JP2000148948A - Non-contact ic label and its manufacture - Google Patents

Non-contact ic label and its manufacture

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Publication number
JP2000148948A
JP2000148948A JP10315105A JP31510598A JP2000148948A JP 2000148948 A JP2000148948 A JP 2000148948A JP 10315105 A JP10315105 A JP 10315105A JP 31510598 A JP31510598 A JP 31510598A JP 2000148948 A JP2000148948 A JP 2000148948A
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JP
Japan
Prior art keywords
ic
label
substrate
non
adhesive layer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10315105A
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Japanese (ja)
Inventor
Seiichi Miyai
清一 宮井
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Sony Corp
ソニー株式会社
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Application filed by Sony Corp, ソニー株式会社 filed Critical Sony Corp
Priority to JP10315105A priority Critical patent/JP2000148948A/en
Publication of JP2000148948A publication Critical patent/JP2000148948A/en
Application status is Pending legal-status Critical

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Abstract

PROBLEM TO BE SOLVED: To obtain a non-contact type IC label which does not generate malfunction in the display of recorded or reproduced contents and is excellent in environment-resistant characteristics and its manufacturing method. SOLUTION: This non-contact type IC label 1 is provided with an antenna substrate 3 having an IC 2 and a label 4 made of such as paper on and over base material 5 such as a PET film, has the antenna substrate 3 by mounting it in a recessed part 8 having a window 7 formed on a 1st principal plane 6 of the material 5 so as to insert the IC 2 in the window 7 from both sides having the IC 2 and has a protection member 10 such as a PET film over the 1st principal plane 6 and the opposite surface of the plane of the substrate 3 which has the IC 2 through a 1st adhesion layer 9. It also has the label 4 over the protection member 10 through a 2nd adhesion layer 11 and also has a 3rd adhesive layer 13 on a 2nd principal plane 12 of the material 5.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は非接触型ICラベルおよびその製造方法に関し、さらに詳しくは、耐環境特性に優れた非接触型ICラベルおよびその製造方法に関する。 The present invention relates to relates to a contactless IC label and a manufacturing method thereof, and more particularly to a non-contact type IC label, and a manufacturing method thereof excellent in environmental resistance.

【0002】 [0002]

【従来の技術】ビデオカセットなどの情報記録媒体において、ビデオカセット自体をビデオデッキに装填し、記録または再生を行うことなしに、その記録または再生内容を表示する方法として、ビデオカセットに貼りつけた非接触型ICラベルのICメモリに記録または再生内容をあらかじめ入力しておいて、ビデオカセットをビデオデッキの受信部に近づけてかざすことにより、その信号を送信することで表示する方法が開発されている。 In the information recording medium such BACKGROUND ART video cassette, loaded with video cassette itself VCR, without performing recording or reproducing, as a method for displaying the recording or reproducing contents, was attached to the video cassette keep in type recording or reproducing contents in advance in the IC memory of the non-contact type IC label, by holding up closer the video cassette receiving portion of the VCR, it is developed a method of displaying by transmitting the signal there. (特開昭62−157391号公報、特開平5−19813 (JP 62-157391 and JP Hei 5-19813
9号公報参照。 9 JP reference. )

【0003】従来の非接触型ICラベルの構成を、従来の非接触型ICラベルの一例を示す概略構成断面図である図2を参照して説明する。 [0003] The structure of a conventional non-contact type IC label is explained with reference to FIG. 2 is a schematic sectional view showing an example of a conventional non-contact type IC labels. 非接触型ICラベル14 Non-contact type IC label 14
は、例えば、ポリエチレンテレフタレートフィルムなどの基材5の第1の主面6上にIC2を有するアンテナ基板3を、第1の主面6上に、IC2を有する面側からI , For example, the antenna substrate 3 having a first major surface 6 on the IC2 of the base material 5, such as polyethylene terephthalate film, on the first main surface 6, I from the side having the IC2
C2が基材5の窓7に挿入されるように載置して有するとともに、第1の主面6上およびアンテナ基板3のIC C2 together have been placed so as to be inserted into the window 7 of the substrate 5, the first major surface 6 and on the antenna substrate 3 IC
を有する面と反対面上に、紙などのラベル4を第2の粘着層11を介して積層された構成となっている。 A surface having on the opposite side has a configuration in which the label 4, such as paper laminated via the second adhesive layer 11. アンテナ基板3には、IC2が実装された面に、図示を省略する渦巻き状のアンテナパターンが形成されており、その端子部がIC2に接続されている。 The antenna substrate 3, IC 2 on a surface that is implemented, are spiral-shaped antenna pattern not shown is formed, the terminal portions are connected to the IC 2. また、基材5の第2 Further, the second substrate 5
の主面12上には、第3の粘着層13が塗布されている。 On major surface 12 of the third adhesive layer 13 is applied. そして、この非接触型ICラベル14は、図示を省略するビデオカセットなどの情報記録媒体上に、第3の粘着層13により貼り付けられて使用される。 Then, the non-contact type IC label 14, onto the information recording medium, such as omitted video cassette shown, are used attached by the third adhesive layer 13.

