JP2005352858A - Communication type recording medium - Google Patents

Communication type recording medium Download PDF

Info

Publication number
JP2005352858A
JP2005352858A JP2004174139A JP2004174139A JP2005352858A JP 2005352858 A JP2005352858 A JP 2005352858A JP 2004174139 A JP2004174139 A JP 2004174139A JP 2004174139 A JP2004174139 A JP 2004174139A JP 2005352858 A JP2005352858 A JP 2005352858A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
wiring
coil
formed
coil pattern
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004174139A
Other languages
Japanese (ja)
Inventor
Koichi Kamisaka
晃一 上坂
Original Assignee
Hitachi Maxell Ltd
日立マクセル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a communication type recording medium such as a noncontact IC card or an RFID system that increases a communication range. <P>SOLUTION: A first wiring 110 formed on one side of a base forms: (1) a first coil pattern 111 formed at the end of the first wiring while facing a chip coil 13 across an insulator layer; (2) a third coil pattern 112 extending from the outermost periphery of the first coil pattern 111 and wound in the direction opposite to the winding direction of the first coil pattern 111; and (3) a first capacity-forming electrode pattern 113 formed at the end of the third coil pattern 112. A second wiring 120 formed on the other side of the base forms a second coil pattern 121 formed at the end of the second wiring 120 while facing the first coil pattern 111 via the base, and a second capacity-forming electrode pattern 123 formed at the end of the second wiring 120 while facing the capacity-forming electrode pattern 113 via the base. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、非接触ICカード、RFIDシステム等の、通信式記録担体の構造に関する。 The present invention, non-contact IC card, such as an RFID system, to the structure of the communication record carrier.

スルーホール加工を必要としないICカードとして、特許文献1記載のICカードが知られている。 As IC card that does not require a through-hole processing, known IC card described in Patent Document 1 is. このICカードの誘電体シートの両面には、容量結合するアンテナコイルが形成されている。 On both surfaces of the dielectric sheet of the IC card, an antenna coil for capacitive coupling is formed. 各アンテナコイルと半導体チップのコイルとの磁気結合効率が高くなるように、各アンテナコイルを構成する配線の一部は、それぞれ、半導体チップのチップコイルに沿った迂回路、具体的には、四角形の領域をその四辺に沿って迂回する迂回路を経由している。 As the magnetic coupling efficiency between the coils of the antenna coil and the semiconductor chip is increased, a part of the wiring constituting each antenna coil, respectively, detour along the semiconductor chip of the chip coil, specifically, square and through the bypass passage bypassing along the region to the four sides.

特開2002−109492号公報 JP 2002-109492 JP

ところが、上記従来のICカードの構造においては、迂回路の内側に、配線が形成されていない四角形領域が残される。 However, in the above-described structure of the conventional IC card, the inside of the bypass passage, a rectangular area where the wiring is not formed is left. このため、チップコイルの対向領域の配線密度がその分小さくなり、ICチップに供給される電力が小さくなる。 Therefore, wiring density of the opposite region of the chip coil is reduced by that amount, the power supplied to the IC chip is reduced. その結果、通信距離が制限される。 As a result, the communication distance is limited.

そこで、この領域を小さくすると、今度は、迂回路の一辺において、迂回路の起点−終点間の幅が占める割り合いが大きくなり、迂回路の形状が、四角形の領域をその三辺だけに沿って迂回する形状に近くなる。 Therefore, reducing this area, in turn, in one side of the bypass path, the starting point of the detour - split each other increases occupied width between endpoints, the shape of the detour path, along the area of ​​the rectangle only that three sides close to the shape that bypasses Te. このため、アンテナコイルと半導体チップのコイルとの磁気結合効率が低下し、ICチップに供給される電力が小さくなる。 Therefore, the magnetic coupling efficiency between the coil of the antenna coil and the semiconductor chip is reduced, the power supplied to the IC chip is reduced. その結果、通信距離が制限される。 As a result, the communication distance is limited.

そこで、本発明は、より通信距離の長い通信式記録担体を提供することを目的とする。 The present invention has an object to provide a longer communication record carrier of communication distance.

本発明は、 The present invention,
配線基板と半導体装置との間隔以上の距離離れたリーダライタと通信可能な通信式記録担体であって、 A usable communication record carrier and the wiring board and the distance over distance away writer to the semiconductor device,
前記半導体装置は、 The semiconductor device,
前記配線基板側の面にチップコイルを有し、 Has a chip coil on the surface of the wiring substrate,
前記配線基板は、 The wiring board,
前記半導体装置側の面に形成された第1配線と、 A first wiring formed on a surface of the semiconductor device side,
前記第1配線と前記チップコイルとの間に設けられた絶縁体層と、 An insulator layer provided between the first wiring and the chip coil,
を有し、 Have,
前記第1配線の端部は、前記絶縁層を挟んで前記チップコイルに対向する第1コイルパターンを形成することを特徴とする通信式記録担体を提供する。 End of the first wire provides a communication record carrier, which comprises forming a first coil pattern facing the chip coil across the insulating layer.

