JPH0334254U - - Google Patents
Info
- Publication number
- JPH0334254U JPH0334254U JP9461589U JP9461589U JPH0334254U JP H0334254 U JPH0334254 U JP H0334254U JP 9461589 U JP9461589 U JP 9461589U JP 9461589 U JP9461589 U JP 9461589U JP H0334254 U JPH0334254 U JP H0334254U
- Authority
- JP
- Japan
- Prior art keywords
- receiving element
- element chip
- light receiving
- copper
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 1
Description
第１図は一実施例における読取りセンサ部を示
す断面図、第２図は一実施例の密着型イメージセ
ンサを示す断面図、第３図は従来の読取りセンサ
部を示す断面図である。
１４……ＬＥＤアレイ、２０……受光素子チツ
プ、２２……ロツドレンズアレイ、２４……実装
基板、２８……パターン化されていない銅箔。
FIG. 1 is a sectional view showing a reading sensor section according to an embodiment, FIG. 2 is a sectional view showing a contact type image sensor according to an embodiment, and FIG. 3 is a sectional view showing a conventional reading sensor section. 14... LED array, 20... Light receiving element chip, 22... Rod lens array, 24... Mounting board, 28... Unpatterned copper foil.
Claims (1)
チツプが基板上に実装されており、原稿からの反
射光が前記受光素子チツプに導かれて読み取られ
る密着型イメージセンサにおいて、前記受光素子
チツプの実装基板として銅張積層板が用いられ、
この銅張積層板の面で受光素子チツプが実装され
ていない面には銅箔が全面に張りつけられている
ことを特徴とする密着型イメージセンサ。 In a contact image sensor in which a light receiving element chip in which photoelectric conversion elements are arranged in a straight line is mounted on a substrate, and light reflected from an original is guided to the light receiving element chip and read, the light receiving element chip is mounted. A copper-clad laminate is used as the substrate,
This contact image sensor is characterized in that the surface of the copper-clad laminate on which the light-receiving element chip is not mounted is entirely covered with copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9461589U JPH08763Y2 (en) | 1989-08-12 | 1989-08-12 | Contact image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9461589U JPH08763Y2 (en) | 1989-08-12 | 1989-08-12 | Contact image sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0334254U true JPH0334254U (en) | 1991-04-04 |
| JPH08763Y2 JPH08763Y2 (en) | 1996-01-10 |
Family
ID=31643937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9461589U Expired - Lifetime JPH08763Y2 (en) | 1989-08-12 | 1989-08-12 | Contact image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08763Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001084287A1 (en) * | 2000-05-02 | 2001-11-08 | Fujitsu Limited | Front cover assembly and information apparatus with the assembly |
| JP2013157546A (en) * | 2012-01-31 | 2013-08-15 | Brother Ind Ltd | Image sensor |
-
1989
- 1989-08-12 JP JP9461589U patent/JPH08763Y2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001084287A1 (en) * | 2000-05-02 | 2001-11-08 | Fujitsu Limited | Front cover assembly and information apparatus with the assembly |
| JP2013157546A (en) * | 2012-01-31 | 2013-08-15 | Brother Ind Ltd | Image sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08763Y2 (en) | 1996-01-10 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |