JPWO2010122888A1 - Antenna device - Google Patents

Antenna device Download PDF

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JPWO2010122888A1
JPWO2010122888A1 JP2011510276A JP2011510276A JPWO2010122888A1 JP WO2010122888 A1 JPWO2010122888 A1 JP WO2010122888A1 JP 2011510276 A JP2011510276 A JP 2011510276A JP 2011510276 A JP2011510276 A JP 2011510276A JP WO2010122888 A1 JPWO2010122888 A1 JP WO2010122888A1
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conductor
conductor layer
coil
antenna
opening
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JP5360202B2 (en
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加藤　登
登 加藤
勝己 谷口
勝己 谷口
佐々木　純
純 佐々木
直樹 郷地
直樹 郷地
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2216—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in interrogator/reader equipment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
    • H01Q19/062—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens for focusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/04—Screened antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H04B5/26—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

Abstract

通信相手側のアンテナに比べて相対的に小型化しても、また、通信する２つのアンテナを同軸上に近接配置しても、安定した通信が行えるようにし、さらに通信可能最大距離も大きくできるようにしたアンテナ装置を構成する。アンテナコイルモジュール（３）のコイル開口部（ＣＷ）と導体層（２）の導体開口部（ＣＡ）とは少なくとも一部で重なっている。コイル開口部（ＣＷ）を通過しようとする磁束（ＭＦ）は導体開口部（ＣＡ）を通過する。一方、導体層（２）には磁束が透過しないので、導体層（２）の導体開口部（ＣＡ）を内側、導体層（２）の外縁を外側とする経路で磁束（ＭＦ）が迂回しようとする。その結果、アンテナコイルモジュール（３）のコイル開口部（ＣＷ）を通過する磁束ＭＦは相対的に大きなループを描き、リーダ・ライタ側アンテナ（４）のコイル導体（４１）の内外を鎖交する。Even if the antenna is relatively small compared to the antenna on the other end of the communication, and even if two communicating antennas are arranged close to each other on the same axis, stable communication can be performed and the maximum communicable distance can be increased. An antenna device is configured. The coil opening (CW) of the antenna coil module (3) and the conductor opening (CA) of the conductor layer (2) overlap at least partially. The magnetic flux (MF) trying to pass through the coil opening (CW) passes through the conductor opening (CA). On the other hand, since the magnetic flux does not permeate the conductor layer (2), the magnetic flux (MF) will bypass the path with the conductor opening (CA) of the conductor layer (2) inside and the outer edge of the conductor layer (2) outside. And As a result, the magnetic flux MF passing through the coil opening (CW) of the antenna coil module (3) draws a relatively large loop, and links the inside and outside of the coil conductor (41) of the reader / writer side antenna (4). .

Description

この発明は、相手側機器と電磁界信号を介して通信するＲＦＩＤシステムや短距離無線通信システムに用いられるアンテナ装置に関するものである。   The present invention relates to an antenna device used in an RFID system or a short-range wireless communication system that communicates with a counterpart device via an electromagnetic field signal.

近年、利用が拡大しているＲＦＩＤシステムや短距離無線通信システムにおいては、携帯電話等の携帯電子機器同士または携帯電子機器とリーダ・ライタとで通信を行うために、各々の機器に通信用のアンテナが搭載されている。これらのアンテナのうち携帯電子機器に搭載されるアンテナについて特許文献１が開示されている。   In recent years, in RFID systems and short-range wireless communication systems that have been increasingly used, in order to communicate between portable electronic devices such as mobile phones or between portable electronic devices and reader / writers, An antenna is installed. Among these antennas, Patent Document 1 discloses an antenna mounted on a portable electronic device.

図１は、特許文献１の携帯情報端末２１とリーダ・ライタ間の近接時における通信の様子を示す図である。図１の例において、リーダ・ライタの送受信アンテナ部２６から放射された電磁波のうち、一部の磁場Ｈが、端末本体２２内のバッテリーパック２５等の金属物による影響を受けて反射、吸収等による減衰作用を受ける。アンテナモジュール１０の通信面ＣＳよりも電磁波の入射側に金属層３０が配置されている。この金属層３０の表面に、外部磁場の印加で誘導電流（渦電流）が発生し、これに起因して生じた磁場Ｈ１が、アンテナモジュール１０のアンテナコイル１５に誘導電流を生じさせる。   FIG. 1 is a diagram illustrating a state of communication when a portable information terminal 21 and a reader / writer in Patent Document 1 are in proximity. In the example of FIG. 1, a part of the magnetic field H out of the electromagnetic waves radiated from the transmission / reception antenna unit 26 of the reader / writer is affected by a metal object such as the battery pack 25 in the terminal body 22 to be reflected, absorbed, etc. It receives a damping action. The metal layer 30 is disposed on the incident side of the electromagnetic wave with respect to the communication surface CS of the antenna module 10. An induced current (eddy current) is generated on the surface of the metal layer 30 by applying an external magnetic field, and the magnetic field H1 generated due to this generates an induced current in the antenna coil 15 of the antenna module 10.

この例では、金属層３０がアンテナコイル１５の一部を覆うように、アンテナモジュール１０に近接対向配置することにより、金属層３０で発生した磁場成分Ｈ１を介してリーダ・ライタの送受信アンテナ部２６とアンテナモジュール１０のアンテナコイル１５との間が誘導結合する。   In this example, the transmission / reception antenna unit 26 of the reader / writer is arranged via the magnetic field component H1 generated in the metal layer 30 by arranging the metal layer 30 close to and facing the antenna module 10 so as to cover a part of the antenna coil 15. And the antenna coil 15 of the antenna module 10 are inductively coupled.

特開２００６−２７０６８１号公報JP 2006-270681 A

図１に示したアンテナ装置は、通信相手側のアンテナとの距離が極めて近接した時にアンテナ同士の中心間の位置ずれの大きさによって通信特性が大きく変動するという問題を解消しようとするものである。携帯情報端末２１側のアンテナモジュール１０のアンテナコイル１５とリーダ・ライタ側の送受信アンテナ部２６とに鎖交しようとする磁束が筐体内バッテリーパック２５等の金属物で遮られるのを解消するために、その磁束を誘導するために金属層３０が設けられている。そのため、前記バッテリーパック２５等の遮蔽物の位置関係によっては大きな効果が得られるとは限らない。
さらに、アンテナ装置と通信相手側のアンテナとが離れた状態で、前記金属層３０が通信距離を拡大するために有効に作用するとは限らない。The antenna device shown in FIG. 1 is intended to solve the problem that the communication characteristics fluctuate greatly depending on the amount of positional deviation between the centers of the antennas when the distance from the antenna on the communication partner side is extremely close. . In order to eliminate the fact that the magnetic flux to be linked to the antenna coil 15 of the antenna module 10 on the portable information terminal 21 side and the transmitting / receiving antenna unit 26 on the reader / writer side is blocked by a metal object such as the battery pack 25 in the housing. In order to induce the magnetic flux, a metal layer 30 is provided. Therefore, depending on the positional relationship of the shielding object such as the battery pack 25, a great effect is not always obtained.
Furthermore, the metal layer 30 does not always work effectively to increase the communication distance in a state where the antenna device and the antenna on the communication partner side are separated.

そこで、この発明の目的は、通信相手側のアンテナに比べて相対的に小型化しても、安定した通信が行えるようにし、さらに通信可能最大距離も大きくできるようにしたアンテナ装置を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide an antenna device that can perform stable communication even when it is relatively downsized compared to the antenna on the communication partner side, and can further increase the maximum communicable distance. is there.

この発明のアンテナ装置は電子機器に構成されるアンテナ装置であって、
巻回中心部をコイル開口部とするループ状または渦巻き状のコイル導体と、導体開口部、及び前記導体開口部と外縁との間を連接するスリット部を備えた導体層と、放射板と、を備え、
前記コイル導体と前記導体層とが電磁界を介して結合し、前記導体層と前記放射板とが電磁界または磁界を介して結合している。The antenna device of the present invention is an antenna device configured in an electronic device,
A loop or spiral coil conductor having a winding center as a coil opening, a conductor opening, a conductor layer having a slit connecting the conductor opening and the outer edge, a radiation plate, With
The coil conductor and the conductor layer are coupled via an electromagnetic field, and the conductor layer and the radiation plate are coupled via an electromagnetic field or a magnetic field.

この発明によれば、コイル導体に電流が流れることにより生じる磁界を遮るように、導体層に電流が流れる。そして、導体層の開口部周囲に流れる電流が、スリット部周辺を通り、縁端効果により導体層周囲に電流が流れる。これにより、導体層から磁界が生じ、通信距離を広げることができる。   According to this invention, the current flows through the conductor layer so as to block the magnetic field generated by the current flowing through the coil conductor. The current flowing around the opening of the conductor layer passes through the periphery of the slit, and the current flows around the conductor layer due to the edge effect. Thereby, a magnetic field is generated from the conductor layer, and the communication distance can be increased.

また、導体層が磁束を大きく周回させるので、アンテナ装置から通信相手側のアンテナまで、または通信相手側のアンテナからアンテナ装置まで磁束が届き、アンテナ装置と通信相手側アンテナとの通信可能最大距離が大きくなる。   In addition, since the conductor layer greatly circulates the magnetic flux, the magnetic flux reaches from the antenna device to the communication partner antenna or from the communication partner antenna to the antenna device, and the maximum communicable distance between the antenna device and the communication partner antenna is increased. growing.

特許文献１の携帯情報端末２１とリーダ・ライタ間の近接時における通信の様子を示す図である。It is a figure which shows the mode of the communication at the time of proximity | contact between the portable information terminal 21 of patent document 1, and a reader / writer. 図２（Ａ）は第１の実施形態に係るアンテナ装置を備える電子機器の背面図である。図２（Ｂ）は背面側の下部筐体の内側の平面図である。FIG. 2A is a rear view of an electronic apparatus including the antenna device according to the first embodiment. FIG. 2B is a plan view of the inside of the lower housing on the back side. 図３（Ａ）はアンテナコイルモジュール３の平面図、図３（Ｂ）はその正面図である。3A is a plan view of the antenna coil module 3, and FIG. 3B is a front view thereof. 図４（Ａ）はアンテナ装置１０１とリーダ・ライタ側アンテナとの磁気的結合状態を示す断面図である。図４（Ｂ）は比較例として、導体層２が存在しない状態を表す断面図である。FIG. 4A is a cross-sectional view showing a magnetic coupling state between the antenna device 101 and the reader / writer side antenna. FIG. 4B is a cross-sectional view showing a state in which the conductor layer 2 does not exist as a comparative example. 第２の実施形態に係るアンテナ装置に関する図である。図５（Ａ）は電子機器の下部筐体１の内面側を見た平面図である。また図５（Ｂ）は下部筐体１の内面にアンテナコイルモジュール３を取り付けた状態での平面図である。It is a figure regarding the antenna device which concerns on 2nd Embodiment. FIG. 5A is a plan view of the inner surface side of the lower housing 1 of the electronic device. FIG. 5B is a plan view in a state where the antenna coil module 3 is attached to the inner surface of the lower housing 1. 第３の実施形態に係るアンテナ装置１０３の平面図である。特に、図６（Ａ）はコイル導体３１に流れる電流、図６（Ｂ）は、導体層２に流れる電流Ｉをそれぞれ示している。It is a top view of the antenna apparatus 103 which concerns on 3rd Embodiment. 6A shows the current flowing through the coil conductor 31, and FIG. 6B shows the current I flowing through the conductor layer 2, respectively. 図７（Ａ）は第４の実施形態に係るアンテナコイルモジュール１３の平面図、図７（Ｂ）はその正面図である。FIG. 7A is a plan view of the antenna coil module 13 according to the fourth embodiment, and FIG. 7B is a front view thereof. 第５の実施形態に係るアンテナ装置１０４の平面図である。It is a top view of the antenna apparatus 104 which concerns on 5th Embodiment. 図９（Ａ）は第６の実施形態に係るアンテナ装置の分解斜視図、図９（Ｂ）はアンテナ装置１０５の平面図である。FIG. 9A is an exploded perspective view of the antenna device according to the sixth embodiment, and FIG. 9B is a plan view of the antenna device 105. 図９に示したアンテナ装置１０５の導体層２と放射板５とに流れる誘導電流の様子を示す図である。It is a figure which shows the mode of the induced current which flows into the conductor layer 2 and the radiation plate 5 of the antenna apparatus 105 shown in FIG. 第７の実施形態に係るアンテナ装置１０６を備えた電子機器の平面図である。It is a top view of electronic equipment provided with antenna device 106 concerning a 7th embodiment. 第８の実施形態に係るアンテナ装置１０７の平面図である。It is a top view of the antenna apparatus 107 which concerns on 8th Embodiment. 第９の実施形態に係るアンテナ装置１０８の平面図である。It is a top view of the antenna apparatus 108 which concerns on 9th Embodiment.

《第１の実施形態》
第１の実施形態に係るアンテナ装置及びその共振周波数設定方法について図２〜図４を参照して説明する。
図２（Ａ）は第１の実施形態に係るアンテナ装置を備える電子機器の背面図である。電子機器の背面は通信相手側であるリーダ・ライタ側アンテナに向ける面である。図２（Ｂ）は前記背面側の下部筐体の内側の平面図である。但し、図２（Ａ），図２（Ｂ）では主要部の構成のみを表している。<< First Embodiment >>
The antenna device and its resonance frequency setting method according to the first embodiment will be described with reference to FIGS.
FIG. 2A is a rear view of an electronic apparatus including the antenna device according to the first embodiment. The rear surface of the electronic device is a surface facing a reader / writer side antenna which is a communication partner side. FIG. 2B is a plan view of the inside of the lower housing on the back side. However, FIGS. 2A and 2B show only the configuration of the main part.

図２（Ａ）に示すように、下部筐体１の外面には導体層２が形成されている。導体層２は例えばアルミニウム等の金属蒸着膜である。この導体層２には導体開口部ＣＡが形成されていて、さらにこの導体開口部ＣＡと外縁との間を連接するスリットＳＬが形成されている。
図２（Ｂ）に示すように、下部筐体１の内面には前記導体開口部ＣＡに部分的に重なるようにアンテナコイルモジュール３が配置されている。As shown in FIG. 2A, a conductor layer 2 is formed on the outer surface of the lower housing 1. The conductor layer 2 is a metal vapor deposition film such as aluminum. The conductor layer 2 is provided with a conductor opening CA, and further, a slit SL is formed to connect the conductor opening CA and the outer edge.
As shown in FIG. 2B, the antenna coil module 3 is disposed on the inner surface of the lower housing 1 so as to partially overlap the conductor opening CA.

なお、この例では導体開口部ＣＡ部分にカメラモジュールが取り付けられる。カメラモジュールのレンズは筐体の開口部から外部へ露出させる必要があるので、導体開口部をこのように筐体に設けた開口部に合わせて配置することによって、導体層２を設けることによる特別な筐体の設計が不要となる。   In this example, a camera module is attached to the conductor opening CA. Since the lens of the camera module needs to be exposed to the outside from the opening of the housing, the special arrangement by providing the conductor layer 2 by arranging the conductor opening in accordance with the opening provided in the housing in this way. The design of a simple housing becomes unnecessary.

また、筐体の外面の一部を意匠上メタリックにするような場合に、筐体の外面に蒸着などによって金属膜が形成されるが、その金属膜を前記導体層として兼用してもよい。   Further, when a part of the outer surface of the housing is made metallic in design, a metal film is formed on the outer surface of the housing by vapor deposition or the like, but the metal film may also be used as the conductor layer.

このように導体層２を電子機器の筐体の内面または外面に形成することによって、導体層２を配置するための特別なスペースを確保する必要がなく、且つ広面積の導体層２を配置できる。   Thus, by forming the conductor layer 2 on the inner surface or the outer surface of the casing of the electronic device, it is not necessary to secure a special space for arranging the conductor layer 2 and the conductor layer 2 having a large area can be arranged. .

図３（Ａ）は前記アンテナコイルモジュール３の平面図、図３（Ｂ）はその正面図である。アンテナコイルモジュール３は、矩形板状のフレキシブル基板３３と、同じく矩形板状の磁性体シート３９とを備えている。フレキシブル基板３３には巻回中心部をコイル開口部ＣＷとする渦巻き状のコイル導体３１及び外部の回路との接続のために用いられる接続部３２が形成されている。磁性体シート３９は例えばシート状に成形したフェライトである。   3A is a plan view of the antenna coil module 3, and FIG. 3B is a front view thereof. The antenna coil module 3 includes a rectangular plate-like flexible substrate 33 and a rectangular plate-like magnetic material sheet 39. The flexible substrate 33 is formed with a spiral coil conductor 31 having a winding center portion as a coil opening CW and a connection portion 32 used for connection to an external circuit. The magnetic sheet 39 is, for example, ferrite formed into a sheet shape.

なお、コイル導体３１の巻回数（ターン数）は必要なインダクタンスによって定める。ワンターンであれば単にループ状のコイル導体となる。   The number of turns (number of turns) of the coil conductor 31 is determined by the required inductance. If it is one turn, it will simply be a looped coil conductor.

前記アンテナコイルモジュール３は、図２（Ｂ）に示したように電子機器の下部筐体１の内面に取り付けられ、上部筐体と重ねられた際に、上部筐体側に取り付けられている回路基板の所定のピンと前記接続部３２が接するように配置されている。   The antenna coil module 3 is attached to the inner surface of the lower housing 1 of the electronic device as shown in FIG. 2B, and is mounted on the upper housing side when it is overlapped with the upper housing. The predetermined pin and the connecting portion 32 are arranged to contact each other.

回路基板側には前記接続部３２に対して並列接続されるキャパシタが備えられている。そして、アンテナコイルモジュール３のコイル導体３１及び磁性体シート３９によって定まるインダクタンスと前記キャパシタのキャパシタンスとによって共振周波数が定められる。例えばFelica（登録商標）などのNFC（Near Field Communication：近距離通信）にアンテナコイルモジュール３を用いて、中心周波数１３．５６ＭＨｚのＨＦ帯を利用する場合には、前記共振周波数を１３．５６ＭＨｚに定める。   A capacitor connected in parallel to the connecting portion 32 is provided on the circuit board side. The resonance frequency is determined by the inductance determined by the coil conductor 31 and the magnetic sheet 39 of the antenna coil module 3 and the capacitance of the capacitor. For example, when the antenna coil module 3 is used for NFC (Near Field Communication) such as Felica (registered trademark) and the HF band having a center frequency of 13.56 MHz is used, the resonance frequency is set to 13.56 MHz. Determine.

図４（Ａ）は前記アンテナ装置１０１とリーダ・ライタ側アンテナとの磁気的結合状態を示す断面図である。また、図４（Ｂ）は比較例として、前記導体層２が存在しない状態を表す断面図である。但し、電子機器の筐体部分については図示を省略している。   FIG. 4A is a cross-sectional view showing a magnetic coupling state between the antenna device 101 and the reader / writer side antenna. FIG. 4B is a cross-sectional view showing a state where the conductor layer 2 does not exist as a comparative example. However, illustration is omitted about the housing | casing part of an electronic device.

