WO2007083575A1 - Radio ic device - Google Patents

Radio ic device

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Publication number
WO2007083575A1
WO2007083575A1 PCT/JP2007/050309 JP2007050309W WO2007083575A1 WO 2007083575 A1 WO2007083575 A1 WO 2007083575A1 JP 2007050309 W JP2007050309 W JP 2007050309W WO 2007083575 A1 WO2007083575 A1 WO 2007083575A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
circuit
ic
wireless
device
plate
Prior art date
Application number
PCT/JP2007/050309
Other languages
French (fr)
Japanese (ja)
Inventor
Yuya Dokai
Noboru Kato
Satoshi Ishino
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B5/00Near-field transmission systems, e.g. inductive loop type
    • H04B5/02Near-field transmission systems, e.g. inductive loop type using transceiver
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0243Printed circuits associated with mounted high frequency components

Abstract

It is possible to provide a radio IC device on which a radio IC chip can be easily and accurately mounted and in which the resonance frequency characteristic is not changed. The radio IC device includes: a radio IC chip (5); a feed circuit substrate (10) having the radio IC chip (5) mounted thereon and a built-in feed circuit (16) connected to the radio IC chip (5) via a solder bump (6); and an emission plate (20) attached to the lower surface of the feed circuit substrate (10) and electromagnetically coupled to the feed circuit (16) by electromagnetic coupling. The feed circuit substrate (10) is formed by overlaying flexible sheets and the feed circuit (16) is formed by an LC resonance circuit having an inductance element (L) and a capacitance element (C).

Description

Specification

The wireless IC device

Technical field

[0001] The present invention relates to a wireless IC device and, more particularly, to a wireless IC device used in an RFID (Radio Frequency Identification) system.

BACKGROUND

In recent years, as a management system of goods, IC tag storing predetermined information attached to the reader-writer and an article that generates an induction field (hereinafter, referred to as a wireless IC device) communication in a non-contact manner the and, it has been developed RFID systems for transmitting information. The wireless IC devices used in RFID systems, for example, there is known one described in Patent Document 1, 2.

[0003] That is, as shown in FIG. 19, only setting the antenna pattern 101 on the plastic film 100, formed by attaching a wireless IC chip 110 on one end of the antenna pattern 101, as shown in FIG. 20, the plastic film 120 the antenna pattern 121 and the radiation electrode 122 provided in the upper, which was fitted with a wireless IC chip 110 at a predetermined position of the antenna pattern 121 is provided.

[0004] However, in the conventional wireless IC devices, DC coupled with Au bumps wireless IC chip 110 on the antenna pattern 101, 121, for mounting, small radio Phil arm 100, 120 having a large area it is necessary to position the IC chip 110. However, there is a problem that implement a small wireless IC chip 110 on the film 100, 120 of large area is very difficult, if occurs a positional deviation in the actual Soji resonance frequency characteristic of the antenna changes.

[0005] Further, the resonance frequency characteristic in the antenna, or antenna patterns 101, 121 are rounded up are, or sandwiched between dielectrics (e.g., sandwiched within books) also changes it.

Patent Document 1: JP 2005- 136528 JP

Patent Document 2: JP 2005 - 244778 discloses

DISCLOSURE OF INVENTION you'll solve

[0006] Accordingly, an object of the present invention can be mounted better wireless IC chip easily and accurately, the tooth forces is also to provide a wireless IC device without the resonant frequency characteristics are changed. Means for Solving the Problems

[0007] To achieve the above object, a wireless IC device according to the first invention, the wireless IC chip is constituted by a flexible substrate, wherein are wireless IC chip is mounted, and the wireless IC chip a power supply circuit board with connected feeder circuit, the feeder circuit board are arranged directly or juxtaposed with, characterized in that and a radiation plate that is coupled the power supply circuit and the electromagnetic field.

[0008] Further, the wireless IC device according to a second invention comprises a non-linear IC chip formed by a flexible semiconductor, the provided wireless IC chip is mounted, and is connected to the wireless IC chip a feed circuit board having a feed circuit, said feed circuit board also directly disposed are arranged close, characterized by comprising a said feed circuit and the electromagnetic field coupling radiation plate.

