JPH0298659U - - Google Patents

Info

Publication number
JPH0298659U
JPH0298659U JP654989U JP654989U JPH0298659U JP H0298659 U JPH0298659 U JP H0298659U JP 654989 U JP654989 U JP 654989U JP 654989 U JP654989 U JP 654989U JP H0298659 U JPH0298659 U JP H0298659U
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
view
side edge
sided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP654989U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP654989U priority Critical patent/JPH0298659U/ja
Publication of JPH0298659U publication Critical patent/JPH0298659U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図は本考案によるSMT半導体装置の一実
施例を示すもので、Aは平面図、Bは断面図、C
は右側面図、第2図A,Bはそれぞれ第1図の実
施例における反射部材の変形例を示す概略断面図
である。第3図は従来のSMT半導体装置の一例
を示すもので、Aは平面図、Bは断面図、Cは右
側面図である。 10……SMT半導体装置、11……基板、1
1a……側縁、12……アノード、13……カソ
ード、14……LEDチツプ、15……外側形状
、16……反射部材、16a……反射面。

Claims (1)

    【実用新案登録請求の範囲】
  1. 両面スルーホールの基板上に半導体素子のチツ
    プを取り付けた表面実装型半導体装置において、
    上記基板の上面の側縁の少なくとも一方に沿つて
    、上方へ立ち上がる反射面が備えられていること
    を特徴とする、表面実装型半導体装置。
JP654989U 1989-01-25 1989-01-25 Pending JPH0298659U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP654989U JPH0298659U (ja) 1989-01-25 1989-01-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP654989U JPH0298659U (ja) 1989-01-25 1989-01-25

Publications (1)

Publication Number Publication Date
JPH0298659U true JPH0298659U (ja) 1990-08-06

Family

ID=31210823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP654989U Pending JPH0298659U (ja) 1989-01-25 1989-01-25

Country Status (1)

Country Link
JP (1) JPH0298659U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000055926A1 (en) * 1999-03-18 2000-09-21 Rohm Co., Ltd. Light-emitting semiconductor chip
JP2016171333A (ja) * 2016-05-06 2016-09-23 東芝ライテック株式会社 照明装置、および車両用灯具

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045453B2 (ja) * 1978-04-13 1985-10-09 日本電気株式会社 多重プロセツサ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045453B2 (ja) * 1978-04-13 1985-10-09 日本電気株式会社 多重プロセツサ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000055926A1 (en) * 1999-03-18 2000-09-21 Rohm Co., Ltd. Light-emitting semiconductor chip
JP2016171333A (ja) * 2016-05-06 2016-09-23 東芝ライテック株式会社 照明装置、および車両用灯具

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