JPS6052645U - 二色発光半導体装置 - Google Patents
二色発光半導体装置Info
- Publication number
- JPS6052645U JPS6052645U JP1984108914U JP10891484U JPS6052645U JP S6052645 U JPS6052645 U JP S6052645U JP 1984108914 U JP1984108914 U JP 1984108914U JP 10891484 U JP10891484 U JP 10891484U JP S6052645 U JPS6052645 U JP S6052645U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting semiconductor
- semiconductor device
- semiconductor chips
- color light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来の二色発光半導体装置を示す一部断面側面
図、第2図は第1図に示す装置の結線図、第3図乃至第
7図はこの考案電装置に係わる ゛もので、第3図は一
実施例を示す一部断面側面図、第4図は同じく平面図、
第5図は同じく斜視図、第6図は第3図に示した装置の
結線図、第7 図は他の実施例を示す一部断面側面
図である。 8.9・・・・・・リード端子、8ay9a・・・・・
・上端面、10・・−・・・モールド部、11.12・
・・・・・発光半導体チップ、lla、12a・・・・
・・裏面電極、11b、12b・・・・・・表面電極。 第4図 第5図 第6図
図、第2図は第1図に示す装置の結線図、第3図乃至第
7図はこの考案電装置に係わる ゛もので、第3図は一
実施例を示す一部断面側面図、第4図は同じく平面図、
第5図は同じく斜視図、第6図は第3図に示した装置の
結線図、第7 図は他の実施例を示す一部断面側面
図である。 8.9・・・・・・リード端子、8ay9a・・・・・
・上端面、10・・−・・・モールド部、11.12・
・・・・・発光半導体チップ、lla、12a・・・・
・・裏面電極、11b、12b・・・・・・表面電極。 第4図 第5図 第6図
Claims (1)
- 発光色の異なる2個の発光半導体チップを有した二色発
光半導体装置において、上端が[状に形成された一方の
リード端子の上端面に、発光色の異なる2個の発光半導
体チップを互に異なる極性の裏面電極側でかつ該半導体
装置の中心軸に近接配置してダイボンドし、前記各発光
半導体チップの表面電極は他方のリード端子の上端面に
ワイヤボンドするとともに、前記各発光半導体チップを
一体に透光性の樹脂によってモールドしたことを特徴と
する二色発光半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984108914U JPS6052645U (ja) | 1984-07-20 | 1984-07-20 | 二色発光半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984108914U JPS6052645U (ja) | 1984-07-20 | 1984-07-20 | 二色発光半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6052645U true JPS6052645U (ja) | 1985-04-13 |
Family
ID=30253920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984108914U Pending JPS6052645U (ja) | 1984-07-20 | 1984-07-20 | 二色発光半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6052645U (ja) |
-
1984
- 1984-07-20 JP JP1984108914U patent/JPS6052645U/ja active Pending
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