JP2002183690A - Noncontact ic tag device - Google Patents

Noncontact ic tag device

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Publication number
JP2002183690A
JP2002183690A JP2000376040A JP2000376040A JP2002183690A JP 2002183690 A JP2002183690 A JP 2002183690A JP 2000376040 A JP2000376040 A JP 2000376040A JP 2000376040 A JP2000376040 A JP 2000376040A JP 2002183690 A JP2002183690 A JP 2002183690A
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Japan
Prior art keywords
coil
non
formed
ic tag
contact ic
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JP2000376040A
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Japanese (ja)
Inventor
Ryuzo Fukao
Tomonori Kanai
Yuji Kikuchi
隆三 深尾
裕二 菊地
友範 金井
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Hitachi Maxell Ltd
日立マクセル株式会社
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Priority to JP2000376040A priority Critical patent/JP2002183690A/en
Publication of JP2002183690A publication Critical patent/JP2002183690A/en
Application status is Withdrawn legal-status Critical

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Abstract

PROBLEM TO BE SOLVED: To provide a noncontact IC tag device having a large communication distance in a slender shape by optimizing a winding pattern of a booster coil. SOLUTION: This noncontact IC tag device is formed of an IC element 2 integrally formed with an antenna coil 1, the booster coil 3, an insulating member 5 for forming capacitance connecting pads 4a and 4b, a chip capacitor 6 connected to the capacitance connecting pads 4a and 4b, and a base body 7 for integrally casing these IC element 2, chip capacitor 6, and insulating member 5. The booster coil 3 is composed of a first coil 3a, mainly electromagnetically coupled with the antenna coil 1 integrally formed in the IC element 2, and a second coil 3b mainly electromagnetically coupled with an antenna coil provided in an unillustrated reader writer, and the first coil 3a is formed outside a forming area of the second coil 3b. The outer diameter of the first coil 3a is formed larger than an inner diameter of the second coil 3b. The outer peripheral end of these respective coils 3a and 3b is connected on the surface side of the insulating member 5, and the inner peripheral end is connected via a lead 15 and through holes 16 and 17 formed on the reverse side of the insulating member 5.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、アンテナコイルが一体形成されたIC素子とブースタコイルとを有する非接触ICタグ装置に係り、特に、一辺の幅が狭い細長形の非接触ICタグ装置に好適なブースタコイルの構成に関する。 The present invention relates to relates to a non-contact IC tag system having an IC element and the booster coil antenna coil are integrally formed, in particular, the non-contact IC tag system width of one side is narrow elongated It relates to a structure suitable booster coil.

【0002】 [0002]

【従来の技術】従来より、絶縁性の基体内にIC素子と当該IC素子の端子部に電気的に接続されたアンテナコイルとを備え、リーダライタからの電力の受給及びリーダライタとの間のデジタル信号の送受信を電磁波を用いて非接触で行う非接触式のタグ装置が知られている。 BACKGROUND ART Conventionally, an electrically connected antenna coil to the terminal section of the IC element and the IC element on an insulating the substrate, between the power receiving and writer of the reader-writer non-contact tag device for transmitting and receiving digital signals in a non-contact manner using electromagnetic waves is known.

【0003】従来、この種の非接触ICタグ装置としては、アンテナコイルを絶縁部材にパターン形成したもの、或いは、巻線からなるアンテナコイルを絶縁部材に担持したものが用いられているが、近年に至って、アンテナコイルとIC素子との接続点の保護処理や防湿対策が不要で安価に作成できること、及び絶縁部材に曲げやねじれ等のストレスが作用した場合にもコイルに断線を生じることがなく耐久性に優れることなどから、IC素子自体にアンテナコイルが一体形成されたIC素子を絶縁部材上に搭載したものが提案されている。 Conventionally, as the non-contact IC tag system of this kind, an antenna coil that is patterned on the insulating member, or, but those carrying an antenna coil made of winding insulation member is used, in recent years reached, the protection process and moisture protection at the connection point between the antenna coil and the IC element can be created unnecessary at low cost, and without causing breakage in the coil even if stress such as bending or twisting the insulating member is applied etc. is excellent in durability, the antenna coil in the IC device itself has been proposed that an IC element which is integrally formed on an insulating member.

【0004】アンテナコイルをIC素子に一体形成した場合、アンテナコイルを絶縁部材にパターン形成したり、巻線からなるアンテナコイルを絶縁部材に担持する場合に比べて、コイルの巻径や導体幅が小さくなり、巻数についても自ずと限界があるため、リーダライタとの間の通信距離を大きくすることが困難で、必要な通信距離を確保することできない場合がある。 [0004] When formed integrally antenna coil in the IC device, the antenna coil or a pattern formed in the insulating member, as compared with the case of carrying the antenna coil made of winding insulation member, the winding diameter and the conductor width of the coil decreases, since there naturally is a limit for the number of turns, it is difficult to increase the communication distance between the reader-writer, it may not be possible to secure the necessary communication distance. そこで、従来より、特開平10−506740号公報等に記載されているように、IC素子に一体形成されたアンテナコイルとリーダライタに備えられたアンテナコイルとの間に、各アンテナコイル間の電磁誘導結合を強化するための導体ループを配置する技術が提案されている。 Therefore, conventionally, as disclosed in JP-A-10-506740 Patent Publication, between the antenna coil provided in the antenna coil and the reader-writer which is integrally formed on the IC element, electromagnetic between the antenna coil technique of placing a conductor loop for enhancing the inductive coupling has been proposed.

【0005】なお、本明細書においては、このアンテナコイル間の電磁結合を強化するための導体ループを、 [0005] In this specification, the conductor loop to enhance the electromagnetic coupling between the antenna coil,
「ブースタコイル」という。 It referred to as a "booster coil".

【0006】前記公知例に記載のブースタコイルは、I [0006] The booster coil according to the known example, I
C素子に一体形成されたアンテナコイルとほぼ同一寸法に形成され、IC素子に一体形成されたアンテナコイルと主に電磁結合する第1コイルと、当該第1コイルと電気的に接続され、絶縁部材の寸法範囲で当該第1コイルよりも大型に形成されて、リーダライタに備えられたアンテナコイルと主に電磁結合する1ターンの第2コイルとを有する構成になっている。 Is formed on substantially the same dimensions as the integrally formed with an antenna coil C element, a first coil which mainly electromagnetically coupled to the antenna coil which is integrally formed on the IC element, is connected the first to coil and electrically insulating member than the first coil size range are formed in large, it has a structure and a second coil of one turn which mainly electromagnetically coupled to the antenna coil provided in the reader-writer. 本構成のブースタコイルを用いることによって、非接触ICタグ装置とリーダライタとの間の通信距離を数cmにすることができる。 By using the booster coil of this configuration, the communication distance between the non-contact IC tag system and the reader-writer can be a few cm.

