JPH01160864U - - Google Patents
Info
- Publication number
- JPH01160864U JPH01160864U JP4871488U JP4871488U JPH01160864U JP H01160864 U JPH01160864 U JP H01160864U JP 4871488 U JP4871488 U JP 4871488U JP 4871488 U JP4871488 U JP 4871488U JP H01160864 U JPH01160864 U JP H01160864U
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- reflective surface
- shaped
- emitted
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は本考案実施例の断面構造を示す図、第
2図は本考案実施例の部分断面構造を示す図、第
3図はLEDの発光径と熱抵抗値との関係を示す
図、第4図は従来例の断面構造を示す図、第5図
は従来例の部分構造を示す斜視図、第6図は従来
例の部分断面構造を示す図である。 1…LEDチツプ、2…キヤンパツケージ、3
…光透過性樹脂。
2図は本考案実施例の部分断面構造を示す図、第
3図はLEDの発光径と熱抵抗値との関係を示す
図、第4図は従来例の断面構造を示す図、第5図
は従来例の部分構造を示す斜視図、第6図は従来
例の部分断面構造を示す図である。 1…LEDチツプ、2…キヤンパツケージ、3
…光透過性樹脂。
Claims (1)
- カツプ状のパツケージの底部から突出した部分
にLEDチツプが搭載され、上記LEDチツプを
囲む上記パツケージの内面はLEDチツプの発光
を前面に射出するように弧状の反射面を形成し、
上記LEDチツプと反射面とがレンズ状に樹脂モ
ールドされた構造である発光ダイオードランプ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4871488U JPH01160864U (ja) | 1988-04-11 | 1988-04-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4871488U JPH01160864U (ja) | 1988-04-11 | 1988-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01160864U true JPH01160864U (ja) | 1989-11-08 |
Family
ID=31274849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4871488U Pending JPH01160864U (ja) | 1988-04-11 | 1988-04-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01160864U (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005039193A (ja) * | 2003-06-26 | 2005-02-10 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
WO2005029597A1 (ja) * | 2003-09-19 | 2005-03-31 | Matsushita Electric Industrial Co., Ltd. | 照明装置 |
JP2005159263A (ja) * | 2003-10-30 | 2005-06-16 | Kyocera Corp | 発光装置および照明装置 |
JP2005174997A (ja) * | 2003-12-08 | 2005-06-30 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005210042A (ja) * | 2003-09-11 | 2005-08-04 | Kyocera Corp | 発光装置および照明装置 |
JP2006156603A (ja) * | 2004-11-26 | 2006-06-15 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
-
1988
- 1988-04-11 JP JP4871488U patent/JPH01160864U/ja active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005039193A (ja) * | 2003-06-26 | 2005-02-10 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
JP2005210042A (ja) * | 2003-09-11 | 2005-08-04 | Kyocera Corp | 発光装置および照明装置 |
WO2005029597A1 (ja) * | 2003-09-19 | 2005-03-31 | Matsushita Electric Industrial Co., Ltd. | 照明装置 |
JPWO2005029597A1 (ja) * | 2003-09-19 | 2006-11-30 | 松下電器産業株式会社 | 照明装置 |
JP4676335B2 (ja) * | 2003-09-19 | 2011-04-27 | パナソニック株式会社 | 照明装置 |
JP2005159263A (ja) * | 2003-10-30 | 2005-06-16 | Kyocera Corp | 発光装置および照明装置 |
JP2005174997A (ja) * | 2003-12-08 | 2005-06-30 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2006156603A (ja) * | 2004-11-26 | 2006-06-15 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
JP4601404B2 (ja) * | 2004-11-26 | 2010-12-22 | 京セラ株式会社 | 発光装置および照明装置 |