本発明は、通信式記録担体の通信距離をより長くすることができる。 The present invention may be a longer communication distance of the communication record carrier.

以下に、添付図を参照しながら、本発明の実施の形態について説明する。 Hereinafter, with reference to the accompanying drawings, illustrating the embodiments of the present invention.

まず、本実施の形態に係る通信式記録担体の構造について説明する。 First, the structure of the communication record carrier according to the present embodiment. ここでは、ICカードを具体例として挙げる。 Here, given the IC card as an example.

図5に示すように、ICカードは、絶縁体(誘電体)で形成されたシート状の基材100、基材100の両面に形成された配線層110,120、一方の配線層(以下、第1配線層)110上に積層された絶縁体(誘電体)層140、絶縁層140を介して第1配線層110の一部(後述の第1コイルパターン)に対向するチップコイル131が形成された半導体チップ130、各配線層110,120及び半導体チップ130を覆うように基材100の両面に重ねられた絶縁体(誘電体)シート(不図示)、を有している。 As shown in FIG. 5, IC card, an insulator (dielectric) sheet substrate 100 formed with the wiring layers 110 and 120 formed on both surfaces of the substrate 100, one wiring layer (hereinafter, and an insulator laminated on the first wiring layer) 110 on (dielectric) layer 140, a chip coil 131 facing the portion (first coil pattern will be described later) of the first wiring layer 110 through an insulating layer 140 is formed semiconductor chip 130, both sides superimposed insulator substrate 100 so as to cover the wiring layers 110, 120 and the semiconductor chip 130 (dielectric) sheet (not shown), and a.

なお、配線層110,120の形成材料は、例えば、基材100が比誘電率3〜5のPETまたは比誘電率2〜5のテフロン(登録商標)である場合にはアルミニウム、基材100が比誘電率3〜10のFPCである場合には銅であることが望ましい。 The formation material of the wiring layers 110 and 120, for example, when the substrate 100 is a dielectric constant 3 to 5 PET or dielectric constant 2-5 Teflon (registered trademark) is aluminum, the substrate 100 it is desirable in the case of FPC of the dielectric constant from 3 to 10 is copper. また、チップコイル131と第1配線層110との間に介在する絶縁体層140は、例えばシリコーン接着剤で形成される。 The insulating layer 140 interposed between the chip coil 131 and the first wiring layer 110 is formed by, for example, silicone adhesive.

第1配線層110に含まれる配線は、図1に示すように、(1)絶縁体層140を挟んでチップコイル13に対向する第1コイルパターン111、(2)第1コイルパターン111の最外周から続き、第1コイルパターン111の巻き方向とは逆方向に巻いた第3コイルパターン112、(2)第3コイルパターン112の端部につながる第1容量形成用電極パターン113、を形成している。 Wiring included in the first wiring layer 110, as shown in Figure 1, the first coil pattern 111, (2) a first coil pattern 111 opposed to the chip coil 13 across the (1) insulator layer 140 outermost Following from the outer periphery, the third coil pattern 112 and the winding direction of the first coil pattern 111 wound in the opposite direction, (2) third first capacitance forming electrode patterns 113 connected to the end portion of the coil pattern 112, is formed ing. なお、第3コイルパターン112の形成領域の面積は、第1コイルパターン111の形成領域の面積よりも大きい。 The area of ​​the formation region of the third coil pattern 112 is larger than the area of ​​the formation region of the first coil pattern 111.

一方、第2配線層120に含まれている配線は、基材100を介して第1コイルパターン111に対向する第2コイルパターン121、基材100を介して容量形成用電極パターン113に対向する第2容量形成用電極パターン123、を形成している。 Meanwhile, the wiring included in the second wiring layer 120 is opposed to the second coil pattern 121, capacitance forming electrode pattern 113 through the substrate 100 facing the first coil pattern 111 through the substrate 100 second capacitance forming electrode patterns 123 are formed. 第2コイルパターン121が第1コイルパターン121に容量結合し、第2容量形成用電極パターン123が第1容量形成用電極113に磁気結合するため、第1及び第2配線層110,120を接続するスルーホール等は設けられていない。 The second coil pattern 121 are capacitively coupled to the first coil pattern 121, the second capacitor forming electrode patterns 123 are magnetically coupled to the first capacitance forming electrodes 113, connecting the first and second wiring layers 110 and 120 through-hole or the like which is not provided.