【0007】 [0007]

【発明が解決しようとする課題】ところで、非接触IC The object of the invention is to be Solved by the way, the non-contact IC
タグ装置は、交通、流通及び情報通信などの各分野で普及が進んでおり、通信距離の拡大が強く求められていると共に、各種の形状及び各種サイズのものが求められている。 Tag device, transportation, and they have become widespread in various fields such as distribution and telecommunications, along with the expansion of the communication distance is a strong demand, that a variety of shapes and various sizes are required.

【0008】通信距離の拡大を図るためには、IC素子に一体形成されたアンテナコイルと主に電磁結合する第1コイル及びリーダライタに備えられたアンテナコイルと主に電磁結合する第2コイルの巻数を多くすること、 In order to expand the communication distance, the second coil which mainly electromagnetically coupled to the antenna coil provided in the first coil and the reader-writer which mainly electromagnetically coupled to the antenna coil which is integrally formed on the IC element possible to increase the number of turns,
並びに、第1コイルのサイズを最適化することが必要不可欠であるが、従来のように第1コイルの外周に第2コイルを配置するという構成によると、例えばCD収納ボックスのインデックス部分に装着されるような一辺の長さが6mm程度の非接触ICタグ装置に適用した場合、 And, although it is essential to optimize the size of the first coil, the the outer periphery of the first coil as in the prior art due to the configuration of arranging the second coil, for example, is mounted on the index portion of the CD storage box If the length of the so that a side is applied to the non-contact IC tag system of about 6 mm,
第1コイル及び第2コイルの巻数を増加することが難しく、通信距離の拡大を図ることができない。 It is difficult to increase the number of turns of the first coil and the second coil, it is impossible to expand the communication distance. また、本願発明者らの実験によると、第1コイルの直径(矩形スパイラル状の第1コイルについては、一辺の長さ)は、I Further, according to experiments of the present inventors, (the first coil rectangular spiral, the length of one side) the diameter of the first coil, I
C素子に一体形成されたアンテナコイルの直径の2〜3 2-3 the diameter of the antenna coil which is integrally formed on the C element
倍にした場合の方が同一径にした場合よりも良好な通信特性が得られることが確認されており、このような事情から第1コイルの直径を大型化すると、それに伴って第2コイルを形成するためのスペースが小さくなるため、 Fold towards have good communication characteristics were confirmed to be obtained than when the same diameter in the case of, when the size of the diameter of the first coil such circumstances, a second coil with it since the space for forming is reduced,
第2のコイルの巻数が減少して、やはり通信距離の拡大を図ることが困難になる。 And the number of turns of the second coil is reduced, also it is difficult to expand the communication distance.

【0009】本発明は、かかる従来技術の不備を解決するためになされたものであって、その課題は、ブースタコイルの巻線パターンを最適化し、細長形にして通信距離が大きい非接触ICタグ装置を提供することにある。 [0009] The present invention was made to solve the deficiencies of the prior art, and an object thereof is to optimize the winding pattern of the booster coil, the non-contact IC tag is larger communication distance in the elongated to provide an apparatus.

【0010】 [0010]

【課題を解決するための手段】本発明は、前記の課題を解決するため、第1に、アンテナコイルが一体形成されたIC素子と、前記IC素子に一体形成されたアンテナコイルとリーダライタに備えられたアンテナコイルとの電磁結合を強化するブースタコイルと、これらIC素子及びブースタコイルを担持する絶縁部材とを備えた非接触ICタグ装置において、前記ブースタコイルを、前記IC素子に一体形成されたアンテナコイルと主に電磁結合する第1コイルと、当該第1コイルと電気的に接続され、前記リーダライタに備えられたアンテナコイルと主に電磁結合する第2コイルとから構成し、前記第1コイルの外径を前記第2コイルの内径よりも大きく形成するという構成にした。 The present invention SUMMARY OF THE INVENTION In order to solve the above problems, the first, the IC element antenna coil are integrally formed, the antenna coil and the reader-writer which is integrally formed on the IC element and the booster coil to enhance electromagnetic coupling between the antenna coil provided in the non-contact IC tag system that includes a dielectric member for carrying these IC elements and the booster coil, the booster coil, is integrally formed on the IC element a first coil which mainly electromagnetically coupled to the antenna coil, connected to the electrical and the first coil, and composed of a second coil mainly electromagnetically coupled to the antenna coil provided in the reader-writer, the first the outer diameter of the first coil has a configuration that greatly than the inner diameter of the second coil.

【0011】このように、ブースタコイルを、IC素子に一体形成されたアンテナコイルと主に電磁結合する第1コイルと、当該第1コイルと電気的に接続され、リーダライタに備えられたアンテナコイルと主に電磁結合する第2コイルとから構成し、第1コイルの外周を第2コイルの内周よりも大きく形成すると、第2コイルの巻数を減少することなく、第1コイルの巻径の拡大を図ることができるので、非接触ICタグ装置の通信距離を拡大することができる。 [0011] In this manner, the booster coil, the first coil which mainly electromagnetically coupled to the antenna coil which is integrally formed on the IC element, is electrically and the first coil connected, an antenna coil provided in the reader-writer and mainly composed of a second coil electromagnetically coupled, when the outer periphery of the first coil greatly than the inner periphery of the second coil, without reducing the number of turns of the second coil, the first coil winding diameter it is possible to expand, it is possible to expand the communication distance of the non-contact IC tag system.

【0012】本発明は、前記の課題を解決するため、第2に、前記絶縁基板の表面に前記第2コイルを渦巻き状に形成し、当該絶縁基板の表面の前記第2コイルの内部に前記第1コイルの一部を渦巻き状に形成すると共に、 The present invention is to solve the above problems, the second, the second coil on the surface of the insulating substrate is formed in a spiral shape, the inside of the second coil of the surface of the insulating substrate with a portion of the first coil is formed in a spiral shape,
前記絶縁基板の裏面に前記第1コイルの他の一部を渦巻き状に形成し、当該第1コイルの他の一部の外周を前記第2コイルの内周よりも大きく形成するという構成にした。 Wherein a portion of the other of said first coil on the back surface of the insulating substrate is formed in a spiral shape, and the other part of the outer periphery of the first coil configuration that larger than the inner circumference of the second coil .

【0013】このように、第1コイルを絶縁基板の第2 [0013] The second In this way, the first coil insulating substrate
コイル形成面側に形成される部分とその裏面に形成される部分とから構成すると、絶縁基板の裏面に形成される部分については、第2コイルのサイズに関係なく、絶縁基板の面積の範囲で自由に形成することができるので、 When composed of a portion formed in a portion and its rear surface is formed into a coil forming surface, portions are formed on the back surface of the insulating substrate, regardless of the size of the second coil, in a range of area of ​​the insulating substrate it is possible to freely form,
第1コイルの直径及び巻数の増加を図ることができて、 And it is possible to achieve an increase in the diameter and number of turns of the first coil,
非接触ICタグ装置の通信距離を拡大することができる。 It is possible to expand the communication distance of the non-contact IC tag system.