[0009] In the radio IC device according to the present invention, the feeding circuit is provided in the feeder circuit board are electromagnetically coupled by electromagnetic coupling and the radiation plate. Wireless IC chip is connected to the power supply circuit board provided with a power supply circuit, since the power feeding circuit board is fairly small area, it is possible to mount good very accurately a wireless IC chip. Further, since the power supply circuits are provided in the feeder circuit board, or rounding the wireless IC device is not the resonant frequency characteristics are changed even Dari I sandwiched a dielectric.

In the wireless IC devices according to the [0010] present invention, the resonance frequency of the radiation plate mosquito ゝ et the emitted signal substantially corresponds to the self-resonant frequency of the feeder circuit, the maximum gain of the signal, feeding electricity the size of the circuit, the shape, is substantially determined by at least one of the distance and the medium between the feeder circuit and the radiation plate. The electric length of the radiation plate, it is an integer multiple of our Keru half wavelength resonant frequency Yo,.

[0011] In addition, the power feeding circuit board may comprise a flexible substrate. If the wireless IC chip and the feeder circuit board is a flexible, easy to handle Kugu the cracked or chipped. Furthermore, the radiation plate is preferably to be formed by a flexible metal film,. The flexible metal film is retained in a flexible film.

[0012] feeding circuit can be composed of a multilayer substrate formed by laminating a plurality of dielectric layers or magnetic layers as the substrate, the feeding circuit can be built easily in the multilayer substrate. In this case, the power supply circuit is configured by also the inductance element and capacitance element child force built in the multilayer board LC resonant circuit Surebayo. The inductance element can be formed with the coil-shaped electrode pattern made of a conductor.

[0013] coil-shaped electrode pattern constituting the inductance element, the convolutions axis Yogu be formed parallel URN ho and the radiation plate or may be substantially vertically formed. In the latter case, it is preferable that the convolutions width of the coil-shaped electrode pattern is toward mosquito ゝ connexion gradually larger to the radiation plate.

Effect of the invention

According to [0014] the present invention, it is possible to extremely accurately with wireless IC chip to the feed circuit board. Further, the feeding circuit because it is provided in the power supply circuit board, or rounding the wireless IC device is not the resonant frequency characteristics are changed even if the pinch in the dielectric.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] is a perspective view showing a first embodiment of a wireless IC device according to [1] present invention.

FIG. 2 is a cross-sectional view of the first embodiment.

FIG. 3 is an equivalent circuit diagram of the first embodiment.

圆 4 is an exploded perspective view showing a feeder circuit board of the first embodiment.

Is a perspective view showing a second embodiment of a wireless IC device according to [5] present invention.

It is a sectional view showing a third embodiment of a wireless IC device according to [6] The present invention.

7 is an equivalent circuit diagram showing a fourth embodiment of a wireless IC device according to the present invention.

8 is an equivalent circuit diagram showing a fifth embodiment of a wireless IC device according to the present invention.

It is an equivalent circuit diagram showing a sixth embodiment of a wireless IC device according to [9] The present invention.

It is a sectional view showing a seventh embodiment of a wireless IC device according to [10] the present invention.

11 is an equivalent circuit diagram of the seventh embodiment.

FIG. 12 is an exploded perspective view showing a feeder circuit board of the seventh embodiment.

FIG. 13 is an equivalent circuit diagram showing an eighth embodiment of a wireless IC device according to the present invention. FIG. 14 is an equivalent circuit diagram showing a ninth embodiment of a wireless IC device according to the present invention.

FIG. 15 is an exploded perspective view showing a feeder circuit board of the ninth embodiment.

It is a perspective view showing a tenth embodiment of a wireless IC device according to [16] the present invention.

It is a sectional view showing an eleventh embodiment of a wireless IC device according to [17] the present invention.

FIG. 18 is an exploded perspective view showing a feeder circuit board of the eleventh embodiment.

Is a plan view showing the FIG. 19 a first example of a conventional wireless IC device.

Is a plan view showing the FIG. 20 a second example of a conventional wireless IC device.

BEST MODE FOR CARRYING OUT THE INVENTION

[0016] Hereinafter, will be described with reference to the accompanying drawings embodiments of a wireless IC device according to the present invention. Incidentally, parts common to each embodiment described below, parts and with the same reference numerals, and redundant description will be omitted.