【0004】しかしながら、このような構成の非接触型ICラベル14においては、高湿度の環境下において、 However, in the non-contact type IC label 14 having such a configuration, in an environment of high humidity,
吸湿の影響により、送信周波数のずれが発生し、記録または再生内容の表示に不具合を生じることが問題となっている。 Due to the influence of moisture absorption, shift of the transmission frequency is generated, causing a problem in view of the recording or reproducing content has become a problem.

【0005】 [0005]

【発明が解決しようとする課題】記録または再生内容の表示に不具合を生じさせず、耐環境特性に優れた非接触型ICラベルおよびその製造方法を提供することを課題とする。 Without causing a problem in view of the recording or reproducing contents [0005], and to provide a non-contact type IC label, and a manufacturing method thereof excellent in environmental resistance.

【0006】 [0006]

【課題を解決するための手段】本発明の非接触型ICラベルは、ICを有するアンテナ基板とラベルとを基材上に具備する非接触型ICラベルであって、アンテナ基板を、基材の第1の主面上に形成された窓を有する凹部に、ICを有する面側からICを窓に挿入するように載置して有し、第1の主面上およびアンテナ基板のICを有する面と反対面上に、第1の粘着層を介して保護部材を有し、保護部材上に第2の粘着層を介してラベルを有するとともに、基材の第2の主面上に第3の粘着層を有することを特徴とする。 Means for Solving the Problems] non-contact IC label of the present invention is a non-contact IC label comprising on a substrate an antenna substrate and a label having the IC, the antenna substrate, the substrate the recess having the formed window on the first major surface has an IC from the side having the IC is placed to be inserted into the window, with an IC of the first major surface and on the antenna substrate on the surface and the opposite surface, a protective member through the first adhesive layer, which has a label through a second adhesive layer on the protective member, the third on the second major surface of the substrate and having a pressure-sensitive adhesive layer.

【0007】本発明の非接触型ICラベルの製造方法は、ICが実装されたアンテナ基板とラベルとを基材上に実装した非接触型ICラベルの製造方法であって、基材の第1の主面上に窓を有する凹部を形成するとともに、アンテナ基板を、凹部に、ICが実装された面側からICが窓に挿入されるように埋設し、アンテナ基板が埋設された第1の主面上およびアンテナ基板のICが実装された面と反対面上に、第1の粘着層を用いて保護部材を積層し、保護部材上に第2の粘着層を用いてラベルを積層するとともに、基材の第2の主面上に第3の粘着層を形成することを特徴とする。 [0007] Production method of non-contact type IC label of the present invention is a method of manufacturing a non-contact type IC label that implements the antenna substrate and labels IC is mounted on a substrate, the first substrate of to form a recess having a window on the main surface, the antenna substrate, the recess, the IC is mounted side IC is embedded so as to be inserted into the window, the first antenna substrate is embedded on the main surface and on the antenna surface IC is mounted in the substrate opposite surface, with the protective member by using a first adhesive layer laminated, laminating the label using a second adhesive layer on the protective member , and forming the third adhesive layer on the second major surface of the substrate.

【0008】本発明の非接触型ICラベルおよびその製造方法によれば、アンテナ基板を実装した基材上に保護部材を積層することにより、耐湿度特性に優れ、記録または再生内容の表示に不具合を生じない非接触型ICラベルを提供できる。 According to the non-contact type IC label, and a manufacturing method thereof of the present invention, by laminating a protective member on a substrate mounted with an antenna substrate, excellent moisture resistance characteristic, failure to display the recording or reproducing content possible to provide a non-contact type IC label that does not cause.

【0009】 [0009]