【0014】本発明は、前記の課題を解決するため、第3に、前記絶縁基板の表面に前記第2コイルを渦巻き状に形成し、当該絶縁基板の表面の前記第2コイルの外部に前記第1コイルを渦巻き状に形成すると共に、前記絶縁基板の裏面に前記第1コイルと前記第2コイルとを接続するリードを形成するという構成にした。 [0014] The present invention is to solve the above problems, the third, the second coil on the surface of the insulating substrate is formed in a spiral shape, the outside of the second coil of the surface of the insulating substrate with the first coil is formed in a spiral shape, and a configuration of forming a lead that connects the first coil and the second coil on the back surface of the insulating substrate.

【0015】このように、第2コイルの外部に第1コイルを形成すると、絶縁基板の表面における第1コイルの形成エリアと第2コイルの形成エリアとを分離することができ、第1コイルを第2コイルのサイズに関係なく、 [0015] Thus, by forming the first coil to the outside of the second coil, it is possible to separate the formed area of ​​the first coil on the surface of the insulating substrate and the formation area of ​​the second coil, the first coil regardless of the size of the second coil,
絶縁基板の面積の範囲で自由に形成することができるので、第1コイルの直径及び巻数の増加を図ることができて、非接触ICタグ装置の通信距離を拡大することができる。 Can be freely formed in a range of area of ​​the insulating substrate, it is possible to be able to achieve an increase in the diameter and number of turns of the first coil, to expand the communication distance of the non-contact IC tag system.

【0016】本発明は、前記の課題を解決するため、第4に、前記第1コイルと第2コイルとの間に静電容量を直列に挿入するという構成にした。 [0016] The present invention is to solve the above problems, the fourth, and the configuration of inserting a capacitance in series between the first coil and the second coil.

【0017】このように、第1コイルと第2コイルとの間に静電容量を直列に挿入すると、これら第1コイル及び第2コイルから構成されるブースタコイルのインダクタンスをL、挿入された静電容量のキャパシタンスをC [0017] Thus, when the electrostatic capacitance between the first coil and the second coil inserted in series, L an inductance of the booster coil composed of these first and second coils, the inserted static C the capacitance of the capacitance
としたとき、f0=1/{2π√(LC)}で表される所要の周波数で非接触ICタグ装置を共振させることができるので、非接触ICタグ装置の通信距離を拡大することができる。 When a was, it is possible to resonate the non-contact IC tag system at a predetermined frequency represented by f0 = 1 / {2π√ (LC)}, it is possible to expand the communication distance of the non-contact IC tag system .

【0018】本発明は、前記の課題を解決するため、第5に、前記絶縁基板の表面に前記第2コイルを渦巻き状に形成し、当該絶縁基板の表面の前記第2コイルの外部に前記第1コイルを渦巻き状に形成すると共に、前記絶縁基板の裏面に、前記絶縁基板の表面側から見て巻線方向が前記第2コイルと逆向きの導線を前記第2コイルと対向に形成するという構成にした。 [0018] The present invention is to solve the above problems, the fifth, the second coil on the surface of the insulating substrate is formed in a spiral shape, the outside of the second coil of the surface of the insulating substrate with the first coil is formed in a spiral shape, wherein the back surface of the insulating substrate, wherein the winding directions when viewed from the surface side of the insulating substrate to form said second lead of the coil and opposite to the counter and the second coil It was the configuration that.

【0019】このように、第2コイルの外部に第1コイルを形成すると、絶縁基板の表面における第1コイルの形成エリアと第2コイルの形成エリアとを分離することができ、第1コイルを第2コイルのサイズに関係なく、 [0019] Thus, by forming the first coil to the outside of the second coil, it is possible to separate the formed area of ​​the first coil on the surface of the insulating substrate and the formation area of ​​the second coil, the first coil regardless of the size of the second coil,
絶縁基板の面積の範囲で自由に形成することができるので、第1コイルの直径及び巻数の増加を図ることができて、非接触ICタグ装置の通信距離を拡大することができる。 Can be freely formed in a range of area of ​​the insulating substrate, it is possible to be able to achieve an increase in the diameter and number of turns of the first coil, to expand the communication distance of the non-contact IC tag system. また、絶縁基板を介して第2コイルを構成する導体と他の導体とを対向に形成すると、これらの各導体間に静電容量が形成されるので、チップコンデンサ等の搭載を省略することができ、非接触ICタグ装置の薄形化及び低コスト化を図ることができる。 Further, when forming the conductor and other conductors constituting the second coil through the insulating substrate to the opposite, the electrostatic capacitance is formed between each of these conductors, it is possible to omit the mounting such as a chip capacitor can, it is possible to slim and cost of the non-contact IC tag system.

【0020】本発明は、前記の課題を解決するため、第6に、前記第1コイル及び/又は第2コイルの一辺の長さを5mmとし、前記ブースタコイルの長さを50mm [0020] The present invention is to solve the above problems, the sixth, the length of one side of the first coil and / or the second coil and 5 mm, 50 mm length of the booster coil
に形成するという構成にした。 And the configuration of forming the.

【0021】このように、第1コイル及び/又は第2コイルの一辺の長さを5mmとし、これら第1コイル及び第2コイルで構成されるブースタコイルの長さを50m [0021] Thus, the length of one side of the first coil and / or the second coil and 5 mm, 50 m length of the composed booster coil by these first and second coils
mに形成すると、例えばCD収納ボックスのインデックス部分に装着可能な一辺の長さが5〜6mm程度の非接触ICタグ装置を得ることができる。 When formed in m, for example, the length of which can be mounted side index portion of the CD storage box can be obtained non-contact IC tag system of about 5 to 6 mm.

【0022】本発明は、前記の課題を解決するため、第7に、前記第1コイルの一辺の長さを前記IC素子に一体形成されたアンテナコイルの一辺の長さの2倍乃至3 [0022] The present invention is to solve the above problems, the 7, the first coil of one side of the length of one side of the antenna coil which is integrally formed on the IC element length of 2 fold to 3
倍に形成するという構成にした。 And the configuration of forming doubled.

【0023】このように、第1コイルの一辺の長さをI [0023] Thus, the length of one side of the first coil I
C素子に一体形成されたアンテナコイルの一辺の長さの2倍乃至3倍に形成すると、第1コイルとIC素子に一体形成されたアンテナコイルとの電磁結合の範囲が広がるので、非接触ICタグ装置の製造工程において、第1 When formed in two times to three times the integral formed antenna coil length of one side of the C-element, the range of the electromagnetic coupling between the antenna coil formed integrally with the first coil and the IC element widens, the non-contact IC in the manufacturing process of the tag device, the first
コイルの形成位置に対するIC素子の設定位置がずれた場合や、第1コイルの形状又は導体幅にばらつきを生じた場合にも、第1コイルに生じる誘導起電力の低下を少なくすることができ、通信特性のばらつきが小さい非接触ICタグ装置を得ることができる。 And if the set position of the IC elements on the formation position of the coil is shifted, even when occurring a variation in the shape or the conductor width of the first coil, it is possible to reduce the decrease in the induced electromotive force generated in the first coil, can be variations in communication characteristics get smaller non-contact IC tag system.

