JP4286977B2 - Non-contact type IC card and its antenna characteristic adjustment method - Google Patents

Non-contact type IC card and its antenna characteristic adjustment method Download PDF

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Publication number
JP4286977B2
JP4286977B2 JP18842499A JP18842499A JP4286977B2 JP 4286977 B2 JP4286977 B2 JP 4286977B2 JP 18842499 A JP18842499 A JP 18842499A JP 18842499 A JP18842499 A JP 18842499A JP 4286977 B2 JP4286977 B2 JP 4286977B2
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non
antenna
ic card
capacitor
adjustment
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Expired - Fee Related
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JP2001010264A (en
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志行 本多
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大日本印刷株式会社
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    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0726Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact type IC card that performs non-contact communication by electromagnetic induction and electromagnetic coupling, and a method for adjusting antenna characteristics thereof. Specifically, in a non-contact type IC card in which an antenna coil, a planar capacitor, and a resistor are built in the base, the resonance frequency can be adjusted within a certain range to match the frequency of the reader / writer, and the sharpness can be adjusted to be good. The present invention relates to a contactless IC card capable of adjusting a resistance component of a resonance circuit capable of obtaining a communication state and an antenna characteristic adjusting method thereof.
[0002]
[Prior art]
There are the following three types of antenna coils built in the non-contact IC card.
(1) Winding method
A wire is covered with an insulating material and wound several to several tens of times. Basically, both ends of the antenna are directly connected to the terminal portion of the IC chip, so there is no example of performing an additional function processing of an adjustable capacitor.
(2) Method using conductive paste
This is a material in which particles such as silver are included in silk screen ink to give conductivity. This is printed in the form of an antenna by the same method as silk printing. In general, a conductive adhesive, an anisotropic conductive film, or the like is used to connect both ends of the antenna and the terminal portion of the IC chip. Also in this case, no example of performing an additional function processing of an adjustable capacitor is found.
(3) Etching method
In this method, a copper foil or the like is vapor-deposited on a base material, and a portion of the copper foil other than the antenna portion is removed by etching to form an antenna. In general, a conductive adhesive, an anisotropic conductive film, or the like is used to connect both ends of the antenna and the terminal portion of the IC chip. In this case, the example which performed the additional function process of the capacitor | condenser is seen.
[0003]
However, each of the above-described IC cards has the following problems.
(1) Winding method
Since the cross-sectional area of the antenna is large and the resistance is small, the sharpness (Q) of the resonance circuit that is inversely proportional to the resistance R as shown in the following (Equation 1) tends to increase. In this case, good communication can be performed in a state where the resonance frequency is matched between the card and the reader / writer (R / W), but there is a high possibility that communication cannot be performed even if the resonance frequency slightly shifts. Therefore, when Q becomes large, the matching range with R / W becomes narrow.
The sharpness (Q) is expressed as a function of the inductance (L), electrostatic capacitance (C), and resistance component (R) of the antenna coil. Therefore, it is necessary to design an antenna to match R / W for each different manufacturer even with an IC chip (for example, ISO14443: CD) using a communication method of the same specification. The problem of high costs arises.
In the case of a non-contact type IC card, it becomes a parallel resonance circuit, and the sharpness (Q) in this case is expressed by the following (formula 1).
Q = (1 / R) × (√C) × (1 / √L) (Formula 1)
[0004]
(2) Method using conductive paste
In the case of the conductive paste, since the antenna resistance is large, the sharpness of the resonance circuit tends to be small. When Q is small, the matching range with R / W is widened, but there is a high possibility that the minimum voltage required for operating the IC chip cannot be obtained. The sharpness Q is expressed as a function of the inductance (L), capacitance (C), and resistance component (R) of the antenna coil as described above (Equation 1). In the method using the conductive paste, L or C Since it is difficult to make adjustment with variable, it is necessary to design an antenna for matching with the R / W for each different manufacturer, resulting in problems of delivery time and cost as in the winding method.
[0005]
(3) Etching method
The resistance of the antenna is located between the two types, and the sharpness (Q) of the resonance circuit is halfway. The matching range with R / W is neither wide nor narrow.