アンテナコイルモジュール３のコイル導体３１と導体層２とは少なくとも一部で重なっているので、コイル導体に電流が流れることにより生じる磁界を遮るように、導体層に電流が流れる。すなわち、コイル導体３１と導体層２とが電磁界を介して結合する。そして、導体層の開口部周囲に流れる電流がスリット部周辺を通り、縁端効果により導体層周囲に流れる。なお、電流は導体層平面部にも流れる。これにより、導体層２に磁界が生じるが、導体層２には磁束が透過しないので、導体層２の導体開口部ＣＡを内側、導体層２の外縁を外側とする経路で磁束ＭＦが迂回しようとする。その結果、磁束ＭＦは相対的に大きなループを描き、リーダ・ライタ側アンテナ４のコイル導体４１の内外を鎖交することになる。すなわちアンテナ装置１０１とリーダ・ライタ側アンテナ４とは磁気的に結合する。   Since the coil conductor 31 and the conductor layer 2 of the antenna coil module 3 overlap at least partly, the current flows through the conductor layer so as to block the magnetic field generated by the current flowing through the coil conductor. That is, the coil conductor 31 and the conductor layer 2 are coupled via an electromagnetic field. Then, the current flowing around the opening of the conductor layer passes around the slit and flows around the conductor layer due to the edge effect. In addition, an electric current flows also to a conductor layer plane part. As a result, a magnetic field is generated in the conductor layer 2, but magnetic flux does not pass through the conductor layer 2, so that the magnetic flux MF will bypass the path having the conductor opening CA of the conductor layer 2 inside and the outer edge of the conductor layer 2 outside. And As a result, the magnetic flux MF draws a relatively large loop and links the inside and outside of the coil conductor 41 of the reader / writer side antenna 4. That is, the antenna device 101 and the reader / writer side antenna 4 are magnetically coupled.

なお、コイル導体３１と導体層２とは少なくとも一部で重なっていることが好ましいが、重なっていなくてもコイル導体３１と導体層２とを電磁界を介して結合させることができる。   The coil conductor 31 and the conductor layer 2 are preferably overlapped at least partially, but the coil conductor 31 and the conductor layer 2 can be coupled via an electromagnetic field even if they do not overlap.

また、コイル導体３１を平面視したとき、コイル開口部ＣＷと導体開口部ＣＡとが少なくとも一部で重なっていることにより、コイル導体３１と相手側アンテナとに鎖交しようとする磁束がコイル開口部ＣＷ及び導体開口部ＣＡを通り周回できる。特に、コイル導体３１を平面視したときに、コイル開口部ＣＷと導体開口部ＣＡとが全周にわたってほぼ重なっていれば、コイル導体３１による磁界を効率よく放射させることができる。   Further, when the coil conductor 31 is viewed in plan, the coil opening CW and the conductor opening CA overlap at least partly, so that the magnetic flux to be linked to the coil conductor 31 and the counterpart antenna can be opened in the coil opening. It can circulate through the part CW and the conductor opening CA. In particular, when the coil conductor 31 is viewed in plan, the magnetic field generated by the coil conductor 31 can be efficiently radiated if the coil opening CW and the conductor opening CA are substantially overlapped over the entire circumference.

また、導体層２の面積がコイル導体３１の形成領域の面積より大きいことにより、大きな磁界ループを生じさせることができる。
その上、フレキシブル基板３３の、通信相手側のアンテナより遠い側の面に磁性体シート３９を積層することによって、アンテナの指向性を通信相手側のアンテナ方向により広げることができる。Moreover, since the area of the conductor layer 2 is larger than the area of the formation region of the coil conductor 31, a large magnetic field loop can be generated.
Moreover, by laminating the magnetic sheet 39 on the surface of the flexible substrate 33 farther from the antenna on the communication partner side, the antenna directivity can be expanded in the direction of the antenna on the communication partner side.

このように磁束は導体層２が広がる方向を指向することになるので、アンテナ装置１０１の（アンテナコイルモジュール３の）中心とリーダ・ライタ側アンテナ４の中心を同軸上に配置したまま両者を近接させても安定した通信が可能となる。   Since the magnetic flux is directed in the direction in which the conductor layer 2 spreads in this manner, the center of the antenna device 101 (of the antenna coil module 3) and the center of the reader / writer side antenna 4 are arranged coaxially and close to each other. Stable communication is possible even if it is done.

また、スリットＳＬを導体層２に設けたことによって、導体層２に導体ループが形成されないので、図４（Ａ）に示したように磁束ＭＦが導体層２の導体開口部ＣＡと外縁とを周回した際、導体層２に渦電流が生じるのを阻止でき、渦電流による損失が抑えられる。その結果、アンテナ装置１０１とリーダ・ライタ側アンテナ４との通信可能最大距離を確保することができる。   In addition, since the conductor layer 2 is not provided with the slit SL in the conductor layer 2, the magnetic flux MF causes the conductor opening CA and the outer edge of the conductor layer 2 to be connected to each other as shown in FIG. When it circulates, it can prevent that an eddy current arises in the conductor layer 2, and the loss by an eddy current is suppressed. As a result, the maximum communicable distance between the antenna device 101 and the reader / writer side antenna 4 can be secured.

なお、導体層２に設けられたスリットＳＬによる開放端部に電流が集中すると共に、電位差が生じるため、スリットＳＬ付近で磁界の強度が強くなる。そのため、導体開口部ＣＡから見たスリットＳＬの開放方向へ向く指向性が生じる。そのため、導体開口部ＣＡの中心からスリットＳＬの開放方向への通信距離が大きくなる。例えば図２では下方向の通信距離が大きくなる。このようにして、スリットＳＬの形成位置によって指向性及び通信距離をコントロールすることができる。このことは以降に示す他の実施形態についても同様である。   Note that current concentrates at the open end portion of the slit SL provided in the conductor layer 2 and a potential difference is generated, so that the strength of the magnetic field is increased in the vicinity of the slit SL. Therefore, directivity directed toward the opening direction of the slit SL as viewed from the conductor opening CA occurs. Therefore, the communication distance from the center of the conductor opening CA to the opening direction of the slit SL increases. For example, in FIG. 2, the downward communication distance becomes large. In this way, directivity and communication distance can be controlled by the formation position of the slit SL. The same applies to other embodiments described below.

これに対して、図４（Ｂ）に示すように、前記導体層２が存在しないと、コイル開口部ＣＷを通過する磁束ＭＦは、図４（Ｂ）に示した向きで左右方向（アンテナコイルモジュール３の平面視状態で広がり方向）に広がることがなく、リーダ・ライタ側アンテナ４との結合量は小さい。したがって接近するほどむしろ通信が不安定になるといった現象が生じる。   On the other hand, as shown in FIG. 4B, if the conductor layer 2 is not present, the magnetic flux MF passing through the coil opening CW is in the left-right direction (antenna coil) in the direction shown in FIG. The module 3 does not spread in the planar view state, and the amount of coupling with the reader / writer side antenna 4 is small. Therefore, a phenomenon occurs that communication becomes unstable as the distance from the user increases.

また、本発明のアンテナ装置は、導体層が磁束を大きく周回させるので、アンテナ装置から通信相手側のアンテナまで、または通信相手側のアンテナからアンテナ装置まで磁束が届き、アンテナ装置と通信相手側アンテナとの通信可能最大距離が大きくなる。   In the antenna device of the present invention, since the conductor layer circulates the magnetic flux greatly, the magnetic flux reaches from the antenna device to the antenna on the communication partner side or from the antenna on the communication partner side to the antenna device. The maximum distance that can be communicated with is increased.

次の表は、アンテナコイルモジュール３の大きさを変化させたとき、各アンテナコイルモジュール３を備えるアンテナ装置１０１と通信相手側アンテナとの間で通信可能な距離範囲を測定した結果である。   The following table shows a result of measuring a distance range in which communication is possible between the antenna device 101 including each antenna coil module 3 and the communication partner antenna when the size of the antenna coil module 3 is changed.

―――――――――――――――――――――――――――――――――
アンテナコイルモジュールの大きさ 導体層無し 導体層有り
―――――――――――――――――――――――――――――――――
２２．５ｍｍ×２０ｍｍ ０〜２４ｍｍ ０〜４４ｍｍ
２２．５ｍｍ×１９ｍｍ ０〜２３ｍｍ ０〜４３ｍｍ
２２．５ｍｍ×１８ｍｍ ０〜１９ｍｍ ０〜４１ｍｍ
２２．５ｍｍ×１７ｍｍ − ０〜３９ｍｍ
２２．５ｍｍ×１６ｍｍ − ０〜３８ｍｍ
―――――――――――――――――――――――――――――――――
例えば、大きさ２２．５ｍｍ×１８ｍｍのアンテナコイルモジュール３を備えたアンテナ装置である場合、導体層が無いと通信可能最大距離は１９ｍｍであるのに対し、導体層が有ると通信可能最大距離は４１ｍｍにまで拡大される。また、例えば大きさ２２．５ｍｍ×１７ｍｍ以下のアンテナコイルモジュール３を備えたアンテナ装置である場合、導体層が無いと、どのような距離でも通信不能である。これに対し、導体層が有ると、例えば大きさ２２．５ｍｍ×１６ｍｍという非常に小型のアンテナコイルモジュール３を備えたアンテナ装置を構成しても、０ｍｍから３８ｍｍまでの広範囲にわたって通信可能となる。―――――――――――――――――――――――――――――――――
Antenna coil module size No conductor layer With conductor layer ―――――――――――――――――――――――――――――――――
22.5mm x 20mm 0-24mm 0-44mm
22.5mm × 19mm 0-23mm 0-43mm
22.5mm x 18mm 0-19mm 0-41mm
22.5 mm x 17 mm-0 to 39 mm
22.5 mm x 16 mm-0 to 38 mm
―――――――――――――――――――――――――――――――――
For example, in the case of an antenna device including the antenna coil module 3 having a size of 22.5 mm × 18 mm, the maximum communicable distance is 19 mm without the conductor layer, whereas the communicable maximum distance is 19 mm with the conductor layer. It is enlarged to 41 mm. For example, in the case of an antenna device including the antenna coil module 3 having a size of 22.5 mm × 17 mm or less, communication is impossible at any distance without a conductor layer. On the other hand, if there is a conductor layer, for example, even if an antenna device including a very small antenna coil module 3 having a size of 22.5 mm × 16 mm is configured, communication is possible over a wide range from 0 mm to 38 mm.

前記アンテナ装置１０１の中心周波数の設定は次のように行う。
図２（Ｂ）に示したアンテナコイルモジュール３を導体層２に近接しない状態、すなわち下部筐体１に取り付けない単体状態での（但し、共振用キャパシタを並列接続した状態）での共振周波数を予め利用周波数帯域の中心周波数より低く設定しておく。アンテナコイルモジュール３を図２（Ｂ）及び図４（Ａ）に示したように、導体層２の導体開口部ＣＡに近接させると、アンテナコイルモジュール３のインダクタンス値が小さくなるので、アンテナ装置１０１の共振周波数が上昇する。そのため、アンテナコイルモジュール３を電子機器の筐体内に組み込み、アンテナ装置１０１を構成した状態で、そのアンテナ装置１０１の共振周波数が利用周波数帯域の中心周波数とほぼ一致するように、前記アンテナコイルモジュール３単体でのインダクタンス値を定める。The center frequency of the antenna device 101 is set as follows.
The resonance frequency in a state where the antenna coil module 3 shown in FIG. 2B is not close to the conductor layer 2, that is, in a single state where the antenna coil module 3 is not attached to the lower housing 1 (however, a resonance capacitor is connected in parallel). It is set in advance lower than the center frequency of the use frequency band. As shown in FIG. 2B and FIG. 4A, when the antenna coil module 3 is brought close to the conductor opening CA of the conductor layer 2, the inductance value of the antenna coil module 3 becomes small. The resonance frequency of increases. Therefore, in a state where the antenna coil module 3 is incorporated in the casing of the electronic device and the antenna device 101 is configured, the antenna coil module 3 is set so that the resonance frequency of the antenna device 101 substantially matches the center frequency of the use frequency band. Determine the inductance value of a single unit.

また、スリットＳＬの長さや幅によってもアンテナ装置のインダクタンスが変わる。例えばスリットＳＬを大きくすると、アンテナコイルモジュール３に導体層２を近接させたときのインダクタンス値の減少（共振周波数の上昇）程度が抑えられる。そのため、所望のインダクタンス値を得るように、スリットＳＬの長さ及び幅を設定する。   Further, the inductance of the antenna device also changes depending on the length and width of the slit SL. For example, if the slit SL is made larger, a decrease in inductance value (an increase in resonance frequency) when the conductor layer 2 is brought close to the antenna coil module 3 can be suppressed. Therefore, the length and width of the slit SL are set so as to obtain a desired inductance value.

さらに、アンテナコイルモジュール３と導体層２との位置関係、導体層２の導体開口部ＣＡの形状・大きさによってもアンテナ装置のインダクタンスが変わるので、所望のインダクタンス値を得るように、アンテナコイルモジュール３と導体層２との位置関係、及び導体層２の導体開口部ＣＡの形状・大きさを設定する。   Furthermore, since the inductance of the antenna device also changes depending on the positional relationship between the antenna coil module 3 and the conductor layer 2 and the shape and size of the conductor opening CA of the conductor layer 2, the antenna coil module is obtained so as to obtain a desired inductance value. 3 and the conductor layer 2 and the shape and size of the conductor opening CA of the conductor layer 2 are set.

このように導体層によって磁束ループが広がるので、コイル導体３１のコイル開口部ＣＷを小さくしてもよく、アンテナコイルモジュールは小型化できる。また、コイル開口部ＣＷを小さくすることに伴い、コイルのターン数を多くでき、アンテナコイルモジュールのインダクタンスの採り得る値を多くできる。その結果、共振周波数の設定が容易となる。   Thus, since the magnetic flux loop spreads by the conductor layer, the coil opening CW of the coil conductor 31 may be reduced, and the antenna coil module can be reduced in size. Further, as the coil opening CW is reduced, the number of turns of the coil can be increased, and the value that can be taken by the inductance of the antenna coil module can be increased. As a result, the resonance frequency can be easily set.

以上に述べたように、本発明は、導体層に磁界が進入することができないという特性を利用して、使用周波数で磁界の放射パターンを導体層によって変更させている。
本発明のアンテナ装置１０１によれば、アンテナ装置１０１とリーダ・ライタ側アンテナ４の大きさが様々であっても安定した通信が行える。すなわち、リーダ・ライタ側アンテナ４が大きい場合は、導体層２の存在により磁束が大きく周回し、アンテナ装置１０１からの磁束がリーダ・ライタ側アンテナ１０１に届くし、リーダ・ライタ側アンテナ４が小さい場合には、導体層２の存在より磁束が届く距離が延びる。As described above, in the present invention, the radiation pattern of the magnetic field is changed by the conductor layer at the operating frequency using the characteristic that the magnetic field cannot enter the conductor layer.
According to the antenna device 101 of the present invention, stable communication can be performed even if the antenna device 101 and the reader / writer side antenna 4 have various sizes. That is, when the reader / writer side antenna 4 is large, the magnetic flux circulates greatly due to the presence of the conductor layer 2, the magnetic flux from the antenna device 101 reaches the reader / writer side antenna 101, and the reader / writer side antenna 4 is small. In some cases, the distance that the magnetic flux reaches is longer than the presence of the conductor layer 2.

《第２の実施形態》
図５は第２の実施形態に係るアンテナ装置１０２に関する図である。図５（Ａ）は電子機器の下部筐体１の内面側を見た平面図である。また図５（Ｂ）は下部筐体１の内面にアンテナコイルモジュール３を取り付けた状態での平面図である。<< Second Embodiment >>
FIG. 5 is a diagram related to the antenna device 102 according to the second embodiment. FIG. 5A is a plan view of the inner surface side of the lower housing 1 of the electronic device. FIG. 5B is a plan view in a state where the antenna coil module 3 is attached to the inner surface of the lower housing 1.

この第２の実施形態では、下部筐体１の内面に導体層２を設けている。導体層２はアルミニウム等の金属膜の蒸着や金属箔の貼着によって構成される。このように導体層は筐体の内面に設けてもよい。   In the second embodiment, the conductor layer 2 is provided on the inner surface of the lower housing 1. The conductor layer 2 is formed by vapor deposition of a metal film such as aluminum or adhesion of a metal foil. Thus, the conductor layer may be provided on the inner surface of the housing.

なお、図５に示した例では、導体層２のスリットＳＬを導体開口部ＣＡから外縁までの距離の短い部分に設けている。
前記導体層２は電子機器内部の回路のグランドに接続してもよい。そのことにより、前記導体層２を電子機器のシールド用の導体層と兼ねることもできる。In the example shown in FIG. 5, the slit SL of the conductor layer 2 is provided in a portion where the distance from the conductor opening CA to the outer edge is short.
The conductor layer 2 may be connected to the ground of a circuit inside the electronic device. Thereby, the conductor layer 2 can also serve as a conductor layer for shielding electronic equipment.

《第３の実施形態》
図６（Ａ），図６（Ｂ）は何れも第３の実施形態に係るアンテナ装置１０３の平面図である。図６（Ａ）はコイル導体３１に流れる電流、図６（Ｂ）は、導体層２に流れる電流Ｉをそれぞれ示している。このアンテナ装置１０３はアンテナコイルモジュール３と導体層２を備えている。アンテナコイルモジュール３は、渦巻き状のコイル導体３１が形成されたフレキシブル基板と磁性体シートとが積層されて構成されている。基本的には図３に示したものと同様である。但し、この例ではフレキシブル基板からコイル導体の両端を引き出し、コイル導体３１から離れた位置に接続部を設けている。<< Third Embodiment >>
6A and 6B are plan views of the antenna device 103 according to the third embodiment. 6A shows the current flowing through the coil conductor 31, and FIG. 6B shows the current I flowing through the conductor layer 2. The antenna device 103 includes an antenna coil module 3 and a conductor layer 2. The antenna coil module 3 is configured by laminating a flexible substrate on which a spiral coil conductor 31 is formed and a magnetic sheet. This is basically the same as that shown in FIG. However, in this example, both ends of the coil conductor are pulled out from the flexible substrate, and a connection portion is provided at a position away from the coil conductor 31.

導体層２は導体開口部ＣＡ及び導体開口部ＣＡと外縁との間を連接するスリットＳＬを備えている。
コイル導体３１及び導体層２を平面視したとき、コイル開口部ＣＷと導体開口部ＣＡとが同軸で全周にわたってほぼ重なっている。このような構成により、コイル導体３１を平面視したときに、コイル導体３１の全部を導体層２と重ならせることができる。これによって、コイル導体３１から生じる磁束が全て導体層２に鎖交しようとするので、その磁束を遮るように導体層２に、コイル導体３１に流れる電流の向きとは反対方向の大きな電流が生じる。導体開口部ＣＡの周囲に流れる大きな電流Ｉは、スリット部ＳＬの周囲を通り、導体層平面、及び、縁端効果により導体層周囲に沿うように流れる。これにより、導体層２から強い磁界が生じ、通信距離をさらに広げることができる。また、導体開口部ＣＡ及びコイル開口部ＣＷを通過し、導体層２を周回する磁束のループがより効果的に広がる。そのため、アンテナ装置１０３を備える電子機器をリーダ・ライタ側アンテナの面に対して面内方向のどの向きでかざしても安定した通信が可能となる。The conductor layer 2 includes a conductor opening CA and a slit SL connecting the conductor opening CA and the outer edge.
When the coil conductor 31 and the conductor layer 2 are viewed in plan, the coil opening CW and the conductor opening CA are coaxial and substantially overlap over the entire circumference. With this configuration, when the coil conductor 31 is viewed in plan, the entire coil conductor 31 can overlap the conductor layer 2. As a result, all the magnetic flux generated from the coil conductor 31 tries to interlink with the conductor layer 2, so that a large current in the direction opposite to the direction of the current flowing through the coil conductor 31 is generated in the conductor layer 2 so as to block the magnetic flux. . A large current I flowing around the conductor opening CA passes through the slit portion SL and flows along the conductor layer plane due to the conductor layer plane and the edge effect. Thereby, a strong magnetic field is generated from the conductor layer 2, and the communication distance can be further increased. In addition, a loop of magnetic flux that passes through the conductor opening CA and the coil opening CW and circulates around the conductor layer 2 is more effectively spread. Therefore, stable communication is possible regardless of the orientation of the electronic device including the antenna device 103 in the in-plane direction with respect to the surface of the reader / writer side antenna.

《第４の実施形態》
図７（Ａ）は第４の実施形態に係るアンテナコイルモジュール１３の平面図、図７（Ｂ）はその正面図である。このアンテナコイルモジュール１３は、第１の実施形態の場合と同様に、図２に示したような導体層に対して近接配置される。このように近接配置されることで、導体層２に大きな電流が生じ、強い磁界が生じる。<< Fourth Embodiment >>
FIG. 7A is a plan view of the antenna coil module 13 according to the fourth embodiment, and FIG. 7B is a front view thereof. The antenna coil module 13 is disposed close to the conductor layer as shown in FIG. 2 as in the case of the first embodiment. By being arranged close to each other in this way, a large current is generated in the conductor layer 2 and a strong magnetic field is generated.

アンテナコイルモジュール１３は、矩形板状のフレキシブル基板３４と、同じく矩形板状の磁性体シート３９とを備えている。フレキシブル基板３４には巻回中心部をコイル開口部ＣＷとする渦巻き状のコイル導体３１及び外部の回路との接続のために用いられる接続部３２が形成されている。前記コイル導体３１はフレキシブル基板３４の二層にわたって形成されている。層間はビア導体で接続されている。磁性体シート３９は例えばシート状に成形したフェライトである。   The antenna coil module 13 includes a rectangular plate-like flexible board 34 and a rectangular plate-like magnetic sheet 39. The flexible substrate 34 is formed with a spiral coil conductor 31 having a winding center portion as a coil opening CW and a connection portion 32 used for connection with an external circuit. The coil conductor 31 is formed over two layers of the flexible substrate 34. The layers are connected by via conductors. The magnetic sheet 39 is, for example, ferrite formed into a sheet shape.

このように、コイル導体３１が複数層にわたって巻回されることによって、コイル導体から強い磁界が生じ、その結果、導体層に大きな電流を流すことができる。また、コイル導体を導体開口部の内縁に沿った位置に集中させることができる。そのため、コイル導体３１に生じる集中した磁束が導体層に鎖交しようとするので、導体層に大きな電流を流すことができる。   Thus, when the coil conductor 31 is wound over a plurality of layers, a strong magnetic field is generated from the coil conductor, and as a result, a large current can flow through the conductor layer. Further, the coil conductor can be concentrated at a position along the inner edge of the conductor opening. For this reason, the concentrated magnetic flux generated in the coil conductor 31 tries to interlink with the conductor layer, so that a large current can flow through the conductor layer.

《第５の実施形態》
図８は第５の実施形態に係るアンテナ装置１０４の平面図である。このアンテナ装置１０４はアンテナコイルモジュール３と導体層２を備えている。アンテナコイルモジュール３は、渦巻き状のコイル導体３１が形成されたフレキシブル基板と磁性体シートとが積層されている。この構造は図６に示したものと同様である。但し、この例では導体開口部ＣＡよりコイル開口部ＣＷが僅かに小さく形成されている。<< Fifth Embodiment >>
FIG. 8 is a plan view of an antenna device 104 according to the fifth embodiment. The antenna device 104 includes an antenna coil module 3 and a conductor layer 2. In the antenna coil module 3, a flexible substrate on which a spiral coil conductor 31 is formed and a magnetic sheet are laminated. This structure is the same as that shown in FIG. However, in this example, the coil opening CW is formed slightly smaller than the conductor opening CA.

コイル導体３１の一部は導体層２と重なっているので、この構造により、コイル導体３１から生じる磁束により導体層２に電流が流れる。   Since a part of the coil conductor 31 overlaps the conductor layer 2, current flows through the conductor layer 2 by the magnetic flux generated from the coil conductor 31 due to this structure.

《第６の実施形態》
図９（Ａ）は第６の実施形態に係るアンテナ装置の分解斜視図、図９（Ｂ）はアンテナ装置１０５の平面図である。このアンテナ装置１０５はアンテナコイルモジュール３、導体層２、及び放射板５を備えている。アンテナコイルモジュール３は、渦巻き状のコイル導体３１が形成されたフレキシブル基板３３と磁性体シート３９とが積層されている。アンテナコイルモジュール３の構造は図３に示したものと基本的に同様である。<< Sixth Embodiment >>
FIG. 9A is an exploded perspective view of the antenna device according to the sixth embodiment, and FIG. 9B is a plan view of the antenna device 105. The antenna device 105 includes an antenna coil module 3, a conductor layer 2, and a radiation plate 5. In the antenna coil module 3, a flexible substrate 33 on which a spiral coil conductor 31 is formed and a magnetic material sheet 39 are laminated. The structure of the antenna coil module 3 is basically the same as that shown in FIG.

導体層２及び放射板５はコイル導体の巻回軸に対してほぼ垂直な平面上にある。導体層２はコイル導体３１の近傍に形成されていて、放射板５は導体層２の近傍に配置されている。放射板５と導体層２とは互いに所定の間隙を隔てて対向し、または絶縁体層若しくは誘電体層を介して対向し、放射板５を平面視したとき、放射板５と導体層２は対向領域ＦＡで重なっている。   The conductor layer 2 and the radiation plate 5 are on a plane substantially perpendicular to the winding axis of the coil conductor. The conductor layer 2 is formed in the vicinity of the coil conductor 31, and the radiation plate 5 is disposed in the vicinity of the conductor layer 2. When the radiation plate 5 and the conductor layer 2 are opposed to each other with a predetermined gap, or opposed to each other via an insulator layer or a dielectric layer, and the radiation plate 5 is viewed in plan, the radiation plate 5 and the conductor layer 2 are It overlaps with the facing area FA.

導体層２は、コイル導体３１と対向するとともに、放射板５に対向している。導体層２は、これを平面視したとき、コイル導体３１をほぼ覆うような導体領域を有し、さらに、コイルパターン３１の開口領域と重なるように設けられた非導体部である開口部ＣＡと、この開口部ＣＡに連接するスリット部ＳＬとを備えている。上述のとおり、平面視状態で導体層２は放射板５の一部に重なっているが、導体層２の開口部ＣＡ及びスリット部ＳＬに放射板５が重なっていないことが望ましい。導体層２の開口部ＣＡ及びスリット部ＳＬに放射板５が重なっていないことによって、スリット部ＳＬ付近の強い磁界が妨げられず、通信距離を確保できる。放射板５は、開口部ＣＡを挟んだ、スリット部ＳＬから離れた位置に配置することが好ましい。
このように、平面視で放射板５が導体層２の一部分と重なっていることによって、導体層２と放射板５とは強く電磁界結合または磁界結合する。The conductor layer 2 faces the coil conductor 31 and faces the radiation plate 5. The conductor layer 2 has a conductor region that substantially covers the coil conductor 31 when viewed in plan, and an opening CA that is a non-conductor portion provided so as to overlap the opening region of the coil pattern 31. And a slit portion SL connected to the opening CA. As described above, the conductor layer 2 overlaps part of the radiation plate 5 in a plan view, but it is desirable that the radiation plate 5 does not overlap the opening CA and the slit portion SL of the conductor layer 2. Since the radiation plate 5 does not overlap the opening CA and the slit SL of the conductor layer 2, a strong magnetic field near the slit SL is not hindered, and a communication distance can be secured. The radiation plate 5 is preferably disposed at a position away from the slit portion SL with the opening CA interposed therebetween.
Thus, when the radiation plate 5 overlaps a part of the conductor layer 2 in plan view, the conductor layer 2 and the radiation plate 5 are strongly electromagnetically coupled or magnetically coupled.

また、コイル導体３１は放射板５と磁界結合するだけでなく、放射板５と電磁界または磁界を介して結合する。そのため、放射板５の存在によってエネルギーの伝達効率が向上する。   The coil conductor 31 is not only magnetically coupled to the radiation plate 5 but also coupled to the radiation plate 5 via an electromagnetic field or a magnetic field. Therefore, the energy transmission efficiency is improved by the presence of the radiation plate 5.

図１０は、図９（Ａ），図９（Ｂ）に示したアンテナ装置１０５の導体層２と放射板５とに流れる誘導電流の様子を示している。図１０中の矢印直線ＩＣは誘導電流の経路を模式的に表している。   FIG. 10 shows a state of an induced current flowing through the conductor layer 2 and the radiation plate 5 of the antenna device 105 shown in FIGS. 9 (A) and 9 (B). An arrow straight line IC in FIG. 10 schematically represents an induced current path.

この導体層２と放射板５との対向状態で、コイル導体の端子に所定の高周波電力（高周波信号）が給電されると、コイル導体の周囲に誘導磁界が形成され、この誘導磁界によって、導体層２の結合領域（コイル導体と結合する領域）には、図１０のような誘導電流ＩＣが流れる。すなわち、コイル導体と導体層２とは磁界結合する。   When a predetermined high frequency power (high frequency signal) is supplied to the terminal of the coil conductor in a state where the conductor layer 2 and the radiation plate 5 face each other, an induced magnetic field is formed around the coil conductor. An induced current IC as shown in FIG. 10 flows in the coupling region of layer 2 (region coupled with the coil conductor). That is, the coil conductor and the conductor layer 2 are magnetically coupled.

ここで、誘導電流ＩＣ（すなわち信号電流）は、放射板５が無ければ、導体層２の縁端部付近を周回するように流れるだけであるが、放射板５が近傍に配置されて結合しているため、放射板５にも流れる。信号電流は磁気抵抗の小さい方に流れるためである。そのため、信号電流は、大面積の放射板５に導かれ、信号電流の流れるエリアが広がり、磁界を放射するエリアが広がる。その結果、通信距離（読取距離）が大きくなる。   Here, if there is no radiation plate 5, the induced current IC (ie, signal current) flows only around the edge of the conductor layer 2, but the radiation plate 5 is disposed in the vicinity and coupled. Therefore, it also flows through the radiation plate 5. This is because the signal current flows in the smaller magnetic resistance. For this reason, the signal current is guided to the radiation plate 5 having a large area, the area where the signal current flows is expanded, and the area where the magnetic field is radiated is expanded. As a result, the communication distance (reading distance) increases.

なお、本実施形態における放射磁界は、放射板５が主であるが、導体層２からも放射磁界が形成されるし、コイル導体からも放射磁界が形成される。   In addition, although the radiation plate 5 is the main radiation magnetic field in this embodiment, a radiation magnetic field is formed also from the conductor layer 2, and a radiation magnetic field is also formed from a coil conductor.

《第７の実施形態》
図１１は第７の実施形態に係るアンテナ装置１０６を備えた電子機器の平面図である。この例では、導体層２が下部筺体１の内側に形成されていて、下部筺体１の外面に放射板５が形成されている。図１１ではコイル導体が見えていなが、コイル導体と導体層２との関係は図９（Ａ）、図９（Ｂ）に示したものと同様である。<< Seventh Embodiment >>
FIG. 11 is a plan view of an electronic apparatus including the antenna device 106 according to the seventh embodiment. In this example, the conductor layer 2 is formed inside the lower casing 1, and the radiation plate 5 is formed on the outer surface of the lower casing 1. Although the coil conductor is not visible in FIG. 11, the relationship between the coil conductor and the conductor layer 2 is the same as that shown in FIGS. 9 (A) and 9 (B).

このように、放射板５を筐体に形成すれば、放射板５を保持するための特別な部材やスペースが不要となり、アンテナ装置を備えた電子機器全体を小型化できる。   Thus, if the radiation plate 5 is formed in the housing, a special member or space for holding the radiation plate 5 is not required, and the entire electronic apparatus including the antenna device can be downsized.

なお、放射板を筐体の外面に設けること以外に、回路基板のグランド電極を放射板として利用することなども可能である。また、筐体内に設けられる二次電池の電極や外装金属などの他の金属を放射板として利用することも可能である。また、コイル導体と導体層とをモジュールとして一体に形成することも可能である。   In addition to providing the radiation plate on the outer surface of the housing, the ground electrode of the circuit board can be used as the radiation plate. Moreover, it is also possible to utilize other metals, such as the electrode of a secondary battery provided in a housing | casing, and an exterior metal as a radiation plate. It is also possible to integrally form the coil conductor and the conductor layer as a module.

なお、本実施形態では、導体層に設けられたスリット部ＳＬの開放方向が、アンテナ装置１０６の上方を向いているので、上方の利得が高い指向特性となり、通信がしやすくなる。   In the present embodiment, since the opening direction of the slit portion SL provided in the conductor layer faces upward of the antenna device 106, the upper gain has a high directivity characteristic and communication is facilitated.

《第８の実施形態》
図１２は第８の実施形態に係るアンテナ装置１０７の平面図である。このアンテナ装置１０７は、コイル導体３１、導体層２、及び放射板５Ａ，５Ｂを備えている。コイル導体３１と導体層２との関係は図９（Ａ）、図９（Ｂ）に示したものと同様である。導体層２及び放射板５Ａ，５Ｂはコイル導体３１の巻回軸に対してほぼ垂直な平面上にある。導体層２はコイル導体３１の近傍に形成されていて、放射板５Ａ，５Ｂは導体層２の近傍に配置されている。放射板５Ａ，５Ｂと導体層２とは互いに所定の間隙を隔てて対向している。放射板５Ａ，５Ｂを平面視したとき、放射板５Ａ，５Ｂは導体層２の一部分と重なっている。<< Eighth Embodiment >>
FIG. 12 is a plan view of an antenna device 107 according to the eighth embodiment. The antenna device 107 includes a coil conductor 31, a conductor layer 2, and radiation plates 5A and 5B. The relationship between the coil conductor 31 and the conductor layer 2 is the same as that shown in FIGS. 9 (A) and 9 (B). The conductor layer 2 and the radiation plates 5A and 5B are on a plane substantially perpendicular to the winding axis of the coil conductor 31. The conductor layer 2 is formed in the vicinity of the coil conductor 31, and the radiation plates 5 </ b> A and 5 </ b> B are disposed in the vicinity of the conductor layer 2. The radiation plates 5A and 5B and the conductor layer 2 are opposed to each other with a predetermined gap. When the radiation plates 5A and 5B are viewed in plan, the radiation plates 5A and 5B overlap a part of the conductor layer 2.

このように、複数の放射板５Ａ，５Ｂを備えてもよい。また、このように、放射板５Ａ，５Ｂは導体層２のスリットＳＬを形成した辺に対向する辺以外の辺（スリットＳＬに隣接する辺）に、平面視で重なるようにしてもよい。   As described above, a plurality of radiation plates 5A and 5B may be provided. As described above, the radiation plates 5A and 5B may overlap with a side other than the side facing the side where the slit SL of the conductor layer 2 is formed (side adjacent to the slit SL) in a plan view.

《第９の実施形態》
図１３は第９の実施形態に係るアンテナ装置１０８の平面図である。このアンテナ装置１０８は、コイル導体３１、導体層２、及び放射板５を備えている。導体層２及び放射板５はコイル導体３１の巻回軸に対してほぼ垂直な平面上にある。導体層２はコイル導体３１の近傍に形成されていて、放射板５は導体層２の近傍に配置されている。放射板５と導体層２とは互いに所定の間隙を隔てて配置されている。放射板５を平面視したとき、放射板５は導体層２から離れた位置に配置されている。<< Ninth embodiment >>
FIG. 13 is a plan view of an antenna device 108 according to the ninth embodiment. The antenna device 108 includes a coil conductor 31, a conductor layer 2, and a radiation plate 5. The conductor layer 2 and the radiation plate 5 are on a plane substantially perpendicular to the winding axis of the coil conductor 31. The conductor layer 2 is formed in the vicinity of the coil conductor 31, and the radiation plate 5 is disposed in the vicinity of the conductor layer 2. The radiation plate 5 and the conductor layer 2 are arranged with a predetermined gap therebetween. When the radiation plate 5 is viewed in plan, the radiation plate 5 is disposed at a position away from the conductor layer 2.

このように放射板５と導体層２とが互いに所定の間隙を隔てて配置されていても、導体層２と放射板５とは電磁界結合する。ここで、導体層２の開口部ＣＡにおける内縁から導体層２の外縁までの距離をＬ１、導体層２と放射板５との間隔をＬ２で表すと、Ｌ２が大きくなるほど、導体層２と放射板５との電磁界結合が弱くなる。しかし、Ｌ１＞＝Ｌ２の関係とすれば、コイル導体３１及び導体層２から放射板５への電力伝達効率が実用上（実質的に）確保できる。   Thus, even if the radiation plate 5 and the conductor layer 2 are arranged with a predetermined gap therebetween, the conductor layer 2 and the radiation plate 5 are electromagnetically coupled. Here, when the distance from the inner edge to the outer edge of the conductor layer 2 in the opening CA of the conductor layer 2 is represented by L1, and the distance between the conductor layer 2 and the radiation plate 5 is represented by L2, the larger the L2, the greater the radiation between the conductor layer 2 and the radiation. The electromagnetic field coupling with the plate 5 is weakened. However, if the relationship of L1> = L2 is satisfied, the power transmission efficiency from the coil conductor 31 and the conductor layer 2 to the radiation plate 5 can be practically (substantially) ensured.

なお、以上に示した実施形態では、コイル導体に対して、通信相手のアンテナに近接する側に導体層を配置したが、コイル導体と導体層との位置はこれに限定されない。例えば、通信相手のアンテナから見て、放射板・コイル導体・導体層の順に配置されていてもよい。   In the embodiment described above, the conductor layer is disposed on the side close to the antenna of the communication partner with respect to the coil conductor, but the positions of the coil conductor and the conductor layer are not limited to this. For example, the radiation plate, the coil conductor, and the conductor layer may be arranged in this order when viewed from the antenna of the communication partner.

また、以上に示した各実施形態では、筐体の外面または内面に導体層や放射板を形成したが、筐体の内部に導体層や放射板を配置してもよい。また、筐体自体が金属である場合には、その筐体を前記導体層や放射板として用いてもよい。   Moreover, in each embodiment shown above, although the conductor layer and the radiation plate were formed in the outer surface or inner surface of a housing | casing, you may arrange | position a conductor layer and a radiation plate in the inside of a housing | casing. Further, when the casing itself is made of metal, the casing may be used as the conductor layer or the radiation plate.

また、以上に示した幾つかの実施形態では、コイル導体３１を備えたフレキシブル基板３３とフェライトからなる磁性体シート３９とを積層してアンテナコイルモジュール３を構成した例を示したが、磁束ループの形成にとって悪影響のない環境では、アンテナコイルモジュール３の背面に必ずしも磁性体シートを設けなくてもよい。   In some embodiments described above, the antenna coil module 3 is configured by laminating the flexible substrate 33 including the coil conductor 31 and the magnetic sheet 39 made of ferrite. In an environment that does not adversely affect the formation of the antenna coil module 3, it is not always necessary to provide a magnetic sheet on the back surface of the antenna coil module 3.