【0024】 [0024]

【発明の実施の形態】〈第1実施形態例〉第1実施形態例に係る非接触ICタグ装置を、図1乃至図4に基づいて説明する。 DETAILED DESCRIPTION OF THE INVENTION The non-contact IC tag system according to the <First embodiment> The first embodiment will be described with reference to FIGS. 図1は第1実施形態例に係る非接触ICタグ装置の断面図、図2は第1実施形態例に係る非接触I Figure 1 is a sectional view of the non-contact IC tag system according to a first embodiment, FIG. 2 is a contactless I according to the first embodiment
Cタグ装置に備えられる絶縁部材の表面図、図3は第1 Surface view of an insulating member provided in the C tag device, Fig 3 is the first
実施形態例に係る非接触ICタグ装置に備えられる絶縁部材の表面側から裏面側を見た透視図、図4は第1実施形態例に係る非接触ICタグ装置に搭載されるIC素子の斜視図である。 Perspective view of the back side from the front surface side of the non-contact IC tag device provided is an insulating member according to an embodiment, FIG. 4 is a perspective of the IC element mounted on the non-contact IC tag system according to a first embodiment it is a diagram.

【0025】図1に示すように、本例の非接触ICタグ装置は、アンテナコイル1が一体形成されたIC素子2 As shown in FIG. 1, the non-contact IC tag system of the present embodiment, IC device 2 antenna coil 1 is integrally formed
と、ブースタコイル3及び静電容量接続パッド4a,4 When the booster coil 3 and the capacitance connection pads 4a, 4
bが形成された絶縁部材5と、前記静電容量接続パッド4a,4bに接続されたチップコンデンサ6と、これらIC素子2、チップコンデンサ6及び絶縁部材5を一体にケーシングする基体7とからなる。 b and the insulating member 5 is formed, consisting of the capacitive connection pads 4a, a chip capacitor 6 connected to 4b, these IC devices 2, a chip capacitor 6 and the insulating member 5 Metropolitan substrate 7 to the casing together .

【0026】IC素子2は、図4に示すように、入出力端子2aの形成面に、ポリイミド樹脂膜等からなる絶縁層2bを介して矩形スパイラル状のアンテナコイル1を一体に形成してなる。 The IC element 2, as shown in FIG. 4, the forming surface of the input and output terminals 2a, formed by integrally formed a rectangular spiral antenna coil 1 via an insulating layer 2b made of a polyimide resin film or the like . アンテナコイル1は、フォトレジスト法、即ち、IC素子2の絶縁層2b上に導電性金属材料をスパッタリング又は真空蒸着し、IC素子2(より実際的には、個々のIC素子に分割される以前の完成ウエハ)の絶縁層形成面に、フォトレジスト層を均一の厚さに形成し、このフォトレジスト層に所要のコイルパターンを露光・現像した後、フォトレジスト層をマスクとしてエッチングし、しかる後に、フォトレジスト層を除去して入出力端子4aの形成面に導電性金属材料からなるコイルパターンを形成するといった方法で形成することができる。 The antenna coil 1, a photoresist method, i.e., a conductive metal material on the insulating layer 2b of the IC element 2 by sputtering or vacuum deposition, IC element 2 (in more practical, the previously divided into individual IC element forming an insulating layer surface of the finished wafer) of a photoresist layer to a uniform thickness, after exposure and development the required coil pattern the photoresist layer, etching the photoresist layer as a mask, and thereafter it can be formed in such a way to form a coil pattern made of a conductive metal material forming surface of the input-output terminals 4a by removing the photoresist layer. なお、コイルパターンの電気抵抗を減少するため、導電性金属膜の表面に銅めっき層を形成することもできる。 In order to reduce the electrical resistance of the coil patterns, it is also possible to form a copper plating layer on the surface of the conductive metal film.

【0027】なお、図4の例では、アンテナコイル1が複数のターン数を有する矩形スパイラル状に形成されているが、当該アンテナコイル1のターン数や平面形状はこれに限定されるものではない。 [0027] In the example of FIG. 4, the antenna coil 1 is formed in a rectangular spiral shape having a number of plurality of turns, not the number of turns and the planar shape of the antenna coil 1 is not limited to this . 即ち、ターン数に関しては、1ターン以上の任意のターン数とすることができ、平面形状に関しては、角部に斜線状又は円弧状の面取りが施された矩形や円形など、任意の形状に形成できる。 That is, with respect to the number of turns, can be any number of turns of one or more turns, with respect to the planar shape, the hatched-like or arc-shaped chamfer and a rectangle or a circle which has been subjected to the corners, formed into any shape it can.

【0028】ブースタコイル3は、図2及び図3に示すように、IC素子2に一体形成されたアンテナコイル1 The booster coil 3, as shown in FIGS. 2 and 3, the antenna coil 1 which is integrally formed on the IC element 2
と主に電磁結合する第1コイル3aと、当該第1コイル3aと電気的に接続され、図示しないリーダライタに備えられたアンテナコイルと主に電磁結合する第2コイル3bとから構成されており、前記第1コイル3aは、絶縁部材5の表面側に前記第2コイル3bと共に形成された表面側第1コイル3a と、絶縁部材5の裏面側に形成された裏面側第1コイル3a とから構成されている。 A first coil 3a which mainly electromagnetically coupled with, connected the the electrically first coil 3a, which is composed of a second coil 3b which mainly electromagnetically coupled to the antenna coil provided in the reader-writer (not shown) the first coil 3a includes a surface-side first coil 3a 1 formed with the second coil 3b on the surface side of the insulating member 5, the insulating member 5 in the back side formed the back side first coil 3a 2 It is composed of a. ブースタコイル3のターン数を増加し、非接触I Increasing the number of turns of the booster coil 3, the contactless I
Cタグの通信距離を拡大するため、ブースタコイル3を構成する導線の導線幅は100μm、導線間のスペース幅は150μm程度にすることが好ましい。 To expand the communication distance C tag, conductor width of the conductor constituting the booster coil 3 is 100 [mu] m, the space width between wires is preferably set to about 150 [mu] m.