【発明の実施の形態】本発明の実施の形態を、非接触型ICラベルの実施の形態例について、本発明に係わる非接触型ICラベルの概略構成断面図である図1を参照して以下に説明する。 The embodiment of the embodiment of the present invention, the embodiment of the implementation of the non-contact type IC label, hereinafter with reference to FIG. 1 is a schematic sectional view of a contactless IC label according to the present invention It will be explained. 本発明の非接触型ICラベル1の構成を説明する。 Illustrating the non-contact IC label 1 configuration of the present invention. 非接触型ICラベル1は、図1のように、IC2を有するアンテナ基板3と例えば紙などのラベル4とをポリエチレンテレフタレート(PET)フィルムなどの基材5上に具備するものであって、アンテナ基板3を、基材5の第1の主面6上に形成された窓7を有する凹部8に、IC2を有する面側からIC2を窓7 Non-contact type IC label 1, as shown in FIG. 1, there is comprising on a base material 5 such as polyethylene terephthalate (PET) film and labels 4, such as an antenna substrate 3, for example, paper having IC 2, antenna the substrate 3, the concave portion 8 having a first major surface 6 window 7 formed on the substrate 5, the window 7 from the side IC2 having IC2
に挿入するように載置して有し、第1の主面6上およびアンテナ基板3のIC2を有する面と反対面上に、第1 It has been placed to be inserted into the opposite surface on the surface having a first major surface 6 and on the antenna substrate 3 of IC 2, first
の粘着層9を介して保護部材10を有し、保護部材10 A protective member 10 through the adhesive layer 9, the protective member 10
上に第2の粘着層11を介してラベル4を有するとともに、基材5の第2の主面12上に第3の粘着層13を有して構成される。 Which has a label 4 via the second adhesive layer 11 on top, and on the second major surface 12 of substrate 5 has a third adhesive layer 13. アンテナ基板3には、IC2を有する面上に、図示を省略する渦巻き状のアンテナパターンが形成されており、その端子部がIC2に接続されている。 The antenna substrate 3, on a surface with IC 2, which is spiral shaped antenna pattern not shown is formed, the terminal portions are connected to the IC 2.

【0010】非接触型ICラベル1の製造方法は、図1 [0010] Production method of non-contact type IC label 1, FIG. 1
のように、IC2が実装されたアンテナ基板3と紙などのラベル4とをPETフィルムなどの基材上に実装したものであり、基材5の第1の主面6上に窓7を有する凹部8を形成するとともに、アンテナ基板3を、凹部8 As, IC 2 is not less that a label 4, such as implemented antenna substrate 3 and the paper was mounted on a substrate, such as PET film, it has a window 7 on the first main surface 6 of the base 5 of the to form a recess 8, the antenna substrate 3, the concave portion 8
に、IC2が実装された面側からIC2が窓7に挿入されるように埋設し、アンテナ基板3が埋設された第1の主面6上およびアンテナ基板3のIC2が実装された面と反対面上に、第1の粘着層9を用いて保護部材10を積層し、保護部材10上に第2の粘着層11を用いてラベル4を積層するとともに、基材5の第2の主面12上に第3の粘着層13を形成することにより作製される。 The opposite from IC2 is implemented side IC2 is embedded so as to be inserted into the window 7, the first major surface 6 and on IC2 is implemented surface of the antenna substrate 3 to the antenna substrate 3 is embedded on the surface, the protective member 10 are stacked with the first adhesive layer 9, as well as laminating the label 4 by using the second adhesive layer 11 on the protective member 10, the second major surface of the substrate 5 It is manufactured by forming the third adhesive layer 13 on 12.

【0011】保護部材10としては、PETフィルム、 [0011] as a protective member 10, PET film,
ポリエチレンナフタレート(PEN)フィルムまたは液晶ポリマーフィルムなどがあげられるが、これらに限定されず、耐湿性を有する高分子フィルムであればいかようなものでもよい。 While polyethylene naphthalate (PEN) film or a liquid crystal polymer film may be mentioned, without being limited thereto, may be as Ika if a polymer film having a moisture resistance. また、第1の粘着層、第2の粘着層または第3の粘着層には、共重合ポリエステルなどが用いられ、ロールコータなどにより塗布される。 The first adhesive layer, a second adhesive layer or the third adhesive layer, such as copolyester is used, it is applied by a roll coater.

【0012】 [0012]

【実施例】上記の実施の形態例と同様な非接触型ICラベルに、本発明の保護部材を適用した場合に、以下のような信頼性試験を行った。 EXAMPLES] non-contact type IC label similar to the embodiment of the above-described embodiment, the case of applying the protective member of the present invention, were subjected to reliability tests such as the following. 保護部材としては、PETフィルム、PENフィルム、液晶ポリマーフィルムを用いた。 The protective member, using a PET film, PEN film, a liquid crystal polymer film. 40℃95%RHの環境下で、非接触型ICラベル1を2週間放置した後に、送信周波数が、試験前の周波数13.56MHzから0.2Hzずれた場合をNGとした。 Under the environment of 40 ° C. 95% RH, after the non-contact type IC label 1 for 2 weeks, transmission frequency, and the case where the deviation 0.2Hz from the frequency 13.56MHz before the test and NG. 試験結果を表1に示す。 The test results are shown in Table 1.

