JPH01139664U - - Google Patents
Info
- Publication number
- JPH01139664U JPH01139664U JP3578688U JP3578688U JPH01139664U JP H01139664 U JPH01139664 U JP H01139664U JP 3578688 U JP3578688 U JP 3578688U JP 3578688 U JP3578688 U JP 3578688U JP H01139664 U JPH01139664 U JP H01139664U
- Authority
- JP
- Japan
- Prior art keywords
- curvature
- light emitting
- emitting element
- reflecting surface
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005286 illumination Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Facsimile Scanning Arrangements (AREA)
Description
第１図はこの考案の第一の実施例を示す側面図
、第２図はこの考案の第二の実施例を示す側面図
、第３図はこの考案の第三の実施例を示す側面図
、第４図はその樹脂部材に蒸着面を施した場合の
様子を示す側面図、第５図は従来例を示す発光ダ
イオードの側面図、第６図は従来例を示す照明装
置の側面図、第７図は発光素子の発光指向特性を
示す特性図である。 １……発光素子、６……樹脂部材、７……曲率
反射面、８……曲率集光面。
、第２図はこの考案の第二の実施例を示す側面図
、第３図はこの考案の第三の実施例を示す側面図
、第４図はその樹脂部材に蒸着面を施した場合の
様子を示す側面図、第５図は従来例を示す発光ダ
イオードの側面図、第６図は従来例を示す照明装
置の側面図、第７図は発光素子の発光指向特性を
示す特性図である。 １……発光素子、６……樹脂部材、７……曲率
反射面、８……曲率集光面。
Claims (1)
- 発光素子を用いた原稿読取り用スキヤナの照明
装置において、前記発光素子から発散する光を反
射する曲率反射面とこの曲率反射面により反射さ
れた光を集光する曲率集光面とを有する樹脂部材
を設けたことを特徴とする照明装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3578688U JPH01139664U (ja) | 1988-03-17 | 1988-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3578688U JPH01139664U (ja) | 1988-03-17 | 1988-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139664U true JPH01139664U (ja) | 1989-09-25 |
Family
ID=31262423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3578688U Pending JPH01139664U (ja) | 1988-03-17 | 1988-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139664U (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8858004B2 (en) | 2005-12-22 | 2014-10-14 | Cree, Inc. | Lighting device |
| US8901585B2 (en) | 2003-05-01 | 2014-12-02 | Cree, Inc. | Multiple component solid state white light |
| US9431589B2 (en) | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
-
1988
- 1988-03-17 JP JP3578688U patent/JPH01139664U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8901585B2 (en) | 2003-05-01 | 2014-12-02 | Cree, Inc. | Multiple component solid state white light |
| US8858004B2 (en) | 2005-12-22 | 2014-10-14 | Cree, Inc. | Lighting device |
| US9431589B2 (en) | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |