JP2007287128A - Non-contact ic medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC medium 23 usable for a plurality of purposes. <P>SOLUTION: The non-contact IC medium 23 comprising a loop antenna 22 for non-contact communication, and IC chips 21 for control operation, is mounted with a plurality of IC chips 21. IC chips different in operation frequency are adopted as the plurality of IC chips 21a, 21b. As one embodiment, the loop antenna 22 is composed of a shared loop antenna 22 shared by the plurality of IC chips 21. As another embodiment, individual loop antennas 22a, 22b are connected to the plurality of IC chips 21a, 21b, respectively. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a non-contact IC medium that stores information and communicates in a non-contact manner, for example.

  Generally, a cash card, a credit card, a debit card, or the like is used as an information storage medium that identifies an individual and handles money electronically. Such a card is provided with a magnetic stripe as an information storage medium for storing information such as an ID for identifying an individual and a charged amount, and a transaction is performed based on information stored in the magnetic stripe.

  In recent years, non-contact IC media capable of non-contact communication have been provided as such information storage media. The non-contact IC medium includes a control unit and a storage unit in an IC chip, and an antenna is connected to the IC chip. Information can be transmitted and received by non-contact communication using the antenna.

  This non-contact IC medium uses a communication frequency of 0.8 MHz when used as an opening / closing key for opening and closing a door lock, and a communication frequency of 125 kHz is used for an ETC. Various types are used such as a communication frequency of 13.56 MHz is used for passing.

On the other hand, an RF-ID antenna including a plurality of antennas having different resonance frequencies has been proposed so that communication can be performed with respect to a plurality of frequencies (see Patent Document 1).
According to this RF-ID antenna, it can resonate at an arbitrary frequency among a plurality of frequencies at which information can be read and written by the IC chip.

  However, since there is only one IC chip, the amount of information that can be stored does not change, and it is not suitable for a plurality of uses described above.

JP 2005-252853 A

  In view of the above-described problems, an object of the present invention is to provide a non-contact IC medium that can be used for a plurality of uses.

  The present invention is a non-contact IC medium including an antenna that performs non-contact communication and an IC chip that performs a control operation, and is a non-contact IC medium on which a plurality of the IC chips are mounted.

  According to the present invention, it is possible to provide a non-contact IC medium that can be used for a plurality of purposes.

  An embodiment of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing a non-contact IC card 1, FIG. 2 is an exploded perspective view thereof, FIG. 3 is a block diagram, and FIG. 4 is an enlarged sectional view.

  As shown in these figures, the non-contact IC card 1 is equipped with a non-contact IC tag 23 composed of two IC chips 21 (21a, 21b) and one loop antenna 22 having different operating frequencies. It is a non-contact type IC card. The non-contact IC tag 23 is generally called an RF-ID (Radio Frequency Identification) tag, and has a function of performing non-contact communication using radio waves or electromagnetic waves and a function of storing information.

  The non-contact IC card 1 is used for a plurality of uses such as a cash card, a credit card, a commuter pass, a prepaid card, an employee card, and a student card, and has an outer shape of a rectangular plate and a plurality of members laminated. Configured.

  The non-contact IC card 1 is provided with two IC chips 21a and 21b as information storage units, and a switching unit 5 for switching which of the IC chips 21a and 21b the loop antenna 22 is connected to is provided. ing.

  Specifically, as shown in FIG. 2, the non-contact IC card 1 mainly includes a card-sized first laminate member 2, a card-sized spacer member 11, and a card-sized second laminate member 15 in this order from the top. It is constructed by polymerizing and bonding.

  The second laminate member 15 corresponding to the bottom surface is provided with a loop antenna 22 on the inner surface to be bonded. The loop antenna 22 is a single loop (may be a double or triple loop such as a double or triple loop) configured by printed wiring or the like, and contacts 24 and 24 are provided at both ends. The space between the contact points 24 and 24 is configured to be sufficiently smaller than the width in the short direction of the second laminate member 15. In this embodiment, the contact points 24 and 24 are configured to have an interval similar to the size of the IC chips 21 a and 21 b. Has been. The contacts 24, 24 are bonded and fixed to the second laminate member 15 and protrude to the inner side surface (upward in FIG. 2). The back surface which is the outer surface of the second laminate member 15 is a decorative surface on which printing or the like has been performed.

