JPH0463661U - - Google Patents

Info

Publication number
JPH0463661U
JPH0463661U JP10656090U JP10656090U JPH0463661U JP H0463661 U JPH0463661 U JP H0463661U JP 10656090 U JP10656090 U JP 10656090U JP 10656090 U JP10656090 U JP 10656090U JP H0463661 U JPH0463661 U JP H0463661U
Authority
JP
Japan
Prior art keywords
wiring conductor
light emitting
emitting element
wall side
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10656090U
Other languages
English (en)
Other versions
JP2508409Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10656090U priority Critical patent/JP2508409Y2/ja
Publication of JPH0463661U publication Critical patent/JPH0463661U/ja
Application granted granted Critical
Publication of JP2508409Y2 publication Critical patent/JP2508409Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す表面実装型発光
ダイオード装置の平面図、第２図は第１図の−
線に沿う断面図、第３図は第１図の−線に
沿う断面図、第４図は側面図、第５図は底面図、
第６図は従来の発光ダイオードの断面図である。 ４１……絶縁性基板、５５……凹部、５６，５
７，５９，６０……壁面、６１……第１の配線導
体、６３……第２の配線導体、６５……第３の配
線導体、４２，４３，４４……発光ダイオードチ
ツプ（発光素子）。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁性基板の一方の主面に形成された凹部の一
    方の壁面側とこれに対向する他方の壁面側とにそ
    れぞれ光反射性を有する第１の配線導体と第２の
    配線導体とが形成され、前記第１の配線導体と前
    記第２の配線導体の間には第３の配線導体が形成
    されており、前記第１及び第２の配線導体には相
    対的に輝度の大きい発光素子が電気的に接続され
    、前記第３の配線導体には相対的に輝度の小さい
    発光素子が電気的に接続されていることを特徴と
    する発光表示装置。
JP10656090U 1990-10-12 1990-10-12 発光表示装置 Expired - Lifetime JP2508409Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10656090U JP2508409Y2 (ja) 1990-10-12 1990-10-12 発光表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10656090U JP2508409Y2 (ja) 1990-10-12 1990-10-12 発光表示装置

Publications (2)

Publication Number Publication Date
JPH0463661U true JPH0463661U (ja) 1992-05-29
JP2508409Y2 JP2508409Y2 (ja) 1996-08-21

Family

ID=31852700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10656090U Expired - Lifetime JP2508409Y2 (ja) 1990-10-12 1990-10-12 発光表示装置

Country Status (1)

Country Link
JP (1) JP2508409Y2 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024238A (ja) * 1999-07-07 2001-01-26 Citizen Electronics Co Ltd 多色発光ダイオード
WO2001013437A1 (fr) * 1999-08-12 2001-02-22 Rohm Co., Ltd. Dispositif electroluminescent a semi-conducteur a puce
JP2002111065A (ja) * 2000-09-26 2002-04-12 Rohm Co Ltd 半導体発光装置
JP2005277380A (ja) * 2004-02-23 2005-10-06 Stanley Electric Co Ltd Ｌｅｄ及びその製造方法
JP2009135484A (ja) * 2007-11-09 2009-06-18 Hitachi Chem Co Ltd 光半導体装置
JP2011155311A (ja) * 2011-05-16 2011-08-11 Citizen Electronics Co Ltd チップ型発光ダイオード

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024238A (ja) * 1999-07-07 2001-01-26 Citizen Electronics Co Ltd 多色発光ダイオード
WO2001013437A1 (fr) * 1999-08-12 2001-02-22 Rohm Co., Ltd. Dispositif electroluminescent a semi-conducteur a puce
JP2002111065A (ja) * 2000-09-26 2002-04-12 Rohm Co Ltd 半導体発光装置
JP4565723B2 (ja) * 2000-09-26 2010-10-20 ローム株式会社 半導体発光装置
JP2005277380A (ja) * 2004-02-23 2005-10-06 Stanley Electric Co Ltd Ｌｅｄ及びその製造方法
JP4572312B2 (ja) * 2004-02-23 2010-11-04 スタンレー電気株式会社 Ｌｅｄ及びその製造方法
JP2009135484A (ja) * 2007-11-09 2009-06-18 Hitachi Chem Co Ltd 光半導体装置
JP2011155311A (ja) * 2011-05-16 2011-08-11 Citizen Electronics Co Ltd チップ型発光ダイオード

Also Published As

Publication number Publication date
JP2508409Y2 (ja) 1996-08-21

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