An external capacitor can be provided to increase Q, and the external capacitor can be trimmed to reduce Q. However, if (Q) is changed by changing the capacitance of the capacitor, the resonance frequency (f) shown in (Equation 2) below may change, and compatibility with R / W may not be obtained. There is.
f (Hz) = (1 / 2π) × (1 / √ (LC)) (Formula 2)
[0006]
[Problems to be solved by the invention]
Therefore, in the present invention, after the predetermined suitable resonance frequency is obtained by giving an additional function to the antenna of the etching method that can be most flexibly handled among the above three types of antenna methods, the resonance frequency is not changed. A non-contact IC card capable of changing the Q value and an adjustment method thereof are provided.
Thereby, antenna characteristic matching with R / W becomes easy, and an IC card having a highly versatile antenna can be supplied.
[0007]
[Means for Solving the Problems]
A first aspect of the present invention for solving the above-described problems is a non-contact type IC card that can communicate with an external reader / writer in a non-contact manner.Consists of a plurality of circuits branched from the antenna coilIt has a resonance circuit including a planar adjustment resistor, and the adjustment resistorDisconnect one of multiple branched circuitsResistance valuechangeBy adjusting the sharpness (Q) of the resonant circuit, the communication state is goodCan be securedAnd a non-contact type IC card. Since this is a non-contact type IC card, the sharpness can be adjusted to ensure a good communication state.
[0009]
A second aspect of the present invention for solving the above-described problems is a non-contact type IC card that can communicate with an external reader / writer in a non-contact manner.Consists of multiple capacitor patterns with equal unit adjustment amount of capacitanceWith a planar adjustment capacitorConsists of a plurality of circuits branched from the antenna coilPlanar adjustment resistorAnd includingHaving a resonant circuit,Cut the unit adjustment amount capacitor pattern step by stepCapacitor capacityAnd disconnecting one of the plurality of branched circuits of the adjusting resistor.Resistance valueChangeBy adjusting the resonance frequency (f) and sharpness (Q) of the resonance circuit, the communication state is goodofSecureButThere is a non-contact type IC card, which is made possible. Since it is such a non-contact type IC card, it is possible to adjust the capacitor capacity to adapt the resonance frequency and to adjust the sharpness to ensure a good communication state.
[0010]
The third of the gist of the present invention for solving the above problems is an antenna coil formed by a photoetching method andConsists of multiple capacitor patterns with equal unit adjustment amount of capacitanceWith a planar adjustment capacitorA planar surface composed of a plurality of circuits branched from the antenna coil.Adjustment resistorWhenIn a non-contact type IC card having a substrate with an antenna in a card base, the adjustment resistorDisconnect one of multiple branched circuitsResistance valueChangeTherefore, the sharpness (Q) of the resonance circuit can be adjusted. Since this is a non-contact type IC card, the sharpness can be adjusted to ensure a good communication state.
[0011]
The gist of the present invention for solving the above-mentioned problems.4This is a method for adjusting the antenna characteristics of a non-contact IC card having a resonance circuit composed of an antenna coil and a planar adjustment resistor in the card base, and is a method of adjusting a plurality of circuits provided to branch to the antenna coil. The antenna characteristic adjusting method is characterized in that the sharpness (Q) of the resonance circuit is adjusted by cutting a portion. Since the antenna characteristic is adjusted, the sharpness (Q) can be easily adjusted.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
The present invention adjusts antenna characteristics in order to obtain a good communication state by matching a non-contact type IC card and R / W. Specifically, with or without adjusting the capacitor, after a predetermined resonance frequency with R / W is obtained, the sharpness (Q) is adjusted by adjusting the resistance component without changing the resonance frequency. To change.
Generally, if the capacitance of the IC chip that is an LSI and the capacitance of the card antenna circuit are constant and unchanged with respect to the resonance frequency of R / W, there is no need to provide an adjustment capacitor.
LSI capacity: C1And the capacity of the card antenna circuit: C2
Variation occurs. When there is no variation between the two, the effect as the initial design can be expected, but in reality, the variation cannot be ignored due to this lot or individual difference.
Therefore, in actual production, C2Need to be adjusted. This is a process for obtaining a predetermined resonance frequency. Even if the resonance frequency is obtained, if the sharpness (Q) is not appropriate, good communication cannot be performed.
Such adjustment of antenna characteristics is performed on the substrate with an antenna in the card manufacturing process to have a certain characteristic, and then an oversheet is laminated to finish a non-contact IC card.
[0014]
Hereinafter, embodiments of a non-contact type IC card of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing an embodiment of a substrate with an antenna used in a non-contact type IC card of the present invention. FIG. 1A is a plan view seen from the IC chip mounting side, and FIG. 1B is a view seen through the surface opposite to the IC chip mounting side from the surface. As shown in FIG. 1, the antenna-equipped substrate 121 </ b> A is formed in a plurality of imposition states on a vinyl chloride or polyethylene terephthalate (PET) resin sheet as a card base material. In the figure, reference numeral 101 denotes a registration mark for punching, which is laminated with an oversheet and then cut by dotted lines 102 to finish individual cards.
Although the entire IC card after completion is not shown in the figure, the IC chip and antenna coil are embedded in the card base. Printed designs are provided.
[0015]
An antenna coil 13 is formed on each surface of the substrate with antenna 121A.
One end of the antenna coil is connected to the IC chip 11 that is an LSI, and the other end is connected to the wiring 13B on the back surface from the through hole 131 and is connected to the IC chip 11 through the through hole 132.
A feature of the contactless IC card of the present invention is that a resistance (R component) adjusting resistor 14 and a capacitance (C component) adjusting capacitor 15 for forming a parallel resonant circuit in an antenna circuit are formed on a substrate with an antenna. There is. Various types of adjustment resistors 14 can be adopted. In the case of FIG. 1, a ladder-like circuit is formed in eight stages by branching from the antenna coil 13. The adjustment capacitor 15 can be formed in various forms. In the case of FIG. 1, the capacitor is formed by providing eight capacitor patterns 151 and 152 on the front and back surfaces of the substrate with the antenna. Therefore, in this case, the base sheet is formed as a dielectric layer.
When adjusting the capacitor capacity, the circuit is cut from the tip of the adjustment capacitor (between two points sandwiching the circuit).
[0016]
In general, in a card antenna circuit (parallel resonant circuit), an IC chip that is an LSI has a C component of 40 to 50 pF, and the C component of the coil itself can be regarded as substantially 0 or 0. Further, the L component of the coil (3 to 4 turns) is about 1 to 4 μH. Therefore, if the capacitance of the LSI does not vary greatly, the adjustment range does not need to be excessive, and in order to adjust to the resonance frequency of a non-contact IC card that is commonly used, the total C component of the adjustment capacitor An amount of about 40-100 pF is considered sufficient.
[0017]
In the case of FIG. 1, the capacitor pattern is formed as a flat plate-like pattern with a base material sheet interposed therebetween. However, the present invention is not limited to this example, and the capacitor pattern may be formed as a straight line group in which thin linear patterns are arranged in parallel. . Also, instead of using the base sheet as a dielectric layer, after forming a capacitor pattern on one surface of the substrate with the antenna, a dielectric layer that is an insulating layer is applied in the form of a thin plate to form a flat plate, A capacitor may be formed by forming a conductive layer on the dielectric layer.
If the capacitance per unit area is determined by the capacitor layer structure (distance between two electrode plates) and the material (dielectric constant of the dielectric), the adjustable unit amount can be adjusted by the area of the flat or comb pattern. Is determined. A capacitance of about 0.1 pF to 100 pF can be arbitrarily provided by adjusting the size of the pattern stepwise.
[0018]
FIG. 2 is a diagram illustrating a method of adjusting the adjustment resistor. When the resistance value is adjusted, the adjustment resistor pattern 141 formed in a ladder shape is cut along the cutting line 14C according to the necessary adjustment resistance value.1, 14C2,..., 14Cn can be cut at any part to adjust the entire resistance value. If the resistance pattern can be formed in a shape having a substantially constant line width and line length, the change in resistance value due to the cut portion can be predicted (calculated). Therefore, the Q value can be calculated from (Equation 1) and adjusted to a predetermined characteristic. it can. Cutting may be performed by a cutter such as a cutter, or may be performed by mechanical cutting using a punching die.
[0019]
FIG. 3 is a diagram showing an equivalent circuit of a substrate with an antenna. For an IC chip 11 which is an LSI, an inductance L by an antenna coil 13, a resistance R and an adjustment resistor Rad of the entire circuit, a capacitance based on the IC chip and a capacitance C of the entire circuit such as a stray capacitance generated in the circuit A parallel resonant circuit is formed by the adjustment capacitor capacitance Cad.
[0020]
Here, the parallel circuit resonates when the impedance Z (Equation 3) is apparently maximized, that is, when the complex component becomes 0, and the resonance frequency can be derived therefrom (Equations 4 and 5). ). ΩcIs the angular resonance frequency, fcIndicates the resonance frequency.
Z = 1 / [1 / R + i (ωcC- (1 / ωcL))] (Formula 3)
ωc= 1 / (LC)1/2= 2πfc                  (Formula 4)
fc= 1 / (2π (LC)1/2(Formula 5)
[In addition, (Formula 5) is the same as the above (Formula 2). ]
C at this time is the capacitance of the entire circuit at the time of resonance.
C = 1 / ((2πf)2L) (Formula 6)
It becomes. For example, if a numerical value when the resonance frequency is 13.56 MHz and the coil is 3.0 μH is substituted, C = 46.0 pF is required. Therefore, when the C component of the LSI is 40 pF, 6.0 pF is required as Cad.
[0021]
Next, the antenna characteristic adjusting method of the present invention will be described in relation to a method for manufacturing a non-contact IC card. FIG. 4 is a diagram for explaining the manufacturing process of the non-contact type IC card of the present invention. In FIG. 4, the case of a card substrate having a three-sheet structure will be described. However, the card substrate may have four or more layers, and is not limited to the three-sheet structure.
[0022]
(1) <Substrate formation with antenna>
First, a base material sheet 121 in which a copper foil 121c is laminated on both surfaces of a resin base material 121i such as a glass epoxy substrate, polyimide, vinyl chloride, polyethylene terephthalate (PET), or PET-G is prepared. The copper foil 121c is preferably formed to a thickness of about 10 to 30 μm.
Next, the antenna coil 13, the antenna coil connection terminal, the adjustment resistor 14, the adjustment capacitor 15, and the like are formed by photoetching of copper foil to prepare the substrate with antenna 121 </ b> A.
[0023]
The adjustment capacitor 15 may be of the type shown in FIG. 1 in which capacitor patterns 151 having unit adjustment capacities are connected in series. In the design concept of FIG. 1, the area of one adjustment capacitor pattern is 10 mm.2The unit adjustment amount is 5.0 pF, and eight units are designed so that the adjustment amount is about 40 pF in total. However, since the electrostatic capacity is affected not only by the size of the capacitor pattern but also by the dielectric constant and thickness of the base material 121i which is an insulating layer, it is necessary to sufficiently consider these factors.
Similarly, the adjustment resistor 14 can be formed by forming a plurality of circuits branched from the antenna coil 13. In the case of FIG. 1, it is formed as a ladder-like circuit. The adjusting resistor 14 is not limited to a ladder shape, and various types can be adopted.
[0024]
(2) <IC chip mounting, capacitor capacity, resistance value adjustment>
Next, the IC chip 11 is mounted on the antenna-equipped substrate 121A. Since the IC chip can be mounted on the antenna-mounted substrate in a plane, a flip chip mounting method using an anisotropic conductive film (ACF) can be preferably employed. When mounting by ACF, it is based on a method of temporarily adhering to the connection terminal of the antenna coil by aligning with the pad of the IC chip via the ACF, and then applying the heat pressure to perform the main bonding.
[0025]
After mounting the IC chip, module tuning is performed. Specifically, it is adjustment of antenna characteristics for matching with R / W, and the resistance values of the adjustment capacitor 15 and the adjustment resistor 14 are set as follows.Increase and decrease capacitor capacityTherefore, an operation for cutting the circuit is performed. In the case of the present invention, the capacitor capacityAmountSince adjustment of the direction to increase cannot be performed, it becomes a direction to reduce. Since the adjustment capacitor actually has a capacity added to the LSI (IC chip), it is desirable that the LSI is designed to be slightly smaller than the optimum capacitor capacity. When adjusting the capacitance of the capacitor, if the capacitance is larger than a predetermined value while monitoring the capacitance between the antenna coil connection terminals with a measuring instrument such as an impedance analyzer, the capacitance is adjusted by cutting the connection portion of the capacitor pattern 151. I do. The combined capacity after cutting and adjusting the characteristics is the total capacity (C + Cad) of the fixed C component and the cad remaining after cutting. When the resonance frequency is obtained by adjusting the capacitor capacity, the adjustment resistor is adjusted. The combined resistance after cutting and adjusting the characteristic is the combined resistance 1 / {(1 / R) + (1 / Rad)} of the fixed R component and Rad remaining after cutting.
[0026]
(3) <Preparation of oversheet>
On the other hand, an oversheet laminated on both surfaces of the substrate with the antenna is prepared by preliminarily printing a pattern for decorating the card and necessary display and overcoat (protective layer). When a magnetic stripe is provided, it is transferred to the surface side of the oversheet. If other additional functions are provided, they are also provided. These are steps performed in a normal card manufacturing process and are not special. Offset printing and silk screen printing can be used for printing.
Since the PET base material is often used for the oversheet, the adhesive sheets 124 and 125 or the adhesive are laminated in that case.
[0027]
(4) <Temporary sticking / Press lamination>
After the module tuning, the antenna-mounted substrate 121A and the printed oversheets 122 and 123 are laminated via the adhesive sheets 124 and 125, etc., and first, appropriate portions are heated and temporarily pasted by an ultrasonic sealer, and press laminate Prevent misalignment between sheets. The substrate after provisional attachment is set by sandwiching it between mirror plates, introduced into a press machine, and press laminated. In addition, since the resin sheet and oversheet of a board | substrate with an antenna are a vinyl chloride or a PET-G sheet | seat, since it fuses, an adhesive agent or an adhesive sheet | seat is unnecessary for a lamination.
[0028]
After hot pressing, punching into individual card shapes with reference to the registration mark. When the card is provided with additional functions such as face photo printing, sign panel, hologram foil transfer, etc., this is done after punching. Thus, the non-contact type IC card of the present invention is completed.
[0029]
(Examples regarding other materials)
(1) <Card base material>
In addition to vinyl chloride resin and PET, various substrate sheets can be adopted as the card substrate, such as PET-G, polypropylene resin, polycarbonate resin, acrylic resin, polystyrene resin, ABS resin, polyamide resin, polyacetal resin, etc. Is mentioned.
(2) <Laminating adhesive>
As the laminating adhesive, a thermoplastic (hot melt) type or a thermosetting / moisture-curing type adhesive or an adhesive sheet can be used. Moreover, an adhesive sheet, an adhesive, cold glue, etc. may be sufficient.
[0030]
【Example】
An embodiment of the non-contact type IC card of the present invention will be described with reference to FIGS. The reference numerals in the examples correspond to the reference numerals in the referenced drawings.
(Example)
(1) <Substrate formation with antenna>
As the base material sheet of the substrate with antenna, a base material in which a copper foil of 30 μm was electrodeposited on both sides of a 25 μm thick polyethylene terephthalate (PET) film was used.
As shown in FIG. 1, the substrate sheet is provided with an antenna coil 13 and eight branched equal area capacitor patterns 151 on the IC chip mounting surface side of the base sheet so as to have a line width of 2 mm and approximately 3 turns. The capacitor 15, the ladder-like adjustment resistor 14 having eight branches, and the antenna coil connection terminal on the IC chip mounting portion were formed by a photoetching method. On the side opposite to the IC chip mounting surface of the base material sheet, the back surface wiring 13B is connected to the portion for connecting the adjustment capacitors consisting of the eight capacitor patterns 152 and the through holes 131 and 132 at positions corresponding to the front surface side. Formed. The copper foil thickness after etching was about 30 μm at any location.
[0031]
The area of one capacitor pattern is 10mm.2(2.5 mm × 4.0 mm = 10 mm2), And the unit capacitance was 5.0 pF, and the total capacitance was 40 pF.
On the other hand, one ladder-like adjusting resistor 14 was formed into a square frame shape with approximately one side of 4 mm, and eight patterns were formed with a line width of 1 mm.
The combined resistance (when the resistance pattern is not cut) between both ends XY of this adjusting resistor was 0.03Ω. On the other hand, the resistance of the most advanced part is 14C in FIG.1When it cut | disconnects with the cut line of this, it became 0.04 (ohm). The following table shows the resistance value (Ω) between the position where the adjustment resistor is cut and XY.
[Table 1]
The combined resistance (Rad) of the adjustment resistor itself is 0.3Ω, and the resistance value R of the entire antenna coil is R = 3.50Ω (when there is no Rad).
[0032]
(2) <IC chip mounting, capacitor capacity, resistance value adjustment>
As the IC chip, a chip for a non-contact IC card (ISO 1443 TYPEB: CD chip) was mounted on the antenna coil connection terminal of the antenna-equipped substrate 121A using ACF (“FP20626” manufactured by Sony Chemical Corporation). ACF temporary sticking condition is 80 ° C, 10kgf / cm21 second, after temporary attachment, 200 ° C, 500 gf / cm2It was mounted by applying hot pressure under the condition of 20 seconds.
[0033]
The intrinsic capacitance of this IC chip is 50 pF, and the L component (inductance) of the antenna coil is 1.36 μH. Further, the C component of the antenna coil is negligible, and in order to adjust to the R / W resonance frequency of 14.39 MHz, the combined capacity of the card needs to be 90 pF from (Equation 1).
Therefore, the capacitance of the adjusting capacitor was set to 40 pF. In other words, in this example, the adjustment capacitor was not cut and all the capacitor patterns were left, so that it was possible to match the resonance frequency of R / W.
[0034]
When the resonance frequency f = 14.39 MHz and the resistance value Rad is adjusted, the sharpness (Q) is calculated based on (Equation 1) as follows.
Q8= 2.32 × 10-3(If there is no Rad, all 8 are cut)
Q0= 2.68x10-3(When all Rad remains)
Q6= 2.61 × 10-3(When 6 Rads are cut)
Q7= 2.55 × 10-3(When 7 Rads are cut)
In this embodiment, Q = 2.55 × 10-3In order to obtain a degree, seven adjustment resistors were cut from the tip.
[0035]
(3) <Preparation of oversheet>
On the other hand, for the oversheets 122 and 123 that are the upper and lower surfaces of the IC card, a milk white PET base material (“E22” manufactured by Toray Industries, Inc.) with a thickness of 188 μm is used, and the pattern by the offset printing and the overcoat layer 122P, 123P was provided. In addition, the oversheet is designed so that the stretching direction thereof is perpendicular to the oversheets 122 and 123 in order to suppress curling of the card.
[0036]
(4) <Temporary sticking / Press lamination>
The etched substrate 121A and the printed oversheets 122 and 123 are made of a 300 μm thick polyester adhesive sheet (“Aron Melt” manufactured by Toa Gosei Co., Ltd.) 124, and the same material and a 100 μm thick adhesive sheet 125 Were laminated and temporarily pasted with an ultrasonic sealer.
After that, the substrate is set by sandwiching it between the mirror plates, and introduced into the press machine at 130 ° C, 10 kgf / cm.2And press lamination for 15 minutes.
[0037]
After the hot press, punching was performed for each card size based on a pre-registered register mark 101, and processing such as hologram foil and sign panel transfer was performed on the card surface. As a result, a non-contact IC card having a card thickness of 800 μm was obtained.
The resonance frequency of this non-contact IC card is f = 14.39 MHz, sharpness, Q = 2.55 × 10-3Met. As a result, a good communication state with the external reader / writer device could be obtained. The communication distance was 5 cm.
[0038]
【The invention's effect】
In the non-contact type IC card of the present invention, the capacitor capacity and the resistance value can be easily adjusted to the optimum values in the manufacturing process, so that the optimum resonance can be obtained even when there are subtle variations due to individual differences of LSIs used. The antenna characteristics of frequency and sharpness can be adjusted and the communication stability can be improved. Therefore, the yield is also improved.
Moreover, the antenna characteristic adjustment method of the present invention can adjust the antenna characteristics of the resonance frequency and the sharpness by a simple method on the substrate with the antenna. Further, since the capacitor capacity and the resistance value are adjusted in the substrate with the antenna before the card base is hot-pressed, the appearance of the card after press lamination is not impaired.
[Brief description of the drawings]
FIG. 1 is a plan view showing an embodiment of a substrate with an antenna used in a non-contact type IC card of the present invention.
FIG. 2 is a diagram illustrating a method of adjusting an adjustment resistor.
FIG. 3 is a diagram showing an equivalent circuit of a substrate with an antenna.
FIG. 4 is a diagram illustrating a manufacturing process of the non-contact type IC card of the present invention.
[Explanation of symbols]
11 IC chip
13 Antenna coil
14 Resistance for adjustment
15 Adjustment capacitor
101 Register mark
121A board with antenna
121 Base sheet
121i Resin base material
121c copper foil
122,123 Oversheet
124,125 Adhesive sheet
131,132 Through hole
141 Resistance pattern
151,152 Capacitor pattern

Claims (6)

  1. A non-contact type IC card capable of non-contact communication with an external reader / writer, comprising a resonance circuit including an antenna coil and a planar adjustment resistor comprising a plurality of circuits branched from the antenna coil in the card base It is possible to secure a good communication state by adjusting the sharpness (Q) of the resonance circuit by cutting any of the plurality of circuits where the adjustment resistor is branched and changing the resistance value of the circuit A non-contact type IC card characterized in that
  2. Non-contact type IC card according to claim 1, wherein the adjustment resistor is characterized by comprising a plurality of circuits branched in a ladder-like from the antenna coil.
  3. A non-contact type IC card that can communicate with an external reader / writer in a non-contact manner, and is a planar adjustment capacitor comprising a plurality of capacitor patterns having an equal unit adjustment amount of capacitance with an antenna coil in the card substrate the has a resonant circuit including a planar and adjusting resistor including a plurality of circuits branched from the antenna coil, to reduce the capacitance and stepwise cutting the capacitor pattern unit adjustment amount in the resonant circuit and and adjusted to better communicate the resonance frequency of the resonance circuit by Rukoto changing the resistance value of the circuit by cutting either (f) and sharpness (Q) of a plurality of circuits which branches of the adjustment resistor contactless IC card, characterized in that the securing state is possible.
  4. 4. The non-contact type IC card according to claim 3 , wherein the adjustment capacitor comprises a capacitor pattern formed on both surfaces of the substrate using a base sheet of the substrate with an antenna as a dielectric layer.
  5. A planar adjustment capacitor composed of a plurality of capacitor patterns with an antenna coil formed by a photo-etching method and a capacitance of equal unit adjustment amount, and a planar adjustment resistor composed of a plurality of circuits branched from the antenna coil the non-contact type IC card having an antenna-provided substrate in a card base made of a by isosamples cut any of a plurality of circuits that branches of the adjustment resistor to change the resistance value of the circuit, the resonant circuit A non-contact type IC card, wherein sharpness (Q) is adjustable.
  6. A method for adjusting antenna characteristics of a contactless IC card having a resonance circuit comprising an antenna coil and a planar adjustment resistor in a card substrate, wherein a part of a plurality of circuits branched from the antenna coil A method for adjusting antenna characteristics, characterized in that the sharpness (Q) of the resonance circuit is adjusted by cutting.
JP18842499A 1999-07-02 1999-07-02 Non-contact type IC card and its antenna characteristic adjustment method Expired - Fee Related JP4286977B2 (en)

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Application Number Priority Date Filing Date Title
JP18842499A JP4286977B2 (en) 1999-07-02 1999-07-02 Non-contact type IC card and its antenna characteristic adjustment method

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