JPS62196365U - - Google Patents
Info
- Publication number
- JPS62196365U JPS62196365U JP8411086U JP8411086U JPS62196365U JP S62196365 U JPS62196365 U JP S62196365U JP 8411086 U JP8411086 U JP 8411086U JP 8411086 U JP8411086 U JP 8411086U JP S62196365 U JPS62196365 U JP S62196365U
- Authority
- JP
- Japan
- Prior art keywords
- light
- reflecting
- emitting element
- semiconductor device
- optical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Description
第1図は本考案の光半導体装置の断面図、第2
図は本考案の光半導体装置における光の放射の説
明図、第3図は従来の光半導体装置の断面図、第
4図は従来の光半導体装置における光の放射の説
明図である。 11…光反射側面、11a…光反射面のステツ
プ面、11b…第2の斜面、12,102…―
族化合物半導体の発光素子、101…光反射側
面、103…導電性接着樹脂、T,t…発光素子
の厚さ。
図は本考案の光半導体装置における光の放射の説
明図、第3図は従来の光半導体装置の断面図、第
4図は従来の光半導体装置における光の放射の説
明図である。 11…光反射側面、11a…光反射面のステツ
プ面、11b…第2の斜面、12,102…―
族化合物半導体の発光素子、101…光反射側
面、103…導電性接着樹脂、T,t…発光素子
の厚さ。
Claims (1)
- カツプ型の光反射面の底面に―族化合物半
導体の発光素子を配置しこの発光素子の側方発光
を上記光反射側面によつて発光素子の主面と垂直
方向に放射する光半導体装置において、カツプ型
の光反射面が光反射側面の開拡端から外方へステ
ツプ面を介して上記光反射側面と平行に延長され
た延長側面を有することを特徴とする光半導体装
置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8411086U JPS62196365U (ja) | 1986-06-04 | 1986-06-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8411086U JPS62196365U (ja) | 1986-06-04 | 1986-06-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62196365U true JPS62196365U (ja) | 1987-12-14 |
Family
ID=30938311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8411086U Pending JPS62196365U (ja) | 1986-06-04 | 1986-06-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62196365U (ja) |
-
1986
- 1986-06-04 JP JP8411086U patent/JPS62196365U/ja active Pending
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