JP2003067711A - Article provided with ic chip mounting body or antenna part - Google Patents

Article provided with ic chip mounting body or antenna part

Info

Publication number
JP2003067711A
JP2003067711A JP2001260005A JP2001260005A JP2003067711A JP 2003067711 A JP2003067711 A JP 2003067711A JP 2001260005 A JP2001260005 A JP 2001260005A JP 2001260005 A JP2001260005 A JP 2001260005A JP 2003067711 A JP2003067711 A JP 2003067711A
Authority
JP
Japan
Prior art keywords
ic chip
antenna
article
rf
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001260005A
Other languages
Japanese (ja)
Inventor
Akira Hirasawa
朗 平澤
Original Assignee
Toppan Forms Co Ltd
トッパン・フォームズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Forms Co Ltd, トッパン・フォームズ株式会社 filed Critical Toppan Forms Co Ltd
Priority to JP2001260005A priority Critical patent/JP2003067711A/en
Publication of JP2003067711A publication Critical patent/JP2003067711A/en
Application status is Pending legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/0776Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07798Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers

Abstract

PROBLEM TO BE SOLVED: To provide a low-cost article having a simple constitution and prevented from doing fraud such as integrally stripping an RF-ID (radio- frequency identification) media from the article or sticking the RF-ID media to another article.
SOLUTION: This article is provided with, at least, a conductive pattern with a connecting conductive part in a substrate and disposed with an IC chip mounting body, which is formed by mounting an IC chip on the connecting conductive part, by directly fixed to a prescribed position, or disposed with an antenna part composed of a conductive pattern, which is formed of an antenna conductive part and a connecting conductive part positioned in the end part of the antenna conductive part, by directly fixed to a prescribed position. The IC chip mounting body or the antenna part is detachably formed with the antenna part or the IC chip mounting body, which is formed into the RF-ID media by assembled with the antenna part or the IC chip mounting body.
COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明はICチップ実装体あるいはアンテナ部を備えた物品に関するものであり、さらに詳しくは、非接触型データ送受信体などの薄形の情報送受信型記録メディアに用いられるRF−ID(Ra BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention relates to an article having an IC chip packaged or antenna unit and, more particularly, thin such as a non-contact type data reception member RF-ID used for information transmission and reception type recording medium (Ra
dio Frequency IDentificat dio Frequency IDentificat
ion)メデイアを形成できるICチップ実装体あるいはアンテナ部を備えた物品に関するものである。 ion) media relates articles with IC chip packaged or antenna portion can be formed. 【0002】 【従来の技術】最近のRF−IDメディアの形成方法には、アンテナ部上に直接ICチップを実装するものから、ICチップ実装体を採用する傾向がある。 2. Description of the Prior Art method of forming a recent RF-ID media, from those directly mounted IC chip on the antenna unit, there is a tendency to adopt the IC chip packaged. この方式は、例えばRF−IDメディア基材上のアンテナ部(ランド部)に対応する接続用導電部を小シート上に形成し、さらにICチップを実装したICチップ実装体を利用するものである。 This method is, for example, those antenna section on RF-ID media substrate the conductive parts for connection corresponding to the (land portion) is formed on the small sheet, further utilizing an IC chip mounting body mounting the IC chip . 【0003】従来のRF−IDメディアの形成方法を図4から図6により説明する。 [0003] illustrating a conventional method of forming a RF-ID media by FIGS. 4-6. この方法ではアンテナ回路体がICチップ実装体とアンテナ部とに構成が区分けされていて、このICチップ実装体とアンテナ部とが予め形成され、これらを用いてアンテナ回路体が形成されるようになっている。 Antenna circuit body in this way have been divided configuration in the IC chip mounting body and the antenna portion, and the IC chip packaged with the antenna portion is formed in advance, so that the antenna circuit body is formed with these going on. 図4は一方のICチップ実装体A1 Figure 4 is one of the IC chip packaged A1
の形成過程を示していて、まず後述するアンテナ部の端子部分に亘るように所定の大きさとした基材1を用意し(イ)、この基材1にICチップ実装用導電部2と接続用導電部3とが連続している一対の導電パターン4を設ける(ロ)。 And it shows the process of forming, first providing a substrate 1 which is a predetermined size to span the terminal portion of the antenna unit to be described later (a), for connection with the IC chip mounting conductive part 2 in the substrate 1 conductive portion 3 and the pair of contiguous conductive pattern 4 provided (b). この後、前記ICチップ実装用導電部2に跨るようにしてICチップ5を実装してICチップ実装体A1を形成し(ハ)、ICチップ5が実装されている片面全面に導電性接着剤6を塗布する(ニ)。 Thereafter, the IC so as to straddle the chip mounting conductive part 2 by mounting the IC chip 5 by forming the IC chip packaged A1 and (c), the conductive adhesive on one entire surface of the IC chip 5 is mounted 6 is applied (d). 【0004】図5は他方のアンテナB1の形成過程を示していて、所定の大きさとした基材7を用意し(イ)、 [0004] Figure 5 is shows the formation process of the other antenna B1, and providing a substrate 7 having a predetermined size (a),
この基材7にアンテナ導電部8とこのアンテナ導電部8 This substrate 7 and the antenna conductive portion 8 the antenna conductive portion 8
の端部に位置して端子部分である接続用導電部9とからなる導電パターン(アンテナ部)10を設け(ロ)、これによってアンテナB1が形成される。 End conductive consisting connecting conductive portions 9 Metropolitan a terminal portion located in the section pattern (antenna unit) 10 is provided (b), whereby the antenna B1 is formed. 前記接続用導電部9は上記ICチップ実装体A1の接続用導電部3と対応するように設けられている。 The connecting conductive portion 9 is provided so as to correspond to the connection conductive portion 3 of the IC chip packaged A1. 11は絶縁部である。 11 denotes an insulating portion. そして、ICチップ実装体A1とアンテナB1とをそれぞれの接続用導電部3、9が導電性接着剤6を用いて相対するように重ね合わせて、ICチップ実装体A1とアンテナB1とを接合した後、全面に絶縁性接着剤12を塗布することで、図6に示すRF−IDメディアC1が得られる。 Then, IC chip packaged A1 and the antenna B1 and the respective conductive parts for connection 3 and 9 with a conductive adhesive 6 superposed so as to face, and bonding the IC chip packaged A1 and the antenna B1 after the entire surface by applying an insulating adhesive 12, RF-ID media C1 shown in FIG. 6 is obtained. 【0005】このようなRF−IDメディアC1は、絶縁性接着剤12を介して製品などの物品aに貼着されて使用される。 [0005] Such RF-ID media C1 is used by being attached to an article a such as the product through an insulating adhesive 12. しかし貼着されたRF−IDメディアC1 But stuck has been RF-ID media C1
を物品aから一体的にはぎ取り、他の物品bにRF−I Stripping the integrally from an article a, RF-I in other articles b
DメディアC1を貼着することが可能であり、物品bを物品aにみせかけるようなことが行われるという問題があった。 It is possible to adhere the D media C1, there is a problem that it as disguise article b to the article a is performed. またRF−IDメディアC1は一度使用すると破棄され、リサイクルされないので環境にやさしくないという問題があった。 The RF-ID media C1 is discarded to be used once, there is a problem that is not friendly to the environment because they are not recycled. 【0006】 【発明が解決しようとする課題】本発明の第1の目的は、従来の問題を解決し、RF−IDメディアC1を物品aから一体的にはぎ取り、他の物品bにRF−IDメディアC1を貼着して物品bを物品aにみせかけるような不正行為ができなくし、また一度使用後破棄しないで再使用できるので環境にやさしい安価なICチップ実装体あるいはアンテナ部を備えた物品を提供することである。 [0006] The first object of the present invention is to solve the above solves the conventional problems, stripping the integrally RF-ID media C1 from the article a, RF-ID into other articles b article an article b was impossible fraud as masquerading article a by sticking the media C1, also with a cheap IC chip packaged or antenna portion environmentally friendly because it can be reused without once discarded after use it is to provide a. 【0007】 【課題を解決するための手段】本発明者は上記課題を解決するために鋭意研究した結果、従来、ICチップ実装体A1とアンテナB1とを一体化して形成されていたR The present inventors have Means for Solving the Problems] As a result of intensive study to solve the above problem, conventionally, R which has been formed by integrating the IC chip packaged A1 and the antenna B1
F−IDメディアC1のICチップ実装体A1とアンテナB1を別々にして、一方を物品の所定の箇所に直に固定して配設し、他方を使用時に着脱可能に装着してRF The IC chip mounting body A1 and the antenna B1 of the F-ID media C1 and separately, one of them directly and fixedly disposed at a predetermined location of the article, RF detachably mounted the other during use
−IDメディアC1を構成して使用し、使用後は脱着するようにすれば、課題を解決できることを見いだし、本発明を成すに到った。 Use constitute -ID media C1, after use if to desorb, it found that can solve the problems, led to form a present invention. 【0008】本発明の請求項1記載のICチップ実装体あるいはアンテナ部を備えた物品は、少なくとも接続用導電部を備えた導電パターンを基材に設け、前記接続用導電部にICチップを実装してなるICチップ実装体を所定の箇所に直に固定して配設した物品、あるいはアンテナ導電部とこのアンテナ導電部の端部に位置する接続用導電部とからなる導電パターンからなるアンテナ部を所定の箇所に直に固定して配設した物品であって、前記ICチップ実装体あるいは前記アンテナ部が、前記IC [0008] The article having an IC chip packaged or antenna unit according to a first aspect of the present invention is provided with a conductive pattern having at least the conductive parts for connection to a substrate, mounting an IC chip to the conductive parts for connection antenna unit for made of a conductive pattern consisting of an IC chip packaged article is disposed in direct fixed to a predetermined position, or the antenna conductor portion and the conductive parts for connection located at the end of the antenna conductor portion comprising the an article which is disposed in direct fixed to a predetermined position, the IC chip packaged or the antenna portion, the IC
チップ実装体と組み合わすことによりRF−IDメデイアを形成するアンテナ部あるいは前記アンテナ部と組み合わすことによりRF−IDメデイアを形成するICチップ実装体を着脱可能に形成されていることを特徴とする。 Characterized in that it is detachably attached to the IC chip mounting body forming the RF-ID media by combining an antenna unit or the antenna section to form the RF-ID media by combining a chip mounting body . 【0009】本発明のICチップ実装体あるいはアンテナ部を備えた物品は、構成が簡単で安価な上、例えば物品に直に固定して配設されたICチップ実装体の接続用導電部に、物品に配設されていない方のアンテナ部の接続用導電部をそれぞれの接続用導電部が相対するように重ね合わせて、前記ICチップ実装体とアンテナ部とを導通接合してRF−IDメディアを形成して使用に供すことができ、使用後はアンテナ部を脱着するようにすれば、RF−IDメディアを物品から一体的にはぎ取り、 [0009] The article having an IC chip packaged or antenna unit of the present invention, on the construction and inexpensive easy, for example, the conductive parts for connection of the directly fixed to disposed an IC chip packaged on the article, by superimposing the conductive parts for connection of the antenna part of which is not disposed in the article such that the respective conductive parts for connection is relative, RF-ID media conducting bonding the IC chip packaged with the antenna portion can Kyosu formed to use, after use if to desorb the antenna unit, stripping the integrally RF-ID media from the article,
他の物品にRF−IDメディアを貼着するなどの不正行為ができなくなり、またICチップ実装体もアンテナ部も再使用可能であるが、アンテナ部の設計変更を行っても、設計変更したアンテナ部を同様にして使用できるようにすればICチップ実装体の方も再使用可能である。 Antenna can not abuse such as pasting a RF-ID media to other articles, Although IC chip packaged also the antenna unit can also be reused, even if the design change of the antenna unit, for changing the design towards the IC chip packaged if parts to be used in a similar manner to also be reused. 【0010】 【発明の実施の形態】以下、図面を用いて本発明の一実施の形態を説明する。 DETAILED DESCRIPTION OF THE INVENTION Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 図1は物品の所定の箇所に直に固定して配設されたアンテナ部を模式的に説明する説明図である。 Figure 1 is an explanatory view for explaining an antenna portion disposed in direct fixed to a predetermined position of the article schematically. 図2は図1に示したアンテナ部にICチップ実装体を装着する様子を模式的に説明する説明図である。 Figure 2 is an explanatory view schematically illustrating a state of mounting the IC chip packaged in the antenna unit shown in FIG.
図3は図1に示したアンテナ部の所定の箇所にICチップ実装体を装着した状態を模式的に説明する説明図である。 Figure 3 is an explanatory view schematically illustrating a state of mounting the IC chip packaged on a predetermined position of the antenna unit shown in FIG. 20は物品、21は物品20の所定の箇所に直に固定して配設されたアンテナ部、22はICチップ実装体、23はRF−IDメデイアを示す。 20 article, 21 antenna portion disposed in direct fixed to a predetermined position of the article 20, 22 is an IC chip mounting body, 23 denotes an RF-ID media. 図1および図2 1 and 2
に示すように物品20に直に印刷するなどして固定してアンテナ部21が配設されており、使用時にICチップ実装体22を所定の箇所に装着してICチップ実装体2 The fixed, such as by directly printing on the article 20 as shown antenna unit 21 is disposed, the IC chip mounting body 2 mounting an IC chip 22 is mounted at a predetermined position at the time of use
2の図示しない接続用導電部に、アンテナ部21の図示しない接続用導電部をそれぞれの接続用導電部が相対するように重ね合わせて、前記ICチップ実装体22とアンテナ部21とを導通接合してRF−IDメディア23 The conductive parts for connection 2 not shown, conductive parts for each connecting the connection conductive portion (not shown) of the antenna portion 21 is superposed so as to face, conductive bonding the IC chip mounting member 22 and the antenna section 21 RF-ID media 23 and
を形成する。 To form. 【0011】上記の例では物品20に直に印刷するなどして固定してアンテナ部21を配設した例を示したが、 [0011] In the above example, an example which is disposed an antenna portion 21 and fixed by, for example, directly printed on the article 20,
配設する方法はこれに限定されず、例えば前記図5に示したアンテナB1の裏面に接着剤を施したものを使用し、接着剤を介して物品20の所定の箇所に直に固定してアンテナ部とすることもできる。 How to arrange is not limited thereto, for example using what subjected to adhesive on the back surface of the antenna B1 shown in FIG. 5, directly fixed to a predetermined portion of the article 20 through an adhesive It can also be an antenna unit. 【0012】ICチップ実装体22をアンテナ部21の所定の箇所に着脱可能に装着する方法も特に限定されるものではなく、前記図4に示したICチップ実装体A1 [0012] The method of mounting the IC chip mounting member 22 detachably at a predetermined position of the antenna portion 21 is not particularly limited, FIG. 4 shows an IC chip packaged A1
を導電性接着剤6を介して装着してもよく、またカード形態に形成したICチップ実装体22を差し込み方式や挟み込み方式などで装着したりしてもよい。 The via a conductive adhesive 6 may be mounted, or may be or mounted in such insertion method and sandwiching method mounting an IC chip 22 which is formed in the card form. 【0013】上記の例では物品20に直に印刷するなどして固定してアンテナ部21を配設した例を示したが、 [0013] In the above example, an example which is disposed an antenna portion 21 and fixed by, for example, directly printed on the article 20,
アンテナ部の代わりにICチップ実装体22を物品20 Article mounting an IC chip 22 in place of the antenna 20
