JPS6052643U - 多色発光半導体装置 - Google Patents

多色発光半導体装置

Info

Publication number
JPS6052643U
JPS6052643U JP1983143628U JP14362883U JPS6052643U JP S6052643 U JPS6052643 U JP S6052643U JP 1983143628 U JP1983143628 U JP 1983143628U JP 14362883 U JP14362883 U JP 14362883U JP S6052643 U JPS6052643 U JP S6052643U
Authority
JP
Japan
Prior art keywords
light emitting
emitting semiconductor
semiconductor device
semiconductor chips
multicolor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983143628U
Other languages
English (en)
Inventor
根来　立彦
進 武田
Original Assignee
スタンレー電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スタンレー電気株式会社 filed Critical スタンレー電気株式会社
Priority to JP1983143628U priority Critical patent/JPS6052643U/ja
Publication of JPS6052643U publication Critical patent/JPS6052643U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の複数色発光半導体装置を示す一部断面正
面図、第２図は同じく回路図、第３図乃至第７図はこの
考案に係わるもので、第３図は一実施例を示す一部断面
正面図、第４図は同じく平を面図、第５図は同じく斜視
図、第６図は他の実施例を示す一部断面正面図、第７図
は第３図および第６図に示した装置の回路図である。 ８．２１・・・・・・中央リード端子、８ｂ・・・・・
・上端面、９，１０・・・・・・リード端子、１１，１
２，１３．１４・・・・・・発光半導体チップ、ｌｌａ
、１２ａｔ　　１３　ａ？　　１４　ａ””裏面電極、
ｌｌｂ、１２ｂ、１３ｂ、１４ｂ・・・・・・表面電極
、１９・・・・・・レンズ部。 第４図 第５図

Claims (1)

    【実用新案登録請求の範囲】
  1. 発光色の異なる多数の発光半導体チップのうち、その裏
    面電極が互に逆極性となる発光半導体チップを一対づつ
    同一中央リード端子の上端面に併置してダイボンドし、
    前記中央リード端子に対設した複数のリード端子の１本
    づつに前記一対づつの発光半導体チップの表面電極をそ
    れぞれワイヤボンドするとともに、レンズ部は透光性の
    樹脂によってモールドしたことを特徴とする多色発光半
    導体装置。
JP1983143628U 1983-09-19 1983-09-19 多色発光半導体装置 Pending JPS6052643U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983143628U JPS6052643U (ja) 1983-09-19 1983-09-19 多色発光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983143628U JPS6052643U (ja) 1983-09-19 1983-09-19 多色発光半導体装置

Publications (1)

Publication Number Publication Date
JPS6052643U true JPS6052643U (ja) 1985-04-13

Family

ID=30320548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983143628U Pending JPS6052643U (ja) 1983-09-19 1983-09-19 多色発光半導体装置

Country Status (1)

Country Link
JP (1) JPS6052643U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS566557A (en) * 1979-06-29 1981-01-23 Nippon Telegr & Teleph Corp <Ntt> Telephone with redialing function

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS566557A (en) * 1979-06-29 1981-01-23 Nippon Telegr & Teleph Corp <Ntt> Telephone with redialing function

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