  The spacer member 11 has the same size as the second laminate member 15 and is formed in a planar shape with a constant thickness. A rectangular slide hole 12 is provided at the center of the spacer member 11 in the short direction so as to surround the position of the contacts 24, 24. The left and right longitudinal sides of the slide hole 12 constitute parallel straight slide guides 13 and 13.

  The switching unit 5 is accommodated in the slide hole 12 of the spacer member 11. The switching unit 5 includes a plate-like member 6, an operation unit 7, IC chips 21a and 21b, and contacts 20a and 20b.

  The plate-like member 6 is a rectangle having a horizontal width that is the same as or slightly smaller than the horizontal width of the slide hole 12 and is shorter than the vertical width of the slide hole 12, and is formed in a planar shape having a constant thickness. Both side edges 8, 8 of the plate-like member 6 are formed in parallel and in a straight line.

  The operation unit 7 is formed so as to protrude to the surface side (first laminate member 2 side) at the center in the width direction at one end in the longitudinal direction of the plate-like member 6, and the surface is anti-slip processed.

  The IC chips 21a and 21b are bonded and fixed side by side in the front-rear direction on the back side (second laminate member 15 side) of the plate-like member 6, and the terminals of the IC chips 21a and 21b are respectively connected to the contacts 20a and 20b. Electrically connected. The contacts 20a and 20b are bonded and fixed to the back side of the plate-like member 6 and protrude to the back side. The contact 20a and the contact 20b are arranged in a straight line with a predetermined interval in the front-rear direction, and are configured such that no electric circuit exists between the contact 20a and the contact 20b.

  The switching portion 5 configured as described above can stably slide and move the side edges 8 and 8 along the slide guides 13 and 13 in the slide hole 12 of the spacer member 11.

  The first laminate member 2 has the same size as the second laminate member 15 and is formed in a planar shape with a constant thickness. A rectangular operation hole 3 is provided at the center in the short direction of the first laminate member 2 so as to surround the position of the operation portion 7. The left and right longitudinal sides of the operation hole 3 constitute parallel straight operation guides 4 and 4. In the operation hole 3, the operation unit 7 of the switching unit 5 is positioned so as to be movable back and forth. Both sides of the operation unit 7 are guided by operation guides 4 and 4, and are configured to slide stably back and forth. The surface of the first laminate member 2 is a decorative surface on which printing or the like has been performed.

  The first laminate member 2, the plate-like member 6, the spacer member 11, and the second laminate member 15 may be formed of a material that allows transmission of communication waves (such as electromagnetic waves and radio waves) such as paper and resin. It can be formed or formed from another material.

  The plate-like member 6 is preferably made of a material having moderate rigidity, and at least all of the first laminate member 2, the spacer member 11, and the second laminate member 15 are superposed and bonded and fixed. It is preferable to use a material having moderate rigidity.

  Moreover, it is preferable that the first laminate member 2, the spacer member 11, and the second laminate member 15 are firmly bonded and fixed at least around the slide hole 12. As a result, the adhesive around the slide hole 12 is peeled off and the switching unit 5 moves in an unintended direction, or the first laminate member 2 and the second laminate member 15 are lifted to contact the contacts 20a, 20b and the contact 24. It is possible to prevent the contact with the head from getting worse.

FIG. 3 shows a block diagram of the non-contact IC card 1.
The non-contact IC card 1 is composed of IC chips 21a and 21b and a loop antenna 22, and the contact 24 of the loop antenna 22 is connected to the contact 20a of the IC chip 21a or the contact 20b of the IC chip 21b. Thus, the IC chip to be driven is switched.

  A capacitor 41 is connected to the IC chip 21 a in parallel with the loop antenna 22, and a command 43 and a transmission clock 44 are input to the control microprocessor 46 from an analog front end 42 subsequent to the capacitor 41.

  Upon receiving the command 43 and the transmission clock 44, the control microprocessor 46 reads / writes data from / to a memory 48 composed of ROM, RAM, EEPROM, etc., and also executes encryption processing 47 as necessary. . The control microprocessor 46 transmits data to the modulator 45.

  The modulator 45 modulates the data received from the control microprocessor 46 into an analog signal and sends it to the analog front end 42. In this way, the IC chip 21a may have application functions such as a cash card, a credit card, a commuter pass, a prepaid card, an employee ID card, and a student ID card as a first function that operates using the first frequency. it can.