【0029】前記第2コイル3bは、図示しないリーダライタに備えられたアンテナコイルとの間の良好な電磁誘導結合を確保するため、絶縁部材5の平面積の範囲内でなるべく大型に形成される。 [0029] The second coil 3b may be formed to ensure good electromagnetic induction coupling between the antenna coil provided in the reader-writer, not shown, to the possible large within the plane area of ​​the insulating member 5 . 例えば、一辺の長さが6 For example, a side length of 6
mm程度のCD収納ボックスのインデックス部分に装着される非接触ICタグ装置については、前記第2コイル2bは、短辺の長さが5mmで、長辺の長さが50mm Non-contact IC tag device attached to the index portion of the mm order of CD storage box, said second coil 2b is the length of the short side of 5 mm, a length of the long side 50mm
の矩形スパイラル状に形成される。 It is of a rectangular spiral. 表面側第1コイル3 Surface-side first coil 3
は、図2に示すように、前記第2コイル2bの内周部分に形成される。 a 1, as shown in FIG. 2, is formed in the inner peripheral portion of the second coil 2b. これに対して、裏面側第1コイル3a は、図3に示すように、その外径が前記第2コイル2bの短辺側の外径と同一寸法に形成され、裏面側第1コイル3a の外径が前記第2コイル2bの短辺側の内径よりも大きくなっている。 In contrast, the back side first coil 3a 2, as shown in FIG. 3, an outer diameter formed on the outer diameter and the same dimension of the short side of the second coil 2b, the back side first coil 3a the outer diameter of 2 is larger than the short side of the inner diameter of the second coil 2b. IC素子2は、図1 IC element 2, FIG. 1
及び図3に示すように、アンテナコイル1を裏面側第1 And FIG. 3, the back side first antenna coil 1
コイル3a と対向に向けて、絶縁部材5の裏面側に設定される。 Towards coil 3a 2 and the counter are set on the rear surface side of the insulating member 5. IC素子2は、一辺の長さが2mm程度の角形に形成されるため、一辺の長さが5mm程度の矩形スパイラル状に形成された裏面側第1コイル3a IC element 2, since the length of one side is formed in the square of approximately 2 mm, the back surface side length of one side is formed to about 5mm square spiral first coil 3a 2 は、 It is,
アンテナコイル1の外径の約2〜3倍になる。 It is about 2 to 3 times the outer diameter of the antenna coil 1.

【0030】表面側第1コイル3a の内周端と裏面側第1コイル3a の内周端は、スルーホール11を介して接続され、裏面側第1コイル3a の外周端と第2コイル3bの内周端はスルーホール12を介して接続される。 The inner peripheral end and the back-side first inner circumferential end of the coil 3a 2 of the first coil 3a surface 1 is connected via a through hole 11, the rear surface-side first outer peripheral end of the coil 3a 2 and the second the inner peripheral end of the coil 3b are connected via a through-hole 12. また、表面側第1コイル3a の外周端と第1の静電容量接続パッド4aは、スルーホール13を介して接続され、第2コイル3bの外周端と第2の静電容量接続パッド4bは、スルーホール14を介して接続される。 The outer peripheral end of the first capacitive connection pad 4a of the surface first coil 3a side 1 is connected through the through hole 13, the outer peripheral end of the second coil 3b and the second capacitance connected pads 4b It is connected via a through-hole 14.

【0031】なお、図1及び図3の例では、ブースタコイル3が複数のターン数を有する矩形スパイラル状に形成されているが、ブースタコイル3のターン数や平面形状はこれに限定されるものではなく、前述のアンテナコイル1と同様に、任意のターン数及び形状に形成することができる。 [0031] In the example of FIGS. 1 and 3, those booster coil 3 are formed in a rectangular spiral shape having a number of plurality of turns, the number of turns and the planar shape of the booster coil 3 is not limited to this rather, like the antenna coil 1 described above can be formed into any number of turns and shape.

【0032】チップコンデンサ6としては、IC素子2 [0032] as the chip capacitor 6, IC element 2
に一体形成されたアンテナコイル1及びブースタコイル3を含む系において、アンテナコイル1の両端に最大電圧が得られる静電容量をもつものが用いられる。 In the antenna coil 1 and system including a booster coil 3 which is integrally formed on, it is used those having a capacitance maximum voltage is obtained across the antenna coil 1.

【0033】絶縁部材5は、所要の誘電率と剛性とをもった絶縁材料をもって形成される。 The insulating member 5 may be formed with an insulating material having a desired dielectric constant and rigidity. 絶縁部材5を構成するに好適な絶縁材料としては、一例として、ガラスエポキシ樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリエチレンテレフタレート樹脂(以下、PETと略称する。) Suitable insulating material constituting the insulating member 5, as an example, a glass epoxy resin, polyimide resin, polyamide resin, polyethylene terephthalate resin (hereinafter, abbreviated as PET.)
又は塩化ビニル樹脂などを挙げることができる。 Or vinyl chloride resins.

【0034】基体7は、カバーシート8と接着剤層9とをもって構成される。 The substrate 7 is configured with a cover sheet 8 and the adhesive layer 9. このうち、カバーシート7は、紙やプラスチックシートなど、任意のシート状材料をもって形成することができるが、廃棄しても分解し、焼却してもダイオキシン等の有害物質を発生しないことから、 Of these, the cover sheet 7, such as paper or plastic sheet, since it can be formed with any sheet material, which be discarded decomposed, does not generate harmful substances such as dioxin even when incinerated,
紙をもって形成することが最も好ましい。 It is most preferable to form with paper. カバーシート材料としてプラスチックシートを用いる場合には、焼却してもダイオキシン等の有害物質を発生しないことから、PETのような塩素を含まないプラスチックシートを用いることが特に好ましい。 When using a plastic sheet as the cover sheet material, since it be incinerated without generating harmful substances such as dioxin, it is particularly preferable to use a plastic sheet that does not contain chlorine, such as PET. 一方、接着剤層9を構成する接着剤としては、硬化後に所要の硬度を有する任意の接着剤を用いることができるが、ブースタコイル1、 On the other hand, the adhesive which constitutes the adhesive layer 9, but may be any adhesive having the required hardness after curing, the booster coil 1,
アンテナコイル3及びIC素子4の保護効果を高めるため、例えばエポキシ樹脂のように吸湿性の低い樹脂材料を用いることが特に好ましい。 To enhance the protective effect of the antenna coil 3 and the IC element 4, particularly preferable to use a low resin material hygroscopicity, for example, as an epoxy resin.