[0017] (First Embodiment, see FIGS. 1 to 4)

Wireless IC device la is a first embodiment is a monopole type, as shown in Figure 1 and Figure 2, the wireless IC chip 5, the feeder circuit board 10 mounted with the wireless IC chip 5 on the upper surface, Ru is composed of a radiation plate 20 which is bonded to the power feeding circuit board 10. The wireless IC chip 5 is information necessary force ^ Mori, is directly connected to the power supply circuit 16 incorporated in the power supply circuit board 10.

[0018] feeding circuit board 10, as shown in FIGS. 2 and 3, the feeder circuit 16 constituted by the inductance element L and Capacity wardrobe element C force becomes LC series resonant circuit is built. Specifically, as shown in FIG. 4, the power supply circuit board 10 is laminated a flexible sheet 11A~11G that also the dielectric strength of polyimide Ya liquid crystal polymer, which was adhered, forming a connection electrode 1 2 and the via-hole conductors 13a sheets 11A, sheet 11B forming the capacitor electrode 14a, the capacitor electrodes 14b and via-hole conductors 13b formed sheets 11C, the sheet 11D forming the via-hole conductors 13c, the conductor pattern 15a and via-hole conductors 13d formed sheets 11E, via hole conductors sheet 1 IF (plural) forming a 13e, consist of a sheet 11G forming the conductor pattern 15b. The sheet 11A~11G consists flexible material having a thickness of 10 / zm about dielectric or magnetic material, the conductor patterns and via-hole conductors may be by thick film forming process, it is formed on each sheet. Further, by laminating those sheets, the feeder circuit board 10 by bonding can be easily obtained by thermal compression bonding.

By laminating [0019] or more sheets IA to 1 IG, and inductance elements L parallel to the convolutions axis radiating plate 20, the capacitor electrode 14b is connected to both ends of the inductance element L, and the capacitor electrode 14a There capacitance element C connected to the connection electrode 12 via the via-hole conductor 13a is formed. The connection electrode 12 is connected to the wireless IC chip 5 via solder bumps 6.

[0020] That is, among the elements constituting the power supply circuit 16, the inductance element is a coil-shaped electrode pattern via a magnetic field, and feeding the transmission signal to the radiating plate 20, also, receives signals from the radiation plate 20 via a magnetic field is fed to the inductance element L. Therefore, in the power supply circuits board 10, the inductance element constituting the resonance circuit, among the capacitance elements, it is preferable that the inductance element is laid out as close to the radiating plate 20.

[0021] The radiation plate 20 is elongated bodies becomes nonmagnetic strength such as aluminum foil, i.e., a metallic body of open-ended, is formed on an insulating flexible film 21, such as PET. The paper feeding circuit board 10 has its lower surface is bonded on the radiating plate 20 via an adhesive 17.

[0022] As the size to an example of which is shown, the wireless IC chip thickness is 50 to 100 mu m of 5, thickness of about 20 m of the solder bumps 6, the feed circuit thickness 200 to 500 111 of the substrate 10, the thickness of the adhesive 17 0.. 1 to: LO mu m, thickness of 1 to 50 mu m of the radiation plate 20, the thickness of Fuinoremu 21 10: a LOO mu m. Also, the size of the wireless IC chip 5 (area), 0. 4 mm X O. 4 mm, are diverse, such as 0. 9mm X 0. 8mm. The size of the power supply circuit board 10 (surface area) may be configured with a size of about 3 mm X 3 mm from the same size as the wireless IC chip 5.

[0023] Figure 3 shows an equivalent circuit of the wireless IC device la. The wireless IC device la is a high-frequency signal is also radiated writer force has such shown (e.g., UHF band) was received by the radiation plate 20, the feeder circuit 16 is mainly magnetically coupled with the radiating plate 20 to resonate, and supplies only a reception signal in a predetermined frequency band to the wireless IC chip 5. On the other hand, extracts energy Jo Tokoro from the received signal, the information stored in the wireless IC chip 5 this energy as a driving source, is matched to a predetermined frequency at the power feeding circuit 16, the power supply circuit 16 inductance from the device, it conveys a transmission signal to the radiating plate 20 via magnetic coupling to transfer from the radiation plate 20 to the reader writer. [0024] In addition, the bond between the radiation plate 20 and the feeder circuit 16 is present bonded via the force electric field is coupled through a magnetic field which is the main, be O, (electromagnetic coupling).

