JP2000148948A - Non-contact ic label and its manufacture - Google Patents

Non-contact ic label and its manufacture

Info

Publication number
JP2000148948A
JP2000148948A JP10315105A JP31510598A JP2000148948A JP 2000148948 A JP2000148948 A JP 2000148948A JP 10315105 A JP10315105 A JP 10315105A JP 31510598 A JP31510598 A JP 31510598A JP 2000148948 A JP2000148948 A JP 2000148948A
Authority
JP
Japan
Prior art keywords
label
adhesive layer
contact type
antenna substrate
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10315105A
Other languages
Japanese (ja)
Inventor
Seiichi Miyai
清一 宮井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP10315105A priority Critical patent/JP2000148948A/en
Publication of JP2000148948A publication Critical patent/JP2000148948A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To obtain a non-contact type IC label which does not generate malfunction in the display of recorded or reproduced contents and is excellent in environment-resistant characteristics and its manufacturing method. SOLUTION: This non-contact type IC label 1 is provided with an antenna substrate 3 having an IC 2 and a label 4 made of such as paper on and over base material 5 such as a PET film, has the antenna substrate 3 by mounting it in a recessed part 8 having a window 7 formed on a 1st principal plane 6 of the material 5 so as to insert the IC 2 in the window 7 from both sides having the IC 2 and has a protection member 10 such as a PET film over the 1st principal plane 6 and the opposite surface of the plane of the substrate 3 which has the IC 2 through a 1st adhesion layer 9. It also has the label 4 over the protection member 10 through a 2nd adhesion layer 11 and also has a 3rd adhesive layer 13 on a 2nd principal plane 12 of the material 5.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は非接触型ICラベル
およびその製造方法に関し、さらに詳しくは、耐環境特
性に優れた非接触型ICラベルおよびその製造方法に関
する。
The present invention relates to a non-contact type IC label and a method of manufacturing the same, and more particularly, to a non-contact type IC label excellent in environmental resistance and a method of manufacturing the same.

【0002】[0002]

【従来の技術】ビデオカセットなどの情報記録媒体にお
いて、ビデオカセット自体をビデオデッキに装填し、記
録または再生を行うことなしに、その記録または再生内
容を表示する方法として、ビデオカセットに貼りつけた
非接触型ICラベルのICメモリに記録または再生内容
をあらかじめ入力しておいて、ビデオカセットをビデオ
デッキの受信部に近づけてかざすことにより、その信号
を送信することで表示する方法が開発されている。(特
開昭62−157391号公報、特開平5−19813
9号公報参照。)
2. Description of the Related Art In an information recording medium such as a video cassette, the video cassette itself is mounted on a video deck and pasted to the video cassette as a method of displaying the recorded or reproduced content without recording or reproducing. A method has been developed in which recording or reproduction contents are input in advance to the IC memory of the non-contact type IC label, and the signal is transmitted by bringing the video cassette close to the receiving section of the VCR and transmitting the signal. I have. (JP-A-62-157391, JP-A-5-19813)
See No. 9. )