  Since the IC chip 21b has the same configuration as the IC chip 21a except that the operating frequency and application functions are different, detailed description thereof is omitted. The IC chip 21b has a second function that operates using a second frequency different from that of the IC chip 21a. For example, the IC chip 21b includes an IC function among application functions such as a cash card, a credit card, a commuter pass, a prepaid card, an employee card, and a student card. An application function different from that of the chip 21a can be provided.

  With the above configuration, the user simply operates the operation unit 7 and slides it to perform the first function execution state in which communication is performed using the IC chip 21a as illustrated in FIG. ), The second function execution state in which communication is performed using the IC chip 21b can be easily switched.

  That is, in the first function execution state, the operation unit 7 is positioned on the near side of the operation hole 3 as shown in FIG. 1A, and the contact 20a and the contact 24 are connected as shown in FIG. 4A. The IC chip 21a and the loop antenna 22 are electrically connected. Therefore, the IC chip 21a can be driven by the induced electromotive force generated by the magnetic field received by the loop antenna 22 from an appropriate interrogator, and the IC chip 21a can communicate with the interrogator through the loop antenna 22. At this time, since the contact 20a and the contact 24 protrude from each other, electrical connection can be reliably performed.

  In the second function execution state, as shown in FIG. 1 (B), the operation unit 7 is positioned on the back side of the operation hole 3, and as shown in FIG. 4 (B), the contact 20b and the contact 24 are in contact with each other. The IC chip 21b and the loop antenna 22 are electrically connected. Accordingly, the IC chip 21b can be driven by the induced electromotive force generated by the magnetic field received by the loop antenna 22 from an appropriate interrogator, and the IC chip 21b can communicate with the interrogator through the loop antenna 22 in a non-contact manner. At this time, since the contact point 20b and the contact point 24 protrude from each other, electrical connection can be reliably performed.

  In this way, the user reliably switches between the first function execution state for executing the first function and the second function execution state for executing the second function by a simple operation of moving the operation unit 7 back and forth. be able to. Thereby, one non-contact IC card 1 can be used for two uses of the first function and the second function. Therefore, for example, when the door opening / closing function is set as the first function, the automatic ticket gate passing function is set as the second function, and the first function is normally enabled and the automatic ticket gate is passed. It is possible to switch to the second function.

  Further, the non-contact IC card 1 is configured to be formed into a thin card shape and manufactured at low cost because the switching unit 5 is configured to be slidable by superposing and arranging a plurality of planar members. can do.

  The contact 20 (20a, 20b) on the IC chip 21 (21a, 21b) side and the contact 24 on the loop antenna 22 side are both protruded, but only one of them or both are not protruded. It is good also as a structure. Even in this case, since the contacts 20 and 24 are electrically connected as long as they are in contact with each other, switching between the first function and the second function can be performed.

  In addition, the number of IC chips 21 is two. In this case, one non-contact IC card 1 can have various types of functions.

  In addition, the contact 24 is configured to switch between the contact 20a and 20b, but in addition to this, the switching unit 5 can be switched to a non-connected state in which neither of the contacts 20a and 20b is connected. May be. As a result, neither the first function nor the second function can be used and the communication function can be disabled, and unauthorized access to the first function or the second function can be avoided.

FIG. 5 is an exploded perspective view of the non-contact IC tag 9 according to the second embodiment.
The non-contact IC tag 9 is configured to be switched by a push-down method, unlike the configuration of switching which of the contact 20a and the contact 20b is connected to the contact 24 by the sliding method of the first embodiment. The contact IC card 1 has a tag shape that is thicker in the upper and lower thickness and smaller in front and rear, left and right.

  In the non-contact IC tag 9, IC chips 21 a and 21 b are respectively arranged on the upper and lower surfaces of the plate-like member 6, and the contacts 20 a and 20 b are arranged in a straight line vertically on one end surface of the switching unit 5. A leaf spring 19 is provided between the bottom of the switching unit 5 and the second laminate member 15. The leaf spring 19 biases the switching unit 5 upward.

  Further, the upper and lower surfaces of the switching unit 5 are covered with an exterior member 18, and a filler 17 is filled between the exterior member 18 and the plate-like member 6. Thus, the IC chips 21a and 21b are configured not to be displaced.

