross-sectional views of conventional multilayer wiring, and FIGS. 5a and 5b are explanatory plan views and cross-sectional views, respectively, of conventional multilayer wiring having shield lines between signal lines. 11... Light receiving element array, 12... Charge transfer section, 13... Multilayer wiring, 14... Common signal line, 15
...Drive IC, 16...Output line, 21...Board, 31...Lower signal line, 32...Upper signal line, 3
3... Insulating layer, 34... Contact hole, 37
...shield wire, 41 ... signal line, 42 ... shield layer, 43 ... contact section.
Claims (1)
上に形成された絶縁層と、前記基板にコンタクト
して前記絶縁層を介して前記信号線を覆うように
形成された一定電位の金属層とを有することを特
徴とする配線構造。 (2) 基板上に形成された一定電位の第１の金属
層と、前記第１の金属層上に形成された第１の絶
縁層と、前記第１の絶縁層上に形成された信号線
と、前記信号線上に形成された第２の絶縁層と、
前記第１の金属層にコンタクトして前記第２の絶
縁層を介して前記信号線を覆うように形成された
一定電位の第２の金属層とを有することを特徴と
する配線構造。[Claims for Utility Model Registration] (1) A signal line formed on a substrate, an insulating layer formed on the signal line, and a device that contacts the substrate and covers the signal line via the insulating layer. 1. A wiring structure comprising: a metal layer having a constant potential formed in a metal layer having a constant potential; (2) A first metal layer with a constant potential formed on a substrate, a first insulating layer formed on the first metal layer, and a signal line formed on the first insulating layer. and a second insulating layer formed on the signal line;
A wiring structure comprising: a second metal layer having a constant potential and formed in contact with the first metal layer so as to cover the signal line via the second insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4028690U JPH04752U (en) | 1990-04-17 | 1990-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4028690U JPH04752U (en) | 1990-04-17 | 1990-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04752U true JPH04752U (en) | 1992-01-07 |
Family
ID=31549949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4028690U Pending JPH04752U (en) | 1990-04-17 | 1990-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04752U (en) |
-
1990
- 1990-04-17 JP JP4028690U patent/JPH04752U/ja active Pending
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