【0035】前記第1実施形態例に係る非接触ICタグ装置は、絶縁部材5の表面側に第2コイル3bと表面側第1コイル3a とを形成し、絶縁部材5の裏面側に裏面側第1コイル3a を形成したので、裏面側第1 [0035] The non-contact IC tag system according to the first embodiment, the first to form a coil 3a 1 second coil 3b and the front side to the surface side of the insulating member 5, the rear surface on the rear surface side of the insulating member 5 since the formation of the side first coil 3a 2, backside first
コイル3a を第2コイル2bのサイズに関係なく絶縁部材5の平面積の範囲で自由に形成することができ、 The coil 3a 2 can be freely formed in a range of the flat area of the insulating member 5 regardless of the size of the second coil 2b,
第1コイル3aの直径及び巻数を増加できて、非接触I And can increase the diameter and number of turns of the first coil 3a, the contactless I
Cタグ装置の通信距離を拡大することができる。 It is possible to expand the communication distance C tag device. また、 Also,
前記第1実施形態例に係る非接触ICタグ装置は、第1 Non-contact IC tag according to the first embodiment device, the first
コイル3aと第2コイル3bとの間にチップコンデンサ6を直列に挿入したので、これら第1コイル3a及び第2コイル3bから構成されるブースタコイル3のインダクタンスをL、挿入されたチップコンデンサ6のキャパシタンスをCとしたとき、f0=1/{2π√(L Having inserted the chip capacitor 6 in series between the coil 3a and the second coil 3b, and the inductance of the booster coil 3 formed from these first coil 3a and second coil 3b L, inserted chip capacitor 6 when the capacitance was C, f0 = 1 / {2π√ (L
C)}で表される所要の周波数で非接触ICタグ装置を共振させることができて、非接触ICタグ装置の通信距離を拡大することができる。 And it is possible to resonate the non-contact IC tag system at a predetermined frequency represented by C)}, it is possible to expand the communication distance of the non-contact IC tag system. さらに、前記第1実施形態例に係る非接触ICタグ装置は、裏面側第1コイル3a Furthermore, the non-contact IC tag system according to the first embodiment, the rear surface-side first coil 3a
の外径をアンテナコイル1の一辺の長さの2倍乃至3倍に形成したので、第1コイル3aとアンテナコイル1との電磁結合の範囲を広げることができ、非接触IC Since the outer diameter of 2 to form double or triple the length of one side of the antenna coil 1 can widen the range of the electromagnetic coupling between the first coil 3a and the antenna coil 1, the non-contact IC
タグ装置の製造工程において、第1コイル3aの形成位置に対するIC素子2の設定位置がずれた場合や、第1 In the manufacturing process of the tag device, or if the setting position of the IC element 2 with respect to the formation position of the first coil 3a is shifted, the first
コイル3aの形状又は導体幅にばらつきを生じた場合にも、第1コイル3aに生じる誘導起電力の低下を少なくすることができ、通信特性のばらつきが小さい非接触I In case any variation in shape or the conductor width of the coil 3a also can reduce the decrease in the induced electromotive force generated in the first coil 3a, the non-contact variation in communication characteristics is small I
Cタグ装置を得ることができる。 It is possible to obtain a C-tag device.

【0036】〈第2実施形態例〉第2実施形態例に係る非接触ICタグ装置を、図5乃至図7に基づいて説明する。 [0036] The non-contact IC tag system according to the <Second embodiment> The second embodiment will be described with reference to FIGS. 5-7. 図5は第2実施形態例に係る非接触ICタグ装置の断面図、図6は第2実施形態例に係る非接触ICタグ装置に備えられる絶縁部材の表面図、図7は第2実施形態例に係る非接触ICタグ装置に備えられる絶縁部材の表面側から裏面側を見た透視図である。 Figure 5 is a sectional view of the non-contact IC tag system according to a second embodiment, FIG. 6 is a surface view of an insulating member provided to the contactless IC tag system according to a second embodiment, FIG. 7 is a second embodiment is a perspective view of the back side from the front surface side of the insulating member provided to the contactless IC tag system according to the embodiment.

【0037】図5に示すように、本例の非接触ICタグ装置も、アンテナコイル1が一体形成されたIC素子2 [0037] As shown in FIG. 5, or non-contact IC tag system of the present embodiment, IC device 2 antenna coil 1 is integrally formed
と、ブースタコイル3及び静電容量接続パッド4a,4 When the booster coil 3 and the capacitance connection pads 4a, 4
bが形成された絶縁部材5と、前記静電容量接続パッド4a,4bに接続されたチップコンデンサ6と、これらIC素子2、チップコンデンサ6及び絶縁部材5を一体にケーシングする基体7とからなる。 b and the insulating member 5 is formed, consisting of the capacitive connection pads 4a, a chip capacitor 6 connected to 4b, these IC devices 2, a chip capacitor 6 and the insulating member 5 Metropolitan substrate 7 to the casing together .

【0038】本例のブースタコイル3は、図6に示すように、IC素子2に一体形成されたアンテナコイル1と主に電磁結合する第1コイル3aと、図示しないリーダライタに備えられたアンテナコイルと主に電磁結合する第2コイル3bとが共に絶縁部材5の表面側に形成されている。 The booster coil in the present embodiment 3, as shown in FIG. 6, a first coil 3a which mainly electromagnetically coupled to the antenna coil 1 which is integrally formed on the IC element 2, the antenna provided in the reader-writer (not shown) a second coil 3b which mainly electromagnetically coupled to the coil are both formed on the surface side of the insulating member 5. 第1コイル3aは、第2コイル3bの形成領域外に形成され、これら第1コイル3aの外周端と第2コイル3bの外周端とは、絶縁部材5の表面側で接続されている。 The first coil 3a is formed outside the formation region of the second coil 3b, the outer peripheral end of the outer peripheral edge and the second coil 3b of the first coil 3a, and is connected at the surface side of the insulating member 5. 絶縁部材5の表面側の前記第2コイル3bの形成領域内には、静電容量接続パッド4a,4bが形成され、第1の静電容量接続パッド4aは、第2コイル3b The formation region of the second coil 3b of the surface side of the insulating member 5, the capacitance connection pads 4a, 4b are formed, a first capacitive connection pad 4a, the second coil 3b
の内周端に接続されている。 It is connected to the inner circumferential edge of the. 絶縁部材5の裏面側には、 On the back side of the insulating member 5,
図7に示すように、第1コイル3aの内周端と第2の静電容量接続パッド4bとを接続するリード15が形成されており、当該リード15の一端と前記第1コイル3a As shown in FIG. 7, and the lead 15 are formed to connect the inner peripheral end of the first coil 3a and a second capacitive connection pad 4b, the one end and the first coil 3a of the lead 15
の内周端とがスルーホール16を介して接続され、当該リード15の他端と前記第2の静電容量接続パッド4b The inner peripheral edge and are connected via a through hole 16, the other end of the lead 15 and the second capacitive connection pad 4b of
とがスルーホール17を介して接続されている。 Door are connected to each other through the through-hole 17. IC素子2は、図5及び図6に示すように、アンテナコイル1 IC element 2, as shown in FIGS. 5 and 6, the antenna coil 1
を第1コイル3aと対向に向けて、絶縁部材5の表面側に設定される。 The toward the first coil 3a and the counter is set to the surface of the insulating member 5.

【0039】その他については、第1実施形態例に係る非接触ICタグ装置と同じであるので、対応する部分に同一の符号を付して説明を省略する。 [0039] Other Be is the same as the non-contact IC tag system according to the first embodiment, the description thereof is omitted corresponding portions are denoted by the same reference numerals. 本例の非接触IC Non-contact IC of the present embodiment
タグ装置も、第1実施形態例に係る非接触ICタグ装置と同様の効果を有する。 Tag device also has a non-contact IC tag system and the same effect of the first embodiment.