に予め直に固定して配設しておき、使用時にアンテナ部21をICチップ実装体22の所定の箇所に装着してI Previously directly fixed to leave arranged, the antenna section 21 when used by being mounted at a predetermined position of the IC chip packaged 22 I to
Cチップ実装体22の図示しない接続用導電部に、アンテナ部21の図示しない接続用導電部をそれぞれの接続用導電部が相対するように重ね合わせて、前記ICチップ実装体22とアンテナ部21とを導通接合してRF− A connection conductive portion (not shown) of the C chip mounting body 22, conductive parts for each connecting the connection conductive portion (not shown) of the antenna portion 21 is superposed so as to face the IC chip mounting member 22 and the antenna section 21 conducting joining the door RF-
IDメディア23を形成することもできる。 It is also possible to form the ID media 23. 【0014】アンテナ部21をICチップ実装体22の所定の箇所に着脱可能に装着してRF−IDメディア2 [0014] Antenna section 21 detachably attached to a predetermined position of the IC chip packaged 22 RF-ID media 2
3を形成する方法も特に限定されるものではなく、図5 A method of forming a 3 is not particularly limited, FIG. 5
に示したようなアンテナB1を接着剤を介して装着してもよく、またカード形態に形成したアンテナ部21を差し込み方式や挟み込み方式などで装着したりしてもよい。 The antenna B1 may be mounted via an adhesive, or may be or mounted in such insertion method and sandwiching manner an antenna portion 21 formed in the card form as shown in. 【0015】図3に示したRF−IDメディア23の使用後はICチップ実装体22を脱着するようにすれば、 [0015] After using the RF-ID media 23 shown in Figure 3 if to desorb the IC chip mounting member 22,
RF−IDメディア23を物品20から一体的にはぎ取り、他の物品にRF−IDメディア23を貼着するなどの不正行為ができなくなり、またICチップ実装体22 Stripping the integrally RF-ID media 23 from the article 20, it can not abuse such as pasting a RF-ID media 23 to other articles, also IC chip packaged 22
の設計変更を行って、設計変更したICチップ実装体2 Perform the design changes, IC chip mounted body 2 has been changed design
2を用いてアンテナ部21に着脱可能に装着して使用するようにすればアンテナ部21の方は設計変更なしに再使用できる。 Towards the antenna unit 21 can be re-used without design changes be used by being detachably attached to the antenna unit 21 using 2. 【0016】本発明で用いる物品は、アンテナ部あるいはIC実装体を直に固定して配設できるものであればよく、具体的には、例えば家電製品類、旅行鞄などの鞄類、ガラス瓶やプラスチック容器などの容器類、額類などの各種製品あるいは半製品類などを挙げることができるが勿論これらに限定されるものではない。 The article used in the present invention may be used as long as it can directly fixed to disposed an antenna unit or the IC mounted body, specifically, for example, household appliances such, bags such as luggage, glass bottles Ya containers such as plastic containers, can be exemplified various products or semi-finished products such as forehead acids not intended to be of course limited thereto. 【0017】前記基材1あるいは基材7の素材としては、ガラス繊維、アルミナ繊維、ポリエステル繊維、ポリアミド繊維などの無機または有機繊維からなる織布、 [0017] As a material for the substrate 1 or substrate 7, glass fibers, alumina fibers, polyester fibers, woven fabric made of inorganic or organic fibers such as polyamide fibers,
不織布、マット、紙あるいはこれらを組み合わせたもの、あるいはこれらに樹脂ワニスを含浸させて成形した複合基材、ポリアミド系樹脂基材、ポリエステル系樹脂基材、ポリオレフィン系樹脂基材、ポリイミド系樹脂基材、エチレン・ビニルアルコール共重合体基材、ポリビニルアルコール系樹脂基材、ポリ塩化ビニル系樹脂基材、ポリ塩化ビニリデン系樹脂基材、ポリスチレン系樹脂基材、ポリカーボネート系樹脂基材、アクリロニトリルブタジエンスチレン共重合系樹脂基材、ポリエーテルスルホン系樹脂基材などのプラスチック基材、あるいはこれらにコロナ放電処理、プラズマ処理、紫外線照射処理、電子線照射処理、フレームプラズマ処理およびオゾン処理などの表面処理を施したもの、などの公知のものから選択して用いるこ Nonwoven, mat, paper or one combination thereof, or a composite substrate obtained by molding these resin impregnated varnish, polyamide resin substrate, polyester resin substrate, polyolefin resin substrate, polyimide resin substrate , ethylene-vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer polymerization resin substrate, plastic substrate, such as a polyethersulfone resin substrate corona discharge treatment or to, a plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, facilities to surface treatment such as flame plasma treatment and ozone treatment the thing, by selecting from known ones, such as Mochiiruko ができる。 Can. 【0018】基材上にICチップ実装体やアンテナ部を形成するような場合は、同じ素材からなる基材を用いて形成してもよいし、異なる基材でもよい。 [0018] When on the substrate so as to form an IC chip packaged and antenna unit, a base material made of the same material may be formed using, or in different substrates. またICチップ実装体あるいはアンテナ部を物品に配設する際、個数は1個に限定されず1個以上配設することができる。 Also when arranging the IC chip packaged or antenna portion to the article, the number may be disposed one or more not limited to one. 1
個以上配設すれば非接触でより多くのデータを送受信できるなどの利点がある。 There are advantages such as send and receive more data in a non-contact when disposed more pieces. 【0019】上記ICチップ実装体での導電パターンの形成、アンテナ部での導電パターンの形成は、それぞれ公知の方法で行うことができる。 The formation of the conductive pattern in the IC chip packaged, forming the conductive pattern of the antenna portion can be respectively carried out by known methods. 例えば、導電ペーストをスクリーン印刷やインクジェット方式印刷により印刷して乾燥固定化する方法、被覆あるいは非被覆金属線の貼り付け、エッチング、デイスペンス、金属箔貼り付け、金属の直接蒸着、金属蒸着膜転写、導電高分子層形成などが挙げられるがこの限りでない。 For example, a method of drying immobilizing a conductive paste is printed by screen printing or ink jet method printing, paste coating, or uncoated metal wire, etching, Deisupensu, metal foil adhered directly deposited, vapor-deposited metal film transfer of metal, conductive polymer layer formation, and the like, but this shall not apply. 【0020】ICチップ実装体を形成するプロセスでのICチップの実装は、ワイヤーボンデイング(WB)を始めとして、異方性導電フィルム(ACF)、導電ペースト(ACP)、絶縁樹脂(NCP)、絶縁フィルム(NCF)、クリーム半田ボールを用いたものなど、公知の方法で接続できる。 The IC chip implementation in the process of forming the IC chip mounting body, including the wire bonding (WB), anisotropic conductive film (ACF), conductive paste (ACP), an insulating resin (NCP), insulation film (NCF), such as those using the cream solder balls, can be connected in a known manner. 必要であれば、公知のアンダーフィル材あるいはポッティング材による接続部の保護・ If necessary, protection of the connection according to known underfill material or potting material,
補強を行ってもよい。 Reinforcement may be performed. 【0021】本発明で用いる接着剤および絶縁性接着剤は特に限定されるものではない。 The adhesive and insulating adhesive agent used in the present invention is not limited in particular. 具体的には、粘着剤、 More specifically, the pressure-sensitive adhesive,
ホットメルトタイプなどの熱可塑性接着剤、熱硬化性接着剤、光硬化性接着剤などを挙げることができる。 Thermoplastic adhesives such as hot melt type, thermosetting adhesive, and the like photocurable adhesive. 粘着剤や接着剤の具体例としては、例えば、天然ゴム(N Specific examples of the pressure-sensitive adhesive or adhesive, for example, natural rubber (N
R)、スチレン/ブタジエン共重合ゴム(SBR)、ポリイソブチレン(PIB)、イソブチレン/イソプレン共重合体(ブチルゴム、IIR)、イソプレンゴム、ブタジエン重合体(BR)、スチレン/ブタジエン共重合体(HSR)、スチレン/イソプレン共重合体、スチレン/イソプレン/スチレンブロックポリマー(SI R), styrene / butadiene copolymer rubber (SBR), polyisobutylene (PIB), isobutylene / isoprene copolymer (butyl rubber, IIR), isoprene rubber, butadiene polymer (BR), styrene / butadiene copolymer (HSR) , styrene / isoprene copolymers, styrene / isoprene / styrene block polymer (SI
S)、スチレン/ブタジエン/スチレンブロックポリマー(SBS)、クロロプレンゴム(CR)、ブタジエン/アクリロニトリル共重合ゴム(NBR)、ブチルゴム、アクリル系ポリマー、ビニルエーテルポリマー、ポリビニルアルコール(PVA)、ポリビニルブチラール(PVB)、ポリビニルピロリドン(PVP)、ビニルピロリドン/酢酸ビニル共重合体、ジメチルアミノエチル・メタクリル酸/ビニルピロリドン共重合体、ポリビニルカプロラクタム、ポリビニルピロリドン、無水マレイン酸共重合体、シリコーン系粘着剤(ポリビニルシロキサン)、ポリウレタン、ポリ塩化ビニル、ゼラチン、 S), styrene / butadiene / styrene block polymers (SBS), a chloroprene rubber (CR), a butadiene / acrylonitrile copolymer rubber (NBR), butyl rubber, acrylic polymers, vinyl polymers, polyvinyl alcohol (PVA), polyvinyl butyral (PVB) , polyvinylpyrrolidone (PVP), vinyl pyrrolidone / vinyl acetate copolymers, dimethylaminoethyl methacrylate / vinylpyrrolidone copolymers, polyvinyl caprolactam, polyvinyl pyrrolidone, maleic anhydride copolymers, silicone-based pressure-sensitive adhesive (polyvinyl siloxane) , polyurethane, polyvinyl chloride, gelatin,
シェラック、アラビアゴム、ロジン、ロジンエステル、 Shellac, gum arabic, rosin, rosin ester,
エチルセルロース、カルボキシメチルセルロース、パラフィン、トリステアリン、ポリエチレン、ポリプロピレン、アクリル系樹脂、ビニル系樹脂、ポリイソブテン、 Cellulose, carboxymethyl cellulose, paraffin, tristearin, polyethylene, polypropylene, acrylic resin, vinyl resin, polyisobutene,
ポリブタジエン、エポキシ樹脂、フェノール樹脂、ポリウレタン樹脂、ポリエステル、ポリアミド、シリコーン、ポリスチレン、メラミン樹脂などの1種または2種以上の混合物を挙げることができる。 Polybutadiene, epoxy resins, phenolic resins, polyurethane resins, polyester, polyamide, silicone, polystyrene, one or a mixture of two or more of such melamine resins. これらには液状ポリブテン、鉱油、液状ポリイソブチレン、液状ポリアクリル酸エステルなどの軟化剤や、ロジン、ロジン誘導体、ポリテルペン樹脂、テルペンフェノール樹脂、石油樹脂などの粘着付与剤を添加することができる。 These include liquid polybutene, mineral oil, liquid polyisobutylene, and a softening agent such as liquid polyacrylic acid ester, rosin, rosin derivatives, can be added polyterpene resin, terpene phenol resin, a tackifier such as petroleum resin. 【0022】光硬化性接着剤の具体例としては、例えば、アクリレート化合物、メタクリレート化合物、プロペニル化合物、アリル化合物、ビニル化合物、アセチレン化合物、不飽和ポリエステル類、エポキシポリ(メタ)アクリレート類、ポリ(メタ)アクリレートポリウレタン類、ポリエステルポリオールポリ(メタ)アクリレート類、ポエーテルポリオールポリ(メタ)アクリレート類、フェノキシエチル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート、スチレン、 [0022] Specific examples of the photocurable adhesive, for example, acrylate compounds, methacrylate compounds, propenyl compound, an allyl compound, vinyl compound, acetylenic compounds, unsaturated polyesters, epoxy poly (meth) acrylates, poly (meth ) acrylate polyurethanes, polyester polyol poly (meth) acrylates, po ether polyol poly (meth) acrylates, phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, styrene,
α−アルキルスチレンなどの1種あるいは2種以上の混合物、およびこれらに公知の光重合開始剤、光重合促進剤などを配合したものなどが挙げられる。 One or two or more kinds of mixtures such as α- alkylstyrene, and known photopolymerization initiator thereto, such as those formulated with such photopolymerization accelerator agents. これらの光硬化性接着剤には、液状ポリブテン、鉱油、液状ポリイソブチレン、液状ポリアクリル酸エステルなどの軟化剤や、ロジン、ロジン誘導体、ポリテルペン樹脂、テルペンフェノール樹脂、石油樹脂などの粘着付与剤を添加することができる。 These light-curable adhesive, liquid polybutene, mineral oil, liquid polyisobutylene, and a softening agent such as liquid polyacrylic acid ester, rosin, rosin derivatives, polyterpene resins, terpene phenol resins, a tackifier such as petroleum resin it can be added. 必要に応じて有機溶剤や反応性有機溶剤などで希釈することができる。 It may be diluted with an organic solvent or reactive organic solvent as needed. 【0023】熱硬化性接着剤のエポキシ樹脂は1分子中に2個以上のエポキシ基を有し、硬化して樹脂状になるものであればよく、具体例としては、ビスフェノールA [0023] The epoxy resin of the thermosetting adhesive has two or more epoxy groups in one molecule, as long as it cured to become resinous, specific examples include bisphenol A
型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、テトラブロモビスフェノールA型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、脂環式エポキシ樹脂、ヒダントイン型エポキシ樹脂などを例示できる。 Type epoxy resins, bisphenol F type epoxy resins can be exemplified tetrabromobisphenol A type epoxy resins, phenol novolak type epoxy resin, cresol novolak type epoxy resin, glycidyl ester type epoxy resins, alicyclic epoxy resins, such as hydantoin epoxy resin . 【0024】硬化剤としてはフェノール樹脂、酸無水物、アミン系化合物などを挙げることができる。 Examples of the curing agent and the like phenolic resins, acid anhydrides, amine compounds. フェノール樹脂としてはフェノールノボラック樹脂、クレゾールノボラック樹脂、ナフトール変性フェノール樹脂、ジシクロペンタジエン変性フェノール樹脂、パラキシレン変性フェノール樹脂などを挙げることができる。 The phenol resin can be exemplified phenol novolak resin, cresol novolak resin, naphthol-modified phenolic resins, dicyclopentadiene-modified phenol resin, paraxylene denatured phenol resin and the like. 【0025】イミダゾール系、第3級アミン系、リン化合物系、これらの2種以上の混合物などの硬化促進剤を必要に応じて添加できる。 [0025] imidazole, tertiary amine, a phosphorus compound-based, can be added as needed a curing accelerator such as a mixture of two or more thereof. 【0026】また、必要に応じて溶媒、臭素化合物、リン化合物などの難燃剤、シリコーン系化合物などの消泡剤、カーボンブラック、有機顔料などの着色剤、カップリング剤などを添加することができる。 Further, it is possible to add a solvent if necessary, a bromine compound, a flame retardant such as phosphorus compounds, antifoaming agents such as silicone-based compounds, carbon black, colorants such as organic pigments, such as coupling agents . 【0027】またシリカ、アルミナ、炭酸カルシウム、 Further silica, alumina, calcium carbonate,
酸化チタン、カーボンブラックなどの1種または2種以上の粉末を充填剤として添加することができる。 It can be added to the titanium oxide, one or more powders such as carbon black as filler. 【0028】本発明で用いる導電性接着剤も特に限定されるものではなく、具体的には、例えば前記のようなホットメルト接着剤、粘着剤、熱可塑性樹脂接着剤あるいは熱硬化性樹脂接着剤あるいは紫外線、電子線などにより硬化する接着剤、天然ゴム系接着剤、合成ゴム系接着剤など、あるいはこれらの2つ以上組み合わせからなる接着剤などに対して導電性粉末を配合したものを挙げることができる。 The conductive adhesive used in the present invention is also not particularly limited, specifically, for example, a hot melt adhesive such as the pressure-sensitive adhesive, thermoplastic resin adhesive or a thermosetting resin adhesive or ultraviolet adhesive which is cured by an electron beam, be mentioned those obtained by blending natural rubber adhesive, synthetic rubber adhesive, or a conductive powder with respect to an adhesive consisting of two or more combinations thereof can. 【0029】本発明で用いる接着剤、絶縁性接着剤や導電性接着剤を所定の箇所に施す方法は特に限定されるものではなく、例えば、刷毛塗りなど手動で塗工する方法、あるいは、自動的に印刷、塗布、テープ貼り付けする方法などを挙げることができる。 The adhesive used in the present invention, a method of applying an insulating adhesive and conductive adhesive at predetermined locations is not particularly limited, for example, a method for coating by hand, such as brushing or automatic to print, coating, and a method of pasting a tape. 【0030】本発明においては、絶縁層は必ずしも必要ではないが、ICチップ実装体側および/またはアンテナ部側に印刷、塗布、テープ貼り付けなどの公知の方法により絶縁層を設けることができる。 [0030] In the present invention, the insulating layer is not necessarily required, printed IC chip mounting side and / or the antenna side, coating by a known method such as tape applying can be provided an insulating layer. 【0031】上記ICチップ実装体とアンテナ部との接続用導電部は、設計上製造加工し易い任意の方法でつくればよく、ICチップ実装用導電部ほどの精密さが必要ない加工許容度の高い構造でよい。 The connection conductive portions of the IC chip mounting body and the antenna unit may be make in any way easy to manufacture processing design, enough conductive portion for mounting an IC chip of precision is not required machining tolerance it may be a high structure. 【0032】なお、本発明は上記実施形態に限定されるものではないので、特許請求の範囲に記載の趣旨から逸脱しない範囲で各種の変形実施が可能である。 [0032] The present invention is therefore intended in no limited to the above embodiments but may be various modifications within a range without departing from the spirit described in the claims. 【0033】 【実施例】以下実施例によって、本発明をさらに詳細に説明するが、本発明はこれらの実施例に限定されるものではない。 EXAMPLES The following examples, the present invention will be described in more detail, the present invention is not limited to these examples. (実施例1)銀ペースト(製品名:LS−411AW、 (Example 1) silver paste (product name: LS-411AW,
アサヒ化学研究所製)に対して、粘度調整剤としてイソホロンおよびブチルセロソルブアセテートを適量加えて、シルク印刷用の銀ペーストインクを作った。 Against Asahi Chemical Laboratory Ltd.), it was added an appropriate amount of isophorone and butyl cellosolve acetate as a viscosity modifier, made of silver paste ink for silk-screen printing. この銀ペーストインクを使用し、厚さ0.1mmのPETフィルム(基材)上にシルク印刷し、150℃、30分の条件で乾燥してアンテナ部を形成した。 The silver paste ink was used to silk printed on a PET film having a thickness of 0.1 mm (base material), 0.99 ° C., to form the antenna portion was dried at 30 minutes. このアンテナ部を公知の方法で図1に示すように物品(プラスチックコンテナ)20に直に固定してアンテナ部21を配設した。 Were provided with the antenna portion 21 in direct fixed to the antenna portion, as shown in Figure 1 in a known manner the article (plastic container) 20.
他方、公知の方法により70kg連量のラベル紙(基材)上にICチップを実装したICチップ実装体(IC On the other hand, 70 kg ream weight of labels by known methods IC chip mounting body mounting the IC chip on the (base) (IC
カード)22を作った。 I made a card) 22. 図2および図3に示すように使用時にICチップ実装体(ICカード)22を所定の箇所に挿入して着脱可能に装着してICチップ実装体(I IC chip packaged in use as shown in FIGS. 2 and 3 (IC card) 22 detachably be mounted by inserting a predetermined location IC chip packaged (I
Cカード)22の図示しない接続用導電部に、アンテナ部21の図示しない接続用導電部をそれぞれの接続用導電部が相対するように重ね合わせて、前記ICチップ実装体(ICカード)22とアンテナ部21とを導通接合したところ、非接触型データ送受信体(RF−IDメディア)23として機能することが確認された。 To C card) connecting conductive portions (not shown) of 22, and superposed so that the respective conductive parts for connection of the conductive parts for connection (not shown) of the antenna unit 21 is relative, and the IC chip packaged (IC card) 22 was conducting bonding the antenna portion 21, it was confirmed that the non-contact type data reception member functions as (RF-ID media) 23. 確認後I After confirming I
Cチップ実装体(ICカード)22を非接触型データ送受信体(RF−IDメディア)23から容易に脱着でき、同様にして再使用することができた。 C chip mounting body (IC card) 22 contactless data transmission and reception member can be easily detached from the (RF-ID media) 23, it could be reused in the same manner. 【0034】(実施例2)実施例1でアンテナ部を形成する際、PETフィルム上にアルミニウムをエッチングしてアンテン部を形成した以外は、実施例1と同様にして図1に示す物品(プラスチックコンテナ)20に直に固定してアンテナ部21を配設するとともに、ICチップ実装体(ICカード)22を作り、図2および図3に示すように使用時にICチップ実装体(ICカード)2 [0034] (Example 2) when forming the antenna portion in Example 1, except for forming a saddle portion by etching the aluminum on the PET film are shown in FIG. 1 in the same manner as in Example 1 article (Plastic with arranging the antenna portion 21 in direct fixed to the container) 20, IC chip packaged (make IC card) 22, IC chip packaged in use as shown in FIGS. 2 and 3 (IC card) 2
2を所定の箇所に挿入して装着したところ、非接触型データ送受信体(RF−IDメディア)23として機能することが確認された。 2 was mounted is inserted into a predetermined position, it was confirmed that the non-contact type data reception member functions as (RF-ID media) 23. 確認後ICチップ実装体(ICカード)22を非接触型データ送受信体(RF−IDメディア)23から容易に脱着でき、同様にして再使用することができた。 After confirming IC chip mounting body (IC card) 22 contactless data transmission and reception member can be easily detached from the (RF-ID media) 23, it could be reused in the same manner. 【0035】(実施例3)実施例1でアンテナ部を形成する際、PETフィルム上に銅板をエッチングしてアンテン部を形成した以外は、実施例1と同様にして図1に示す物品(プラスチックコンテナ)20に直に固定してアンテナ部21を配設するとともに、ICチップ実装体(ICカード)22を作り、図2および図3に示すように使用時にICチップ実装体(ICカード)22を所定の箇所に挿入して装着したところ、非接触型データ送受信体(RF−IDメディア)23として機能することが確認された。 [0035] (Example 3) when forming the antenna portion in Example 1, except for forming a saddle portion by etching a copper plate on a PET film, the article shown in Figure 1 in the same manner as in Example 1 (Plastic with arranging the antenna portion 21 in direct fixed to the container) 20, IC chip packaged (make IC card) 22, IC chip packaged (IC card in use, as shown in FIGS. 2 and 3) 22 the was mounted is inserted into a predetermined position, the non-contact type data reception body to function as an (RF-ID media) 23 was confirmed. 確認後ICチップ実装体(ICカード)2 After confirming the IC chip mounted body (IC card) 2
2を非接触型データ送受信体(RF−IDメディア)2 2 contactless data transmission and reception body (RF-ID media) 2
3から容易に脱着でき、同様にして再使用することができた。 3 can be easily detached from, could be reused in the same manner. 【0036】 【発明の効果】本発明の請求項1記載のICチップ実装体あるいはアンテナ部を備えた物品は、少なくとも接続用導電部を備えた導電パターンを基材に設け、前記接続用導電部にICチップを実装してなるICチップ実装体を所定の箇所に直に固定して配設した物品、あるいはアンテナ導電部とこのアンテナ導電部の端部に位置する接続用導電部とからなる導電パターンからなるアンテナ部を所定の箇所に直に固定して配設した物品であって、前記ICチップ実装体あるいは前記アンテナ部が、前記I The article with an IC chip packaged or antenna unit according to the first aspect of the present invention according to the present invention is provided with a conductive pattern having at least the conductive parts for connection to the substrate, the conductive parts for connection conductive consisting in an article the IC chip mounting body formed by mounting the IC chip is disposed in direct fixed to a predetermined position, or the antenna conductor portion and the conductive parts for connection located at the end of the antenna conductive portion an antenna portion comprising a pattern an article is disposed in direct fixed to a predetermined position, the IC chip packaged or said antenna unit, the I
Cチップ実装体と組み合わすことによりRF−IDメデイアを形成するアンテナ部あるいは前記アンテナ部と組み合わすことによりRF−IDメデイアを形成するIC IC to form a RF-ID media by combining an antenna unit or the antenna section to form the RF-ID media by combining a C chip mounting body
チップ実装体を着脱可能に形成されているので、構成が簡単で安価な上、例えば物品に直に固定して配設されたアンテナ部の接続用導電部に、物品に配設されていない方のICチップ実装体の接続用導電部をそれぞれの接続用導電部が相対するように重ね合わせて、前記ICチップ実装体とアンテナ部とを導通接合してRF−IDメディアを形成して使用に供し、使用後は前記ICチップ実装体を脱着するようにすれば、RF−IDメディアを物品から一体的にはぎ取り、他の物品にRF−IDメディアを貼着するなどの不正行為ができなくなり、またIC Because it is detachable form the chip mounting body, on the configuration and inexpensive simple, for example directly fixed to the conductive parts for connection of the antennas portion disposed on the article, which is not disposed in the article the IC chip packaged in the conductive portion of the connection by overlapping so that each conductive parts for connection is relatively, in use to form a RF-ID media conducting bonding the IC chip packaged with the antenna portion subjected, after use if to desorb the IC chip packaged, stripping the integrally RF-ID media from the article, can not abuse such as pasting a RF-ID media to other articles, The IC
チップ実装体もアンテナ部も再使用可能であるが、IC Chip mounting body is also the antenna unit is also reusable, IC
チップ実装体の設計変更を行っても、設計変更したIC Even if the design change of the chip mounting body, IC it has changed design
チップ実装体を同様にして使用できるようにすればアンテナ部の方も再使用可能であるという顕著な効果を奏する。 A marked effect that if for use in a similar manner the chip mounting body also towards the antenna portion is reusable.

【図面の簡単な説明】 【図1】物品の所定の箇所に直に固定して配設されたアンテナ部を模式的に説明する説明図である。 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view schematically explaining the antenna portion disposed directly fixed to the predetermined portion of the article. 【図2】図1に示したアンテナ部にICチップ実装体を装着する様子を模式的に説明する説明図である。 Figure 2 is an explanatory diagram of schematically illustrating how to mount the IC chip packaged in the antenna unit shown in FIG. 【図3】図1に示したアンテナ部の所定の箇所にICチップ実装体を装着した状態を模式的に説明する説明図である。 [3] a state of mounting the IC chip packaged on a predetermined position of the antenna unit shown in FIG. 1 is an explanatory view illustrating schematically. 【図4】従来のICラベルのICチップ実装体の形成過程を示す説明図である。 4 is an explanatory view showing the formation process of the IC chip packaged in the conventional IC labels. 【図5】従来のアンテナ部の形成過程を示す説明図である。 5 is an explanatory diagram showing a formation process of a conventional antenna unit. 【図6】従来のICラベルを示す説明図である。 6 is an explanatory diagram showing a conventional IC labels. 【符号の説明】 1 基材2 ICチップ実装用導電部3 接続用導電部4 導電パターン5 ICチップ6 導電性接着剤7 基材8 アンテナ導電部9 接続用導電部10 導電パターン11 絶縁部12 絶縁性接着剤20 物品21 アンテナ部22 ICチップ実装体23 RF−IDメデイアA1 ICチップ実装体B1 アンテナC1 RF−IDメデイア(ICラベル) [Description of Reference Numerals] 1 Substrate 2 IC chip mounting conductive portion 3 connecting conductive portions 4 conducting pattern 5 IC chip 6 electrically conductive adhesive 7 substrate 8 antenna conductor portion 9 connecting conductive portions 10 conductive pattern 11 insulating section 12 insulating adhesive 20 article 21 antenna portion 22 IC chip packaged 23 RF-ID media A1 IC chip packaged B1 antennas C1 RF-ID media (IC label)