このようなICカードがリーダライタの無線通信範囲を通過すると、リーダライタのコイル(以下、R/Wコイル)200が発生する磁界によって第3コイルパターン112に誘導起電力が発生し、第3コイルパターン112に電流が流れる。 When such an IC card is passed through the wireless communication range of the reader-writer, the reader-writer of the coil (hereinafter, R / W coil) induced electromotive force in the third coil pattern 112 by the magnetic field 200 is generated is generated, the third coil current flows through the pattern 112. そして、ICカード内の全インダクタンス(第3コイルパターン112の自己インダクタンス、第1及び第3コイルパターンの自己及び相互インダクタンス、チップコイル121及び第1コイルパターン111の自己及び相互インダクタンス)及び全容量(配線上の浮遊容量、第1及び第2容量形成用電極113,123間の容量)によって共振が起こるため、第1コイルパターン111に流れる電流値が増大する。 The total inductance (third self-inductance of the coil pattern 112, the first and third coil pattern self and mutual inductances, the self and mutual inductances of the chip coil 121 and the first coil pattern 111) in the IC card and the total capacity ( since the stray capacitance of the wiring, the resonance by the first and the capacitance between the second capacitance-forming electrodes 113 and 123) occurs, the current value flowing through the first coil pattern 111 is increased. これにより、第1コイルパターン111が再放射する磁界強度が大きくなる。 Thus, the magnetic field intensity by the first coil pattern 111 is re-emitted is increased. このため、ICチップと基材との間隔以上の距離離れた、リーダライタのアンテナコイルとの間でデータ送受信が可能なICカード(例えば、通信距離10cm以上の近傍型ICカード、通信距離2mm以上の近接型ICカード)として機能可能な程度に、チップコイル131への電力伝送・通信信号のレベルを増大させることができる。 Therefore, apart distances greater than the interval between the IC chip and the substrate, the data transmitted and received between the antenna coil of the reader-writer capable IC card (for example, communication distance 10cm or more near-type IC card, the communication distance 2mm or more enough to be functioning as a proximity IC card) of the level of power transmission and communication signals to the chip coil 131 can be increased.

ここで、第1コイルパターン111は、配線が、その端部111Aの周りに複数回巻かれ、第3コイルパターン112へとつながる形状をなしている。 The first coil pattern 111, wiring is wound several times around the end 111A, it has a shape that leads to the third coil pattern 112. このような形状は、配線が形成されていない四角形等の領域をコイルパターン軸心部に残さなくても、または、そのような四角形等の領域を小さくしても、コイル軸心周り360度にわたってぐるりと配線が存在する。 Such a shape also regions such as square wire is not formed without leaving the coil pattern axis unit, or, even by reducing the area such as such a rectangle over the coil axis around 360 degrees there is a round wiring. このため、チップコイルに対向する迂回路部分をアンテナコイルに設ける場合と比較して、チップコイル131への電力伝送・通信信号のレベルを増大させることができ、通信距離をより長くすることができる。 Therefore, as compared with the case where the detour portion facing the chip coil antenna coil, the level of the power transmission and communication signals to the chip coil 131 can be increased, it is possible communication distance is longer .

ところで、図1の構成においては、第1及び第2配線層110,120に容量形成用電極113,123を設けているが、図2に示すように、容量形成用電極113,123の代わりに、第3コイルパターン112よりも小さな第4及び第5コイルパターン(層間接続用コイルパターン)114,124を基材100の第1及び第2配線層110,130に設けてもよい。 Incidentally, in the configuration of FIG. 1, is provided with the capacitance forming electrodes 113 and 123 to the first and second wiring layers 110 and 120, as shown in FIG. 2, instead of the capacitance forming electrodes 113 and 123 it may be provided with a small fourth and fifth coil pattern (the layer connecting coil pattern) 114 and 124 to the first and second wiring layers 110 and 130 of the substrate 100 than the third coil pattern 112. なお、これらの層間接続用コイルパターン114,124は、第1コイルパターンと同様、配線が、その端部の周りに複数回巻かれた形状を有している。 Note that these interlayer connecting coil pattern 114 and 124, similarly to the first coil pattern, the wiring has a plurality of turns shape around the end portion.

これらの層間接続用コイル114,124が磁気結合するため、図2の構成を有するICカードも、図1の構成を有するICカードと同様に機能する。 Since these interlayer connection coil 114, 124 is magnetically coupled, even IC card having the configuration of FIG. 2, functions similarly to the IC card having the structure of FIG. また、図4に示すように、図2の構成に含まれる第2コイルパターン121の代わりに基板表裏接続用パッド125を設けても、図1の構成を有するICカードと同様に機能する。 Further, as shown in FIG. 4, be provided with a substrate front and back connecting pad 125 in place of the second coil pattern 121 in the configuration of FIG. 2, functions similarly to the IC card having the structure of FIG.