[0025] In the wireless IC device la is a first embodiment, a wireless IC chip 5 is directly connected on the power supply circuit board 10 with built-in power supply circuit 16, the feeder circuit board 10 is quite small again area because it can be mounted in very accurately position the wireless IC chip 5 than mounted on a film of large area as in the conventional.

[0026] In addition, the power feeding circuit 16 is a resonance frequency characteristic in the inductance element L and the capacitance element C is determined. Resonance frequency of a signal radiated from the radiation plate 20 substantially corresponds to the self-resonant frequency of the feeder circuit 16, the maximum gain of the signal, the size of the power supply circuit 16, shape, and the feeder circuit 16 and the radiation plate 20 It is substantially determined by at least one of the distance and the medium. Specifically, in the first embodiment, the electrical length of the radiation plate 20 is a 1Z2 wavelength λ corresponding to the resonant frequency. However, the electrical length of the radiation plate 20 may not be an integer multiple of lambda ?? 2. That is, in the present invention, the frequency of the signal radiated from the radiation plate, since substantially determined by the resonant frequency of the power supply circuit constituting a resonant circuit, with respect to the frequency characteristics, substantially to the electrical length of the radiation plate It does not depend on. When the electrical length of the radiation plate is an integer multiple of lambda ?? 2, the gain is maximized preferred.

[0027] or more for the resonance frequency characteristics of your sharpen feeder circuit 16 is determined by the inductance element L and the capacitance element C that is built into the power supply circuit board 10, pinch wireless IC device 1 a between the book never resonant frequency characteristics are changed even if the. Moreover, they curl wireless devices la, be varied the size of the radiation plate 20, it is not the resonant frequency characteristics are changed. The coil-shaped electrode pattern constituting the inductance element L is, therefore the convolutions axis is parallel to the radiating plate 20 has the advantage that the center frequency does not vary. Further, downstream of the wireless IC chip 5, since the capacitance element C is inserted, it is possible to cut the low frequency surge in this device C, the wireless IC chip 5 can be protected surge force.

[0028] In addition, the power feeding circuit board 10 is a flexible substrate, the radiation plate 20 is formed by a flexible metal film held on the flexible film 21, because, for example, soft bags and pets of plastic film it can be attached without any trouble in a cylindrical shape, such as a bottle.

[0029] Further, by manufacturing a power supply circuit board 10 with an organic material, the firing step is Nakuna connexion inexpensive to produce required, cut with achieving a low height of the wireless IC device la by thinning generally to substrate . Further, by manufacturing a wireless IC chip 5 with a flexible semiconductor, further handling doctor is facilitated, it is possible to increase the bonded wearing target wireless IC device la.

[0030] (Second Embodiment, see Fig. 5)

Wireless IC device lb is a second embodiment, as shown in FIG. 5, the radiation plate 20 having a large area on the flexible plastic film 21 which have a insulating large area obtained by forming such an aluminum foil, power supply circuit board 10 equipped with the wireless IC chip 5 at an arbitrary position of the radiation plate 20 is bonded.

[0031] In addition, another configuration of the wireless IC device lb, i.e., the internal configuration of the feeder circuit board 10 is the same as the first embodiment. Therefore, effects of the present second embodiment is similar to the first embodiment basically.

[0032] (Third Embodiment, see Fig. 6)

Wireless IC device lc is a third embodiment, as shown in FIG. 6, the adhesive 17 via the radiation plate 20 on the entire surface of the film 21 is applied, Ru. At the adhesive 17 can be attached to the wireless IC device lc to any part of the article.

[0033] In addition, another configuration of the wireless IC device lc, i.e., the internal configuration of the feeder circuit board 10 is the same as the first embodiment. Therefore, operation and effect of the third embodiment is the same as the first embodiment basically.

[0034] (Fourth Embodiment, see Fig. 7)

Wireless IC device Id which is the fourth embodiment, as shown as an equivalent circuit in FIG. 7, but with built-in inductance element L which is also coiled electrode pattern forces the antenna substrate as a power supply circuit 16. The capacitance element C constituting an LC resonance circuit is formed as a stray capacitance between the conductor pattern of the inductance element L (volume of distribution constant type).