ＣＡ…導体開口部
ＣＷ…コイル開口部
ＦＡ…対向領域
ＭＦ…磁束
ＳＬ…スリット
１…下部筐体
２…導体層
３，１３…アンテナコイルモジュール
４…リーダ・ライタ側アンテナ
５，５Ａ，５Ｂ…放射板
３１…コイル導体
３２…接続部
３３，３４…フレキシブル基板
３９…磁性体シート
４１…コイル導体
１０１〜１０８…アンテナ装置CA ... Conductor opening CW ... Coil opening FA ... Opposite area MF ... Magnetic flux SL ... Slit 1 ... Lower housing 2 ... Conductor layer 3, 13 ... Antenna coil module 4 ... Reader / writer side antenna 5, 5A, 5B ... Radiation Plate 31 ... Coil conductor 32 ... Connection portions 33, 34 ... Flexible substrate 39 ... Magnetic material sheet 41 ... Coil conductors 101-108 ... Antenna device

Claims (11)

巻回中心部をコイル開口部とするループ状または渦巻き状のコイル導体と、
導体開口部、及び前記導体開口部と外縁との間を連接するスリット部を備えた導体層と、
放射板と、を備え、
前記コイル導体と前記導体層とが電磁界を介して結合し、
前記導体層と前記放射板とが電磁界または磁界を介して結合しているアンテナ装置。A loop or spiral coil conductor having a coil opening at the winding center; and
A conductor layer including a conductor opening, and a slit portion connecting the conductor opening and an outer edge; and
A radiation plate,
The coil conductor and the conductor layer are coupled via an electromagnetic field,
An antenna device in which the conductor layer and the radiation plate are coupled via an electromagnetic field or a magnetic field. 前記コイル導体を平面視したとき、前記コイル開口部と前記導体開口部とが少なくとも一部で重なっている、請求項１に記載のアンテナ装置。   The antenna device according to claim 1, wherein the coil opening and the conductor opening overlap at least partially when the coil conductor is viewed in plan. 前記コイル導体を平面視したとき、前記コイル導体と前記導体層とが重なっている、請求項１又は２に記載のアンテナ装置。   The antenna device according to claim 1 or 2, wherein the coil conductor and the conductor layer overlap when the coil conductor is viewed in plan. 前記コイル導体と前記導体層とは近接して配置されている、請求項１乃至３の何れかに記載のアンテナ装置。   The antenna device according to claim 1, wherein the coil conductor and the conductor layer are arranged close to each other. 前記導体層の面積は前記コイル導体の形成領域の面積より大きい、請求項１乃至４の何れかに記載のアンテナ装置。   The antenna device according to any one of claims 1 to 4, wherein an area of the conductor layer is larger than an area of a formation region of the coil conductor. 前記コイル導体は複数層に亘って巻回されている、請求項１乃至５の何れかに記載のアンテナ装置。   The antenna device according to claim 1, wherein the coil conductor is wound over a plurality of layers. 前記コイル導体を平面視したとき、前記コイル開口部と前記導体開口部とが全周にわたってほぼ重なっている、請求項１乃至６の何れかに記載のアンテナ装置。   The antenna device according to any one of claims 1 to 6, wherein when the coil conductor is viewed in plan, the coil opening and the conductor opening substantially overlap over the entire circumference. 前記導体層は、組み込み先の電子機器の筐体の内面または外面に形成されている、請求項１乃至７の何れかに記載のアンテナ装置。   The antenna device according to claim 1, wherein the conductor layer is formed on an inner surface or an outer surface of a housing of an electronic device to be assembled. 前記コイル導体は基板に形成され、前記基板の通信相手側のアンテナより遠い側の面に磁性体シートが積層され、前記基板と前記磁性体シートとによってアンテナコイルモジュールが構成された、請求項１乃至８の何れかに記載のアンテナ装置。   The coil conductor is formed on a substrate, a magnetic sheet is laminated on a surface of the substrate farther from an antenna on the communication partner side, and an antenna coil module is configured by the substrate and the magnetic sheet. The antenna apparatus in any one of thru | or 8. 前記放射板は前記導体層と対向し、前記放射板を平面視したとき、当該放射板は前記導体層の一部分と重なっている、請求項９に記載のアンテナ装置。   The antenna device according to claim 9, wherein the radiation plate faces the conductor layer, and the radiation plate overlaps a part of the conductor layer when the radiation plate is viewed in plan. 前記導体層と前記放射板とが電磁界または磁界を介して結合している、請求項１乃至１０の何れかに記載のアンテナ装置。   The antenna device according to any one of claims 1 to 10, wherein the conductor layer and the radiation plate are coupled via an electromagnetic field or a magnetic field.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9905925B2 (en) * 2013-05-13 2018-02-27 Amotech Co., Ltd. NFC antenna module and portable terminal comprising same

Families Citing this family (178)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136600B2 (en) * 2010-09-30 2015-09-15 Murata Manufacturing Co., Ltd. Antenna
EP2424041B1 (en) * 2009-04-21 2018-11-21 Murata Manufacturing Co., Ltd. Antenna apparatus and resonant frequency setting method of same
CN102576929B (en) * 2009-11-20 2015-01-28 株式会社村田制作所 Antenna device and mobile communication terminal
JP5018918B2 (en) * 2010-03-17 2012-09-05 パナソニック株式会社 ANTENNA DEVICE AND PORTABLE TERMINAL DEVICE USING THE SAME
JP5370581B2 (en) * 2010-03-24 2013-12-18 株式会社村田製作所 RFID system
GB2495419B (en) * 2010-06-18 2015-05-27 Murata Manufacturing Co Communication terminal apparatus and antenna device
WO2012014939A1 (en) * 2010-07-28 2012-02-02 株式会社村田製作所 Antenna device and communications terminal device
TWI469442B (en) * 2010-10-15 2015-01-11 Advanced Connectek Inc Soft antenna
JP5472153B2 (en) 2010-12-24 2014-04-16 株式会社村田製作所 Antenna device, battery pack with antenna, and communication terminal device
WO2012111430A1 (en) * 2011-02-15 2012-08-23 株式会社村田製作所 Antenna device and communication terminal device
WO2012144482A1 (en) * 2011-04-18 2012-10-26 株式会社村田製作所 Antenna device and communication terminal device
US20120274148A1 (en) * 2011-04-27 2012-11-01 Samsung Electro-Mechanics Co., Ltd. Contactless power transmission device and electronic device having the same
WO2013011865A1 (en) * 2011-07-19 2013-01-24 株式会社村田製作所 Antenna module, antenna device, rfid tag, and communication terminal device
US10733494B2 (en) 2014-08-10 2020-08-04 Féinics Amatech Teoranta Contactless metal card constructions
US10518518B2 (en) 2013-01-18 2019-12-31 Féinics Amatech Teoranta Smart cards with metal layer(s) and methods of manufacture
JP5609922B2 (en) 2011-08-10 2014-10-22 株式会社村田製作所 Antenna device and communication terminal device
CN103703473B (en) * 2011-09-20 2017-02-15 株式会社村田制作所 Communication terminal equipment
WO2013051684A1 (en) 2011-10-07 2013-04-11 株式会社村田製作所 Antenna device and electronic device
WO2013069465A1 (en) 2011-11-09 2013-05-16 株式会社村田製作所 Antenna device and electronic device
CN103620868B (en) * 2012-02-01 2016-06-08 株式会社村田制作所 Antenna assembly and communication terminal
JP5772868B2 (en) 2012-05-21 2015-09-02 株式会社村田製作所 ANTENNA DEVICE AND WIRELESS COMMUNICATION DEVICE
US8819662B2 (en) 2012-06-11 2014-08-26 Sony Corporation Device and method for time notification for updating software
US9083073B2 (en) * 2012-06-28 2015-07-14 Intel Corporation Thin chassis near field communication (NFC) antenna integration
EP2733787B1 (en) 2012-06-28 2017-09-06 Murata Manufacturing Co., Ltd. Antenna device and communication terminal device
US9225388B2 (en) 2012-07-03 2015-12-29 Intel Corporation Transmitting magnetic field through metal chassis using fractal surfaces
US9099765B2 (en) * 2012-07-06 2015-08-04 Blackberry Limited Device having a quadrature near field communication antenna
US9112280B2 (en) 2012-07-10 2015-08-18 Sony Corporation Antenna apparatus and terminal device associated with antenna apparatus
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
US10224601B2 (en) 2012-09-06 2019-03-05 Panasonic Intelletual Property Management Co., Ltd. Antenna device and communications device
US9837720B2 (en) * 2012-09-17 2017-12-05 Emw Co., Ltd. Metamaterial antenna
CN103918125B (en) * 2012-09-26 2017-03-08 株式会社村田制作所 Antenna assembly and possesses the electronic equipment of antenna assembly
JP5672414B2 (en) 2012-10-12 2015-02-18 株式会社村田製作所 HF band wireless communication device
JP6099352B2 (en) * 2012-10-17 2017-03-22 デクセリアルズ株式会社 Electronic device and coil module
GB2539334A (en) * 2012-10-26 2016-12-14 Murata Manufacturing Co Interface, communication apparatus, and program
WO2014097970A1 (en) * 2012-12-20 2014-06-26 株式会社村田製作所 Information terminal device
CN104094468B (en) * 2012-12-21 2016-01-20 株式会社村田制作所 Interface unit and computer
JP2014135448A (en) * 2013-01-11 2014-07-24 Taiyo Yuden Co Ltd Electronic component
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
US11928537B2 (en) 2013-01-18 2024-03-12 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US11341389B2 (en) 2013-01-18 2022-05-24 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
US10599972B2 (en) 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
CN204696809U (en) 2013-01-21 2015-10-07 株式会社村田制作所 Current-collecting device, power transmission device and power transmission system
WO2014125927A1 (en) * 2013-02-13 2014-08-21 株式会社村田製作所 Antenna device, and electronic apparatus
JP2014156700A (en) * 2013-02-14 2014-08-28 Denso Corp Electronic tag and vehicle door locking-unlocking system
EP2962358B1 (en) 2013-02-22 2019-12-25 Nokia Technologies Oy Apparatus and method for wireless coupling
US9024826B2 (en) * 2013-02-25 2015-05-05 Htc Corporation Electronic devices with antennas formed with optically-transparent films and related methods
JP6122321B2 (en) 2013-03-19 2017-04-26 デクセリアルズ株式会社 ANTENNA DEVICE AND ELECTRONIC DEVICE
JP5621953B1 (en) * 2013-03-25 2014-11-12 株式会社村田製作所 Antenna device and communication device
CN103219579B (en) * 2013-04-11 2015-05-06 上海安费诺永亿通讯电子有限公司 Novel near field communication (NFC) antenna structure
US10096903B2 (en) 2013-04-12 2018-10-09 Panasonic Intellectual Property Management Co., Ltd. Antenna, antenna device and communication device
WO2014185687A1 (en) * 2013-05-13 2014-11-20 주식회사 아모텍 Nfc antenna module and portable terminal comprising same
EP2897221B1 (en) 2013-06-14 2017-08-16 Murata Manufacturing Co., Ltd. Antenna device and communication-terminal device
CN205646165U (en) 2013-06-14 2016-10-12 株式会社村田制作所 Antenna device and communication terminal device
GB2516305A (en) * 2013-07-19 2015-01-21 Nokia Corp Apparatus and methods for wireless communication
CN104377424A (en) * 2013-08-14 2015-02-25 三星电机株式会社 Cover for electronic device, antenna assembly, electronic device, and method for manufacturing the same
WO2015022859A1 (en) 2013-08-14 2015-02-19 株式会社村田製作所 Antenna device and electronic device
KR101659138B1 (en) * 2013-08-14 2016-09-22 삼성전기주식회사 Cover for electronic device, antenna assembly, electronic device and method for manufacturing the same
JP2015043567A (en) * 2013-08-20 2015-03-05 サムソン エレクトロ−メカニックス カンパニーリミテッド． Camera module and electronic device including the same
US20150054704A1 (en) * 2013-08-23 2015-02-26 Samsung Sdi Co., Ltd. Antenna module for terminal device and method for manufacturing the same
KR101514331B1 (en) * 2013-08-30 2015-04-22 (주)파트론 Device with loop type antenna
WO2015041066A1 (en) 2013-09-17 2015-03-26 株式会社村田製作所 Camera module, and electronic apparatus
US10205489B2 (en) 2013-10-07 2019-02-12 Amotech Co., Ltd. Rear cover and portable terminal having same
KR101875446B1 (en) * 2013-10-14 2018-07-09 주식회사 아모텍 Rear cover and portable device having the same
MX2016005965A (en) * 2013-11-08 2016-07-18 Nokia Technologies Oy Arrangement of a communication coil and an induction charging coil.
US9461500B2 (en) 2013-11-21 2016-10-04 Htc Corporation Wireless charging receiving device and wireless charging system using the same
CN104682005A (en) * 2013-11-29 2015-06-03 佳邦科技股份有限公司 Antenna structure
WO2015098462A1 (en) 2013-12-26 2015-07-02 株式会社村田製作所 Communication terminal device
JP6347607B2 (en) * 2013-12-27 2018-06-27 キヤノン株式会社 Electronics
EP3090469B1 (en) 2013-12-31 2019-06-26 BYD Company Limited Nfc antenna assembly
EP3092679B1 (en) * 2014-01-06 2020-07-29 Nokia Technologies Oy A body of a portable electronic device that includes a near field coil
WO2015115401A1 (en) * 2014-01-30 2015-08-06 株式会社村田製作所 Wireless communication apparatus
WO2015115402A1 (en) * 2014-01-30 2015-08-06 株式会社村田製作所 Wireless communication apparatus
US10186753B2 (en) 2014-01-31 2019-01-22 Tdk Corporation Antenna device and portable electronic device using the same
JP6129091B2 (en) * 2014-01-31 2017-05-17 Tdk株式会社 Antenna device and portable electronic device using the same
JP5928496B2 (en) * 2014-01-31 2016-06-01 Tdk株式会社 Antenna device and portable electronic device using the same
JP5825457B1 (en) * 2014-02-14 2015-12-02 株式会社村田製作所 ANTENNA DEVICE AND WIRELESS COMMUNICATION DEVICE
KR101762778B1 (en) 2014-03-04 2017-07-28 엘지이노텍 주식회사 Wireless communication and charge substrate and wireless communication and charge device
KR102129249B1 (en) 2014-04-28 2020-07-02 삼성전자주식회사 Antenna apparatus and electronic device including the same
EP3125367B1 (en) 2014-04-30 2019-07-31 Murata Manufacturing Co., Ltd. Antenna device and electronic device
US10290934B2 (en) 2014-04-30 2019-05-14 Tdk Corporation Antenna device
US10014578B2 (en) 2014-05-05 2018-07-03 Nxp B.V. Body antenna system
US10009069B2 (en) 2014-05-05 2018-06-26 Nxp B.V. Wireless power delivery and data link
US10015604B2 (en) 2014-05-05 2018-07-03 Nxp B.V. Electromagnetic induction field communication
CN104037504B (en) * 2014-06-13 2016-08-24 华侨大学 A kind of trumpet type low section wide band high-gain antenna
JP2016058825A (en) * 2014-09-08 2016-04-21 パナソニックＩｐマネジメント株式会社 Electronic equipment
KR102245184B1 (en) 2014-11-21 2021-04-27 삼성전자주식회사 Electronic device with antenna
KR20160063191A (en) * 2014-11-26 2016-06-03 삼성전기주식회사 Antenna device and Near field communication device including the same
KR102257892B1 (en) * 2014-11-26 2021-05-28 삼성전자주식회사 Advanced NFC Antenna and Electronic Device with the same
US10003218B2 (en) * 2014-12-20 2018-06-19 Intel Corporation Chassis design for wireless-charging coil integration for computing systems
US20160179140A1 (en) * 2014-12-20 2016-06-23 Intel Corporation Chassis Design for Wireless-Charging Coil Integration for Computing Systems
US10109415B2 (en) * 2015-01-07 2018-10-23 Samsung Electronics Co., Ltd. Wireless power receiver and external inductor connected thereto
JP2016140026A (en) * 2015-01-29 2016-08-04 Tdk株式会社 Antenna device
JP6146550B2 (en) 2015-02-16 2017-06-14 株式会社村田製作所 Antenna device and communication terminal device
US10122182B2 (en) * 2015-02-27 2018-11-06 Qualcomm Incorporated Multi-turn coil on metal backplate
TWI538296B (en) * 2015-03-31 2016-06-11 和碩聯合科技股份有限公司 Mobile communication device with antenna
JP6519299B2 (en) 2015-04-28 2019-05-29 Tdk株式会社 Antenna device
JP6627252B2 (en) * 2015-04-28 2020-01-08 Tdk株式会社 Antenna device
US10476304B2 (en) * 2015-05-27 2019-11-12 Qualcomm Incorporated Wireless power receive coil for metal backed device
CN104993215B (en) * 2015-06-01 2019-06-07 瑞声精密制造科技(常州)有限公司 NFC antenna structure
JP6589403B2 (en) 2015-06-15 2019-10-16 Tdk株式会社 Antenna device and coil component used therefor
CN105161819A (en) * 2015-06-23 2015-12-16 瑞声精密制造科技(常州)有限公司 Rfid antenna structure
US20170005395A1 (en) * 2015-06-30 2017-01-05 Tdk Corporation Antenna device
CN105024162B (en) * 2015-07-08 2018-06-26 深圳市信维通信股份有限公司 A kind of NFC antenna with metal rear shell
CN105006654A (en) * 2015-07-08 2015-10-28 深圳市信维通信股份有限公司 Figure-eight-shaped NFC antenna with metal rear housing
JP6845624B2 (en) * 2015-07-08 2021-03-17 ローム株式会社 Power transmission device, power receiving device and contactless power supply system
CN105024169B (en) * 2015-07-15 2019-08-27 深圳市信维通信股份有限公司 A kind of high performance NFC antenna structure of small size
JP6549436B2 (en) 2015-07-22 2019-07-24 デクセリアルズ株式会社 Antenna device
WO2017018243A1 (en) * 2015-07-27 2017-02-02 株式会社村田製作所 Portable terminal device
CN105048061B (en) * 2015-07-27 2018-01-12 电子科技大学 A kind of near field communication antenna device
WO2017022554A1 (en) 2015-08-03 2017-02-09 株式会社村田製作所 Antenna apparatus and electronic device
CN105098324B (en) * 2015-08-06 2018-06-19 电子科技大学 A kind of near field communication antenna device
US20170077733A1 (en) * 2015-09-10 2017-03-16 Qualcomm Incorporated Wireless power transmitting unit using metal plates
US20170077754A1 (en) * 2015-09-15 2017-03-16 Qualcomm Incorporated Near field communication and wireless power transfer dual mode antennas for metal backed devices
US9787368B2 (en) * 2015-11-06 2017-10-10 Mediatek Inc. Antenna having passive booster for near field communication
CN105428799A (en) * 2015-11-11 2016-03-23 威海北洋电气集团股份有限公司 Radio-frequency antenna
CN105870576A (en) * 2015-11-25 2016-08-17 深圳市中天迅通信技术有限公司 Near-field communication antenna device for metal shell communication equipment
CN107534218B (en) 2016-01-14 2019-05-17 株式会社村田制作所 Antenna assembly and electronic equipment
WO2017126418A1 (en) 2016-01-18 2017-07-27 株式会社村田製作所 Antenna apparatus and electronic device
CN105552545A (en) * 2016-01-28 2016-05-04 深圳市飞荣达科技股份有限公司 Near field communication (NFC) antenna device and electronic device
CN105552527A (en) * 2016-03-08 2016-05-04 上海德门电子科技有限公司 NFC antenna interpenetrating intersected dual-loop structure and mobile terminal
CN105655706B (en) * 2016-03-18 2018-01-19 广东欧珀移动通信有限公司 Metallic terminations bonnet and terminal
JP6642219B2 (en) * 2016-04-07 2020-02-05 株式会社村田製作所 Camera module and electronic equipment
KR102533473B1 (en) * 2016-04-26 2023-05-18 삼성전자주식회사 Electronic Device for Transmitting Electromagnetic Wave in Multi-Direction
US10320086B2 (en) * 2016-05-04 2019-06-11 Nxp B.V. Near-field electromagnetic induction (NFEMI) antenna
US10522912B2 (en) * 2016-05-12 2019-12-31 Tdk Corporation Antenna device and mobile wireless device provided with the same
CN107437650A (en) 2016-05-25 2017-12-05 三星电子株式会社 Electronic equipment including NFC antenna
JP2016165155A (en) * 2016-06-14 2016-09-08 Tdk株式会社 Antenna device and portable electronic apparatus using the same
JP6693293B2 (en) * 2016-06-21 2020-05-13 富士通株式会社 Wireless power receiving device and electronic device using the same
KR101824998B1 (en) * 2016-07-13 2018-02-02 엘지전자 주식회사 Mobile terminal
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
DK3491584T3 (en) 2016-07-27 2022-10-17 Composecure Llc Molded electronic components for transaction cards and methods of making the same
KR101795959B1 (en) * 2016-08-12 2017-11-10 주식회사 이엠따블유 An antenna including an antenna pattern formed on a top surface and a bottom surface of magnetic sheet
CN106129585A (en) * 2016-08-24 2016-11-16 深圳市信维通信股份有限公司 A kind of prefix type NFC antenna
US10074891B2 (en) 2016-09-02 2018-09-11 AQ Corporation Smartphone antenna in flexible PCB
USD850424S1 (en) 2016-12-14 2019-06-04 AQ Corporation Flexible PCB dual antenna module for use in smartphone
US10003120B2 (en) 2016-09-02 2018-06-19 AQ Corporation Smartphone antenna in flexible PCB
US10547112B2 (en) 2016-09-02 2020-01-28 AQ Corporation Smartphone antenna in flexible PCB
JP6895725B2 (en) * 2016-09-13 2021-06-30 マクセル株式会社 Power transmission device
JP6242459B2 (en) * 2016-10-25 2017-12-06 京セラ株式会社 Electronics
US10886598B2 (en) * 2016-11-16 2021-01-05 Wits Co., Ltd. Antenna module and electronic device having the same
TWI635655B (en) * 2016-11-21 2018-09-11 佳邦科技股份有限公司 Portable electronic device and antenna module thereof
US10950941B2 (en) * 2016-11-21 2021-03-16 Microsoft Technology Licensing, Llc Conductive structural member acting as single-ended NFC antenna
KR102562734B1 (en) 2016-11-24 2023-08-02 삼성전자주식회사 Electronic Device for Including Conductive Housing
US10790703B2 (en) * 2016-12-19 2020-09-29 Koji Yoden Smart wireless power transfer between devices
WO2018113341A1 (en) * 2016-12-23 2018-06-28 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Housing assembly for terminal, terminal and mobile phone
KR101962001B1 (en) * 2017-01-19 2019-03-25 주식회사 이엠따블유 An antenna including an antenna pattern formed on a top surface and a bottom surface of magnetic sheet and a method of forming the same
CN113839223B (en) * 2017-02-23 2024-02-27 株式会社友华 Antenna device
JP2018170679A (en) * 2017-03-30 2018-11-01 株式会社村田製作所 Antenna device and electronic apparatus
KR102335846B1 (en) * 2017-04-17 2021-12-07 삼성전자주식회사 Electronic device comprising a plurality of coils
US10622705B2 (en) * 2017-07-07 2020-04-14 Wits Co., Ltd. Antenna module and electronic device including the same
KR101883109B1 (en) * 2017-07-20 2018-07-27 삼성전기주식회사 Antenna module
TWI655804B (en) * 2017-08-03 2019-04-01 廣達電腦股份有限公司 Communication device
CN107565216A (en) 2017-08-29 2018-01-09 广州三星通信技术研究有限公司 The shell and electronic equipment of electronic equipment
CA3075405A1 (en) 2017-09-07 2019-03-14 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
WO2019079007A1 (en) 2017-10-18 2019-04-25 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
WO2019159903A1 (en) 2018-02-13 2019-08-22 株式会社村田製作所 Antenna device and electronic apparatus
DE102018129569A1 (en) * 2018-11-23 2020-05-28 Infineon Technologies Ag Smart card
JP7182513B2 (en) * 2019-05-24 2022-12-02 株式会社Soken Magnetic components and power converters equipped with the same
US20210081743A1 (en) 2019-08-12 2021-03-18 Federal Card Services, LLC Dual interface metal cards and methods of manufacturing
US20210049431A1 (en) 2019-08-14 2021-02-18 Federal Card Services, LLC Metal-containing dual interface smartcards
US11113593B2 (en) 2019-08-15 2021-09-07 Federal Card Services; LLC Contactless metal cards with fingerprint sensor and display
US11162750B1 (en) 2019-09-16 2021-11-02 Donald L. Weeks Detection of firearms in a security zone using radio frequency identification tag embedded within weapon bolt carrier
CN112566440A (en) * 2019-09-25 2021-03-26 中兴通讯股份有限公司 Electronic component and terminal equipment
US11387678B2 (en) * 2019-09-27 2022-07-12 Apple Inc. Stacked resonant structures for wireless power systems
US11341385B2 (en) 2019-11-16 2022-05-24 Federal Card Services, LLC RFID enabled metal transaction card with shaped opening and shaped slit
US11303011B2 (en) 2019-11-27 2022-04-12 AQ Corporation Smartphone antenna in flexible PCB
US20210221211A1 (en) * 2019-12-30 2021-07-22 Afreecar Llc Configurable electric vehicle power and propulsion kit
US11907790B2 (en) * 2020-03-06 2024-02-20 Hutchinson Technology Incorporated Component identification
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
CN113708054B (en) * 2020-05-20 2023-04-04 华为技术有限公司 Electronic device
WO2023034642A1 (en) 2021-09-06 2023-03-09 Metaland Llc Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card
KR102613064B1 (en) 2023-08-14 2023-12-12 주식회사 티아이씨피 A metal card having a contactless card function and the fabricating method thereof