【0003】従来の非接触型ICラベルの構成を、従来
の非接触型ICラベルの一例を示す概略構成断面図であ
る図2を参照して説明する。非接触型ICラベル14
は、例えば、ポリエチレンテレフタレートフィルムなど
の基材5の第1の主面6上にIC2を有するアンテナ基
板3を、第1の主面6上に、IC2を有する面側からI
C2が基材5の窓7に挿入されるように載置して有する
とともに、第1の主面6上およびアンテナ基板3のIC
を有する面と反対面上に、紙などのラベル4を第2の粘
着層11を介して積層された構成となっている。アンテ
ナ基板3には、IC2が実装された面に、図示を省略す
る渦巻き状のアンテナパターンが形成されており、その
端子部がIC2に接続されている。また、基材5の第2
の主面12上には、第3の粘着層13が塗布されてい
る。そして、この非接触型ICラベル14は、図示を省
略するビデオカセットなどの情報記録媒体上に、第3の
粘着層13により貼り付けられて使用される。
The configuration of a conventional non-contact type IC label will be described with reference to FIG. 2 which is a schematic cross-sectional view showing an example of a conventional non-contact type IC label. Non-contact IC label 14
For example, the antenna substrate 3 having the IC 2 on the first main surface 6 of the base material 5 such as a polyethylene terephthalate film is placed on the first main surface 6 from the surface side having the IC 2.
C2 is mounted so as to be inserted into the window 7 of the base member 5, and the IC 2 on the first main surface 6 and the antenna substrate 3
The label 4 made of paper or the like is laminated on the surface opposite to the surface having the above via a second adhesive layer 11. On the antenna substrate 3, a spiral antenna pattern (not shown) is formed on a surface on which the IC 2 is mounted, and its terminal portion is connected to the IC 2. In addition, the second
The third adhesive layer 13 is applied on the main surface 12 of the first adhesive layer. The non-contact type IC label 14 is used by being attached to an information recording medium such as a video cassette (not shown) by a third adhesive layer 13.

【0004】しかしながら、このような構成の非接触型
ICラベル14においては、高湿度の環境下において、
吸湿の影響により、送信周波数のずれが発生し、記録ま
たは再生内容の表示に不具合を生じることが問題となっ
ている。
[0004] However, in the non-contact type IC label 14 having such a configuration, in a high humidity environment,
Due to the influence of moisture absorption, a shift in transmission frequency occurs, which causes a problem in displaying recorded or reproduced contents.

【0005】[0005]

【発明が解決しようとする課題】記録または再生内容の
表示に不具合を生じさせず、耐環境特性に優れた非接触
型ICラベルおよびその製造方法を提供することを課題
とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a non-contact type IC label which does not cause a problem in displaying recorded or reproduced contents and has excellent environmental resistance and a method of manufacturing the same.

【0006】[0006]

【課題を解決するための手段】本発明の非接触型ICラ
ベルは、ICを有するアンテナ基板とラベルとを基材上
に具備する非接触型ICラベルであって、アンテナ基板
を、基材の第1の主面上に形成された窓を有する凹部
に、ICを有する面側からICを窓に挿入するように載
置して有し、第1の主面上およびアンテナ基板のICを
有する面と反対面上に、第1の粘着層を介して保護部材
を有し、保護部材上に第2の粘着層を介してラベルを有
するとともに、基材の第2の主面上に第3の粘着層を有
することを特徴とする。
A non-contact type IC label according to the present invention is a non-contact type IC label having an antenna substrate having an IC and a label on a base material. An IC is placed in a recess having a window formed on the first main surface so as to be inserted into the window from the side having the IC, and has the IC on the first main surface and the antenna substrate. A protective member is provided on the surface opposite to the first adhesive layer via a first adhesive layer, a label is provided on the protective member via a second adhesive layer, and a third member is provided on a second main surface of the base material. Characterized by having an adhesive layer of

【0007】本発明の非接触型ICラベルの製造方法
は、ICが実装されたアンテナ基板とラベルとを基材上
に実装した非接触型ICラベルの製造方法であって、基
材の第1の主面上に窓を有する凹部を形成するととも
に、アンテナ基板を、凹部に、ICが実装された面側か
らICが窓に挿入されるように埋設し、アンテナ基板が
埋設された第1の主面上およびアンテナ基板のICが実
装された面と反対面上に、第1の粘着層を用いて保護部
材を積層し、保護部材上に第2の粘着層を用いてラベル
を積層するとともに、基材の第2の主面上に第3の粘着
層を形成することを特徴とする。
A method of manufacturing a non-contact type IC label according to the present invention is a method of manufacturing a non-contact type IC label in which an antenna substrate on which an IC is mounted and a label are mounted on a base material. A concave portion having a window is formed on the main surface of the first substrate, and the antenna substrate is embedded in the concave portion so that the IC is inserted into the window from the side on which the IC is mounted, and the first antenna substrate is embedded. A protective member is laminated using a first adhesive layer on the main surface and a surface opposite to a surface on which the IC of the antenna substrate is mounted, and a label is laminated using a second adhesive layer on the protective member. And forming a third adhesive layer on the second main surface of the base material.

