JPH0485757U - - Google Patents
Info
- Publication number
- JPH0485757U JPH0485757U JP12850690U JP12850690U JPH0485757U JP H0485757 U JPH0485757 U JP H0485757U JP 12850690 U JP12850690 U JP 12850690U JP 12850690 U JP12850690 U JP 12850690U JP H0485757 U JPH0485757 U JP H0485757U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- insulating substrate
- emitting device
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す発光装置の平
面図、第２図は第１図のＡ−Ａ断面図、第３図は
第１図のＢ−Ｂ断面図、第４図は同じくその指向
特性を示す図、第５図は従来の発光装置を示す断
面図、第６図は同じくその指向特性を示す図であ
る。 １０……絶縁基板、１１……発光素子、１２…
…集光レンズ、１３……凹部、１８……反射面。
面図、第２図は第１図のＡ−Ａ断面図、第３図は
第１図のＢ−Ｂ断面図、第４図は同じくその指向
特性を示す図、第５図は従来の発光装置を示す断
面図、第６図は同じくその指向特性を示す図であ
る。 １０……絶縁基板、１１……発光素子、１２…
…集光レンズ、１３……凹部、１８……反射面。
Claims (1)
- 絶縁基板と、該絶縁基板上に搭載される発光素
子と、該発光素子上に配され発光素子から出射さ
れた光を集光する集光レンズとを備えた発光装置
において、前記絶縁基板に、発光素子を搭載する
ための搭載用凹部が設けられ、該凹部に、発光素
子から出射された光が横方向に通り抜けるのを防
止して集光レンズ側に反射させる反射面が形成さ
れたことを特徴とする発光装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12850690U JPH0485757U (ja) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12850690U JPH0485757U (ja) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485757U true JPH0485757U (ja) | 1992-07-24 |
Family
ID=31875965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12850690U Pending JPH0485757U (ja) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485757U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1174420A (ja) * | 1997-08-28 | 1999-03-16 | Citizen Electron Co Ltd | 表面実装型チップ部品及びその製造方法 |
-
1990
- 1990-11-29 JP JP12850690U patent/JPH0485757U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1174420A (ja) * | 1997-08-28 | 1999-03-16 | Citizen Electron Co Ltd | 表面実装型チップ部品及びその製造方法 |