また、図1の構成においては、基材100を挟んで第1コイルチップ111に第2コイルパターン121を対向させているが、図3に示すように、第2コイルパターン121の代わりに基板表裏接続用パッド125を第2配線層120に設けてもよい。 Further, in the configuration of FIG. 1, although the first coil chip 111 sandwich the substrate 100 is made to face the second coil pattern 121, as shown in FIG. 3, the substrate front and back in place of the second coil pattern 121 the connecting pad 125 may be provided on the second wiring layer 120. ICカードのコイルの巻数には、インダクタンス及び浮遊容量により定まる自己共振周波数を搬送周波数以上とする必要から、上限が存在する。 The number of turns of the coil of the IC card, the self-resonant frequency determined by the inductance and stray capacitance from the need to be more carrier frequencies, there upper limit. ところが、図3の構成によれば、共振用容量パッド113,123によって発生する容量と、第1コイルパターン111及び基板表裏接続用パッド125によって発生する容量とが直列に接続されるため、全体の容量が大幅に小さくなる。 However, according to the configuration of FIG. 3, since the capacitance generated by the resonant capacitor pads 113 and 123, and capacitance generated by the first coil pattern 111 and the substrate front and back connection pads 125 are connected in series, the overall capacity is reduced significantly. したがって、第3コイルパターン112または/および第1コイルパターン111の巻数を多くすることができる。 Therefore, it is possible to increase the number of turns of the third coil pattern 112 and / or the first coil pattern 111.

なお、以上においては、ICカードを例に挙げたが、本実施の形態に係る構造は、RFIDシステム等、他の通信式記録担体にも適用可能である。 In the above, has been given an IC card as an example, the structure according to the present embodiment, RFID system or the like, is also applicable to other communication record carrier. そして、本実施の形態に係る通信式記録担体には、例えば、搭載されたICチップに情報を記憶させる記憶媒体として使用可能である。 Then, the communication record carrier according to the present embodiment, for example, can be used as a storage medium for storing information in the mounted IC chip.

本発明の実施の一形態に係る通信式情報担体における、各コイルパターンの位置関係を示した図である。 In the communication type information carrier according to an embodiment of the present invention and shows the positional relationship of the coil pattern. 本発明の実施の一形態に係る通信式情報担体における、各コイルパターンの位置関係を示した図である。 In the communication type information carrier according to an embodiment of the present invention and shows the positional relationship of the coil pattern. 本発明の実施の一形態に係る通信式情報担体における、各コイルパターンの位置関係を示した図である。 In the communication type information carrier according to an embodiment of the present invention and shows the positional relationship of the coil pattern. 本発明の実施の一形態に係る通信式情報担体における、各コイルパターンの位置関係を示した図である。 In the communication type information carrier according to an embodiment of the present invention and shows the positional relationship of the coil pattern. 本発明の実施の一形態に係る通信式情報担体の構造を説明するための図である。 It is a diagram for explaining the structure of a communication type information carrier according to an embodiment of the present invention.

符号の説明 DESCRIPTION OF SYMBOLS

111…第1コイルパターン、112…第2コイルパターン、113…第1容量形成用電極、114…層間接続用コイル、121…第3コイルパターン、122…第4コイルパターン、123…第2容量形成用電極、124…層間接続用コイル、125…基板表裏接続用容量パッド、200…R/Wコイル 111 ... first coil pattern, 112 ... second coil pattern, 113 ... first capacitance forming electrodes, 114 ... interlayer connection coil, 121 ... third coil pattern, 122 ... fourth coil pattern, 123 ... second capacitance formation use electrodes, 124 ... interlayer connection coil, 125 ... substrate sides connected capacitor pads, 200 ... R / W coil

Claims (7)