【0008】本発明の非接触型ICラベルおよびその製
造方法によれば、アンテナ基板を実装した基材上に保護
部材を積層することにより、耐湿度特性に優れ、記録ま
たは再生内容の表示に不具合を生じない非接触型ICラ
ベルを提供できる。
According to the non-contact type IC label and the method of manufacturing the same according to the present invention, the protective member is laminated on the base material on which the antenna substrate is mounted, so that the humidity resistance is excellent and the display of recorded or reproduced contents is inconvenient. Can be provided.

【0009】[0009]

【発明の実施の形態】本発明の実施の形態を、非接触型
ICラベルの実施の形態例について、本発明に係わる非
接触型ICラベルの概略構成断面図である図1を参照し
て以下に説明する。本発明の非接触型ICラベル1の構
成を説明する。非接触型ICラベル1は、図1のよう
に、IC2を有するアンテナ基板3と例えば紙などのラ
ベル4とをポリエチレンテレフタレート(PET)フィ
ルムなどの基材5上に具備するものであって、アンテナ
基板3を、基材5の第1の主面6上に形成された窓7を
有する凹部8に、IC2を有する面側からIC2を窓7
に挿入するように載置して有し、第1の主面6上および
アンテナ基板3のIC2を有する面と反対面上に、第1
の粘着層9を介して保護部材10を有し、保護部材10
上に第2の粘着層11を介してラベル4を有するととも
に、基材5の第2の主面12上に第3の粘着層13を有
して構成される。アンテナ基板3には、IC2を有する
面上に、図示を省略する渦巻き状のアンテナパターンが
形成されており、その端子部がIC2に接続されてい
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIG. 1 which is a schematic sectional view of a non-contact type IC label according to an embodiment of the present invention. Will be described. The configuration of the non-contact type IC label 1 of the present invention will be described. As shown in FIG. 1, a non-contact type IC label 1 includes an antenna substrate 3 having an IC 2 and a label 4 such as paper on a base material 5 such as a polyethylene terephthalate (PET) film. The substrate 3 is placed in the concave portion 8 having the window 7 formed on the first main surface 6 of the base material 5, and the IC 2 is placed in the window 7 from the side having the IC 2.
And the first main surface 6 and the surface of the antenna substrate 3 opposite to the surface on which the IC 2 is provided.
Having a protective member 10 with an adhesive layer 9 interposed therebetween.
It has a label 4 on the second adhesive layer 11 above and a third adhesive layer 13 on the second main surface 12 of the substrate 5. On the antenna substrate 3, a spiral antenna pattern (not shown) is formed on a surface having the IC 2, and its terminal portion is connected to the IC 2.

【0010】非接触型ICラベル1の製造方法は、図1
のように、IC2が実装されたアンテナ基板3と紙など
のラベル4とをPETフィルムなどの基材上に実装した
ものであり、基材5の第1の主面6上に窓7を有する凹
部8を形成するとともに、アンテナ基板3を、凹部8
に、IC2が実装された面側からIC2が窓7に挿入さ
れるように埋設し、アンテナ基板3が埋設された第1の
主面6上およびアンテナ基板3のIC2が実装された面
と反対面上に、第1の粘着層9を用いて保護部材10を
積層し、保護部材10上に第2の粘着層11を用いてラ
ベル4を積層するとともに、基材5の第2の主面12上
に第3の粘着層13を形成することにより作製される。
A method for manufacturing the non-contact type IC label 1 is shown in FIG.
The antenna substrate 3 on which the IC 2 is mounted and the label 4 such as paper are mounted on a base material such as a PET film, and have a window 7 on the first main surface 6 of the base material 5 as shown in FIG. The recess 8 is formed, and the antenna substrate 3 is
The IC 2 is embedded so as to be inserted into the window 7 from the side on which the IC 2 is mounted, and is opposite to the first main surface 6 where the antenna substrate 3 is embedded and the surface of the antenna substrate 3 on which the IC 2 is mounted. The protective member 10 is laminated on the surface using the first adhesive layer 9, the label 4 is laminated on the protective member 10 using the second adhesive layer 11, and the second main surface of the base material 5 It is produced by forming a third adhesive layer 13 on the second adhesive layer 12.