[0035] with a self-resonance even one coil-shaped electrode pattern! / In Re ヽ, acts as an LC parallel resonance circuit between the C component is the L component and the line between the floating capacitance of the coil-shaped electrode pattern itself and, it is possible to configure the power supply circuit 16. [0036] (Fifth Embodiment, see Fig. 8)

Wireless IC device le is the fifth embodiment, as shown as an equivalent circuit in FIG. 8, a device with a power supply circuit 16 and the radiation plate 20 of the dipole Rutaipu, a pair of LC parallel resonance circuit to the power feeding circuit board 10 force also feed circuit 16a, a built-in 16b. Feed circuit 1 6a is connected to the hot side of the wireless IC chip 5, the feeder circuit 16b is connected to the ground side of the wireless IC chip 5, respectively, opposed to the radiation plate 20, 20. End of the feeder circuit 16a is an open end. Such LC parallel resonance circuit forces also feed circuit 16a, the action of 16b is similar to the feeder circuit 16 composed of the LC series resonant circuit, the same effects as essentially the first embodiment.

[0037] (Sixth Embodiment, see FIG. 9)

Wireless IC device If a sixth embodiment, as shown as an equivalent circuit in FIG. 9, a device with a power supply circuit 16 and the radiation plate 20 of the dipole Rutaipu, a pair of LC series resonant circuits to the power supply circuit board 10 force also feed circuit 16a, a built-in 16b. Each feeding circuit 1 6a, 16b faces the radiation plate 20, 20, the capacitance element C is connected to the ground. Such LC series resonance circuit forces also feed circuit 16a, the action of 16b is similar to the feeder circuit 16 composed of the LC series resonant circuit, the same effects as essentially the first embodiment.

[0038] (Seventh Embodiment, see FIGS. 10 to 12)

Wireless IC device lg is a seventh embodiment, as shown in FIG. 10, Ri Oh monopole type, the inductance element L and the capacitance elements C and the LC series resonance circuit power becomes power supply circuit built in the power supply circuit board 10 16 is obtained by constituting the. As shown in FIG. 11, a coil-shaped electrode pattern constituting the inductance element L has its convolutions shaft is formed perpendicular to the radiating plate 20, the feeder circuit 16 is mainly magnetically coupled with the radiating plate 20 .

[0039] feeding circuit board 10, specifically, as shown in FIG. 12, the laminated dielectric mosquitoes ゝ Ranaru flexible sheet 31 A~31F such as polyimide Ya liquid crystal polymer, which was adhered, the connection electrodes 32 and the sheet 31 a forming the via-hole conductors 33a, the sheet 31B forming the capacitor electrode 34a and via-hole conductors 33b, the capacitor electrode 34b and via-hole conductors 33c, the sheet 31C was formed and 33b, conductor patterns 35a and via-hole conductors 33d, and 33b the formed sheet 31D (a plurality), the conductor patterns 35b and via-hole conductors 33e, the sheet 31E (a plurality) forming a 33b, also sheet 31F force to form a conductor pattern 35c.

By laminating [0040] or more sheets 31A to 31F, becomes an inductance element L is perpendicular with convolutions axis radiation plate 20, also LC resonant circuit forces the capacitance element C is connected to the inductance element L and the series feeder circuit 16 is obtained. Capacitor electrodes 34a is connected to the connection electrode 32 via the via-hole conductors 33a, further connected to the wireless IC chip 5 via a solder bump 6, an inductance element L of the one end of electrodes for connection via-hole conductor 33b 32 is connected to, is further connected to the wireless IC chip 5 via solder bumps 6.

[0041] action of such LC series resonance circuit power becomes the feeder circuit 16 is the the same as that LC series resonance circuit forces also feed circuit 16, so the same effect as essentially the first embodiment. In particular, in the seventh embodiment, a coil-shaped electrode pattern Ru Therefore convolutions axis is formed perpendicular to the radiating plate 2 0, the transmission efficiency of signal energy flux component is increased in the radiation plate 20 improved gain in size, and, has the advantage cormorants, Ru.

[0042] (Eighth Embodiment, see FIG. 13)

Wireless IC device lh is the eighth embodiment, as shown as an equivalent circuit in FIG. 13, the radiation plate 20 the seventh convolutions width of the coil-shaped electrode pattern of the inductance element L as shown in Example (coil diameter) toward mosquito ゝ go-between to the one in which was gradually larger. Other components are similar to those of the seventh embodiment.