【0040】〈第3実施形態例〉第3実施形態例に係る非接触ICタグ装置を、図8乃至図10に基づいて説明する。 [0040] The non-contact IC tag system according to the <Third embodiment> The third embodiment will be described with reference to FIGS. 8-10. 図8は第3実施形態例に係る非接触ICタグ装置の断面図、図9は第3実施形態例に係る非接触ICタグ装置に備えられる絶縁部材の表面図、図10は第3実施形態例に係る非接触ICタグ装置に備えられる絶縁部材の表面側から裏面側を見た透視図である。 Figure 8 is a sectional view of the non-contact IC tag system according to a third embodiment, FIG. 9 is a surface view of an insulating member provided to the contactless IC tag system according to a third embodiment, FIG. 10 is a third embodiment is a perspective view of the back side from the front surface side of the insulating member provided to the contactless IC tag system according to the embodiment.

【0041】図8に示すように、本例の非接触ICタグ装置は、アンテナコイル1が一体形成されたIC素子2 As shown in FIG. 8, the non-contact IC tag system of the present embodiment, IC device 2 antenna coil 1 is integrally formed
と、ブースタコイル3及び静電容量形成用導体18が形成された絶縁部材5と、これらIC素子2及び絶縁部材5を一体にケーシングする基体7とからなる。 When an insulating member 5 to the booster coil 3 and the capacitance forming conductor 18 is formed, these IC element 2 and the insulating member 5 from the base body 7 for the casing together.

【0042】本例のブースタコイル3も、図9に示すように、IC素子2に一体形成されたアンテナコイル1と主に電磁結合する第1コイル3aと、図示しないリーダライタに備えられたアンテナコイルと主に電磁結合する第2コイル3bとが共に絶縁部材5の表面側に形成されている。 [0042] This Example booster coil 3 also, as shown in FIG. 9, a first coil 3a which mainly electromagnetically coupled to the antenna coil 1 which is integrally formed on the IC element 2, the antenna provided in the reader-writer (not shown) a second coil 3b which mainly electromagnetically coupled to the coil are both formed on the surface side of the insulating member 5. 第1コイル3aは、第2コイル3bの形成領域外に形成され、これら第1コイル3aの外周端と第2コイル3bの外周端とは、絶縁部材5の表面側で接続されている。 The first coil 3a is formed outside the formation region of the second coil 3b, the outer peripheral end of the outer peripheral edge and the second coil 3b of the first coil 3a, and is connected at the surface side of the insulating member 5. 絶縁部材5の裏面側には、図10に示すように、前記第2コイル3bとほぼ同形同大のコイル状に形成され、巻線方向が前記第2コイル3bとは逆向きにされた静電容量形成用導体18が形成され、当該静電容量形成用導体18の外周端と前記第1コイル3aの内周端とがスルーホール19を介して接続されている。 On the back side of the insulating member 5, as shown in FIG. 10, it is formed into a coil shape substantially the same shape and size and the second coil 3b, windings direction and the second coil 3b is reversed capacitance forming conductor 18 is formed, the inner peripheral edge of the outer peripheral edge of the capacitance forming conductor 18 first coil 3a are connected through the through hole 19. 前記第2コイル3bを構成する導体と前記静電容量形成用導体18とは、絶縁部材5を介して対向に配置され、これら各導体間に静電容量を形成している。 Wherein the second conductor and the capacitance forming conductor 18 constituting the coil 3b, arranged facing each other via an insulating member 5, to form an electrostatic capacitance between each of these conductors. その静電容量は、 The capacitance,
IC素子2に一体形成されたアンテナコイル1及びブースタコイル3を含む系において、アンテナコイル1の両端に最大電圧が得られるように調整される。 In a system comprising an antenna coil 1 and the booster coil 3 which is integrally formed on the IC element 2 is adjusted so that the maximum voltage is obtained across the antenna coil 1.

【0043】なお、前記前記第2コイル3bを構成する導体の導体幅と前記静電容量形成用導体18の導体幅とは、同一にすることもできるし、互いに異ならせることもできる。 Incidentally, the conductor width of the conductor constituting the second coil 3b and the conductor width of the capacitance forming conductor 18 can either be the same, may be different from each other. 各導体の導体幅を互いに異ならせた場合には、製造上、第2コイル3bを構成する導体の形成位置と静電容量形成用導体18の形成位置とが導体幅の差の範囲でずれたとしても静電容量の値が変化しないので、 When having different conductor width of each conductor to each other, the manufacturing, the formation position of the second conductor forming position and the capacitance forming conductor 18 constituting the coil 3b is displaced in the range of the difference between the conductor width since the value of the capacitance does not change as,
非接触ICタグ装置の通信特性のばらつきを小さくすることができる。 It is possible to reduce variations in communication characteristics of the non-contact IC tag system.

【0044】IC素子2は、図8及び図9に示すように、アンテナコイル1を第1コイル3aと対向に向けて、絶縁部材5の表面側に設定される。 The IC element 2, as shown in FIGS. 8 and 9, an antenna coil 1 toward the first coil 3a and the counter is set to the surface of the insulating member 5.

【0045】その他については、第1実施形態例に係る非接触ICタグ装置と同じであるので、対応する部分に同一の符号を付して説明を省略する。 [0045] Other Be is the same as the non-contact IC tag system according to the first embodiment, the description thereof is omitted corresponding portions are denoted by the same reference numerals.

【0046】本例の非接触ICタグ装置は、前記各実施形態例に係る非接触ICタグ装置と同様の効果を有するほか、絶縁基板を介して第2コイル3bと静電容量形成用導体18とを対向に形成したので、これらの各導体間に所要の静電容量を形成することができて、チップコンデンサの搭載を省略することができ、非接触ICタグ装置の薄形化及び低コスト化を図ることができる。 The non-contact IC tag system of the present embodiment, in addition to having a non-contact IC tag system and the same effect according to the each embodiment, the second coil 3b and the capacitance forming conductor 18 through the insulating substrate since the formation of the bets on the counter, and it is possible to form a desired electrostatic capacitance between each of these conductors, it is possible to omit the installation of the chip capacitors, thin and low-cost non-contact IC tag system it is possible to achieve the reduction.