【0011】保護部材10としては、PETフィルム、
ポリエチレンナフタレート(PEN)フィルムまたは液
晶ポリマーフィルムなどがあげられるが、これらに限定
されず、耐湿性を有する高分子フィルムであればいかよ
うなものでもよい。また、第1の粘着層、第2の粘着層
または第3の粘着層には、共重合ポリエステルなどが用
いられ、ロールコータなどにより塗布される。
As the protective member 10, a PET film,
Examples thereof include a polyethylene naphthalate (PEN) film and a liquid crystal polymer film, but are not limited thereto, and any polymer film having moisture resistance may be used. Further, for the first adhesive layer, the second adhesive layer, or the third adhesive layer, a copolymer polyester or the like is used and is applied by a roll coater or the like.

【0012】[0012]

【実施例】上記の実施の形態例と同様な非接触型ICラ
ベルに、本発明の保護部材を適用した場合に、以下のよ
うな信頼性試験を行った。保護部材としては、PETフ
ィルム、PENフィルム、液晶ポリマーフィルムを用い
た。40℃95%RHの環境下で、非接触型ICラベル
1を2週間放置した後に、送信周波数が、試験前の周波
数13.56MHzから0.2Hzずれた場合をNGと
した。試験結果を表1に示す。
EXAMPLES When the protective member of the present invention was applied to a non-contact type IC label similar to that of the above-described embodiment, the following reliability test was conducted. As a protective member, a PET film, a PEN film, or a liquid crystal polymer film was used. After leaving the non-contact type IC label 1 for 2 weeks in an environment of 40 ° C. and 95% RH, a case where the transmission frequency deviated from the frequency of 13.56 MHz before the test by 0.2 Hz was regarded as NG. Table 1 shows the test results.

【0013】[0013]

【表1】 [Table 1]

【0014】上記の試験結果から、信頼性を保持するた
めには、保護部材10の高分子フィルムの厚さは、10
μm以上あればよいが、10μmでは、第1の粘着層9
を塗布して基材5に貼り付ける場合の作業性が悪いの
で、好ましくは25μm以上必要である。
From the above test results, in order to maintain reliability, the thickness of the polymer film of the protective member 10 must be 10
μm or more, the first adhesive layer 9
Since the workability when applying and affixing to the substrate 5 is poor, the thickness is preferably 25 μm or more.

【0015】上記の非接触型ICラベル1は、保護部材
10上に紙などのラベル4を貼り付けた構成であるが、
保護部材10の高分子フィルムにペンなどで書くことが
できれば、ラベル4を用いる必要はない。
The above-mentioned non-contact type IC label 1 has a structure in which a label 4 such as paper is attached on a protective member 10.
If it is possible to write on the polymer film of the protective member 10 with a pen or the like, it is not necessary to use the label 4.

【0016】[0016]

【発明の効果】本発明の非接触型ICラベルおよびその
製造方法によれば、アンテナ基板に保護部材を積層する
ことにより、耐環境特性に優れ、記録または再生内容の
表示に不具合を生じない非接触型ICラベルを提供でき
る。
According to the non-contact type IC label and the method of manufacturing the same of the present invention, the protective member is laminated on the antenna substrate, so that the non-contact type IC label has excellent environmental resistance characteristics and does not cause any trouble in displaying recorded or reproduced contents. A contact IC label can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明に係わる非接触型ICラベルの概略構
成断面図である。
FIG. 1 is a schematic sectional view of the configuration of a non-contact type IC label according to the present invention.

【図2】 従来例の非接触型ICラベルの概略構成断面
図である。
FIG. 2 is a schematic sectional view of a conventional non-contact type IC label.

