JPS63136365U - - Google Patents
Info
- Publication number
- JPS63136365U JPS63136365U JP2743987U JP2743987U JPS63136365U JP S63136365 U JPS63136365 U JP S63136365U JP 2743987 U JP2743987 U JP 2743987U JP 2743987 U JP2743987 U JP 2743987U JP S63136365 U JPS63136365 U JP S63136365U
- Authority
- JP
- Japan
- Prior art keywords
- hill
- concave
- solder
- display device
- led display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Description
第１図〜第６図は本考案の一実施例を説明する
ための図であつて、第１図はＬＥＤ表示装置の構
造を説明する概略側面図、第２図はその平面図、
第３図〜第６図はＬＥＤ表示装置の製造組立、構
成の工程を説明するための側面図並びに平面図で
ある。第７図、第８図は従来のＬＥＤ表示装置の
側面図並びに平面図である。
１……ＬＥＤチツプ、２……接着剤、３……金
線、４……ＰＣ板、５，５１……電極パターン、
６……レンズ、７……レジスト、８……凹型半田
丘、８１……半田クリーム、８２……半田丘、８
３……凹部、８８……斜面。
1 to 6 are diagrams for explaining one embodiment of the present invention, in which FIG. 1 is a schematic side view explaining the structure of an LED display device, FIG. 2 is a plan view thereof,
3 to 6 are a side view and a plan view for explaining the steps of manufacturing, assembling, and configuring the LED display device. FIGS. 7 and 8 are a side view and a plan view of a conventional LED display device. 1... LED chip, 2... Adhesive, 3... Gold wire, 4... PC board, 5, 51... Electrode pattern,
6...Lens, 7...Resist, 8...Concave solder hill, 81...Solder cream, 82...Solder hill, 8
3... recess, 88... slope.
Claims (1)
丘を形成し、該凹型半田丘の凹型底部にＬＥＤチ
ツプを固定したことを特徴とするＬＥＤ表示装置
。 An LED display device comprising: a concave solder hill with a wide opening side formed on a printed circuit board; and an LED chip fixed to the concave bottom of the concave solder hill.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2743987U JPS63136365U (en) | 1987-02-27 | 1987-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2743987U JPS63136365U (en) | 1987-02-27 | 1987-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63136365U true JPS63136365U (en) | 1988-09-07 |
Family
ID=30829468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2743987U Pending JPS63136365U (en) | 1987-02-27 | 1987-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63136365U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001291905A (en) * | 2000-04-11 | 2001-10-19 | Nichia Chem Ind Ltd | Optical semiconductor element |
| JP2011044752A (en) * | 2010-12-02 | 2011-03-03 | Nichia Corp | Method of manufacturing optical semiconductor element |
-
1987
- 1987-02-27 JP JP2743987U patent/JPS63136365U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001291905A (en) * | 2000-04-11 | 2001-10-19 | Nichia Chem Ind Ltd | Optical semiconductor element |
| JP4677653B2 (en) * | 2000-04-11 | 2011-04-27 | 日亜化学工業株式会社 | Optical semiconductor device |
| JP2011044752A (en) * | 2010-12-02 | 2011-03-03 | Nichia Corp | Method of manufacturing optical semiconductor element |