  1. 配線基板と半導体装置との間隔以上の距離離れたリーダライタと通信可能な通信式記録担体であって、 A usable communication record carrier and the wiring board and the distance over distance away writer to the semiconductor device,
    前記半導体装置は、 The semiconductor device,
    前記配線基板側の面にチップコイルを有し、 Has a chip coil on the surface of the wiring substrate,
    前記配線基板は、 The wiring board,
    前記半導体装置側の面に形成された第1配線と、 A first wiring formed on a surface of the semiconductor device side,
    前記第1配線と前記チップコイルとの間に設けられた絶縁体層と、 An insulator layer provided between the first wiring and the chip coil,
    を有し、 Have,
    前記第1配線の端部は、前記絶縁層を挟んで前記チップコイルに対向する第1コイルパターンを形成することを特徴とする通信式記録担体。 An end portion of the first wiring, the communication record carrier, which comprises forming a first coil pattern facing the chip coil across the insulating layer.
  2. 請求項1記載の通信式記録担体であって、 A communication record carrier according to claim 1,
    前記配線基板は、前記半導体装置とは反対側の面に形成された第2の配線を有し、当該第2の配線の端部は、前記配線基板を挟んで前記第1コイルパターンに対向する第2コイルパターンを形成することを特徴とする通信式記録担体。 The wiring board, the a second wiring formed on the surface opposite to the semiconductor device, the ends of the second lines are opposed to the first coil pattern across said wiring board communication record carrier, which comprises forming the second coil pattern.
  3. 配線基板と半導体装置との間隔以上の距離離れたリーダライタと通信可能な通信式記録担体であって、 A usable communication record carrier and the wiring board and the distance over distance away writer to the semiconductor device,
    前記半導体装置は、 The semiconductor device,
    前記配線基板側の面にチップコイルを有し、 Has a chip coil on the surface of the wiring substrate,
    前記配線基板は、 The wiring board,
    前記半導体装置側の面に形成された第1配線と、 A first wiring formed on a surface of the semiconductor device side,
    前記第1配線と前記チップコイルとの間に介在する絶縁層と、 An insulating layer interposed between the first wiring and the chip coil,
    前記半導体装置とは反対側の面に形成された第2配線と、 A second wiring formed on the surface opposite to the semiconductor device,
    を有し、 Have,
    前記第1配線は、 The first wiring,
    当該第1配線の一方の端部で形成された、前記絶縁層を挟んで前記チップコイルに対向する第1コイルパターンと、 Formed in one end portion of the first wiring, and the first coil pattern facing the chip coil across the insulating layer,
    当該第1配線の他方の端部で形成された第4コイルパターンと、 A fourth coil patterns formed at the other end of the first wire,
    前記第1コイルパターンと第4コイルパターンとにつながった、前記第1及び第4コイルパターンよりも大きな第3コイルパターンと、 Said first coil pattern and led to the fourth coil pattern, a large third coil pattern than the first and fourth coil pattern,
    を有し、 Have,
    前記第2配線は、 The second wiring,
    当該第2配線の一方の端部で形成された第2コイルパターンと、 A second coil pattern formed on one end portion of the second wiring,
    当該第2配線の他方の端部で形成され、前記配線基板を挟んで前記第4コイルパターンに対向する第5コイルパターンと、 Is formed at the other end of the second wiring, and a fifth coil pattern facing the fourth coil pattern across the wiring substrate,
    を有することを特徴とする通信式記録担体。 Communication record carrier characterized in that it comprises a.
  4. 請求項3記載の通信式記録担体であって、 A communication record carrier according to claim 3,
    前記第2コイルパターンと前記第1コイルパターンは、前記配線基板を挟んで対向することを特徴とする通信式記録担体。 Wherein the second coil pattern first coil pattern, the communication record carrier, characterized in that facing each other across the wiring board.
  5. 配線基板と半導体装置との間隔以上の距離離れたリーダライタと通信可能な通信式記録担体であって、 A usable communication record carrier and the wiring board and the distance over distance away writer to the semiconductor device,
    前記半導体装置は、 The semiconductor device,
    前記配線基板側の面にチップコイルを有し、 Has a chip coil on the surface of the wiring substrate,
    前記配線基板は、 The wiring board,
    前記半導体装置側の面に形成された第1配線と、 A first wiring formed on a surface of the semiconductor device side,
    前記第1配線と前記チップコイルとの間に介在する絶縁層と、 An insulating layer interposed between the first wiring and the chip coil,
    前記半導体装置とは反対側の面に形成された第2配線と、 A second wiring formed on the surface opposite to the semiconductor device,
    を有し、 Have,
    前記第1配線は、 The first wiring,
    当該第1配線の一方の端部で形成された、前記絶縁層を挟んで前記チップコイルに対向する第1コイルパターンと、 Formed in one end portion of the first wiring, and the first coil pattern facing the chip coil across the insulating layer,
    当該第1配線の他方の端部で形成された第4コイルパターンと、 A fourth coil patterns formed at the other end of the first wire,