【符号の説明】[Explanation of symbols]

1,14…非接触型ICラベル、2…IC、3…アンテ
ナ基板、4…ラベル、5…基材、6…第1の主面、7…
窓、8…凹部、9…第1の粘着層、10…保護部材、1
1…第2の粘着層、12…第2の主面、13…第3の粘
着層
1, 14: non-contact type IC label, 2: IC, 3: antenna board, 4: label, 5: base material, 6: first main surface, 7:
Window, 8 ... concave portion, 9 ... first adhesive layer, 10 ... protective member, 1
DESCRIPTION OF SYMBOLS 1 ... 2nd adhesive layer, 12 ... 2nd main surface, 13 ... 3rd adhesive layer

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ICを有するアンテナ基板とラベルとを
基材上に具備する非接触型ICラベルであって、 前記アンテナ基板を、前記基材の第1の主面上に形成さ
れた窓を有する凹部に、前記ICを有する面側から前記
ICを前記窓に挿入するように載置して有し、 前記第1の主面上および前記アンテナ基板の前記ICを
有する面と反対面上に、第1の粘着層を介して保護部材
を有し、前記保護部材上に第2の粘着層を介して前記ラ
ベルを有するとともに、 前記基材の第2の主面上に第3の粘着層を有することを
特徴とする非接触型ICラベル。
1. A non-contact type IC label comprising an antenna substrate having an IC and a label on a base material, wherein the antenna substrate is provided with a window formed on a first main surface of the base material. The IC is placed in the recess having the IC so as to be inserted into the window from the side having the IC, on the first main surface and on the surface of the antenna substrate opposite to the surface having the IC. Having a protective member via a first adhesive layer, having the label on the protective member via a second adhesive layer, and a third adhesive layer on a second main surface of the base material. A non-contact type IC label comprising:
【請求項2】 ICが実装されたアンテナ基板とラベル
とを基材上に実装した非接触型ICラベルの製造方法で
あって、 前記基材の第1の主面上に、窓を有する凹部を形成する
とともに、前記アンテナ基板を、前記凹部に、前記IC
が実装された面側から前記ICが前記窓に挿入されるよ
うに埋設し、前記アンテナ基板が埋設された前記第1の
主面上および前記アンテナ基板の前記ICが実装された
面と反対面上に、第1の粘着層を用いて保護部材を積層
し、前記保護部材上に第2の粘着層を用いて前記ラベル
を積層するとともに、前記基材の第2の主面上に第3の
粘着層を形成することを特徴とする非接触型ICラベル
の製造方法。
2. A method for manufacturing a non-contact type IC label in which an antenna substrate on which an IC is mounted and a label are mounted on a base material, wherein a concave portion having a window on a first main surface of the base material. And forming the antenna substrate in the concave portion with the IC
Is embedded from the side on which the IC is mounted, so that the IC is inserted into the window, and the first main surface on which the antenna substrate is embedded and the surface of the antenna substrate opposite to the surface on which the IC is mounted A protective member is laminated on the protective member using a first adhesive layer, the label is laminated on the protective member using a second adhesive layer, and a third member is laminated on a second main surface of the base material. A method for producing a non-contact type IC label, characterized by forming an adhesive layer as described above.
JP10315105A 1998-11-05 1998-11-05 Non-contact ic label and its manufacture Pending JP2000148948A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10315105A JP2000148948A (en) 1998-11-05 1998-11-05 Non-contact ic label and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10315105A JP2000148948A (en) 1998-11-05 1998-11-05 Non-contact ic label and its manufacture

Publications (1)

Publication Number Publication Date
JP2000148948A true JP2000148948A (en) 2000-05-30

Family

ID=18061488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10315105A Pending JP2000148948A (en) 1998-11-05 1998-11-05 Non-contact ic label and its manufacture

Country Status (1)

Country Link
JP (1) JP2000148948A (en)

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US7786949B2 (en) 2006-04-14 2010-08-31 Murata Manufacturing Co., Ltd. Antenna
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