JPH065661A - Tab film carrier - Google Patents

Abstract

PURPOSE:To enable a film carrier to be enveloped in a small space inside an electronic equipment as folded up without deteriorating in reliability. CONSTITUTION:A TAB film carrier is composed of an insulating base material 10 where a conductor 12 is pasted with adhesive agent 11, and not only the conductor 12 but also the adhesive agent 11 is left on slit holes 10a and 10b provided to the base material 10 at points A and B where the insulating base material 10 is folded up. The TAB film is folded up at the points A and B to be built in a small space inside an electronic equipment.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB film carrier for mounting an IC or the like and connecting it to, for example, a liquid crystal panel.

[0002]

2. Description of the Related Art In a flexible circuit board, for example, as shown in FIG. 13, an insulating substrate 1 has a thickness of 25 .mu.m or less and an adhesive 2 of about 20 .mu.
Some copper foils 3 are attached. This type of flexible circuit board can be easily bent with a small radius of curvature, as shown in FIG.

However, in the TAB film carrier, since an IC or the like is mounted and connected to, for example, a liquid crystal panel, the insulating base material has dimensional stability so that a fine circuit can be formed with high precision and high density. It is required to be excellent in shape retention. Therefore, for example, as shown in FIG. 11, the thickness of the insulating base material 4 is 75 to 125.
μ, and also using adhesive 20 of about 20μ
A conductor 6 such as a copper foil having a thickness of about 8 to 36 μ is attached. Therefore, since the insulating base material 4 is much thicker than the flexible circuit board described above, it cannot be bent with a small radius of curvature as it is.

However, with the recent miniaturization of electronic devices, it is required to fit them in a small storage space. Therefore, it is desired to arrange the TAB film carrier by bending it.

Therefore, in the conventional TAB film carrier, for example, as shown in FIG. 10, thin long holes 4a, 5a and 4b, 5b are punched at the bending positions a and b of the insulating base material 4 and the adhesive 5 by punching. Had formed. Then, as shown in FIG. 9, the long holes 4a, 5a and 4b are formed.
-It was bent at the bending positions a and b along 5b.

[0006]

However, if the bending positions a and b are only the conductor 6, the strength is insufficient and the conductor 6 is cracked or fractured, resulting in a decrease in reliability.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art and to make it possible to fold and store the electronic equipment in a small space without impairing its reliability.

[0008]

Therefore, according to the first aspect of the present invention, the conductor 12 is attached to the insulating base material 10 via the adhesive 11 and the insulation of the conductor 12 is applied, for example, as shown in the following embodiments. Slit holes 10a formed in the base material 10
In the TAB film carrier which is used by bending at the 10b position, not only the conductor 12 but also the adhesive 11 is left in the portion corresponding to the positions of the slit holes 10a and 10b.

According to the second aspect of the invention, the T of the first aspect of the invention can be realized as in the embodiment shown in FIG.
In the film carrier for AB, the slit hole 10
A resin 13 is applied to the outer surface portion of the conductor 12 corresponding to the positions a and 10b.

[0010]

[Function] The slit holes 10a-1 of the insulating base material 10
Bend at 0b position, and assemble in a small space in an electronic device, for example.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a T which is an embodiment of the present invention.
The film carrier for AB is shown. Reference numeral 10 in the drawing is 20
It is an insulating base material made of polyimide or polyester having a thickness of ˜200 μm. The surface of the insulating base material 10 has a thickness of 20 μm to 30 μm.
The conductor 12 is adhered with a certain degree of adhesive 11, and not only the conductor 12 but also the adhesive 11 is left in the slit holes 10a and 10b provided at the bending positions.