    前記第1コイルパターンと第4コイルパターンとにつながった、前記第1及び第4コイルパターンよりも大きな第3コイルパターンと、 Said first coil pattern and led to the fourth coil pattern, a large third coil pattern than the first and fourth coil pattern,
    を有し、 Have,
    前記第2配線は、 The second wiring,
    当該第2配線の一方の端部で形成され、前記配線基板を挟んで前記第1コイルパターンに対向するた電極パターンと、 Is formed in one end portion of the second wiring, and the electrode pattern facing the first coil pattern across the wiring substrate,
    当該第2配線の他方の端部で形成され、前記配線基板を挟んで前記第4コイルパターンに対向する第5コイルパターンと、 Is formed at the other end of the second wiring, and a fifth coil pattern facing the fourth coil pattern across the wiring substrate,
    を有することを特徴とする通信式記録担体。 Communication record carrier characterized in that it comprises a.
  6. 配線基板と半導体装置との間隔以上の距離離れたリーダライタと通信可能な通信式記録担体であって、 A usable communication record carrier and the wiring board and the distance over distance away writer to the semiconductor device,
    前記半導体装置は、 The semiconductor device,
    前記配線基板側の面にチップコイルを有し、 Has a chip coil on the surface of the wiring substrate,
    前記配線基板は、 The wiring board,
    前記半導体装置側の面に形成された第1配線と、 A first wiring formed on a surface of the semiconductor device side,
    前記第1配線と前記チップコイルとの間に介在する絶縁層と、 An insulating layer interposed between the first wiring and the chip coil,
    前記半導体装置とは反対側の面に形成された第2配線と、 A second wiring formed on the surface opposite to the semiconductor device,
    を有し、 Have,
    前記第1配線は、 The first wiring,
    当該第1配線の一方の端部で形成された、前記絶縁層を挟んで前記チップコイルに対向する第1コイルパターンと、 Formed in one end portion of the first wiring, and the first coil pattern facing the chip coil across the insulating layer,
    当該第1配線の他方の端部で形成された第1電極パターンと、 A first electrode pattern formed at the other end of the first wire,
    前記第1コイルパターンと第1電極パターンとにつながった、前記第1コイルパターンよりも大きな第3コイルパターンと、 Led to the first coil pattern and the first electrode pattern, and a large third coil pattern than the first coil pattern,
    を有し、 Have,
    前記第2配線は、 The second wiring,
    当該第2配線の一方の端部で形成され、前記配線基板を挟んで前記第1コイルパターンに対向するた第2コイルパターンと、 Is formed in one end portion of the second wiring, and a second coil pattern opposite to the first coil pattern across the wiring substrate,
    当該第2配線の他方の端部で形成され、前記配線基板を挟んで前記第1電極パターンに対向する第2電極パターンと、 Is formed at the other end of the second wiring, a second electrode pattern which is opposed to the first electrode pattern across the wiring substrate,
    を有することを特徴とする通信式記録担体。 Communication record carrier characterized in that it comprises a.
  7. 配線基板と半導体装置との間隔以上の距離離れたリーダライタと通信可能な通信式記録担体であって、 A usable communication record carrier and the wiring board and the distance over distance away writer to the semiconductor device,
    前記半導体装置は、 The semiconductor device,
    前記配線基板側の面にチップコイルを有し、 Has a chip coil on the surface of the wiring substrate,
    前記配線基板は、 The wiring board,
    前記半導体装置側の面に形成された第1配線と、 A first wiring formed on a surface of the semiconductor device side,
    前記第1配線と前記チップコイルとの間に介在する絶縁層と、 An insulating layer interposed between the first wiring and the chip coil,
    前記半導体装置とは反対側の面に形成された第2配線と、 A second wiring formed on the surface opposite to the semiconductor device,
    を有し、 Have,
    前記第1配線は、 The first wiring,
    当該第1配線の一方の端部で形成された、前記絶縁層を挟んで前記チップコイルに対向する第1コイルパターンと、 Formed in one end portion of the first wiring, and the first coil pattern facing the chip coil across the insulating layer,
    当該第1配線の他方の端部で形成された第1電極パターンと、 A first electrode pattern formed at the other end of the first wire,
    前記第1コイルパターンと第1電極パターンとにつながった、前記第1コイルパターンよりも大きな第3コイルパターンと、 Led to the first coil pattern and the first electrode pattern, and a large third coil pattern than the first coil pattern,
    を有し、 Have,
    前記第2配線は、 The second wiring,
    当該第2配線の一方の端部で形成され、前記配線基板を挟んで前記第1コイルパターンに対向する第2電極パターンと、 Is formed in one end portion of the second wiring, a second electrode pattern which is opposed to the first coil pattern across the wiring substrate,
    当該第2配線の他方の端部で形成され、前記配線基板を挟んで前記第1電極パターンに対向する第3電極パターンと、 Is formed at the other end of the second wire, a third electrode pattern which is opposed to the first electrode pattern across the wiring substrate,
    を有することを特徴とする通信式記録担体。 Communication record carrier characterized in that it comprises a.