  On the upper surfaces of the first laminate member 2 and the switching unit 5, a surface sheet 16 that covers the entire surface is provided. The top sheet 16 is made of a material that is flexibly deformed and restored.

  Since other configurations are the same as those of the non-contact IC card 1 of the first embodiment, detailed description thereof is omitted.

  With the above configuration, in the normal state, as shown in FIG. 5A, the contact 20b and the contact 24 are brought into a second function execution state. In addition, when the switching unit 5 is pressed, the contact 20a and the contact 24 are connected to enter the first function execution state. In this way, switching between the first function and the second function can be easily performed.

  Note that the first function is executed only while the switching unit 5 is pressed. However, if the switch is pressed once, the pressed function is maintained even if the hand is released, and the first function execution state is maintained. It may be configured to return to the second function execution state.

FIG. 6 is an exploded perspective view of the non-contact IC card 1 according to the third embodiment.
The non-contact IC card 1 is configured by superposing and bonding a top sheet 31, a first non-contact IC label 32, an insulating sheet 33, a second non-contact IC label 34, and a back sheet 35 in this order from the top. .

  The surface sheet 31 corresponding to the upper surface is formed in a card size with a material such as resin having appropriate rigidity, and the surface is constituted by a decorative surface on which printing or the like is applied.

  The first non-contact IC label 32 is provided with a loop antenna 22a printed on a film and an IC chip 21a, and the loop antenna 22a and the IC chip 21a are connected. The IC chip 21a has a first function for communicating in a frequency band of 0.8 GHz, for example.

  The insulating sheet 33 is a sheet that is formed on a large card by an insulating material such as carbon.

  The second non-contact IC label 34 is provided with a loop antenna 22b printed on a film and an IC chip 21b. The IC chip 21b has a second function of communicating in a 13.56 MHz frequency band, for example.

  The back sheet 35 corresponding to the bottom surface is formed in a card size with a material such as resin having appropriate rigidity, and includes a magnetic stripe 36 on the back surface which is the outer surface. The portion other than the magnetic stripe 36 on the back surface is a decorative surface on which printing or the like has been performed.

  With the above configuration, one non-contact IC card 1 can have a plurality of functions. That is, by providing a plurality of non-contact IC labels (32, 34), each of the first function and the second function can be executed at any time. Since the first non-contact IC label 32 and the second non-contact IC label 34 are separated by the insulating sheet 33, the mutual loop antennas 22a and 22b can be prevented from interfering with each other.

  In the above embodiments, the non-contact IC card 1 has been described. However, the present invention is not limited to the card type, and is provided for a non-contact IC medium provided in a cellular phone, a paper-type or seal-type non-contact IC tag. You may comprise by the non-contact IC medium made. Even in this case, the same effects can be obtained.

FIG. 7 shows an exploded perspective view of the non-contact IC card 1 of the fourth embodiment, and FIG. 8 shows a partially enlarged sectional view of the non-contact IC card 1 of the fourth embodiment.
The non-contact IC card 1 is configured by superposing and bonding a top sheet 31, a first non-contact IC label 32, a separator 50, a second non-contact IC label 34, and a back sheet 35 in this order from the top.

  The top sheet 31 corresponding to the upper surface is formed in a card size (card size) by a material such as resin having an appropriate rigidity, and the surface is constituted by a decorative surface on which printing or the like is applied.

  The first non-contact IC label 32 is provided by connecting a loop antenna 22a printed on a film and an IC chip 21a to each other. The IC chip 21a is configured to receive and communicate with an electromagnetic wave stronger than the IC chip 21b in the same frequency band as the IC chip 21b. The IC chip 21a is configured to be able to perform non-contact communication with a reader / writer at a position separated from the reader / writer by a frequency band of 13.56 MHz, for example, and has a first function that can be used as, for example, a railroad ticket. Since the configuration of the IC chip 21a is the same as the IC chip 21a of the first embodiment described with reference to FIG. 3, detailed description thereof is omitted.