Claims (1)

  1. 【特許請求の範囲】 【請求項1】 少なくとも接続用導電部を備えた導電パターンを基材に設け、前記接続用導電部にICチップを実装してなるICチップ実装体を所定の箇所に直に固定して配設した物品、あるいはアンテナ導電部とこのアンテナ導電部の端部に位置する接続用導電部とからなる導電パターンからなるアンテナ部を所定の箇所に直に固定して配設した物品であって、 前記ICチップ実装体あるいは前記アンテナ部が、前記ICチップ実装体と組み合わすことによりRF−IDメデイアを形成するアンテナ部あるいは前記アンテナ部と組み合わすことによりRF−IDメデイアを形成するI Claims We claim: 1. A provided a conductive pattern having at least the conductive parts for connection to a substrate, directly mounting an IC chip body formed by mounting the IC chip to the conductive parts for connection in a predetermined position fixed and arranged with articles, or the antenna portion made of a conductive pattern consisting of the antenna conductor portion and the conductive parts for connection located at the end of the antenna conductor portion and directly fixed to a predetermined portion is disposed on the an article, form the RF-ID media by the IC chip packaged or said antenna unit, combining the antenna unit or the antenna section to form the RF-ID media and by combining said IC chip packaged I to
    Cチップ実装体を着脱可能に形成されていることを特徴とするICチップ実装体あるいはアンテナ部を備えた物品。 Article with an IC chip packaged or antenna unit, characterized in that C is detachably formed chip mounting body.
JP2001260005A 2001-08-29 2001-08-29 Article provided with ic chip mounting body or antenna part Pending JP2003067711A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001260005A JP2003067711A (en) 2001-08-29 2001-08-29 Article provided with ic chip mounting body or antenna part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001260005A JP2003067711A (en) 2001-08-29 2001-08-29 Article provided with ic chip mounting body or antenna part

Publications (1)

Publication Number Publication Date
JP2003067711A true JP2003067711A (en) 2003-03-07

Family

ID=19087273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001260005A Pending JP2003067711A (en) 2001-08-29 2001-08-29 Article provided with ic chip mounting body or antenna part

Country Status (1)

Country Link
JP (1) JP2003067711A (en)

Cited By (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005244852A (en) * 2004-02-27 2005-09-08 Kyocera Corp Electronic appliance
WO2008090943A1 (en) * 2007-01-26 2008-07-31 Murata Manufacturing Co., Ltd. Container with electromagnetically coupling module
US7764928B2 (en) 2006-01-19 2010-07-27 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
US7786949B2 (en) 2006-04-14 2010-08-31 Murata Manufacturing Co., Ltd. Antenna
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7871008B2 (en) 2008-06-25 2011-01-18 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7932730B2 (en) 2006-06-12 2011-04-26 Murata Manufacturing Co., Ltd. System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
US7931206B2 (en) 2007-05-10 2011-04-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US7990337B2 (en) 2007-12-20 2011-08-02 Murata Manufacturing Co., Ltd. Radio frequency IC device
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8009101B2 (en) 2007-04-06 2011-08-30 Murata Manufacturing Co., Ltd. Wireless IC device
US8070070B2 (en) 2007-12-26 2011-12-06 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8081541B2 (en) 2006-06-30 2011-12-20 Murata Manufacturing Co., Ltd. Optical disc
US8081119B2 (en) 2006-04-26 2011-12-20 Murata Manufacturing Co., Ltd. Product including power supply circuit board
US8081121B2 (en) 2006-10-27 2011-12-20 Murata Manufacturing Co., Ltd. Article having electromagnetic coupling module attached thereto
US8081125B2 (en) 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8193939B2 (en) 2007-07-09 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8228075B2 (en) 2006-08-24 2012-07-24 Murata Manufacturing Co., Ltd. Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
US8228252B2 (en) 2006-05-26 2012-07-24 Murata Manufacturing Co., Ltd. Data coupler
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8264357B2 (en) 2007-06-27 2012-09-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8384547B2 (en) 2006-04-10 2013-02-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8544754B2 (en) 2006-06-01 2013-10-01 Murata Manufacturing Co., Ltd. Wireless IC device and wireless IC device composite component
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05298502A (en) * 1992-04-20 1993-11-12 Mitsubishi Electric Corp Noncontact type ic card
JP2001229357A (en) * 2000-02-18 2001-08-24 Dainippon Printing Co Ltd Non-contact ic form