[0043] The present eighth embodiment exerts the same effects as the seventh embodiment, Karoete, convolutions width of the coil-shaped electrode pattern of the inductance element L (coil diameter) gradually toward the radiation plate 20 because it is larger, thereby improving the signal transmission efficiency.

[0044] (Ninth Embodiment, see FIG. 14 and FIG. 15)

A wireless IC device li a ninth embodiment, as shown as an equivalent circuit in FIG. 14, a dipole Rutaipu, which feeder circuit 16 a which is also a pair of LC series resonant circuits force to the power supply circuit board 10, and 16b were built it is.

[0045] feeding circuit board 10, specifically, as shown in FIG. 15, the laminated dielectric mosquitoes ゝ Ranaru flexible sheet 41A~41F such as polyimide Ya liquid crystal polymer, which was adhered, the connection electrodes 42 a sheet 41A forming the via-hole conductors 43a, sheet over preparative 41B forming the capacitor electrode 44a, the capacitor electrode 44b and the sheet 41C forming a via hole conductor 43 b, the conductor patterns 45a and via-hole conductors 43c formed sheets 41D (a plurality Like), the sheet 41E (a plurality of forming a conductor pattern 45b and via-hole conductors 43d), comprising sheet Ichiboku 41F force et al forming the conductor pattern 45 c.

By laminating [0046] or more sheets 41a to 41f, becomes the inductance element L is perpendicular with convolutions axis radiation plate 20, also LC resonant circuit forces the capacitance element C is connected to the inductance element L and the series feed circuit 16a, 16b is obtained. Capacitor electrodes 44a is connected to the connection electrode 42 via the via-hole Le conductors 43a, is further connected to the radio IC Chi-up 5 via solder bumps.

[0047] Such a pair of LC series resonant circuits force also feed circuit 16a, the action of 16b is similar to the feeder circuit 16 composed of the LC series resonant circuits, basically the same as those of the first and seventh embodiment functions and effects of.

[0048] (Tenth Embodiment, see FIG. 16)

Wireless IC device lj is the tenth embodiment, as shown in FIG. 16, in which the feeding circuits 56 on the surface of a flexible power supply circuit board 50 made of heat-resistant 榭脂 comprising coil-shaped electrode pattern force is there. Both end portions of the power supply circuit 56 is directly connected through a wireless IC chip 5 and solder bumps, the power supply circuit board 50 are adhered by adhesives on the film 21 for holding the radiation plate 20. The conductor patterns 56a to intersect with each other to constitute a power supply circuit 56, 56b, 56c are separated by an insulating film (not shown).

[0049] In the wireless IC device lj is the tenth embodiment, the feed circuit 56 are magnetically coupled to the primary and the radiation plate 20. Therefore, supplies in the same manner as in the above embodiment, a high-frequency signal Isa release from a reader-writer is received by the radiation plate 20, the feed circuit 56 to resonate, only a reception signal in a predetermined frequency band to the wireless IC chip 5 . On the other hand, extracts predetermined E energy from the reception signal, a is the memory in! / ヽ Ru information this energy to the wireless IC chip 5 as a drive source, matched to a predetermined frequency at the power feeding circuit 56, the power supply circuit 56 inductance element, transmitted a transmission signal to the radiating plate 20 via magnetic coupling to transmit ¾5 from the radiation plate 20 to the reader writer.

[0050] Then, similarly to the first embodiment before Symbol feeder circuit 56 in that provided on the feeder circuit board 50 of a small area, a good positioning precision, depending on the wireless IC chip 5 and solder bumps it is possible to connect.

[0051] (Eleventh Embodiment, see FIG. 17 and FIG. 18)

Wireless IC device lk is the eleventh embodiment, as shown in FIG. 17, in which a built-in Koi Le shaped electrode pattern of the feeder circuit 56 to the power supply circuit board 50. Power supply circuit board 50, as shown in FIG. 18, the laminated dielectric strength becomes flexible sheet over preparative 51A~51D such as polyimide Ya liquid crystal polymer, which was adhered, form forming the connection electrodes 52 and via-hole conductors 53a sheets 51 a, the conductor patterns 54a and via-hole conductors 53b, the sheet 51C was formed sheet 5 1B forming the 53c, the conductor pattern 54b, made of plain sheet 5 ID (plurality).

