JPS5839063U - 全色発光半導体装置 - Google Patents
全色発光半導体装置Info
- Publication number
- JPS5839063U JPS5839063U JP13380281U JP13380281U JPS5839063U JP S5839063 U JPS5839063 U JP S5839063U JP 13380281 U JP13380281 U JP 13380281U JP 13380281 U JP13380281 U JP 13380281U JP S5839063 U JPS5839063 U JP S5839063U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- color light
- light emitting
- full color
- emitting semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
図は本考案実施例を示し、第1図Aは斜視図、第1図B
は平面図、第1図Cは第1図BのC−C要部断面図、第
2図及び第3図は側面図、第4図は等価電気回路図であ
る。
は平面図、第1図Cは第1図BのC−C要部断面図、第
2図及び第3図は側面図、第4図は等価電気回路図であ
る。
Claims (1)
- 青色発光機能を有する第1半導体発光素子と緑色及び赤
色発光機能を有する゛第2半導体発光素子とを透明樹脂
にて一体モールドしたことを特徴とする全色発光半導体
装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13380281U JPS5839063U (ja) | 1981-09-08 | 1981-09-08 | 全色発光半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13380281U JPS5839063U (ja) | 1981-09-08 | 1981-09-08 | 全色発光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5839063U true JPS5839063U (ja) | 1983-03-14 |
JPS6246293Y2 JPS6246293Y2 (ja) | 1987-12-12 |
Family
ID=29927248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13380281U Granted JPS5839063U (ja) | 1981-09-08 | 1981-09-08 | 全色発光半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5839063U (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02273482A (ja) * | 1989-04-13 | 1990-11-07 | Nec Corp | Icソケット |
JPH0334258U (ja) * | 1989-08-11 | 1991-04-04 | ||
JPH10256605A (ja) * | 1997-03-13 | 1998-09-25 | Rohm Co Ltd | 半導体発光素子 |
JP2005072628A (ja) * | 2004-12-13 | 2005-03-17 | Rohm Co Ltd | 半導体発光素子 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48102948U (ja) * | 1972-03-09 | 1973-12-03 |
-
1981
- 1981-09-08 JP JP13380281U patent/JPS5839063U/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48102948U (ja) * | 1972-03-09 | 1973-12-03 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02273482A (ja) * | 1989-04-13 | 1990-11-07 | Nec Corp | Icソケット |
JPH0334258U (ja) * | 1989-08-11 | 1991-04-04 | ||
JPH10256605A (ja) * | 1997-03-13 | 1998-09-25 | Rohm Co Ltd | 半導体発光素子 |
JP2005072628A (ja) * | 2004-12-13 | 2005-03-17 | Rohm Co Ltd | 半導体発光素子 |
Also Published As
Publication number | Publication date |
---|---|
JPS6246293Y2 (ja) | 1987-12-12 |
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