This TAB film carrier is manufactured as follows. First, as shown in FIG. 2, slit holes 10a and 10b are formed in the insulating base material 10 by punching. As shown in FIG. 3, on the entire surface of the insulating base material 20, as shown in FIG.
A film-shaped highly heat-resistant adhesive 11 having a thickness of 30 μ is transferred to close the slit holes 10a and 10b. Next, Fig. 4
As shown in FIG. 5, after forming a hole 10c for the inner lead and a hole 10d for the outer lead which penetrate the insulating base material 10 and the adhesive 11, as shown in FIG. The conductor 12 is bonded onto the material 10. As the conductor 12, copper, copper alloy, aluminum, aluminum alloy,
Using iron, iron alloy, etc., the thickness is 18
Approximately 36 μ.

Thereafter, a wiring circuit is formed by etching in a conventional method, and tin, gold, solder or the like is plated to facilitate bonding to the surface of the conductor 12 to obtain the TAB film carrier shown in FIG.

As a result, as shown in FIG. 6, for example, the IC 1 is formed on the inner leads 12a and 12b formed of the conductor 12.
4 is attached and stored in the inner lead hole 10c,
The outer lead 12c is cut at the position of the outer lead hole 10d to be connected to the printed circuit board 15, while the conductor 12 is connected to the liquid crystal panel 16 using an adhesive 11 or solder. Then, as shown in FIG.
Bend at positions a and b at positions a and b, and assemble in a small space in an electronic device, for example. In the illustrated embodiment, the case where the folding positions are two A and B is described.
It goes without saying that any number of points may be used.

In the above embodiment, the slit hole 10a
Although the conductor 12 and the adhesive 11 are provided on 10b, as shown in FIG. 8, the outer surface portion of the conductor 12 corresponding to the slit holes 10a and 10b positions A and B is easy to bend and has mechanical strength. A resin 13 such as polyimide having heat resistance and chemical resistance may be applied and cured to increase the strength of the bent portion.

[0016]

Therefore, according to the present invention, since a hole is formed in the insulating base material and bent at the position of the hole, the insulating base material is used.
For example, the electronic device can be easily stored in a small space. In addition, since not only the conductor but also the adhesive is left in the conductor portion on the insulating base material corresponding to the hole position, the conductor at the bending position can be reinforced with the adhesive, and the conductor may be cracked or broken. It is small and does not reduce reliability.

Further, according to the second aspect, since the resin is applied to the conductor at the bending position, the conductor can be further reinforced at the bending position.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a TAB film carrier that is an embodiment of the present invention.

FIG. 2 is an explanatory view of the first manufacturing step of the insulating base material, showing a state where slit holes are formed in the insulating base material.

FIG. 3 is a second manufacturing step explanatory view showing a state in which a film-shaped adhesive is transferred.

FIG. 4 is a third manufacturing diagram showing the state in which a hole for a lead is opened.
FIG.

FIG. 5 is a fourth manufacturing step explanatory view showing a state in which a conductor is stuck on an adhesive.

FIG. 6 is a state diagram in which an IC is attached to the film carrier and the film carrier is connected to a liquid crystal panel.

FIG. 7 is a diagram showing its usage state.

FIG. 8 is a cross-sectional view of a TAB film carrier according to another embodiment of the present invention.

FIG. 9 is a state of use when a conventional TAB film carrier is folded and used.

FIG. 10 is a sectional view of the film carrier.

FIG. 11 is a cross-sectional view of a conventional TAB film carrier that is not folded and used.

FIG. 12 is a usage state diagram when the flexible circuit board is bent and used.

FIG. 13 is a partial cross-sectional view of the flexible circuit board.

[Explanation of symbols]

 10 Insulating Base Material 10a and 10b Slit Hole 11 Adhesive 12 Conductor 13 Resin

Claims (2)

[Claims] 1. A film carrier for TAB which is used by bonding a conductor to an insulating base material with an adhesive and bending the slit base material at a slit hole position formed in the insulating base material to a portion corresponding to the slit hole position. A film carrier for TAB, which is configured by leaving not only the conductor but also the adhesive. 2. The T according to claim 1, wherein a resin is applied to an outer surface portion of the conductor corresponding to the position of the slit hole.
Film carrier for AB.