JP2004174139A 2004-06-11 2004-06-11 Communication type recording medium Pending JP2005352858A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004174139A JP2005352858A (en) 2004-06-11 2004-06-11 Communication type recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004174139A JP2005352858A (en) 2004-06-11 2004-06-11 Communication type recording medium

Publications (1)

Publication Number Publication Date
JP2005352858A true true JP2005352858A (en) 2005-12-22

Family

ID=35587287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004174139A Pending JP2005352858A (en) 2004-06-11 2004-06-11 Communication type recording medium

Country Status (1)

Country Link
JP (1) JP2005352858A (en)

Cited By (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006287659A (en) * 2005-03-31 2006-10-19 Tdk Corp Antenna device
WO2007125683A1 (en) * 2006-04-26 2007-11-08 Murata Manufacturing Co., Ltd. Article provided with electromagnetically coupled module
JP2008042866A (en) * 2006-08-07 2008-02-21 Teruaki Bihazama Shortened antenna
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
US7764928B2 (en) 2006-01-19 2010-07-27 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US7786949B2 (en) 2006-04-14 2010-08-31 Murata Manufacturing Co., Ltd. Antenna
EP2226893A1 (en) * 2006-01-19 2010-09-08 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7871008B2 (en) 2008-06-25 2011-01-18 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7932730B2 (en) 2006-06-12 2011-04-26 Murata Manufacturing Co., Ltd. System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
US7931206B2 (en) 2007-05-10 2011-04-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US7990337B2 (en) 2007-12-20 2011-08-02 Murata Manufacturing Co., Ltd. Radio frequency IC device
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8009101B2 (en) 2007-04-06 2011-08-30 Murata Manufacturing Co., Ltd. Wireless IC device
US8031124B2 (en) 2007-01-26 2011-10-04 Murata Manufacturing Co., Ltd. Container with electromagnetic coupling module
US20110279340A1 (en) * 2009-01-30 2011-11-17 Murata Manufacturing Co., Ltd. Antenna and wireless ic device
US8070070B2 (en) 2007-12-26 2011-12-06 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8081121B2 (en) 2006-10-27 2011-12-20 Murata Manufacturing Co., Ltd. Article having electromagnetic coupling module attached thereto
US8081119B2 (en) 2006-04-26 2011-12-20 Murata Manufacturing Co., Ltd. Product including power supply circuit board
US8081125B2 (en) 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
US8081541B2 (en) 2006-06-30 2011-12-20 Murata Manufacturing Co., Ltd. Optical disc
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8193939B2 (en) 2007-07-09 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8228075B2 (en) 2006-08-24 2012-07-24 Murata Manufacturing Co., Ltd. Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
US8228252B2 (en) 2006-05-26 2012-07-24 Murata Manufacturing Co., Ltd. Data coupler
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8264357B2 (en) 2007-06-27 2012-09-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8384547B2 (en) 2006-04-10 2013-02-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
WO2013073314A1 (en) * 2011-11-14 2013-05-23 株式会社村田製作所 Antenna device and wireless communication device
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
WO2013115148A1 (en) * 2012-02-01 2013-08-08 株式会社村田製作所 Antenna apparatus and communication terminal apparatus
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8544754B2 (en) 2006-06-01 2013-10-01 Murata Manufacturing Co., Ltd. Wireless IC device and wireless IC device composite component
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
JP2014052756A (en) * 2012-09-06 2014-03-20 Mitsubishi Materials Corp The antenna device
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
JP5672414B2 (en) * 2012-10-12 2015-02-18 株式会社村田製作所 Hf-band wireless communication device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
WO2015147132A1 (en) * 2014-03-28 2015-10-01 株式会社村田製作所 Antenna device and communications apparatus
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
CN106898484A (en) * 2015-12-17 2017-06-27 三星电机株式会社 Coil for wireless communications, coil module and mobile terminal using the same
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device