Family Cites Families (595)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3364564A (en) 1965-06-28 1968-01-23 Gregory Ind Inc Method of producing welding studs dischargeable in end-to-end relationship
JPS5754964B2 (en) 1974-05-08 1982-11-20
JPS6193701A (en) 1984-10-13 1986-05-12 Toyota Motor Corp Antenna system for automobile
JPS61284102A (en) * 1985-06-11 1986-12-15 Oki Electric Ind Co Ltd Antenna for portable radio equipment
JPS62127140U (en) 1986-02-03 1987-08-12
JPH01212035A (en) 1987-08-13 1989-08-25 Secom Co Ltd Electromagnetic field diversity reception system
US5248989A (en) * 1988-02-04 1993-09-28 Unisan Ltd. Magnetic field concentrator
EP0397755A4 (en) * 1988-02-04 1992-11-04 Uniscan Ltd. Magnetic field concentrator
JPH0744114B2 (en) 1988-12-16 1995-05-15 株式会社村田製作所 Multilayer chip coil
JPH02164105A (en) 1988-12-19 1990-06-25 Mitsubishi Electric Corp Spiral antenna
US5253969A (en) 1989-03-10 1993-10-19 Sms Schloemann-Siemag Aktiengesellschaft Feeding system for strip material, particularly in treatment plants for metal strips
JPH03171385A (en) 1989-11-30 1991-07-24 Sony Corp Information card
JP2662742B2 (en) 1990-03-13 1997-10-15 株式会社村田製作所 Bandpass filter
JP2763664B2 (en) 1990-07-25 1998-06-11 日本碍子株式会社 Wiring board for distributed constant circuit
JPH04150011A (en) 1990-10-12 1992-05-22 Tdk Corp Composite electronic component
JPH04167500A (en) 1990-10-30 1992-06-15 Omron Corp Printed-circuit board management system
JP2539367Y2 (en) 1991-01-30 1997-06-25 株式会社村田製作所 Multilayer electronic components
NL9100176A (en) 1991-02-01 1992-03-02 Nedap Nv Antenna configuration for contactless identification label - forms part of tuned circuit of ID or credit card interrogated via inductive coupling
JP2558330Y2 (en) 1991-02-06 1997-12-24 オムロン株式会社 Electromagnetic coupling type electronic equipment
NL9100347A (en) 1991-02-26 1992-03-02 Nedap Nv Integrated transformer circuit for ID or credit card - is interrogated via contactless inductive coupling using capacitor to form tuned circuit
JPH04321190A (en) 1991-04-22 1992-11-11 Mitsubishi Electric Corp Antenna circuit and its production for non-contact type portable storage
JPH0745933Y2 (en) 1991-06-07 1995-10-18 太陽誘電株式会社 Multilayer ceramic inductance element
DE69215283T2 (en) 1991-07-08 1997-03-20 Nippon Telegraph & Telephone Extendable antenna system
JP2839782B2 (en) 1992-02-14 1998-12-16 三菱電機株式会社 Printed slot antenna
US5229652A (en) * 1992-04-20 1993-07-20 Hough Wayne E Non-contact data and power connector for computer based modules
JPH05327331A (en) 1992-05-15 1993-12-10 Matsushita Electric Works Ltd Printed antenna
JP3186235B2 (en) 1992-07-30 2001-07-11 株式会社村田製作所 Resonator antenna
JPH0677729A (en) 1992-08-25 1994-03-18 Mitsubishi Electric Corp Antenna integrated microwave circuit
JP2592328Y2 (en) 1992-09-09 1999-03-17 神鋼電機株式会社 Antenna device
JPH06177635A (en) 1992-12-07 1994-06-24 Mitsubishi Electric Corp Cross dipole antenna system
JPH06260949A (en) 1993-03-03 1994-09-16 Seiko Instr Inc Radio equipment
JPH07183836A (en) 1993-12-22 1995-07-21 San'eisha Mfg Co Ltd Coupling filter device for distribution line carrier communication
US5491483A (en) 1994-01-05 1996-02-13 Texas Instruments Incorporated Single loop transponder system and method
US6096431A (en) 1994-07-25 2000-08-01 Toppan Printing Co., Ltd. Biodegradable cards
JP3427527B2 (en) 1994-12-26 2003-07-22 凸版印刷株式会社 Biodegradable laminate and biodegradable card
JP2999374B2 (en) 1994-08-10 2000-01-17 太陽誘電株式会社 Multilayer chip inductor
JP3141692B2 (en) 1994-08-11 2001-03-05 松下電器産業株式会社 Millimeter wave detector
DE4431754C1 (en) 1994-09-06 1995-11-23 Siemens Ag Carrier element for ic module of chip card
US5528222A (en) 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
JPH0887580A (en) 1994-09-14 1996-04-02 Omron Corp Data carrier and ball game
JP3064840B2 (en) 1994-12-22 2000-07-12 ソニー株式会社 IC card
JP2837829B2 (en) 1995-03-31 1998-12-16 松下電器産業株式会社 Inspection method for semiconductor device
JPH08279027A (en) 1995-04-04 1996-10-22 Toshiba Corp Radio communication card
DE19516227C2 (en) 1995-05-03 2002-02-07 Infineon Technologies Ag Data carrier arrangement, in particular chip card
US5955723A (en) 1995-05-03 1999-09-21 Siemens Aktiengesellschaft Contactless chip card
JPH08307126A (en) 1995-05-09 1996-11-22 Kyocera Corp Container structure of antenna
JP3637982B2 (en) 1995-06-27 2005-04-13 株式会社荏原電産 Inverter-driven pump control system
US5629241A (en) 1995-07-07 1997-05-13 Hughes Aircraft Company Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
JP3150575B2 (en) 1995-07-18 2001-03-26 沖電気工業株式会社 Tag device and manufacturing method thereof
GB2305075A (en) 1995-09-05 1997-03-26 Ibm Radio Frequency Tag for Electronic Apparatus
DE19534229A1 (en) 1995-09-15 1997-03-20 Licentia Gmbh Transponder arrangement
JPH0993029A (en) * 1995-09-21 1997-04-04 Matsushita Electric Ind Co Ltd Antenna device
JP3882218B2 (en) 1996-03-04 2007-02-14 ソニー株式会社 optical disk
JP3471160B2 (en) 1996-03-18 2003-11-25 株式会社東芝 Monolithic antenna
JPH09270623A (en) 1996-03-29 1997-10-14 Murata Mfg Co Ltd Antenna system
JPH09284038A (en) * 1996-04-17 1997-10-31 Nhk Spring Co Ltd Antenna equipment of non-contact data carrier
JPH09294374A (en) 1996-04-26 1997-11-11 Hitachi Ltd Power supply circuit
JP3427663B2 (en) 1996-06-18 2003-07-22 凸版印刷株式会社 Non-contact IC card
AUPO055296A0 (en) 1996-06-19 1996-07-11 Integrated Silicon Design Pty Ltd Enhanced range transponder system
US6104311A (en) 1996-08-26 2000-08-15 Addison Technologies Information storage and identification tag
JP3767030B2 (en) 1996-09-09 2006-04-19 三菱電機株式会社 Foldable wireless communication device
WO1998015916A1 (en) 1996-10-09 1998-04-16 Pav Card Gmbh Method and connection arrangement for producing a smart card
JPH10171954A (en) 1996-12-05 1998-06-26 Hitachi Maxell Ltd Non-contact type ic card
JP3279205B2 (en) 1996-12-10 2002-04-30 株式会社村田製作所 Surface mount antenna and communication equipment
JPH10193849A (en) 1996-12-27 1998-07-28 Rohm Co Ltd Circuit chip-mounted card and circuit chip module
JPH10193851A (en) 1997-01-08 1998-07-28 Denso Corp Non-contact card
DE19703029A1 (en) 1997-01-28 1998-07-30 Amatech Gmbh & Co Kg Transmission module for a transponder device and transponder device and method for operating a transponder device
JPH10242742A (en) 1997-02-26 1998-09-11 Harada Ind Co Ltd Transmission reception antenna
JP2001514777A (en) 1997-03-10 2001-09-11 プレシジョン ダイナミクス コーポレイション Reactively connected elements of a circuit provided on a flexible substrate
JPH10293828A (en) 1997-04-18 1998-11-04 Omron Corp Data carrier, coil module, reader-writer, and clothing data acquiring method
JP3900593B2 (en) 1997-05-27 2007-04-04 凸版印刷株式会社 IC card and IC module
JPH11346114A (en) 1997-06-11 1999-12-14 Matsushita Electric Ind Co Ltd Antenna device
JPH1125245A (en) * 1997-06-27 1999-01-29 Toshiba Chem Corp Non-contact data carrier package
JPH1125244A (en) * 1997-06-27 1999-01-29 Toshiba Chem Corp Non-contact data carrier package
JP3621560B2 (en) 1997-07-24 2005-02-16 三菱電機株式会社 Electromagnetic induction data carrier system
JPH1175329A (en) 1997-08-29 1999-03-16 Hitachi Ltd Non-contact type ic card system
JPH1185937A (en) 1997-09-02 1999-03-30 Nippon Lsi Card Kk Non-contact lsi card and method for inspecting the same
JPH1188241A (en) 1997-09-04 1999-03-30 Nippon Steel Corp Data carrier system
JP3853930B2 (en) 1997-09-26 2006-12-06 株式会社マースエンジニアリング Non-contact data carrier package and manufacturing method thereof
JPH11103209A (en) 1997-09-26 1999-04-13 Fujitsu Ten Ltd Radio wave reception equipment
JP3800765B2 (en) 1997-11-14 2006-07-26 凸版印刷株式会社 Compound IC card
JPH11149536A (en) 1997-11-14 1999-06-02 Toppan Printing Co Ltd Composite ic card
WO1999026195A1 (en) 1997-11-14 1999-05-27 Toppan Printing Co., Ltd. Composite ic module and composite ic card
JP3800766B2 (en) 1997-11-14 2006-07-26 凸版印刷株式会社 Compound IC module and compound IC card
JPH11175678A (en) 1997-12-09 1999-07-02 Toppan Printing Co Ltd Ic module and ic card on which the module is loaded
JP4066520B2 (en) * 1997-12-18 2008-03-26 株式会社デンソー Non-contact IC card reader / writer
JPH11220319A (en) 1998-01-30 1999-08-10 Sharp Corp Antenna system
JPH11219420A (en) 1998-02-03 1999-08-10 Tokin Corp Ic card module, ic card and their manufacture
JP2001084463A (en) 1999-09-14 2001-03-30 Miyake:Kk Resonance circuit
JPH11261325A (en) 1998-03-10 1999-09-24 Shiro Sugimura Coil element and its manufacture
JP4260917B2 (en) 1998-03-31 2009-04-30 株式会社東芝 Loop antenna
WO1999050932A1 (en) 1998-03-31 1999-10-07 Matsushita Electric Industrial Co., Ltd. Antenna unit and digital television receiver
US5936150A (en) 1998-04-13 1999-08-10 Rockwell Science Center, Llc Thin film resonant chemical sensor with resonant acoustic isolator
AU8588698A (en) 1998-04-14 1999-11-01 Liberty Carton Company Container for compressors and other goods
JP4030651B2 (en) * 1998-05-12 2008-01-09 三菱電機株式会社 Mobile phone
JPH11328352A (en) 1998-05-19 1999-11-30 Tokin Corp Connection structure between antenna and ic chip, and ic card
US6107920A (en) 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6018299A (en) 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
JP2000021639A (en) 1998-07-02 2000-01-21 Sharp Corp Inductor, resonance circuit using the same, matching circuit, antenna circuit, and oscillation circuit
JP2000022421A (en) 1998-07-03 2000-01-21 Murata Mfg Co Ltd Chip antenna and radio device mounted with it
JP2000021128A (en) 1998-07-03 2000-01-21 Nippon Steel Corp Disk-shaped storage medium and its accommodation case
AUPP473898A0 (en) 1998-07-20 1998-08-13 Integrated Silicon Design Pty Ltd Metal screened electronic labelling system
JP2000311226A (en) 1998-07-28 2000-11-07 Toshiba Corp Radio ic card and its production and read and write system of the same
EP0977145A3 (en) 1998-07-28 2002-11-06 Kabushiki Kaisha Toshiba Radio IC card
JP3956172B2 (en) 1998-07-31 2007-08-08 吉川アールエフシステム株式会社 Data carrier and antenna for data carrier
JP2000059260A (en) 1998-08-04 2000-02-25 Sony Corp Storage device
KR100699755B1 (en) 1998-08-14 2007-03-27 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Radio frequency identification systems applications
ES2198938T3 (en) 1998-08-14 2004-02-01 3M Innovative Properties Company APPLICATION FOR A RADIO FREQUENCY IDENTIFICATION SYSTEM.
JP4411670B2 (en) 1998-09-08 2010-02-10 凸版印刷株式会社 Non-contact IC card manufacturing method
JP4508301B2 (en) 1998-09-16 2010-07-21 大日本印刷株式会社 Non-contact IC card
JP3632466B2 (en) 1998-10-23 2005-03-23 凸版印刷株式会社 Inspection device and inspection method for non-contact IC card
US6837438B1 (en) 1998-10-30 2005-01-04 Hitachi Maxell, Ltd. Non-contact information medium and communication system utilizing the same
JP3924962B2 (en) 1998-10-30 2007-06-06 株式会社デンソー ID tag for dishes
JP2000137779A (en) 1998-10-30 2000-05-16 Hitachi Maxell Ltd Non-contact information medium and production thereof
JP2000137785A (en) 1998-10-30 2000-05-16 Sony Corp Manufacture of noncontact type ic card and noncontact type ic card
JP2000148948A (en) 1998-11-05 2000-05-30 Sony Corp Non-contact ic label and its manufacture
JP2000172812A (en) 1998-12-08 2000-06-23 Hitachi Maxell Ltd Noncontact information medium
FR2787640B1 (en) * 1998-12-22 2003-02-14 Gemplus Card Int ARRANGEMENT OF AN ANTENNA IN A METALLIC ENVIRONMENT
JP3088404B2 (en) 1999-01-14 2000-09-18 埼玉日本電気株式会社 Mobile radio terminal and built-in antenna
JP2000222540A (en) 1999-02-03 2000-08-11 Hitachi Maxell Ltd Non-contact type semiconductor tag
JP2000228602A (en) 1999-02-08 2000-08-15 Alps Electric Co Ltd Resonance line
JP2000243797A (en) 1999-02-18 2000-09-08 Sanken Electric Co Ltd Semiconductor wafer, and cutting method thereof, and semiconductor wafer assembly and cutting method thereof
JP3967487B2 (en) 1999-02-23 2007-08-29 株式会社東芝 IC card
JP2000251049A (en) 1999-03-03 2000-09-14 Konica Corp Card and production thereof
JP4106673B2 (en) 1999-03-05 2008-06-25 株式会社エフ・イー・シー Antenna device using coil unit, printed circuit board
JP4349597B2 (en) 1999-03-26 2009-10-21 大日本印刷株式会社 IC chip manufacturing method and memory medium manufacturing method incorporating the same
JP3751178B2 (en) 1999-03-30 2006-03-01 日本碍子株式会社 Transceiver
US6542050B1 (en) 1999-03-30 2003-04-01 Ngk Insulators, Ltd. Transmitter-receiver
JP2000286634A (en) 1999-03-30 2000-10-13 Ngk Insulators Ltd Antenna system and its manufacture
JP3067764B1 (en) 1999-03-31 2000-07-24 株式会社豊田自動織機製作所 Mobile communication coupler, mobile body, and mobile communication method
JP2000321984A (en) 1999-05-12 2000-11-24 Hitachi Ltd Label with rf-id tag
JP4286977B2 (en) 1999-07-02 2009-07-01 大日本印刷株式会社 Non-contact type IC card and its antenna characteristic adjustment method
JP3557130B2 (en) 1999-07-14 2004-08-25 新光電気工業株式会社 Method for manufacturing semiconductor device
JP2001043340A (en) 1999-07-29 2001-02-16 Toppan Printing Co Ltd Composite ic card
JP2001066990A (en) 1999-08-31 2001-03-16 Sumitomo Bakelite Co Ltd Protective filter and protection method of ic tag
US6259369B1 (en) 1999-09-30 2001-07-10 Moore North America, Inc. Low cost long distance RFID reading
JP2001101369A (en) 1999-10-01 2001-04-13 Matsushita Electric Ind Co Ltd Rf tag
JP3451373B2 (en) 1999-11-24 2003-09-29 オムロン株式会社 Manufacturing method of data carrier capable of reading electromagnetic wave
JP4186149B2 (en) 1999-12-06 2008-11-26 株式会社エフ・イー・シー Auxiliary antenna for IC card
JP2001188890A (en) 2000-01-05 2001-07-10 Omron Corp Non-contact tag
JP2001209767A (en) 2000-01-27 2001-08-03 Hitachi Maxell Ltd Object to be accessed provided with non-contact ic module
US7334734B2 (en) 2000-01-27 2008-02-26 Hitachi Maxwell, Ltd. Non-contact IC module
JP2001240046A (en) 2000-02-25 2001-09-04 Toppan Forms Co Ltd Container and manufacturing method thereof
JP4514880B2 (en) 2000-02-28 2010-07-28 大日本印刷株式会社 Book delivery, returns and inventory management system
JP2001257292A (en) 2000-03-10 2001-09-21 Hitachi Maxell Ltd Semiconductor device
JP2001256457A (en) 2000-03-13 2001-09-21 Toshiba Corp Semiconductor device, its manufacture and ic card communication system
JP2003529163A (en) 2000-03-28 2003-09-30 ルカトロン アーゲー RFID label having member for adjusting resonance frequency
JP4624536B2 (en) 2000-04-04 2011-02-02 大日本印刷株式会社 Non-contact data carrier device
JP4624537B2 (en) 2000-04-04 2011-02-02 大日本印刷株式会社 Non-contact data carrier device, storage
JP2001291181A (en) 2000-04-07 2001-10-19 Ricoh Elemex Corp Sensor and sensor system
JP2001319380A (en) 2000-05-11 2001-11-16 Mitsubishi Materials Corp Optical disk with rfid
JP2001326526A (en) * 2000-05-16 2001-11-22 Mitsubishi Electric Corp Shield antenna coil
JP2001331976A (en) 2000-05-17 2001-11-30 Casio Comput Co Ltd Optical recording type recording medium
JP4223174B2 (en) 2000-05-19 2009-02-12 Ｄｘアンテナ株式会社 Film antenna
JP2001339226A (en) 2000-05-26 2001-12-07 Nec Saitama Ltd Antenna system
JP2001344574A (en) 2000-05-30 2001-12-14 Mitsubishi Materials Corp Antenna device for interrogator
JP2001352176A (en) 2000-06-05 2001-12-21 Fuji Xerox Co Ltd Multilayer printed wiring board and manufacturing method of multilayer printed wiring board
WO2001095242A2 (en) 2000-06-06 2001-12-13 Battelle Memorial Institute Remote communication system
JP2001358527A (en) 2000-06-12 2001-12-26 Matsushita Electric Ind Co Ltd Antenna device
JP2002157564A (en) 2000-11-21 2002-05-31 Toyo Aluminium Kk Antenna coil for ic card and its manufacturing method
EP1172760B1 (en) 2000-06-23 2004-12-01 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
WO2002003560A1 (en) 2000-07-04 2002-01-10 Credipass Co.,Ltd. Passive transponder identification system and credit-card type transponder
JP4138211B2 (en) 2000-07-06 2008-08-27 株式会社村田製作所 Electronic component and manufacturing method thereof, collective electronic component, mounting structure of electronic component, and electronic apparatus
JP2002024776A (en) 2000-07-07 2002-01-25 Nippon Signal Co Ltd:The Ic card reader/writer
JP2001076111A (en) 2000-07-12 2001-03-23 Hitachi Kokusai Electric Inc Resonance circuit
JP2002032731A (en) 2000-07-14 2002-01-31 Sony Corp Non-contact information exchange card
EP1308883B1 (en) 2000-07-19 2008-09-17 Hanex Co. Ltd Rfid tag housing structure, rfid tag installation structure and rfid tag communication method
RU2163739C1 (en) 2000-07-20 2001-02-27 Криштопов Александр Владимирович Antenna
JP2002042076A (en) 2000-07-21 2002-02-08 Dainippon Printing Co Ltd Non-contact data carrier and booklet therewith
JP2002042083A (en) 2000-07-27 2002-02-08 Hitachi Maxell Ltd Non-contact communication type information carrier
JP3075400U (en) 2000-08-03 2001-02-16 昌栄印刷株式会社 Non-contact IC card
US6466007B1 (en) 2000-08-14 2002-10-15 Teradyne, Inc. Test system for smart card and indentification devices and the like
JP2002063557A (en) 2000-08-21 2002-02-28 Mitsubishi Materials Corp Tag for rfid
JP2002076750A (en) 2000-08-24 2002-03-15 Murata Mfg Co Ltd Antenna device and radio equipment equipped with it
JP2002143826A (en) 2000-08-30 2002-05-21 Denso Corp System for recycling waste and system for detecting unlawful dumping
JP3481575B2 (en) * 2000-09-28 2003-12-22 寛児 川上 antenna
JP4615695B2 (en) 2000-10-19 2011-01-19 三星エスディーエス株式会社 IC module for IC card and IC card using it
US6634564B2 (en) 2000-10-24 2003-10-21 Dai Nippon Printing Co., Ltd. Contact/noncontact type data carrier module
JP4628611B2 (en) 2000-10-27 2011-02-09 三菱マテリアル株式会社 antenna
JP4432254B2 (en) 2000-11-20 2010-03-17 株式会社村田製作所 Surface mount antenna structure and communication device including the same
JP2002185358A (en) 2000-11-24 2002-06-28 Supersensor Pty Ltd Method for fitting rf transponder to container
JP4641096B2 (en) 2000-12-07 2011-03-02 大日本印刷株式会社 Non-contact data carrier device and wiring member for booster antenna
JP2002183676A (en) 2000-12-08 2002-06-28 Hitachi Ltd Information reader
JP2002175920A (en) 2000-12-08 2002-06-21 Murata Mfg Co Ltd High-frequency filter element
JP2002183690A (en) 2000-12-11 2002-06-28 Hitachi Maxell Ltd Noncontact ic tag device
AU2002226093A1 (en) 2000-12-15 2002-06-24 Electrox Corp. Process for the manufacture of novel, inexpensive radio frequency identificationdevices
JP3788325B2 (en) 2000-12-19 2006-06-21 株式会社村田製作所 Multilayer coil component and manufacturing method thereof
JP3621655B2 (en) 2001-04-23 2005-02-16 株式会社ハネックス中央研究所 RFID tag structure and manufacturing method thereof
TW531976B (en) 2001-01-11 2003-05-11 Hanex Co Ltd Communication apparatus and installing structure, manufacturing method and communication method
KR20020061103A (en) 2001-01-12 2002-07-22 후루까와덴끼고오교 가부시끼가이샤 Antenna device and terminal with the antenna device
JP2002280821A (en) 2001-01-12 2002-09-27 Furukawa Electric Co Ltd:The Antenna system and terminal equipment
JP2002222398A (en) 2001-01-25 2002-08-09 Jstm Kk Non-contact data carrier
JP2002232221A (en) 2001-01-30 2002-08-16 Alps Electric Co Ltd Transmission and reception unit
JPWO2002061675A1 (en) 2001-01-31 2004-06-03 株式会社ルネサステクノロジ Non-contact identification medium
JP4662400B2 (en) 2001-02-05 2011-03-30 大日本印刷株式会社 Articles with coil-on-chip semiconductor modules
JP2002246828A (en) 2001-02-15 2002-08-30 Mitsubishi Materials Corp Antenna for transponder
JP4396046B2 (en) 2001-02-16 2010-01-13 株式会社デンソー Reader / writer for ID tag
DE60239262D1 (en) 2001-03-02 2011-04-07 Nxp Bv MODULE AND ELECTRONIC DEVICE
JP4712986B2 (en) 2001-03-06 2011-06-29 大日本印刷株式会社 Liquid container with RFID tag
JP2002290130A (en) 2001-03-28 2002-10-04 Aiwa Co Ltd Radio communication unit
JP3772778B2 (en) 2001-03-30 2006-05-10 三菱マテリアル株式会社 Antenna coil, identification tag using the same, reader / writer device, reader device and writer device
JP2002298109A (en) 2001-03-30 2002-10-11 Toppan Forms Co Ltd Contactless ic medium and manufacturing method thereof
JP3570386B2 (en) 2001-03-30 2004-09-29 松下電器産業株式会社 Portable information terminal with built-in wireless function
JP2002308437A (en) 2001-04-16 2002-10-23 Dainippon Printing Co Ltd Inspection system using rfid tag
JP2002319812A (en) 2001-04-20 2002-10-31 Oji Paper Co Ltd Data carrier adhesion method
JP4700831B2 (en) 2001-04-23 2011-06-15 株式会社ハネックス RFID tag communication distance expansion method
JP4265114B2 (en) 2001-04-26 2009-05-20 三菱マテリアル株式会社 Antenna coil for tags
JP2002325013A (en) * 2001-04-26 2002-11-08 Mitsubishi Materials Corp Antenna coil
JP3850680B2 (en) * 2001-05-15 2006-11-29 サクサ株式会社 Non-contact type IC card reader / writer device
JP2005236339A (en) 2001-07-19 2005-09-02 Oji Paper Co Ltd Ic chip mounted body
FI112550B (en) 2001-05-31 2003-12-15 Rafsec Oy Smart label and smart label path
JP2002362613A (en) 2001-06-07 2002-12-18 Toppan Printing Co Ltd Laminated packaging material having non-contact ic, packaging container using laminated packaging material and method for detecting opened seal of packaging container
JP2002366917A (en) 2001-06-07 2002-12-20 Hitachi Ltd Ic card incorporating antenna
JP4710174B2 (en) 2001-06-13 2011-06-29 株式会社村田製作所 Balanced LC filter
JP2002373029A (en) 2001-06-18 2002-12-26 Hitachi Ltd Method for preventing illegal copy of software by using ic tag
JP4882167B2 (en) 2001-06-18 2012-02-22 大日本印刷株式会社 Card-integrated form with non-contact IC chip
JP4759854B2 (en) 2001-06-19 2011-08-31 株式会社寺岡精工 Mounting method of IC tag to metal object and IC tag built-in marker
JP2003087008A (en) 2001-07-02 2003-03-20 Ngk Insulators Ltd Laminated type dielectric filter
JP4058919B2 (en) 2001-07-03 2008-03-12 日立化成工業株式会社 Non-contact IC label, non-contact IC card, non-contact IC label or IC module for non-contact IC card
JP2003026177A (en) 2001-07-12 2003-01-29 Toppan Printing Co Ltd Packaging member with non-contact type ic chip
JP2003030612A (en) 2001-07-19 2003-01-31 Oji Paper Co Ltd Ic chip mounting body
JP4670195B2 (en) 2001-07-23 2011-04-13 凸版印刷株式会社 Mobile phone case with non-contact IC card
US7274285B2 (en) 2001-07-24 2007-09-25 Hewlett-Packard Development Company, L.P. System and method for improved object identification
ES2295105T3 (en) 2001-07-26 2008-04-16 Irdeto Access B.V. SYSTEM FOR THE VALIDATION OF TIME TIME.
JP3629448B2 (en) 2001-07-27 2005-03-16 Ｔｄｋ株式会社 ANTENNA DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
JP4731060B2 (en) 2001-07-31 2011-07-20 トッパン・フォームズ株式会社 RF-ID inspection method and inspection system
JP2003058840A (en) 2001-08-14 2003-02-28 Hirano Design Sekkei:Kk Information protection management program utilizing rfid-loaded computer recording medium
JP2003069335A (en) 2001-08-28 2003-03-07 Hitachi Kokusai Electric Inc Auxiliary antenna
JP2003067711A (en) 2001-08-29 2003-03-07 Toppan Forms Co Ltd Article provided with ic chip mounting body or antenna part
JP2003078333A (en) 2001-08-30 2003-03-14 Murata Mfg Co Ltd Radio communication apparatus
JP2003078336A (en) 2001-08-30 2003-03-14 Tokai Univ Laminated spiral antenna
JP4843885B2 (en) 2001-08-31 2011-12-21 凸版印刷株式会社 Fraud prevention label with IC memory chip
JP4514374B2 (en) 2001-09-05 2010-07-28 トッパン・フォームズ株式会社 RF-ID inspection system
JP4747467B2 (en) 2001-09-07 2011-08-17 大日本印刷株式会社 Non-contact IC tag
JP2003085520A (en) 2001-09-11 2003-03-20 Oji Paper Co Ltd Manufacturing method for ic card
JP2003087044A (en) 2001-09-12 2003-03-20 Mitsubishi Materials Corp Antenna for rfid and rfid system having the antenna
JP4845306B2 (en) 2001-09-25 2011-12-28 トッパン・フォームズ株式会社 RF-ID inspection system
JP4698096B2 (en) 2001-09-25 2011-06-08 トッパン・フォームズ株式会社 RF-ID inspection system
JP2003099184A (en) 2001-09-25 2003-04-04 Sharp Corp Information system and information processor and input pen to be used for the same system
JP2003110344A (en) 2001-09-26 2003-04-11 Hitachi Metals Ltd Surface-mounting type antenna and antenna device mounting the same
JP4196554B2 (en) 2001-09-28 2008-12-17 三菱マテリアル株式会社 Tag antenna coil and RFID tag using the same
WO2003030300A1 (en) 2001-09-28 2003-04-10 Mitsubishi Materials Corporation Antenna coil and rfid-use tag using it, transponder-use antenna
JP2003132330A (en) 2001-10-25 2003-05-09 Sato Corp Rfid label printer
JP2003134007A (en) 2001-10-30 2003-05-09 Auto Network Gijutsu Kenkyusho:Kk System and method for exchanging signal between on- vehicle equipment
JP3984458B2 (en) 2001-11-20 2007-10-03 大日本印刷株式会社 Manufacturing method of package with IC tag
JP3908514B2 (en) 2001-11-20 2007-04-25 大日本印刷株式会社 Package with IC tag and method of manufacturing package with IC tag
US6812707B2 (en) 2001-11-27 2004-11-02 Mitsubishi Materials Corporation Detection element for objects and detection device using the same
JP3894540B2 (en) 2001-11-30 2007-03-22 トッパン・フォームズ株式会社 Interposer with conductive connection
JP2003188338A (en) 2001-12-13 2003-07-04 Sony Corp Circuit board and its manufacturing method
JP3700777B2 (en) 2001-12-17 2005-09-28 三菱マテリアル株式会社 Electrode structure of RFID tag and method for adjusting resonance frequency using the electrode
JP2003188620A (en) 2001-12-19 2003-07-04 Murata Mfg Co Ltd Antenna integral with module
JP4028224B2 (en) 2001-12-20 2007-12-26 大日本印刷株式会社 Paper IC card substrate having non-contact communication function
JP3895175B2 (en) 2001-12-28 2007-03-22 Ｎｔｎ株式会社 Dielectric resin integrated antenna
JP3896965B2 (en) 2002-01-17 2007-03-22 三菱マテリアル株式会社 Reader / writer antenna and reader / writer equipped with the antenna
JP2003209421A (en) 2002-01-17 2003-07-25 Dainippon Printing Co Ltd Rfid tag having transparent antenna and production method therefor
CN101308947A (en) * 2002-01-17 2008-11-19 三菱麻铁里亚尔株式会社 Antenna for reader/writer and reader/writer having the antenna
JP3915092B2 (en) 2002-01-21 2007-05-16 株式会社エフ・イー・シー Booster antenna for IC card
JP2003216919A (en) 2002-01-23 2003-07-31 Toppan Forms Co Ltd Rf-id media
JP2003233780A (en) 2002-02-06 2003-08-22 Mitsubishi Electric Corp Data communication device
JP3998992B2 (en) 2002-02-14 2007-10-31 大日本印刷株式会社 Method for forming antenna pattern on IC chip mounted on web and package with IC tag
JP2003243918A (en) 2002-02-18 2003-08-29 Dainippon Printing Co Ltd Antenna for non-contact ic tag, and non-contact ic tag
JP2003249813A (en) 2002-02-25 2003-09-05 Tecdia Kk Tag for rfid with loop antenna
JP2003331250A (en) * 2002-03-05 2003-11-21 Mitsubishi Materials Corp Small disk with rfid
US7119693B1 (en) 2002-03-13 2006-10-10 Celis Semiconductor Corp. Integrated circuit with enhanced coupling
JP2003288560A (en) 2002-03-27 2003-10-10 Toppan Forms Co Ltd Interposer and inlet sheet with antistatic function
US7129834B2 (en) 2002-03-28 2006-10-31 Kabushiki Kaisha Toshiba String wireless sensor and its manufacturing method
JP2003309418A (en) 2002-04-17 2003-10-31 Alps Electric Co Ltd Dipole antenna
JP2003308363A (en) 2002-04-18 2003-10-31 Oki Electric Ind Co Ltd Product and related information management method
JP2003317060A (en) 2002-04-22 2003-11-07 Dainippon Printing Co Ltd Ic card
US7135974B2 (en) 2002-04-22 2006-11-14 Symbol Technologies, Inc. Power source system for RF location/identification tags
JP2003317052A (en) 2002-04-24 2003-11-07 Smart Card:Kk Ic tag system
AU2003232221A1 (en) * 2002-05-02 2003-11-17 Sony Ericsson Mobile Communications Ab Integrated antenna assembly
JP3879098B2 (en) 2002-05-10 2007-02-07 株式会社エフ・イー・シー Booster antenna for IC card
JP3979178B2 (en) 2002-05-14 2007-09-19 凸版印刷株式会社 Non-contact IC medium module and non-contact IC medium
US6753814B2 (en) 2002-06-27 2004-06-22 Harris Corporation Dipole arrangements using dielectric substrates of meta-materials
JP3863464B2 (en) 2002-07-05 2006-12-27 株式会社ヨコオ Filter built-in antenna
JP3803085B2 (en) 2002-08-08 2006-08-02 株式会社日立製作所 Wireless IC tag
JP4100993B2 (en) 2002-08-09 2008-06-11 キヤノン株式会社 Electronics
JP2004088218A (en) 2002-08-23 2004-03-18 Tokai Univ Planar antenna
JP4107381B2 (en) 2002-08-23 2008-06-25 横浜ゴム株式会社 Pneumatic tire
JP4273724B2 (en) 2002-08-29 2009-06-03 カシオ電子工業株式会社 Consumables unauthorized use prevention system
JP2004096566A (en) 2002-09-02 2004-03-25 Toenec Corp Inductive communication equipment
JP3925364B2 (en) 2002-09-03 2007-06-06 株式会社豊田中央研究所 Antenna and diversity receiver
JP3645239B2 (en) 2002-09-06 2005-05-11 シャープ株式会社 Dipole antenna, tag and moving object identification system using the same
AU2003272420A1 (en) 2002-09-20 2004-04-08 Fairchild Semiconductor Corporation Rfid tag wide bandwidth logarithmic spiral antenna method and system
JP4232474B2 (en) * 2002-09-27 2009-03-04 ソニー株式会社 Electronic equipment with communication function
JP3975918B2 (en) * 2002-09-27 2007-09-12 ソニー株式会社 Antenna device
JP2004126750A (en) 2002-09-30 2004-04-22 Toppan Forms Co Ltd Information write/read device, antenna and rf-id medium
JP2004121412A (en) 2002-09-30 2004-04-22 Toppan Printing Co Ltd Surgical gauze, and its management device
JP3958667B2 (en) 2002-10-16 2007-08-15 株式会社日立国際電気 Loop antenna for reader / writer, and article management shelf and book management system provided with the loop antenna
EP1556947A4 (en) 2002-10-17 2006-07-26 Ambient Corp Filter for segmenting power lines for communications
JP4158483B2 (en) 2002-10-22 2008-10-01 ソニー株式会社 IC module
JP3659956B2 (en) 2002-11-11 2005-06-15 松下電器産業株式会社 Pressure measuring device and pressure measuring system
JP3789424B2 (en) 2002-11-20 2006-06-21 埼玉日本電気株式会社 Mobile device
JP2004213582A (en) 2003-01-09 2004-07-29 Mitsubishi Materials Corp Rfid tag, reader/writer and rfid system with tag
DE602004026549D1 (en) 2003-02-03 2010-05-27 Panasonic Corp ANTENNA DEVICE AND THEREOF USING WIRELESS COMMUNICATION DEVICE
JP2004234595A (en) 2003-02-03 2004-08-19 Matsushita Electric Ind Co Ltd Information recording medium reader
EP1445821A1 (en) 2003-02-06 2004-08-11 Matsushita Electric Industrial Co., Ltd. Portable radio communication apparatus provided with a boom portion
US7225992B2 (en) 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
JP2004253858A (en) 2003-02-18 2004-09-09 Minerva:Kk Booster antenna device for ic tag
JP4010263B2 (en) 2003-03-14 2007-11-21 富士電機ホールディングス株式会社 Antenna and data reader
JP2004280390A (en) 2003-03-14 2004-10-07 Toppan Forms Co Ltd Rf-id media and method for manufacturing the same
JP4034676B2 (en) 2003-03-20 2008-01-16 日立マクセル株式会社 Non-contact communication type information carrier
JP2004297249A (en) 2003-03-26 2004-10-21 Matsushita Electric Ind Co Ltd Coupler between different phase lines, mounting method therefor, and coupling method between different phase lines
JP4097139B2 (en) 2003-03-26 2008-06-11 Ｎｅｃトーキン株式会社 Wireless tag
JP2004297681A (en) 2003-03-28 2004-10-21 Toppan Forms Co Ltd Non-contact information recording medium
JP2004304370A (en) 2003-03-28 2004-10-28 Sony Corp Antenna coil and communication equipment
JP4208631B2 (en) 2003-04-17 2009-01-14 日本ミクロン株式会社 Manufacturing method of semiconductor device
JP2004326380A (en) 2003-04-24 2004-11-18 Dainippon Printing Co Ltd Rfid tag
JP2004334268A (en) 2003-04-30 2004-11-25 Dainippon Printing Co Ltd Paper slip ic tag, book/magazine with it, and book with it
JP2004336250A (en) 2003-05-02 2004-11-25 Taiyo Yuden Co Ltd Antenna matching circuit, and mobile communication apparatus and dielectric antenna having the same
JP4080944B2 (en) 2003-05-12 2008-04-23 株式会社ハネックス Data carrier installation structure
JP2004343000A (en) 2003-05-19 2004-12-02 Fujikura Ltd Semiconductor module, non-contact integrated circuit tag having the semiconductor module, and method of manufacturing semiconductor module
JP2004362190A (en) 2003-06-04 2004-12-24 Hitachi Ltd Semiconductor device
JP4828088B2 (en) 2003-06-05 2011-11-30 凸版印刷株式会社 IC tag
JP2005005866A (en) 2003-06-10 2005-01-06 Alps Electric Co Ltd Antenna-integrated module
JP3596774B1 (en) 2003-06-12 2004-12-02 松下電器産業株式会社 Portable radio
JP4210559B2 (en) 2003-06-23 2009-01-21 大日本印刷株式会社 Sheet with IC tag and manufacturing method thereof
JP2005033461A (en) * 2003-07-11 2005-02-03 Mitsubishi Materials Corp Rfid system and structure of antenna therein
JP2005050581A (en) 2003-07-30 2005-02-24 Seiko Epson Corp Power supply cord, power supply code inspection device, and power supply code inspection method
JP2005064799A (en) 2003-08-11 2005-03-10 Toppan Printing Co Ltd Rfid antenna for portable information terminal unit
JP3982476B2 (en) * 2003-10-01 2007-09-26 ソニー株式会社 Communications system
JP4062233B2 (en) 2003-10-20 2008-03-19 トヨタ自動車株式会社 Loop antenna device
JP4680489B2 (en) 2003-10-21 2011-05-11 三菱電機株式会社 Information record reading system
JP2005134942A (en) 2003-10-28 2005-05-26 Mitsubishi Materials Corp Rfid reader/writer and structure of antenna
JP3570430B1 (en) 2003-10-29 2004-09-29 オムロン株式会社 Loop coil antenna
JP4402426B2 (en) 2003-10-30 2010-01-20 大日本印刷株式会社 Temperature change detection system
JP4343655B2 (en) 2003-11-12 2009-10-14 株式会社日立製作所 antenna
JP4451125B2 (en) 2003-11-28 2010-04-14 シャープ株式会社 Small antenna
JP2005165839A (en) 2003-12-04 2005-06-23 Nippon Signal Co Ltd:The Reader/writer, ic tag, article control device, and optical disk device
JP4177241B2 (en) 2003-12-04 2008-11-05 株式会社日立情報制御ソリューションズ Wireless IC tag antenna, wireless IC tag, and container with wireless IC tag
JP4916658B2 (en) 2003-12-19 2012-04-18 株式会社半導体エネルギー研究所 Semiconductor device
US7494066B2 (en) 2003-12-19 2009-02-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US6999028B2 (en) 2003-12-23 2006-02-14 3M Innovative Properties Company Ultra high frequency radio frequency identification tag
JP4326936B2 (en) 2003-12-24 2009-09-09 シャープ株式会社 Wireless tag
US7777677B2 (en) 2003-12-25 2010-08-17 Mitsubishi Material Corporation Antenna device and communication apparatus
JP2005210676A (en) 2003-12-25 2005-08-04 Hitachi Ltd Wireless ic tag, and method and apparatus for manufacturing the same
EP1548674A1 (en) 2003-12-25 2005-06-29 Hitachi, Ltd. Radio IC tag, method and apparatus for manufacturing the same
JP4089680B2 (en) 2003-12-25 2008-05-28 三菱マテリアル株式会社 Antenna device
JP4218519B2 (en) * 2003-12-26 2009-02-04 戸田工業株式会社 Magnetic field antenna, wireless system and communication system using the same
JP2005190417A (en) 2003-12-26 2005-07-14 Taketani Shoji:Kk Fixed object management system and individual identifier for use therein
JP4174801B2 (en) * 2004-01-15 2008-11-05 株式会社エフ・イー・シー Identification tag reader / writer antenna
FR2865329B1 (en) 2004-01-19 2006-04-21 Pygmalyon PASSIVE RECEIVER-RECEIVER DEVICE POWERED BY AN ELECTROMAGNETIC WAVE
JP2005210223A (en) 2004-01-20 2005-08-04 Tdk Corp Antenna device
WO2005073937A2 (en) 2004-01-22 2005-08-11 Mikoh Corporation A modular radio frequency identification tagging method
KR101270180B1 (en) 2004-01-30 2013-05-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 An inspection apparatus, inspenction method, and method for manufacturing a semiconductor device
JP4271591B2 (en) 2004-01-30 2009-06-03 双信電機株式会社 Antenna device
JP2005229474A (en) 2004-02-16 2005-08-25 Olympus Corp Information terminal device
JP4393228B2 (en) 2004-02-27 2010-01-06 シャープ株式会社 Small antenna and wireless tag provided with the same
JP2005252853A (en) 2004-03-05 2005-09-15 Fec Inc Antenna for rf-id
JP2005269537A (en) * 2004-03-22 2005-09-29 Mitsubishi Electric Corp Radio device
JP2005277579A (en) 2004-03-23 2005-10-06 Kyocera Corp High frequency module and communication apparatus employing the same
JP4374346B2 (en) 2004-03-24 2009-12-02 株式会社内田洋行 IC tag affixing sheet for optical recording media
JP2005275870A (en) 2004-03-25 2005-10-06 Matsushita Electric Ind Co Ltd Insertion type radio communication medium device and electronic equipment
JP2005284352A (en) 2004-03-26 2005-10-13 Toshiba Corp Portable electronic equipment
JP2005284455A (en) 2004-03-29 2005-10-13 Fujita Denki Seisakusho:Kk Rfid system
JP4067510B2 (en) 2004-03-31 2008-03-26 シャープ株式会社 Television receiver
JP2005293537A (en) 2004-04-05 2005-10-20 Fuji Xynetics Kk Cardboard with ic tag
US8139759B2 (en) 2004-04-16 2012-03-20 Panasonic Corporation Line state detecting apparatus and transmitting apparatus and receiving apparatus of balanced transmission system
JP2005311205A (en) 2004-04-23 2005-11-04 Nec Corp Semiconductor device
JP2005306696A (en) 2004-04-26 2005-11-04 Matsushita Electric Ind Co Ltd Magnetic ferrite, and common mode noise filter and chip transformer using the same
JP2005340759A (en) 2004-04-27 2005-12-08 Sony Corp Magnetic core member for antenna module, antenna module, and personal digital assistant equipped with this
JP2005322119A (en) 2004-05-11 2005-11-17 Ic Brains Co Ltd Device for preventing illegal taking of article equipped with ic tag
JP2005321305A (en) 2004-05-10 2005-11-17 Murata Mfg Co Ltd Electronic component measurement jig
JP3867085B2 (en) 2004-05-13 2007-01-10 東芝テック株式会社 Wireless communication device, RF tag reader / writer, and printer
JP4191088B2 (en) 2004-05-14 2008-12-03 株式会社デンソー Electronic equipment
JP2005333244A (en) 2004-05-18 2005-12-02 Mitsubishi Electric Corp Mobile telephone set
US7317396B2 (en) 2004-05-26 2008-01-08 Funai Electric Co., Ltd. Optical disc having RFID tag, optical disc apparatus, and system for preventing unauthorized copying
JP4551122B2 (en) 2004-05-26 2010-09-22 株式会社岩田レーベル RFID label affixing device
JP4360276B2 (en) 2004-06-02 2009-11-11 船井電機株式会社 Optical disc having wireless IC tag and optical disc reproducing apparatus
JP2005345802A (en) 2004-06-03 2005-12-15 Casio Comput Co Ltd Imaging device, replacement unit used for the imaging device, and replacement unit use control method and program
JP2005352858A (en) 2004-06-11 2005-12-22 Hitachi Maxell Ltd Communication type recording medium
JP4348282B2 (en) 2004-06-11 2009-10-21 株式会社日立製作所 Wireless IC tag and method of manufacturing wireless IC tag
JP4530140B2 (en) 2004-06-28 2010-08-25 Ｔｄｋ株式会社 Soft magnetic material and antenna device using the same
JP4359198B2 (en) 2004-06-30 2009-11-04 株式会社日立製作所 IC tag mounting substrate manufacturing method
JP4328682B2 (en) 2004-07-13 2009-09-09 富士通株式会社 Radio tag antenna structure for optical recording medium and optical recording medium housing case with radio tag antenna
JP2006033312A (en) * 2004-07-15 2006-02-02 Matsushita Electric Ind Co Ltd Antenna and antenna fitting method
JP2004362602A (en) 2004-07-26 2004-12-24 Hitachi Ltd Rfid tag
JP2006039947A (en) * 2004-07-27 2006-02-09 Daido Steel Co Ltd Composite magnetic sheet
JP2006039902A (en) 2004-07-27 2006-02-09 Ntn Corp Uhf band radio ic tag
JP2006042059A (en) 2004-07-28 2006-02-09 Tdk Corp Radio communication apparatus and impedance controlling method thereof
JP2006042097A (en) 2004-07-29 2006-02-09 Kyocera Corp Antenna wiring board
JP2006050200A (en) 2004-08-04 2006-02-16 Matsushita Electric Ind Co Ltd Reader/writer
JP4653440B2 (en) 2004-08-13 2011-03-16 富士通株式会社 RFID tag and manufacturing method thereof
JP4482403B2 (en) 2004-08-30 2010-06-16 日本発條株式会社 Non-contact information medium
JP4186895B2 (en) 2004-09-01 2008-11-26 株式会社デンソーウェーブ Coil antenna for non-contact communication device and manufacturing method thereof
JP4125275B2 (en) 2004-09-02 2008-07-30 日本電信電話株式会社 Non-contact IC medium control system
JP2005129019A (en) 2004-09-03 2005-05-19 Sony Chem Corp Ic card
JP2006080367A (en) 2004-09-10 2006-03-23 Brother Ind Ltd Inductance element, radio tag circuit element, tagged tape roll, and manufacturing method of inductance element
US20060055531A1 (en) 2004-09-14 2006-03-16 Honeywell International, Inc. Combined RF tag and SAW sensor
JP2006085552A (en) * 2004-09-17 2006-03-30 Oji Paper Co Ltd Reader and/or writer device
JP2006092630A (en) 2004-09-22 2006-04-06 Sony Corp Optical disk and manufacturing method therefor
JP4600742B2 (en) 2004-09-30 2010-12-15 ブラザー工業株式会社 Print head and tag label producing apparatus
JP2006107296A (en) 2004-10-08 2006-04-20 Dainippon Printing Co Ltd Non-contact ic tag and antenna for non-contact ic tag
GB2419779A (en) 2004-10-29 2006-05-03 Hewlett Packard Development Co Document having conductive tracks for coupling to a memory tag and a reader
WO2006048663A1 (en) 2004-11-05 2006-05-11 Qinetiq Limited Detunable rf tags
EP1713022A4 (en) 2004-11-08 2008-02-20 Matsushita Electric Ind Co Ltd Antenna assembly and wireless communication system employing same
JP4088797B2 (en) 2004-11-18 2008-05-21 日本電気株式会社 RFID tag
JP2006148518A (en) 2004-11-19 2006-06-08 Matsushita Electric Works Ltd Adjuster and adjusting method of non-contact ic card
JP2006151402A (en) 2004-11-25 2006-06-15 Rengo Co Ltd Corrugated box with radio tag
US7545328B2 (en) 2004-12-08 2009-06-09 Electronics And Telecommunications Research Institute Antenna using inductively coupled feeding method, RFID tag using the same and antenna impedance matching method thereof
JP4281683B2 (en) 2004-12-16 2009-06-17 株式会社デンソー IC tag mounting structure
WO2006068286A1 (en) 2004-12-24 2006-06-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP4942998B2 (en) 2004-12-24 2012-05-30 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of semiconductor device
JP4541246B2 (en) 2004-12-24 2010-09-08 トッパン・フォームズ株式会社 Non-contact IC module
JP4737505B2 (en) 2005-01-14 2011-08-03 日立化成工業株式会社 IC tag inlet and manufacturing method of IC tag inlet
US7714794B2 (en) 2005-01-19 2010-05-11 Behzad Tavassoli Hozouri RFID antenna
JP4711692B2 (en) 2005-02-01 2011-06-29 富士通株式会社 Meander line antenna
JP2006232292A (en) 2005-02-22 2006-09-07 Nippon Sheet Glass Co Ltd Container with electronic tag, and rfid system
JP2006237674A (en) 2005-02-22 2006-09-07 Suncall Corp Patch antenna and rfid inlet
JP2006238282A (en) 2005-02-28 2006-09-07 Matsushita Electric Ind Co Ltd Antenna unit, transmitter/receiver, wireless tag reading apparatus, and wireless tag read system
JP4639857B2 (en) 2005-03-07 2011-02-23 富士ゼロックス株式会社 A storage box for storing articles to which RFID tags are attached, an arrangement method thereof, a communication method, a communication confirmation method, and a packaging structure.
US8008066B2 (en) 2005-03-10 2011-08-30 Gen-Probe Incorporated System for performing multi-formatted assays
JP4330575B2 (en) 2005-03-17 2009-09-16 富士通株式会社 Tag antenna
JP4437965B2 (en) 2005-03-22 2010-03-24 Ｎｅｃトーキン株式会社 Wireless tag
JP2006270681A (en) 2005-03-25 2006-10-05 Sony Corp Portable equipment
JP4087859B2 (en) 2005-03-25 2008-05-21 東芝テック株式会社 Wireless tag
JP2006287659A (en) 2005-03-31 2006-10-19 Tdk Corp Antenna device
CN101142711B (en) 2005-04-01 2012-07-04 富士通株式会社 RFID label suitable for metal and RFID label section of the same
JP4750450B2 (en) 2005-04-05 2011-08-17 富士通株式会社 RFID tag
JP2006302219A (en) 2005-04-25 2006-11-02 Fujita Denki Seisakusho:Kk Rfid tag communication range setting device
US8115681B2 (en) 2005-04-26 2012-02-14 Emw Co., Ltd. Ultra-wideband antenna having a band notch characteristic
JP4771115B2 (en) 2005-04-27 2011-09-14 日立化成工業株式会社 IC tag
JP4452865B2 (en) 2005-04-28 2010-04-21 智三 太田 Wireless IC tag device and RFID system
JP4529786B2 (en) 2005-04-28 2010-08-25 株式会社日立製作所 Signal processing circuit and non-contact IC card and tag using the same
US8111143B2 (en) 2005-04-29 2012-02-07 Hewlett-Packard Development Company, L.P. Assembly for monitoring an environment
JP4740645B2 (en) 2005-05-17 2011-08-03 富士通株式会社 Manufacturing method of semiconductor device
US7688272B2 (en) 2005-05-30 2010-03-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2007013120A (en) 2005-05-30 2007-01-18 Semiconductor Energy Lab Co Ltd Semiconductor device
JP4827618B2 (en) * 2005-05-31 2011-11-30 株式会社半導体エネルギー研究所 Method for manufacturing antenna, method for manufacturing semiconductor device
JP4255931B2 (en) 2005-06-01 2009-04-22 日本電信電話株式会社 Non-contact IC medium and control device
JP2007007888A (en) 2005-06-28 2007-01-18 Oji Paper Co Ltd Non-contact ic chip mount body mounting corrugated cardboard and its manufacturing method
JP2007018067A (en) 2005-07-05 2007-01-25 Kobayashi Kirokushi Co Ltd Rfid tag and rfid system
JP4286813B2 (en) 2005-07-08 2009-07-01 富士通株式会社 Antenna and RFID tag equipped with the same
JP2007028002A (en) 2005-07-13 2007-02-01 Matsushita Electric Ind Co Ltd Antenna of reader/writer, and communication system
EP1912284B1 (en) 2005-07-29 2012-04-11 Fujitsu Ltd. Rf tag and rf tag manufacturing method
JP2007040702A (en) 2005-07-29 2007-02-15 Oki Electric Ind Co Ltd Semiconductor ic, wireless ic tag and sensor
JP4720348B2 (en) 2005-08-04 2011-07-13 パナソニック株式会社 Antenna for RF-ID reader / writer device, RF-ID reader / writer device using the antenna, and RF-ID system
JP4737716B2 (en) 2005-08-11 2011-08-03 ブラザー工業株式会社 RFID tag IC circuit holder, tag tape roll, RFID tag cartridge
JP4801951B2 (en) 2005-08-18 2011-10-26 富士通フロンテック株式会社 RFID tag
JP2007065822A (en) 2005-08-30 2007-03-15 Sofueru:Kk Radio ic tag, intermediate ic tag body, intermediate ic tag body set and method for manufacturing radio ic tag
JP2007068073A (en) 2005-09-02 2007-03-15 Sony Corp Information processing device
DE102005042444B4 (en) 2005-09-06 2007-10-11 Ksw Microtec Ag Arrangement for an RFID transponder antenna
JP4725261B2 (en) 2005-09-12 2011-07-13 オムロン株式会社 RFID tag inspection method
JP4384102B2 (en) 2005-09-13 2009-12-16 株式会社東芝 Portable radio device and antenna device
JP2007096655A (en) 2005-09-28 2007-04-12 Oji Paper Co Ltd Antenna for rfid tag and rfid tag
