JPS634010U - - Google Patents

Info

Publication number
JPS634010U
JPS634010U JP1986097628U JP9762886U JPS634010U JP S634010 U JPS634010 U JP S634010U JP 1986097628 U JP1986097628 U JP 1986097628U JP 9762886 U JP9762886 U JP 9762886U JP S634010 U JPS634010 U JP S634010U
Authority
JP
Japan
Prior art keywords
lighting device
substrate
transparent resin
recesses
semiconductor chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986097628U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986097628U priority Critical patent/JPS634010U/ja
Publication of JPS634010U publication Critical patent/JPS634010U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る照明装置の一実施例を示
す要部断面図、第２図はインナーレンズと画成部
材の要部斜視図、第３図は本考案の他の実施例を
示す要部断面図、第４図は照明装置の従来例を示
す要部断面図、第５図は同じく照明装置の他の従
来例を示す要部断面図、第６図は画成部材の斜視
図である。 ２……前面レンズ、３……拡散レンズ、６……
基板、２０……灯具本体、２２……インナーレン
ズ、２３……発光ダイオード、２４……画成部材
、２５……透明樹脂、２７……集光レンズ、３２
……半導体チツプ、３４……収納凹部、２５Ｂ…
…ドーム部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板に配設された多数の半導体チツプを備え、
    これらのチツプを光源として使用する照明装置に
    おいて、前記各半導体チツプを収納する複数個の
    収納凹部を有しかつ該凹部の内壁面が反射面を構
    成する画成部材を前記基板に配設すると共に前記
    各収納凹部内に透明樹脂を該凹部の背面側開口端
    縁を境界として充填して前記半導体チツプをモー
    ルドし、該透明樹脂の光端部表面をドーム状に形
    成したことを特徴とする照明装置。
JP1986097628U 1986-06-27 1986-06-27 Pending JPS634010U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986097628U JPS634010U (ja) 1986-06-27 1986-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986097628U JPS634010U (ja) 1986-06-27 1986-06-27

Publications (1)

Publication Number Publication Date
JPS634010U true JPS634010U (ja) 1988-01-12

Family

ID=30964776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986097628U Pending JPS634010U (ja) 1986-06-27 1986-06-27

Country Status (1)

Country Link
JP (1) JPS634010U (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005029597A1 (ja) * 2003-09-19 2005-03-31 Matsushita Electric Industrial Co., Ltd. 照明装置
JP2006214888A (ja) * 2005-02-03 2006-08-17 Ccs Inc 光照射装置
JP2007180234A (ja) * 2005-12-27 2007-07-12 Matsushita Electric Ind Co Ltd 発光光源及び照明器具
JP2008010228A (ja) * 2006-06-28 2008-01-17 Koito Mfg Co Ltd 車両用灯具
JP2008277607A (ja) * 2007-05-01 2008-11-13 Matsushita Electric Ind Co Ltd 発光装置、線状発光装置、面状発光装置、液晶表示装置および電子機器
JP2010086726A (ja) * 2008-09-30 2010-04-15 Ushio Inc 光源ユニット及び該光源ユニットを具備した露光装置
JP2015149307A (ja) * 2015-05-25 2015-08-20 株式会社小糸製作所 発光モジュールおよび車両用灯具
JP2016225666A (ja) * 2016-10-06 2016-12-28 日立化成株式会社 光半導体素子搭載用基板および光半導体装置
JP2018053264A (ja) * 2017-12-27 2018-04-05 日立化成株式会社 光半導体素子搭載用基板および光半導体装置
CN109560181A (zh) * 2018-11-16 2019-04-02 重庆秉为科技有限公司 一种led封装结构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6188402A (ja) * 1984-10-08 1986-05-06 株式会社小糸製作所 車輛用灯具

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6188402A (ja) * 1984-10-08 1986-05-06 株式会社小糸製作所 車輛用灯具

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2005029597A1 (ja) * 2003-09-19 2006-11-30 松下電器産業株式会社 照明装置
WO2005029597A1 (ja) * 2003-09-19 2005-03-31 Matsushita Electric Industrial Co., Ltd. 照明装置
KR101109899B1 (ko) * 2003-09-19 2012-01-31 파나소닉 주식회사 조명장치
JP4676335B2 (ja) * 2003-09-19 2011-04-27 パナソニック株式会社 照明装置
JP4498160B2 (ja) * 2005-02-03 2010-07-07 シーシーエス株式会社 光照射装置
JP2006214888A (ja) * 2005-02-03 2006-08-17 Ccs Inc 光照射装置
JP2007180234A (ja) * 2005-12-27 2007-07-12 Matsushita Electric Ind Co Ltd 発光光源及び照明器具
JP2008010228A (ja) * 2006-06-28 2008-01-17 Koito Mfg Co Ltd 車両用灯具
JP2008277607A (ja) * 2007-05-01 2008-11-13 Matsushita Electric Ind Co Ltd 発光装置、線状発光装置、面状発光装置、液晶表示装置および電子機器
JP2010086726A (ja) * 2008-09-30 2010-04-15 Ushio Inc 光源ユニット及び該光源ユニットを具備した露光装置
JP2015149307A (ja) * 2015-05-25 2015-08-20 株式会社小糸製作所 発光モジュールおよび車両用灯具
JP2016225666A (ja) * 2016-10-06 2016-12-28 日立化成株式会社 光半導体素子搭載用基板および光半導体装置
JP2018053264A (ja) * 2017-12-27 2018-04-05 日立化成株式会社 光半導体素子搭載用基板および光半導体装置
CN109560181A (zh) * 2018-11-16 2019-04-02 重庆秉为科技有限公司 一种led封装结构

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