Cited By (143)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006287659A (en) * 2005-03-31 2006-10-19 Tdk Corp Antenna device
US8725071B2 (en) 2006-01-19 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8326223B2 (en) 2006-01-19 2012-12-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US7764928B2 (en) 2006-01-19 2010-07-27 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
EP2226893A1 (en) * 2006-01-19 2010-09-08 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8078106B2 (en) 2006-01-19 2011-12-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8384547B2 (en) 2006-04-10 2013-02-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7786949B2 (en) 2006-04-14 2010-08-31 Murata Manufacturing Co., Ltd. Antenna
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8081119B2 (en) 2006-04-26 2011-12-20 Murata Manufacturing Co., Ltd. Product including power supply circuit board
JP4674638B2 (en) * 2006-04-26 2011-04-20 株式会社村田製作所 With electromagnetic coupling module goods
JPWO2007125683A1 (en) * 2006-04-26 2009-09-10 株式会社村田製作所 With electromagnetic coupling module goods
WO2007125683A1 (en) * 2006-04-26 2007-11-08 Murata Manufacturing Co., Ltd. Article provided with electromagnetically coupled module
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8228252B2 (en) 2006-05-26 2012-07-24 Murata Manufacturing Co., Ltd. Data coupler
US8544754B2 (en) 2006-06-01 2013-10-01 Murata Manufacturing Co., Ltd. Wireless IC device and wireless IC device composite component
US7932730B2 (en) 2006-06-12 2011-04-26 Murata Manufacturing Co., Ltd. System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8081541B2 (en) 2006-06-30 2011-12-20 Murata Manufacturing Co., Ltd. Optical disc
US8081125B2 (en) 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
JP2008042866A (en) * 2006-08-07 2008-02-21 Teruaki Bihazama Shortened antenna
US8228075B2 (en) 2006-08-24 2012-07-24 Murata Manufacturing Co., Ltd. Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8081121B2 (en) 2006-10-27 2011-12-20 Murata Manufacturing Co., Ltd. Article having electromagnetic coupling module attached thereto
US8031124B2 (en) 2007-01-26 2011-10-04 Murata Manufacturing Co., Ltd. Container with electromagnetic coupling module
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8009101B2 (en) 2007-04-06 2011-08-30 Murata Manufacturing Co., Ltd. Wireless IC device
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
US7931206B2 (en) 2007-05-10 2011-04-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8264357B2 (en) 2007-06-27 2012-09-11 Murata Manufacturing Co., Ltd. Wireless IC device
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
US8662403B2 (en) 2007-07-04 2014-03-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8193939B2 (en) 2007-07-09 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8191791B2 (en) 2007-07-17 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US9830552B2 (en) 2007-07-18 2017-11-28 Murata Manufacturing Co., Ltd. Radio IC device
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
US7990337B2 (en) 2007-12-20 2011-08-02 Murata Manufacturing Co., Ltd. Radio frequency IC device
US8610636B2 (en) 2007-12-20 2013-12-17 Murata Manufacturing Co., Ltd. Radio frequency IC device
US8360330B2 (en) 2007-12-26 2013-01-29 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8915448B2 (en) 2007-12-26 2014-12-23 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8070070B2 (en) 2007-12-26 2011-12-06 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US9022295B2 (en) 2008-05-21 2015-05-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8960557B2 (en) 2008-05-21 2015-02-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8973841B2 (en) 2008-05-21 2015-03-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US8047445B2 (en) 2008-05-22 2011-11-01 Murata Manufacturing Co., Ltd. Wireless IC device and method of manufacturing the same
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
US8011589B2 (en) 2008-06-25 2011-09-06 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7871008B2 (en) 2008-06-25 2011-01-18 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US9104950B2 (en) * 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US20110279340A1 (en) * 2009-01-30 2011-11-17 Murata Manufacturing Co., Ltd. Antenna and wireless ic device
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8876010B2 (en) 2009-04-14 2014-11-04 Murata Manufacturing Co., Ltd Wireless IC device component and wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9203157B2 (en) 2009-04-21 2015-12-01 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9564678B2 (en) 2009-04-21 2017-02-07 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8757502B2 (en) 2011-02-28 2014-06-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
WO2013073314A1 (en) * 2011-11-14 2013-05-23 株式会社村田製作所 Antenna device and wireless communication device
US9627760B2 (en) 2011-11-14 2017-04-18 Murata Manufacturing Co., Ltd. Antenna device and wireless communication apparatus
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
JPWO2013115148A1 (en) * 2012-02-01 2015-05-11 株式会社村田製作所 Antenna apparatus and communication terminal apparatus
JP5549787B2 (en) * 2012-02-01 2014-07-16 株式会社村田製作所 Antenna apparatus and communication terminal apparatus
US9576238B2 (en) 2012-02-01 2017-02-21 Murata Manufacturing Co., Ltd. Antenna device and communication terminal device
WO2013115148A1 (en) * 2012-02-01 2013-08-08 株式会社村田製作所 Antenna apparatus and communication terminal apparatus
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
JP2014052756A (en) * 2012-09-06 2014-03-20 Mitsubishi Materials Corp The antenna device
JP5672414B2 (en) * 2012-10-12 2015-02-18 株式会社村田製作所 Hf-band wireless communication device
US9634714B2 (en) 2012-10-12 2017-04-25 Murata Manufacturing Co., Ltd. HF-band wireless communication device
WO2015147132A1 (en) * 2014-03-28 2015-10-01 株式会社村田製作所 Antenna device and communications apparatus
CN106898484A (en) * 2015-12-17 2017-06-27 三星电机株式会社 Coil for wireless communications, coil module and mobile terminal using the same

Similar Documents

Publication Publication Date Title
US6378774B1 (en) IC module and smart card
US4960983A (en) Noncontact type IC card and system for noncontact transfer of information using the same
US20090033467A1 (en) Rf identification device with near-field-coupled antenna
US20120223149A1 (en) Antenna and rfid device
JP2004287767A (en) Noncontact communication type information carrier
JP3148168U (en) Wireless ic device
JP2009065426A (en) Booster antenna coil
US20060012482A1 (en) Radio frequency identification tag having an inductively coupled antenna
JP2004364199A (en) Antenna module and portable communication terminal equipped therewith
US8474726B2 (en) RFID antenna modules and increasing coupling
JP2001168628A (en) Auxiliary antenna for ic card
JP2006067479A (en) Non-contact information medium
US8366009B2 (en) Coupling in and to RFID smart cards
JP2000261230A (en) Coil unit and antenna system using the same and printed circuit board
JP2003332820A (en) Booster antenna for ic card
JP2008167190A (en) Base body sheet
JP2004213582A (en) Rfid tag, reader/writer and rfid system with tag
JP2002183690A (en) Noncontact ic tag device
JP2002175508A (en) Non-contact type data carrier device, and wiring member for booster antenna part
JP2006041986A (en) Antenna
US20140184462A1 (en) Antenna module and radio communication device
JP2008197714A (en) Non-contact data carrier device, and auxiliary antenna for non-contact data carrier
JP2003218624A (en) Booster antenna for ic card
US20130075477A1 (en) Coupling in and to rfid smart cards
JP2001101370A (en) Information processing medium

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061101

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090203

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090406

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090609