The separator 50 is a sheet that is formed on a large card by an insulating material such as carbon.
The separator 50 includes a card-sized electromagnetic wave blocking layer 52 provided as an intermediate layer, and a card-sized first electromagnetic wave absorbing layer 51 arranged on the first non-contact IC label 32 side with respect to the electromagnetic wave blocking layer 52. The second electromagnetic wave absorption layer 53 is a card-sized second electromagnetic wave absorption layer 53 that is superposed on the second non-contact IC label 34 side of the electromagnetic wave shielding layer 52.

Here, the electromagnetic wave shielding layer 52 is made of an electromagnetic wave shielding material such as aluminum or copper.
The first electromagnetic wave absorbing layer 51 is made of a material that disperses and absorbs electromagnetic waves, such as a soft magnetic material. In this embodiment, permalloy is used in order to enhance the electromagnetic wave absorption capability of the second electromagnetic wave absorption layer 53.

  The second electromagnetic wave absorbing layer 53 is made of a material that disperses and absorbs electromagnetic waves, such as a soft magnetic material. In this embodiment, in order to weaken the electromagnetic wave absorption capability of the first electromagnetic wave absorption layer 51, it is formed by filling a metal magnetic flake into a resin. The thickness is preferably about 0.5 mm to 0.25 mm. In this embodiment, the thickness is about 0.25 mm. The second electromagnetic wave absorbing layer 53 is formed so that the recommended frequency band is about 100 MHz to 3 GHz and the initial permeability (at 10 MHz) is about 21 to 32. For the material of the second electromagnetic wave absorption layer 53, it is preferable to use ferrite or the like in order to weaken the electromagnetic wave absorption capability of the first electromagnetic wave absorption layer 51.

  The second non-contact IC label 34 is provided by connecting a loop antenna 22b printed on a film and an IC chip 21b. The IC chip 21b is configured to receive and communicate with an electromagnetic wave weaker than the IC chip 21a in the same frequency band as the IC chip 21a. The IC chip 21b is configured to be able to perform non-contact communication from a position (distance shorter than the case of the IC chip 21a) separated from the reader / writer by about 10 cm in a frequency band of 13.56 MHz, for example, and is used for caching, for example. The second function is provided. Since the configuration of the IC chip 21b is the same as the IC chip 21b of the first embodiment described with reference to FIG. 3, detailed description thereof is omitted.

  The back sheet 35 corresponding to the bottom surface is formed in a large card by a material such as resin having appropriate rigidity, and includes a magnetic stripe 36 on the back surface which is the outer surface. The portion other than the magnetic stripe 36 on the back surface is a decorative surface on which printing or the like has been performed.

  With the above configuration, one non-contact IC card 1 can have a plurality of functions. That is, by providing a plurality of non-contact IC labels (32, 34), each of the first function and the second function can be executed at any time. Since the first non-contact IC label 32 and the second non-contact IC label 34 are separated by the separator 50, the mutual loop antennas 22a and 22b can be prevented from interfering with each other.

  Further, since the electromagnetic wave absorption performance of the first electromagnetic wave absorption layer 51 and the second electromagnetic wave absorption layer 53 provided in the separator 50 is different, each of the first non-contact IC label 32 and the second non-contact IC label 34 is provided. Communication can be executed reliably.

  More specifically, for example, if the second electromagnetic wave absorption layer 53 is configured to have the same electromagnetic wave absorption performance as the first electromagnetic wave absorption layer 51, the first non-contact IC label 32 can communicate well with a strong magnetic field, but the second Even when trying to communicate with the non-contact IC label 34 with a weak magnetic field, the electromagnetic wave absorbing performance of the second electromagnetic wave absorbing layer 53 may be too strong to communicate. Conversely, if the first electromagnetic wave absorbing layer 51 is configured to have the same electromagnetic wave absorbing performance as the second electromagnetic wave absorbing layer 53, the second non-contact IC label 34 can communicate well with a weak magnetic field, When trying to communicate with the contact IC label 32 with a strong magnetic field, even the second non-contact IC label 34 may react and electromagnetic waves may be mixed. Such a problem can be solved by making the electromagnetic wave absorbing performances of the first electromagnetic wave absorbing layer 51 and the second electromagnetic wave absorbing layer 53 different.