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05298502A (en) * 1992-04-20 1993-11-12 Mitsubishi Electric Corp Noncontact type ic card
JP2001229357A (en) * 2000-02-18 2001-08-24 Dainippon Printing Co Ltd Non-contact ic form

Cited By (129)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005244852A (en) * 2004-02-27 2005-09-08 Kyocera Corp Electronic appliance
US8725071B2 (en) 2006-01-19 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8078106B2 (en) 2006-01-19 2011-12-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US7764928B2 (en) 2006-01-19 2010-07-27 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8326223B2 (en) 2006-01-19 2012-12-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8384547B2 (en) 2006-04-10 2013-02-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7786949B2 (en) 2006-04-14 2010-08-31 Murata Manufacturing Co., Ltd. Antenna
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8081119B2 (en) 2006-04-26 2011-12-20 Murata Manufacturing Co., Ltd. Product including power supply circuit board
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8228252B2 (en) 2006-05-26 2012-07-24 Murata Manufacturing Co., Ltd. Data coupler
US8544754B2 (en) 2006-06-01 2013-10-01 Murata Manufacturing Co., Ltd. Wireless IC device and wireless IC device composite component
US7932730B2 (en) 2006-06-12 2011-04-26 Murata Manufacturing Co., Ltd. System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8081541B2 (en) 2006-06-30 2011-12-20 Murata Manufacturing Co., Ltd. Optical disc
US8081125B2 (en) 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
US8228075B2 (en) 2006-08-24 2012-07-24 Murata Manufacturing Co., Ltd. Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8081121B2 (en) 2006-10-27 2011-12-20 Murata Manufacturing Co., Ltd. Article having electromagnetic coupling module attached thereto
WO2008090943A1 (en) * 2007-01-26 2008-07-31 Murata Manufacturing Co., Ltd. Container with electromagnetically coupling module
JP4835696B2 (en) * 2007-01-26 2011-12-14 株式会社村田製作所 Container with an electromagnetic coupling module
US8031124B2 (en) 2007-01-26 2011-10-04 Murata Manufacturing Co., Ltd. Container with electromagnetic coupling module
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8009101B2 (en) 2007-04-06 2011-08-30 Murata Manufacturing Co., Ltd. Wireless IC device
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
US7931206B2 (en) 2007-05-10 2011-04-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8264357B2 (en) 2007-06-27 2012-09-11 Murata Manufacturing Co., Ltd. Wireless IC device
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8662403B2 (en) 2007-07-04 2014-03-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8193939B2 (en) 2007-07-09 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8191791B2 (en) 2007-07-17 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
US9830552B2 (en) 2007-07-18 2017-11-28 Murata Manufacturing Co., Ltd. Radio IC device
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US7990337B2 (en) 2007-12-20 2011-08-02 Murata Manufacturing Co., Ltd. Radio frequency IC device
US8610636B2 (en) 2007-12-20 2013-12-17 Murata Manufacturing Co., Ltd. Radio frequency IC device
US8070070B2 (en) 2007-12-26 2011-12-06 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8915448B2 (en) 2007-12-26 2014-12-23 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8360330B2 (en) 2007-12-26 2013-01-29 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US8973841B2 (en) 2008-05-21 2015-03-10 Murata Manufacturing Co., Ltd. Wireless IC device
US9022295B2 (en) 2008-05-21 2015-05-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8960557B2 (en) 2008-05-21 2015-02-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8047445B2 (en) 2008-05-22 2011-11-01 Murata Manufacturing Co., Ltd. Wireless IC device and method of manufacturing the same
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
US7871008B2 (en) 2008-06-25 2011-01-18 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US8011589B2 (en) 2008-06-25 2011-09-06 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8876010B2 (en) 2009-04-14 2014-11-04 Murata Manufacturing Co., Ltd Wireless IC device component and wireless IC device
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9564678B2 (en) 2009-04-21 2017-02-07 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9203157B2 (en) 2009-04-21 2015-12-01 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8757502B2 (en) 2011-02-28 2014-06-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag

Similar Documents

Publication Publication Date Title
CA1286821C (en) Heat activatable adhesive for wire scribed circuits
EP0851726B1 (en) Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same
EP0819747B1 (en) Adhesive, adhesive film and adhesive-backed metal foil
JP4187278B2 (en) Contactless ic card and manufacturing method thereof
CN1261990C (en) Bound board with electric conductor, method for mfg. semiconductor device and semiconductor device
US5317438A (en) Liquid crystal display device and method of producing the same having an improved connection between a flexible film substrate and a drive circuit substrate
US5645932A (en) Circuit-like metallic foil sheet and the like and process for producing them
US20030034645A1 (en) Peelable label
US5987739A (en) Method of making a polymer based circuit
KR100541779B1 (en) Method of producing an epoxy resin composition and a multilayered printed circuit board using the same
US20020025431A1 (en) Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate, and semiconductor device
ES2453486T3 (en) Circuit chip connector and method of connecting a circuit chip
EP1405278B1 (en) Identification device comprising a transponder and a discontinuously metallised retroreflective or holographic image field and method of making such a device
KR940005806B1 (en) Cover tape for sealing the chip-holding parts of a carrier tape
US20030140485A1 (en) Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
JP2872736B2 (en) A method of manufacturing a liquid crystal display element
US7034688B2 (en) Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
EP0122619A2 (en) Composite product having patterned metal layer and process
US20080191174A1 (en) Use Of Heat-Activated Adhesive For Manufacture And A Device So Manufactured
US7066393B2 (en) Smart label and a smart label web
EP0999532A1 (en) Resonant tag labels and method of making same
KR920006894B1 (en) Dicing film for support of semiconductor wafer and forming method of its chip
US6809045B1 (en) Screen ink printed film carrier and electrically modulated device using same
US20110051384A1 (en) Printed circuit board element having at least one component embedded therein and method for embedding at least one component in a printed circuit board element
WO1998006007A1 (en) A method of forming a monolayer of particles, and products formed thereby

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080806

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110426

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110823