JPS6232542U - - Google Patents

Info

Publication number
JPS6232542U
JPS6232542U JP12252285U JP12252285U JPS6232542U JP S6232542 U JPS6232542 U JP S6232542U JP 12252285 U JP12252285 U JP 12252285U JP 12252285 U JP12252285 U JP 12252285U JP S6232542 U JPS6232542 U JP S6232542U
Authority
JP
Japan
Prior art keywords
resin body
substrate
exposes
covers
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12252285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12252285U priority Critical patent/JPS6232542U/ja
Publication of JPS6232542U publication Critical patent/JPS6232542U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の側面図、第2図は
従来の素子の斜視図、第3図は第2図の素子の冷
却体への取付け状況を示す側面図、第4図は第1
図の素子の冷却体への取付け状況を示す側面図で
ある。 1:金属基板、3:モールド樹脂体、4:押さ
え金具。
Fig. 1 is a side view of an embodiment of the present invention, Fig. 2 is a perspective view of a conventional element, Fig. 3 is a side view showing how the element of Fig. 2 is attached to a cooling body, and Fig. 4 is a side view of an embodiment of the present invention. 1st
FIG. 3 is a side view showing how the element shown in the figure is attached to a cooling body. 1: Metal substrate, 3: Molded resin body, 4: Holder metal fitting.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属基板の下面を露出させ、該基板の上面に支
持される半導体素体を被覆する樹脂体を備えるも
のにおいて、樹脂体の上面がほぼ中央部を最も高
くした凸状に形成されたことを特徴とする半導体
素子。
A resin body that exposes the lower surface of a metal substrate and covers a semiconductor element supported on the upper surface of the substrate, characterized in that the upper surface of the resin body is formed in a convex shape with the highest point approximately at the center. Semiconductor device.
JP12252285U 1985-08-09 1985-08-09 Pending JPS6232542U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12252285U JPS6232542U (en) 1985-08-09 1985-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12252285U JPS6232542U (en) 1985-08-09 1985-08-09

Publications (1)

Publication Number Publication Date
JPS6232542U true JPS6232542U (en) 1987-02-26

Family

ID=31012786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12252285U Pending JPS6232542U (en) 1985-08-09 1985-08-09

Country Status (1)

Country Link
JP (1) JPS6232542U (en)

Similar Documents

Publication Publication Date Title
JPS6232542U (en)
JPS62157086U (en)
JPS6351458U (en)
JPH01157424U (en)
JPS61109141U (en)
JPS63141194U (en)
JPS6214738U (en)
JPS6298241U (en)
JPS6251242U (en)
JPS6454394U (en)
JPH0258344U (en)
JPH036847U (en)
JPH0267664U (en)
JPS61117260U (en)
JPS62140737U (en)
JPS63118243U (en)
JPS63105955U (en)
JPS5877744U (en) Simple sauna bath
JPH01116430U (en)
JPS61171679U (en)
JPS6230343U (en)
JPH0325242U (en)
JPS61126866U (en)
JPH0215736U (en)
JPS6320446U (en)