JPS6223459U - - Google Patents
Info
- Publication number
- JPS6223459U JPS6223459U JP11545885U JP11545885U JPS6223459U JP S6223459 U JPS6223459 U JP S6223459U JP 11545885 U JP11545885 U JP 11545885U JP 11545885 U JP11545885 U JP 11545885U JP S6223459 U JPS6223459 U JP S6223459U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- integrated circuit
- optical sensor
- sensor array
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
Description
第１図Ａ，Ｂはこの考案の一実施例による密着
形イメージセンサを示す平面図およびそのＡ―Ａ
′線断面図、第２図は密着形イメージセンサの回
路図、第３図は従来の密着形イメージセンサを示
す平面図、第４図は第３図のＢ―Ｂ′線断面図、
第５図は第２図の回路の動作を示すタイミング図
である。
１０１……絶縁基板、２０１……フオトダイオ
ード、３０５……集積回路チツプ、１０３……フ
レキシブル基板、１０４……チツプコンデンサ。
なお、図中の同一符号は同一又は相当部分を示す
。
FIGS. 1A and 1B are plan views showing a contact type image sensor according to an embodiment of this invention, and A--A thereof.
2 is a circuit diagram of a contact type image sensor, Figure 3 is a plan view showing a conventional contact type image sensor, Figure 4 is a sectional view taken along line B-B' in Figure 3,
FIG. 5 is a timing diagram showing the operation of the circuit of FIG. 2. 101...Insulating substrate, 201...Photodiode, 305...Integrated circuit chip, 103...Flexible substrate, 104... Chip capacitor.
Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
た非晶質半導体を用いた光センサアレイと、上記
絶縁基板上に配設され上記光センサアレイを駆動
するための複数の集積回路チツプと、上記絶縁基
板と別体に設けられ上記集積回路チツプと電気的
接続を行うための２層配線されたフレキシブル配
線板とを備えた密着形イメージセンサ。 an insulating substrate; an optical sensor array using amorphous semiconductors arranged in a line on the insulating substrate; and a plurality of integrated circuit chips disposed on the insulating substrate for driving the optical sensor array. . A contact image sensor comprising a flexible wiring board provided separately from the insulating substrate and having two layers of wiring for electrically connecting the integrated circuit chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11545885U JPS6223459U (en) | 1985-07-26 | 1985-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11545885U JPS6223459U (en) | 1985-07-26 | 1985-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6223459U true JPS6223459U (en) | 1987-02-13 |
Family
ID=30999128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11545885U Pending JPS6223459U (en) | 1985-07-26 | 1985-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6223459U (en) |
-
1985
- 1985-07-26 JP JP11545885U patent/JPS6223459U/ja active Pending