JPH0238757U - - Google Patents

Info

Publication number
JPH0238757U
JPH0238757U JP11771588U JP11771588U JPH0238757U JP H0238757 U JPH0238757 U JP H0238757U JP 11771588 U JP11771588 U JP 11771588U JP 11771588 U JP11771588 U JP 11771588U JP H0238757 U JPH0238757 U JP H0238757U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
recess
lens
diode chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11771588U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11771588U priority Critical patent/JPH0238757U/ja
Publication of JPH0238757U publication Critical patent/JPH0238757U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Description

【図面の簡単な説明】
第１図〜第４図は本考案の一実施例を示し、第
１図ａおよびｂは、それぞれ第１の凹部が円錐面
の場合の部分縦断正面図およびこの凹部における
赤外光の反射強度の分布図を示し、第２図ａおよ
びｂは、それぞれ第１の凹部が放物面の場合の部
分８断正面図およびこの凹部における赤外光の反
射強度の分布図を示す。第３図ａは主としてレン
ズの形状を示す側面図、第３図ｂはレンズの焦点
を示す拡大図である。第４図は赤外光の光路図を
示し、第４図ａは本実施例のレンズを用いた場合
、第４図ｂは一般的なレンズを用いた場合を示す
。第５図ａは従来の赤外発光ダイオードの基本的
な構造図を、第５図ｂは凹部における赤外光の反
射強度の分布図を、第５ｃは凹部近辺の拡大図を
それぞれ示す。第６図ａは赤外発光ダイオードチ
ツプの構造図を示し、第６図ｂは、赤外発光ダイ
オードチツプが発する赤外光の強度分布図を示す
。 １……赤外発光ダイオード、２……凹部、４…
…赤外発光ダイオードチツプ、６……レンズ、９
……凹部、ａ，ｂ……球。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一端部分に第１の凹部を形成したリードフレー
    ムと、前記凹部に設けた発光ダイオードチツプと
    、この発光ダイオードチツプと前記リードフレー
    ムの他端部分を除いた部分を一体として封止した
    透光性樹脂のレンズとを具備した発光ダイオード
    において、前記発光ダイオードチツプを前記第１
    の凹部の底部に形成した第２の凹部に取り付け、
    且つ前記レンズの先端部分は、半径の異なる二つ
    の球を部分的に合成して形成したことを特徴とす
    る発光ダイオード。
JP11771588U 1988-09-07 1988-09-07 Pending JPH0238757U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11771588U JPH0238757U (ja) 1988-09-07 1988-09-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11771588U JPH0238757U (ja) 1988-09-07 1988-09-07

Publications (1)

Publication Number Publication Date
JPH0238757U true JPH0238757U (ja) 1990-03-15

Family

ID=31361415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11771588U Pending JPH0238757U (ja) 1988-09-07 1988-09-07

Country Status (1)

Country Link
JP (1) JPH0238757U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006013265A (ja) * 2004-06-28 2006-01-12 Kyocera Corp 発光装置およびそれを用いた照明装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006013265A (ja) * 2004-06-28 2006-01-12 Kyocera Corp 発光装置およびそれを用いた照明装置
JP4574248B2 (ja) * 2004-06-28 2010-11-04 京セラ株式会社 発光装置およびそれを用いた照明装置

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