【0013】 [0013]

【表1】 [Table 1]

【0014】上記の試験結果から、信頼性を保持するためには、保護部材10の高分子フィルムの厚さは、10 [0014] From the above test results, in order to maintain the reliability, the thickness of the polymer film of the protection member 10, 10
μm以上あればよいが、10μmでは、第1の粘着層9 μm suffices above, but in 10 [mu] m, the first adhesive layer 9
を塗布して基材5に貼り付ける場合の作業性が悪いので、好ましくは25μm以上必要である。 Since the workability is poor when pasted to a substrate 5 by coating, preferably more than necessary 25 [mu] m.

【0015】上記の非接触型ICラベル1は、保護部材10上に紙などのラベル4を貼り付けた構成であるが、 The contactless IC label 1 described above, but on the protective member 10 is configured to paste the label 4, such as paper,
保護部材10の高分子フィルムにペンなどで書くことができれば、ラベル4を用いる必要はない。 If we can write with a pen on the polymer film of the protection member 10, it is not necessary to use a label 4.

【0016】 [0016]

【発明の効果】本発明の非接触型ICラベルおよびその製造方法によれば、アンテナ基板に保護部材を積層することにより、耐環境特性に優れ、記録または再生内容の表示に不具合を生じない非接触型ICラベルを提供できる。 According to the non-contact type IC label, and a manufacturing method thereof of the present invention, by laminating a protective member on the antenna substrate, excellent environmental characteristics, does not cause inconvenience of display of recording or reproducing content Hide it is possible to provide a contact type IC label.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】 本発明に係わる非接触型ICラベルの概略構成断面図である。 1 is a schematic sectional view of a contactless IC label according to the present invention.

【図2】 従来例の非接触型ICラベルの概略構成断面図である。 2 is a schematic sectional view of a contactless IC label of the prior art.

【符号の説明】 DESCRIPTION OF SYMBOLS

1,14…非接触型ICラベル、2…IC、3…アンテナ基板、4…ラベル、5…基材、6…第1の主面、7… 1,14 ... non-contact type IC label, 2 ... IC, 3 ... antenna substrate, 4 ... label, 5 ... substrate, 6 ... first major surface, 7 ...
窓、8…凹部、9…第1の粘着層、10…保護部材、1 Windows, 8 ... recess, 9 ... first adhesive layer, 10 ... protective member, 1
1…第2の粘着層、12…第2の主面、13…第3の粘着層 1 ... second adhesive layer, 12 ... second main surface, 13 ... third adhesive layer

Claims (2)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 ICを有するアンテナ基板とラベルとを基材上に具備する非接触型ICラベルであって、 前記アンテナ基板を、前記基材の第1の主面上に形成された窓を有する凹部に、前記ICを有する面側から前記ICを前記窓に挿入するように載置して有し、 前記第1の主面上および前記アンテナ基板の前記ICを有する面と反対面上に、第1の粘着層を介して保護部材を有し、前記保護部材上に第2の粘着層を介して前記ラベルを有するとともに、 前記基材の第2の主面上に第3の粘着層を有することを特徴とする非接触型ICラベル。 1. A non-contact IC label comprising on a substrate an antenna substrate and a label having the IC, the said antenna substrate, which is formed on the first main surface of the substrate window the recess having has a side having said IC is placed so as to insert the IC to the window, to the first main surface and the antenna and the surface having the IC substrate opposite plane , a protective member through the first adhesive layer, which has the label through a second adhesive layer on the protective member, a third adhesive layer on the second major surface of said substrate non-contact type IC label, characterized in that it comprises a.
  2. 【請求項2】 ICが実装されたアンテナ基板とラベルとを基材上に実装した非接触型ICラベルの製造方法であって、 前記基材の第1の主面上に、窓を有する凹部を形成するとともに、前記アンテナ基板を、前記凹部に、前記IC 2. A method for producing a non-contact type IC label IC is mounted with the antenna substrate and a label mounted on the substrate, on the first main surface of the substrate, the recess having a window to form a, the antenna substrate, in the recess, the IC
    が実装された面側から前記ICが前記窓に挿入されるように埋設し、前記アンテナ基板が埋設された前記第1の主面上および前記アンテナ基板の前記ICが実装された面と反対面上に、第1の粘着層を用いて保護部材を積層し、前記保護部材上に第2の粘着層を用いて前記ラベルを積層するとともに、前記基材の第2の主面上に第3の粘着層を形成することを特徴とする非接触型ICラベルの製造方法。 Opposite surface but buried from implemented side so that the IC is inserted into the window, the IC is mounted face of the said antenna substrate is embedded first main surface and the antenna substrate and above, with the first adhesive layer is laminated to the protective member, with laminating the label using a second adhesive layer on the protective member, the third on the second major surface of said substrate non-contact type IC manufacturing method of the label and forming the adhesive layer.
JP10315105A 1998-11-05 1998-11-05 Non-contact ic label and its manufacture Pending JP2000148948A (en)

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