JP4075919B2 (en) 2005-09-29 2008-04-16 オムロン株式会社 Antenna unit and non-contact IC tag
JP4826195B2 (en) 2005-09-30 2011-11-30 大日本印刷株式会社 RFID tag
JP2007116347A (en) * 2005-10-19 2007-05-10 Mitsubishi Materials Corp Tag antenna and mobile radio equipment
JP4774273B2 (en) 2005-10-31 2011-09-14 株式会社サトー RFID label and RFID label attaching method
JP2007159083A (en) 2005-11-09 2007-06-21 Alps Electric Co Ltd Antenna matching circuit
EP1953862A4 (en) 2005-11-22 2009-01-14 Murata Manufacturing Co Coil antenna and portable electronic apparatus
JP4899446B2 (en) 2005-11-24 2012-03-21 Ｔｄｋ株式会社 Composite electronic component and manufacturing method thereof
JP2007150642A (en) 2005-11-28 2007-06-14 Hitachi Ulsi Systems Co Ltd Interrogator for wireless tag, antenna for wireless tag, wireless tag system, and wireless tag selector
JP2007150868A (en) 2005-11-29 2007-06-14 Renesas Technology Corp Electronic equipment and method of manufacturing the same
WO2007063786A1 (en) 2005-11-29 2007-06-07 Semiconductor Energy Laboratory Co., Ltd. Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication system
US7573388B2 (en) 2005-12-08 2009-08-11 The Kennedy Group, Inc. RFID device with augmented grain
JP4560480B2 (en) 2005-12-13 2010-10-13 Ｎｅｃトーキン株式会社 Wireless tag
JP4815211B2 (en) 2005-12-22 2011-11-16 株式会社サトー RFID label and RFID label attaching method
JP4848764B2 (en) 2005-12-26 2011-12-28 大日本印刷株式会社 Non-contact data carrier device
CN100412593C (en) * 2006-01-18 2008-08-20 华硕电脑股份有限公司 Lens module, and electronic equipment of using the Lens module
JP4473825B2 (en) * 2006-01-19 2010-06-02 原田工業株式会社 Mobile terminal antenna
WO2007083575A1 (en) 2006-01-19 2007-07-26 Murata Manufacturing Co., Ltd. Radio ic device
US7519328B2 (en) 2006-01-19 2009-04-14 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
CN105631509A (en) 2006-01-19 2016-06-01 株式会社村田制作所 Radio ic device and radio ic device part
JP4696923B2 (en) 2006-01-19 2011-06-08 横河電機株式会社 Antenna, wireless tag device using the antenna, and wireless tag communication device
JP4728820B2 (en) * 2006-01-26 2011-07-20 シャープ株式会社 Radio wave IC tag system and radio wave IC tag
US20090231106A1 (en) 2006-01-27 2009-09-17 Totoku Electric Co., Ltd. Tag Apparatus,Transceiver Apparatus, and Tag System
KR101061648B1 (en) 2006-02-19 2011-09-01 니폰샤신인사츠가부시키가이샤 Feeding structure of the housing with antenna
KR101314036B1 (en) * 2006-02-22 2013-10-01 도요세이칸 그룹 홀딩스 가부시키가이샤 Base material for rfid tag adapted to metallic material
JP4524674B2 (en) 2006-02-23 2010-08-18 ブラザー工業株式会社 Interrogator for RFID tag communication system
JP4755921B2 (en) 2006-02-24 2011-08-24 富士通株式会社 RFID tag
JP4026080B2 (en) 2006-02-24 2007-12-26 オムロン株式会社 Antenna and RFID tag
JP5055478B2 (en) 2006-02-28 2012-10-24 凸版印刷株式会社 IC tag
WO2007099602A1 (en) 2006-02-28 2007-09-07 Matsushita Electric Industrial Co., Ltd. Portable radio apparatus
JP3121577U (en) 2006-03-02 2006-05-18 株式会社スマート Eccentric magnetic coil system
EP1993170A4 (en) 2006-03-06 2011-11-16 Mitsubishi Electric Corp Rfid tag, method for manufacturing rfid tag and method for arranging rfid tag
JP2007241789A (en) 2006-03-10 2007-09-20 Ic Brains Co Ltd Radio tag reader/writer, communication device and communication system
JP3933191B1 (en) 2006-03-13 2007-06-20 株式会社村田製作所 Portable electronic devices
JP2007249620A (en) 2006-03-16 2007-09-27 Nec Tokin Corp Wireless tag
JP2007287128A (en) 2006-03-22 2007-11-01 Orient Sokki Computer Kk Non-contact ic medium
JP4735368B2 (en) 2006-03-28 2011-07-27 富士通株式会社 Planar antenna
JP4854362B2 (en) 2006-03-30 2012-01-18 富士通株式会社 RFID tag and manufacturing method thereof
JP4927625B2 (en) * 2006-03-31 2012-05-09 ニッタ株式会社 Magnetic shield sheet, non-contact IC card communication improving method, and non-contact IC card container
JP2007279782A (en) 2006-04-03 2007-10-25 Dainippon Printing Co Ltd Non-contact ic tag having ic chip breakdown prevention structure, connecting element of the non-contact ic tag, and manufacturing method of the non-contact ic tag connecting element
CN101416353B (en) 2006-04-10 2013-04-10 株式会社村田制作所 Wireless IC device
CN102780084B (en) 2006-04-14 2016-03-02 株式会社村田制作所 Antenna
EP2009736B1 (en) 2006-04-14 2016-01-13 Murata Manufacturing Co. Ltd. Wireless ic device
JP4853095B2 (en) 2006-04-24 2012-01-11 大日本印刷株式会社 Non-contact data carrier, wiring board for non-contact data carrier
JP2007295395A (en) 2006-04-26 2007-11-08 Fujitsu Ltd Antenna for tag, and tag using the same
ATE526648T1 (en) 2006-04-26 2011-10-15 Murata Manufacturing Co ITEM WITH ELECTROMAGNETICALLY COUPLED MODULES
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
JP4803253B2 (en) 2006-04-26 2011-10-26 株式会社村田製作所 Article with power supply circuit board
US20080068132A1 (en) 2006-05-16 2008-03-20 Georges Kayanakis Contactless radiofrequency device featuring several antennas and related antenna selection circuit
US7589675B2 (en) 2006-05-19 2009-09-15 Industrial Technology Research Institute Broadband antenna
JP2007317009A (en) * 2006-05-26 2007-12-06 Matsushita Electric Works Ltd Socket for memory card
JP2007324865A (en) 2006-05-31 2007-12-13 Sony Chemical & Information Device Corp Antenna circuit, and transponder
ATE507538T1 (en) * 2006-06-01 2011-05-15 Murata Manufacturing Co HIGH FREQUENCY IC ARRANGEMENT AND COMPOSITE COMPONENT FOR A HIGH FREQUENCY IC ARRANGEMENT
JP5200338B2 (en) * 2006-06-15 2013-06-05 ソニー株式会社 RFID tags and products
JP4796904B2 (en) * 2006-06-29 2011-10-19 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 Data communication device
JP4281850B2 (en) 2006-06-30 2009-06-17 株式会社村田製作所 optical disk
JP3957000B1 (en) * 2006-07-07 2007-08-08 株式会社村田製作所 Antenna coil for board mounting and antenna device
WO2008007606A1 (en) 2006-07-11 2008-01-17 Murata Manufacturing Co., Ltd. Antenna and radio ic device
JP2008033716A (en) 2006-07-31 2008-02-14 Sankyo Kk Coin type rfid tag
JP4169062B2 (en) 2006-08-03 2008-10-22 凸版印刷株式会社 Wireless tag
KR100797172B1 (en) 2006-08-08 2008-01-23 삼성전자주식회사 Loop-antenna having a matching circuit on it
US7981528B2 (en) 2006-09-05 2011-07-19 Panasonic Corporation Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same
JP4836899B2 (en) 2006-09-05 2011-12-14 パナソニック株式会社 Magnetic striped array sheet, RFID magnetic sheet, electromagnetic shielding sheet, and manufacturing method thereof
JP4770655B2 (en) 2006-09-12 2011-09-14 株式会社村田製作所 Wireless IC device
US8120462B2 (en) 2006-09-25 2012-02-21 Sensomatic Electronics, LLC Method and system for standing wave detection for radio frequency identification marker readers
JP2008083867A (en) * 2006-09-26 2008-04-10 Matsushita Electric Works Ltd Memory card socket
JP2008092131A (en) 2006-09-29 2008-04-17 Tdk Corp Antenna element and mobile information terminal
JP2008098993A (en) 2006-10-12 2008-04-24 Dx Antenna Co Ltd Antenna
JP4913529B2 (en) 2006-10-13 2012-04-11 トッパン・フォームズ株式会社 RFID media
JP4876842B2 (en) * 2006-10-16 2012-02-15 大日本印刷株式会社 IC tag label
JP2008107947A (en) * 2006-10-24 2008-05-08 Toppan Printing Co Ltd Rfid tag
JP2008118359A (en) 2006-11-02 2008-05-22 Nec Corp Walkie-talkie
US7605761B2 (en) 2006-11-30 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Antenna and semiconductor device having the same
DE102006057369A1 (en) 2006-12-04 2008-06-05 Airbus Deutschland Gmbh Radio frequency identification tag for e.g. identifying metal container, has radio frequency identification scanning antenna with conductor loop that is aligned diagonally or perpendicularly to attachment surface
WO2008081699A1 (en) 2006-12-28 2008-07-10 Philtech Inc. Base sheet
JP2008167190A (en) 2006-12-28 2008-07-17 Philtech Inc Base body sheet
JP2008182438A (en) 2007-01-24 2008-08-07 Nec Tokin Corp Radio tag
US7886315B2 (en) 2007-01-30 2011-02-08 Sony Corporation Optical disc case, optical disc tray, card member, and manufacturing method
JP2008207875A (en) 2007-01-30 2008-09-11 Sony Corp Optical disk case, optical disk tray, card member and manufacturing method
JP2008197714A (en) * 2007-02-08 2008-08-28 Dainippon Printing Co Ltd Non-contact data carrier device, and auxiliary antenna for non-contact data carrier
JP4872713B2 (en) 2007-02-27 2012-02-08 大日本印刷株式会社 Non-contact data carrier device
JP5061657B2 (en) 2007-03-05 2012-10-31 大日本印刷株式会社 Non-contact data carrier device
JP2008226099A (en) 2007-03-15 2008-09-25 Dainippon Printing Co Ltd Noncontact data carrier device
JP4865614B2 (en) 2007-03-27 2012-02-01 マグネックス・コーポレーション RFID chip and antenna with improved range
CN101276959B (en) * 2007-03-30 2013-08-21 麦格耐克斯有限公司 RFID chip with improved range as well as antenna
JP4867753B2 (en) 2007-03-30 2012-02-01 Ｔｄｋ株式会社 ANTENNA DEVICE AND RADIO COMMUNICATION DEVICE USING THE SAME
EP2133827B1 (en) 2007-04-06 2012-04-25 Murata Manufacturing Co. Ltd. Radio ic device
GB2461443B (en) 2007-04-13 2012-06-06 Murata Manufacturing Co Magnetic field coupling antenna module arrangements including a magnetic core embedded in an insulating layer and their manufacturing methods.
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
DE112008000065B4 (en) 2007-05-10 2011-07-07 Murata Manufacturing Co., Ltd., Kyoto-fu Wireless IC device
JP4666102B2 (en) 2007-05-11 2011-04-06 株式会社村田製作所 Wireless IC device
JP4770792B2 (en) 2007-05-18 2011-09-14 パナソニック電工株式会社 Antenna device
KR101196465B1 (en) * 2007-05-18 2012-11-09 (주)엠쓰리모바일 Barcode reader module for recognizing rfid to be loaded an rugged pda
JP4867787B2 (en) 2007-05-22 2012-02-01 Ｔｄｋ株式会社 Antenna device
JP4885093B2 (en) 2007-06-11 2012-02-29 株式会社タムラ製作所 Booster antenna coil
KR101047266B1 (en) 2007-07-04 2011-07-06 가부시키가이샤 무라타 세이사쿠쇼 Wireless IC Devices and Components for Wireless IC Devices
JP2009017284A (en) 2007-07-05 2009-01-22 Panasonic Corp Antenna device
EP2166617B1 (en) 2007-07-09 2015-09-30 Murata Manufacturing Co. Ltd. Wireless ic device
JP5167709B2 (en) 2007-07-17 2013-03-21 株式会社村田製作所 Wireless IC device, inspection system thereof, and method of manufacturing wireless IC device using the inspection system
CN104540317B (en) 2007-07-17 2018-11-02 株式会社村田制作所 printed wiring substrate
JP4867830B2 (en) 2007-07-18 2012-02-01 株式会社村田製作所 Wireless IC device
US7830311B2 (en) * 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
US20090021352A1 (en) 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. Radio frequency ic device and electronic apparatus
EP2166616B1 (en) 2007-07-18 2013-11-27 Murata Manufacturing Co. Ltd. Wireless ic device
ATE556466T1 (en) 2007-07-18 2012-05-15 Murata Manufacturing Co WIRELESS IC DEVICE
JP2009037413A (en) 2007-08-01 2009-02-19 Murata Mfg Co Ltd Radio ic device
JP4702336B2 (en) 2007-08-10 2011-06-15 株式会社デンソーウェーブ Portable RFID tag reader
JP4885092B2 (en) 2007-09-06 2012-02-29 株式会社タムラ製作所 Booster antenna coil
US8717244B2 (en) 2007-10-11 2014-05-06 3M Innovative Properties Company RFID tag with a modified dipole antenna
TW200919327A (en) 2007-10-29 2009-05-01 China Steel Corp Three-dimensional wireless identification label adhered onto metal
JP2009110144A (en) 2007-10-29 2009-05-21 Oji Paper Co Ltd Coin-shaped rfid tag
JP2009111950A (en) 2007-11-01 2009-05-21 Dainippon Printing Co Ltd Non-contact type ic tag, and method for manufacturing non-contact type ic tag
JP5155642B2 (en) 2007-11-28 2013-03-06 ルネサスエレクトロニクス株式会社 ID tag
JP2009135166A (en) 2007-11-29 2009-06-18 Nikon Corp Exposure method and exposure device, exposure unit, and device manufacturing method
ATE555518T1 (en) 2007-12-20 2012-05-15 Murata Manufacturing Co IC RADIO DEVICE
JP2009181246A (en) 2008-01-29 2009-08-13 Toppan Forms Co Ltd Rfid inspection system
JP2009182630A (en) * 2008-01-30 2009-08-13 Dainippon Printing Co Ltd Booster antenna board, booster antenna board sheet and non-contact type data carrier device
EP2251934B1 (en) 2008-03-03 2018-05-02 Murata Manufacturing Co. Ltd. Wireless ic device and wireless communication system
JP4518211B2 (en) 2008-03-03 2010-08-04 株式会社村田製作所 Compound antenna
JP4404166B2 (en) 2008-03-26 2010-01-27 株式会社村田製作所 Wireless IC device
CN101953025A (en) 2008-04-14 2011-01-19 株式会社村田制作所 Radio IC device, electronic device, and method for adjusting resonance frequency of radio IC device
JP2009260758A (en) 2008-04-18 2009-11-05 Murata Mfg Co Ltd Radio ic device
US8965461B2 (en) 2008-05-13 2015-02-24 Qualcomm Incorporated Reverse link signaling via receive antenna impedance modulation
JP4927781B2 (en) 2008-05-15 2012-05-09 株式会社東海理化電機製作所 Portable machine
CN103729676B (en) * 2008-05-21 2017-04-12 株式会社村田制作所 Wireless ic device
JP5078022B2 (en) 2008-05-22 2012-11-21 Ｎｅｃトーキン株式会社 Wireless tag and method of using wireless tag
JP4557186B2 (en) 2008-06-25 2010-10-06 株式会社村田製作所 Wireless IC device and manufacturing method thereof
US7934646B2 (en) * 2008-06-25 2011-05-03 International Currency Technologies Corporation Face panel assembly with an RFID module
JP2010015342A (en) 2008-07-03 2010-01-21 Dainippon Printing Co Ltd Antenna sheet, inlet, and ic tag
JP2010050844A (en) 2008-08-22 2010-03-04 Sony Corp Loop antenna and communication device
JP5319313B2 (en) 2008-08-29 2013-10-16 峰光電子株式会社 Loop antenna
JP4618459B2 (en) 2008-09-05 2011-01-26 オムロン株式会社 RFID tag, RFID tag set and RFID system
JP5223584B2 (en) * 2008-10-14 2013-06-26 富士通モバイルコミュニケーションズ株式会社 Wireless communication device
JP3148168U (en) 2008-10-21 2009-02-05 株式会社村田製作所 Wireless IC device
JP5195275B2 (en) 2008-10-22 2013-05-08 株式会社村田製作所 Wireless communication system
CN102197537B (en) 2008-10-29 2014-06-18 株式会社村田制作所 Wireless IC device
JP5041075B2 (en) 2009-01-09 2012-10-03 株式会社村田製作所 Wireless IC device and wireless IC module
JP5287289B2 (en) 2009-01-26 2013-09-11 株式会社村田製作所 Antenna device
EP3276746B1 (en) 2009-03-13 2019-05-22 Murata Manufacturing Co., Ltd. Antenna apparatus
JP5510450B2 (en) 2009-04-14 2014-06-04 株式会社村田製作所 Wireless IC device
EP2424041B1 (en) * 2009-04-21 2018-11-21 Murata Manufacturing Co., Ltd. Antenna apparatus and resonant frequency setting method of same
JP5535752B2 (en) 2009-04-30 2014-07-02 ニッタ株式会社 Wireless communication improving sheet body, wireless tag with wireless communication improving sheet body, and wireless tag communication system
JP4883136B2 (en) 2009-05-15 2012-02-22 株式会社村田製作所 Coil antenna
JP2011015395A (en) 2009-06-03 2011-01-20 Nippon Information System:Kk Cloth with rfid tag, and system for managing cloth with rfid tag
JP5304580B2 (en) 2009-10-02 2013-10-02 株式会社村田製作所 Wireless IC device
JP2010051012A (en) 2009-11-06 2010-03-04 Tdk Corp Antenna, and radio ic memory
WO2011062274A1 (en) 2009-11-20 2011-05-26 日立金属株式会社 Antenna
JP5521686B2 (en) 2010-03-25 2014-06-18 株式会社村田製作所 Antenna apparatus and wireless communication device
JP5558960B2 (en) 2010-07-30 2014-07-23 トッパン・フォームズ株式会社 RF-ID media inspection device
JP4894960B2 (en) 2011-03-15 2012-03-14 株式会社村田製作所 Electronics

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9905925B2 (en) * 2013-05-13 2018-02-27 Amotech Co., Ltd. NFC antenna module and portable terminal comprising same

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