[0052] The above sheet feeding circuit board 50 incorporating a coiled feeding circuit 56 by laminating a sheet 51A~51D is obtained, the connection electrode 52 is solder van flop 6 located at both ends of the feeder circuit 56 It is connected to the wireless IC chip 5 via. Then, effects of the 11th embodiment is similar to the previous SL tenth embodiment.

[0053] (Other embodiments)

The wireless IC device according to the present invention is the limited to the embodiments can be modified in various ways within the scope of the invention that Nag.

[0054] For example, the internal structure of the details of the feeder circuit board, detailed shape of the radiation plate Ya 榭脂 films is arbitrary. Moreover, to connect the wireless IC chip on the feeder circuit board may be used the process of the solder bump except.

[0055] Further, in each of the foregoing embodiments, the force feeder circuit board feeder circuit board showed an example of directly bonded to the radiation plate is disposed at a position close to the radiation plate, also, .

BACKGROUND OF THE

[0056] As described above, the present invention is useful for a wireless IC device used in the RFID system, in particular, a wireless IC chip can be easily and accurately mounted, excellent in resonance frequency characteristics are not changed ing.

Claims

The scope of the claims
[1] and the wireless IC chip,
Is constituted by a flexible substrate, it said has a wireless IC chip is mounted, and a feed circuit board having a feed circuit before SL connected to the wireless IC chip,
Are placed or arranged close directly on the feeder circuit board, and the power supply circuit and the electromagnetic field coupled radiation plate,
Wireless IC device characterized by comprising a.
[2] and the wireless IC chip formed by a flexible semiconductor,
The wireless IC chip is mounted, and the feeder circuit board with connected feed circuit to the wireless IC chip,
Are placed or arranged close directly on the feeder circuit board, and the power supply circuit and the electromagnetic field coupled radiation plate,
Wireless IC device characterized by comprising a.
[3] The power supply circuit board is a wireless IC device according to claim 2, characterized in that a flexible substrate.
[4] The resonant frequency of signals radiated from the radiation plate is substantially equivalent to the self-resonance frequency of the power supply circuit,
Maximum gain of the signal, the size of the power supply circuit, shape, substantially determined by that at least one of the distance and the medium between the feeder circuit and the radiation plate,
Range first of claims, wherein the teeth of the third term, the wireless IC device Zureka 〖this description.
[5] The wireless IC device according to claim 4 to feature the electrical length of the radiating plate is an integer multiple of a half wavelength at the resonant frequency.
[6] The flexible substrate is a claim 1, wherein characterized by comprising an organic material force
V, the teeth of the fifth term, the wireless IC device according to any misalignment.
[7] The radiation plate is formed by a flexible metal film, it ranges first of claims, wherein Rukoto, the teeth of paragraph 6, the wireless IC device according to any misalignment.
[8] The flexible metal film is retained in the flexible film, the wireless IC device according to claim 7, wherein Rukoto.
[9] The scope of the claims the feed circuit board which Ri multilayer substrate der formed by laminating a plurality of dielectric layers or magnetic layers, the power supply circuit is characterized in that it is built in the multilayer board
1 Section of the teeth of Section 8, the wireless IC device according to any misalignment.
[10] the power supply circuit, the wireless IC device according to claim 9, characterized in that it is constituted by the inductance element built in the multilayer board and a capacitor emission scan element force becomes LC resonant circuit.
[11] The wireless IC device according to item 10 claims the inductance element that is formed of a conductive material mosquito ゝ Ranaru coil-shaped electrode pattern and said ヽ Rukoto.
[12] The coil-shaped electrode pattern, the convolutions axis is substantially parallel to said radiating plate
V, the wireless IC device according to claim 11, wherein Rukoto.
[13] The coil-shaped electrode pattern, the convolutions axis is substantially vertically formed and the radiating plate
V, the wireless IC device according to claim 11, wherein Rukoto.
[14] The coil-shaped electrode pattern, the wireless IC device according to claim 13, characterized in that the convolutions width is directed force connexion gradually larger to the radiation plate.
PCT/JP2007/050309 2006-01-19 2007-01-12 Radio ic device WO2007083575A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006011626 2006-01-19
JP2006-011626 2006-01-19
JP2006238373 2006-09-01
JP2006-238373 2006-09-01

Applications Claiming Priority (1)

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JP2007531524A JP4123306B2 (en) 2006-01-19 2007-01-12 Wireless ic device

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WO (1) WO2007083575A1 (en)

Cited By (76)

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