In addition, since the material of the first electromagnetic wave absorption layer 51 on the first non-contact IC label 32 side that uses electromagnetic waves strong for communication is made higher in electromagnetic wave absorption performance than the material of the second electromagnetic wave absorption layer 53, the entire structure is thin. can do.
That is, if the first electromagnetic wave absorbing layer 51 and the second electromagnetic wave absorbing layer 53 are formed using the same material, the first electromagnetic wave absorbing layer 51 is used to improve the electromagnetic wave absorbing performance of the first electromagnetic wave absorbing layer 51. 2 The electromagnetic wave absorbing layer 53 needs to be formed thicker, and the entire thickness of the non-contact IC card 1 is increased. However, the overall thickness can be reduced by using different materials as in the fourth embodiment.

  The material of the first electromagnetic wave absorbing layer 51 and the second electromagnetic wave absorbing layer 53 is not limited to permalloy or ferrite, but iron oxide, chromium, nickel, amorphous alloy, electromagnetic steel, silicon iron, Fe-AL alloy, Sendust alloy, You may comprise carbonyl iron or the mixed material of these several materials.

In correspondence between the configuration of the present invention and the above-described embodiment,
The non-contact IC medium of the present invention corresponds to the non-contact IC card 1,
Similarly,
The switching means corresponds to the switching unit 5 of the embodiment,
The contacts correspond to the contacts 20a and 20b,
The IC chip corresponds to the IC chips 21a and 21b,
The antenna corresponds to the loop antenna 22, 22a, 22b,
The shared antenna corresponds to the loop antenna 22,
Individual antennas are loop antennas 22a and 22b.
The present invention is not limited only to the configuration of the above-described embodiment, and many embodiments can be obtained.

1 is a perspective view of a non-contact IC card according to Embodiment 1. FIG. 1 is an exploded perspective view of a non-contact IC card according to Embodiment 1. FIG. 1 is a block diagram of a non-contact IC card according to Embodiment 1. FIG. FIG. 3 is an enlarged cross-sectional view of the non-contact IC card according to the first embodiment. FIG. 4 is an enlarged cross-sectional view of a non-contact IC card according to Embodiment 2. FIG. 6 is an exploded perspective view of a non-contact IC card according to Embodiment 3. FIG. 6 is an exploded perspective view of a non-contact IC card according to Embodiment 4. FIG. 6 is a partial enlarged cross-sectional view of a non-contact IC card according to a fourth embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 5 ... Switching part 20a, 20b ... Contact 21a, 21b ... IC chip 22, 22a, 22b ... Loop antenna 23 ... Non-contact type IC tag 50 ... Separator 51 ... 1st electromagnetic wave absorption layer 52 ... Electromagnetic wave shielding layer 53 ... 2nd electromagnetic wave Absorption layer

Claims (7)

A non-contact IC medium comprising an antenna that performs non-contact communication and an IC chip that performs a control operation,
A non-contact IC medium on which a plurality of the IC chips are mounted. A first non-contact IC sheet composed of a first IC chip and a first antenna;
A second non-contact IC sheet configured by a second IC chip and a second antenna and driven by receiving an electromagnetic wave stronger than the first non-contact IC sheet;
A separator sandwiched between the first non-contact IC sheet and the second non-contact IC sheet,
The separator,
An electromagnetic wave blocking layer for blocking electromagnetic waves,
A first electromagnetic wave absorbing layer that is polymerized and disposed closer to the first non-contact IC sheet than the electromagnetic wave blocking layer;
The second electromagnetic wave absorbing layer is arranged on the second non-contact IC sheet side than the electromagnetic wave blocking layer,
The non-contact IC medium which comprised the electromagnetic wave absorption capability of this 2nd electromagnetic wave absorption layer higher than the said 1st electromagnetic wave absorption layer. The non-contact IC medium according to claim 2, wherein a material of the second electromagnetic wave absorbing layer is made of a material having an electromagnetic wave absorbing ability higher than that of the first electromagnetic wave absorbing layer. The non-contact IC medium according to claim 2 or 3, wherein a relationship between an operating frequency of the first IC chip and an operating frequency of the second IC chip is the same frequency or an integral multiple of the frequency. The non-contact IC medium according to claim 1, wherein the antenna is a shared antenna shared by a plurality of the IC chips. Provided with a contact for connection to the plurality of IC chips,
6. The non-contact IC medium according to claim 5, further comprising switching means for switching contact points of the IC chip connected to the antenna. 7. The non-contact IC medium according to claim 5, wherein ones having different operating frequencies are used for the plurality of IC chips.

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