【0047】 [0047]

【発明の効果】請求項1に記載の発明は、ブースタコイルを、IC素子に一体形成されたアンテナコイルと主に電磁結合する第1コイルと、当該第1コイルと電気的に接続され、リーダライタに備えられたアンテナコイルと主に電磁結合する第2コイルとから構成し、第1コイルの外周を第2コイルの内周よりも大きく形成したので、 The invention of claim 1 according to the present invention is a booster coil, a first coil which mainly electromagnetically coupled to the antenna coil which is integrally formed on the IC element, is the electrically connected to the first coil, the reader consist of a second coil which mainly electromagnetically coupled to the antenna coil provided in the writer, since the outer periphery of the first coil second and larger than the inner circumference of the coil,
第2コイルの巻数を減少することなく第1コイルの巻径の拡大を図ることができて、非接触ICタグ装置の通信距離を拡大することができる。 To be able to expand in the winding diameter of the first coil without reducing the number of turns of the second coil, it is possible to expand the communication distance of the non-contact IC tag system.

【0048】請求項2に記載の発明は、第1コイルを絶縁基板の第2コイル形成面側に形成される部分とその裏面に形成される部分とから構成したので、絶縁基板の裏面に形成される部分については、第2コイルのサイズに関係なく、絶縁基板の面積の範囲で自由に形成することができ、第1コイルの直径及び巻数の増加を図ることができて、非接触ICタグ装置の通信距離を拡大することができる。 [0048] According to a second aspect of the invention, since the configuration from the portion formed of the first coil to a second coil forming surface of the insulating substrate and the portion formed on the back surface, formed on the back surface of the insulating substrate the portion to be, regardless of the size of the second coil can be freely formed in a range of area of ​​the insulating substrate, and it is possible to achieve an increase in the diameter and number of turns of the first coil, the non-contact IC tag it is possible to expand the communication distance of the device.

【0049】請求項3に記載の発明は、第2コイルの外部に第1コイルを形成したので、絶縁基板の表面における第1コイルの形成エリアと第2コイルの形成エリアとを分離することができ、第1コイルを第2コイルのサイズに関係なく、絶縁基板の面積の範囲で自由に形成することができることから、第1コイルの直径及び巻数の増加を図ることができて、非接触ICタグ装置の通信距離を拡大することができる。 [0049] According to a third aspect of the invention, that since the first coil is formed outside the second coil, to separate the formed area of ​​the first coil on the surface of the insulating substrate and the formation area of ​​the second coil can, regardless of the first coil to the size of the second coil, since it is possible to freely form a range of area of ​​the insulating substrate, and it is possible to achieve an increase in the diameter and number of turns of the first coil, the non-contact IC it is possible to expand the communication distance of the tag device.

【0050】請求項4に記載の発明は、第1コイルと第2コイルとの間に静電容量を直列に挿入したので、これら第1コイル及び第2コイルから構成されるブースタコイルのインダクタンスをL、挿入された静電容量のキャパシタンスをCとしたとき、f0=1/{2π√(L [0050] According to a fourth aspect of the invention, since the inserted capacitance in series between the first coil and the second coil, the inductance of the booster coil composed of these first and second coils L, when the capacitance of the inserted capacitance was C, f0 = 1 / {2π√ (L
C)}で表される所要の周波数で非接触ICタグ装置を共振させることができて、非接触ICタグ装置の通信距離を拡大することができる。 And it is possible to resonate the non-contact IC tag system at a predetermined frequency represented by C)}, it is possible to expand the communication distance of the non-contact IC tag system.

【0051】請求項5に記載の発明は、第2コイルの外部に第1コイルを形成したので、絶縁基板の表面における第1コイルの形成エリアと第2コイルの形成エリアとを分離することができ、第1コイルを第2コイルのサイズに関係なく、絶縁基板の面積の範囲で自由に形成することができることから、第1コイルの直径及び巻数の増加を図ることができて、非接触ICタグ装置の通信距離を拡大することができる。 The invention described in claim 5, that since the first coil is formed outside the second coil, to separate the formed area of ​​the first coil on the surface of the insulating substrate and the formation area of ​​the second coil can, regardless of the first coil to the size of the second coil, since it is possible to freely form a range of area of ​​the insulating substrate, and it is possible to achieve an increase in the diameter and number of turns of the first coil, the non-contact IC it is possible to expand the communication distance of the tag device. また、絶縁基板を介して第2 Further, the through insulating substrate 2
コイルを構成する導体と他の導体とを対向に形成したので、これらの各導体間に必要な静電容量を形成することができ、チップコンデンサ等の搭載を省略することができて、非接触ICタグ装置の薄形化及び低コスト化を図ることができる。 Since the formation of the conductor and other conductors constituting the coil to the opposite, these can form a capacitance required between the conductors, and it is possible to omit the installation of such a chip capacitor, a non-contact it is possible to slim and cost of the IC tag system.

【0052】請求項6に記載の発明は、第1コイル及び/又は第2コイルの一辺の長さを5mmとし、これら第1コイル及び第2コイルで構成されるブースタコイルの長さを50mmに形成したので、例えばCD収納ボックスのインデックス部分に装着可能な非接触ICタグ装置を得ることができる。 [0052] The invention according to claim 6, the length of one side of the first coil and / or the second coil and 5 mm, the length of the configured booster coil 50mm in these first and second coils since the formed, it is possible to obtain a non-contact IC tag system that can be mounted for example in the index portion of the CD storage box.

【0053】請求項7に記載の発明は、第1コイルの一辺の長さをIC素子に一体形成されたアンテナコイルの一辺の長さの2倍乃至3倍に形成したので、第1コイルとIC素子に一体形成されたアンテナコイルとの電磁結合の範囲を広げることができ、非接触ICタグ装置の製造工程において、第1コイルの形成位置に対するIC素子の設定位置がずれた場合や、第1コイルの形状又は導体幅にばらつきを生じた場合にも、第1コイルに生じる誘導起電力の低下を少なくすることができ、通信特性のばらつきが小さい非接触ICタグ装置を得ることができる。 [0053] The invention according to claim 7, since the formed double or triple the length of one side of the antenna coil which is integrally formed with the length of one side of the first coil to the IC element, a first coil can extend the range of the electromagnetic coupling between the integral formed antenna coil in the IC device, in the manufacturing process of the non-contact IC tag system, and when the setting position of the IC elements on the formation position of the first coil is shifted, the even if occurring variations in the shape or the conductor width of the first coil, it is possible to reduce the decrease in the induced electromotive force generated in the first coil, it can be variations in communication characteristics get smaller non-contact IC tag system.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】第1実施形態例に係る非接触ICタグ装置の断面図である。 1 is a cross-sectional view of the non-contact IC tag system according to the first embodiment.

【図2】第1実施形態例に係る非接触ICタグ装置に備えられる絶縁部材の表面図である。 2 is a top plan view of an insulating member provided to the contactless IC tag system according to the first embodiment.

【図3】第1実施形態例に係る非接触ICタグ装置に備えられる絶縁部材の表面側から裏面側を見た透視図である。 3 is a perspective view of the back side from the front surface side of the insulating member provided to the contactless IC tag system according to the first embodiment.

【図4】第1実施形態例に係る非接触ICタグ装置に搭載されるIC素子の斜視図である。 4 is a perspective view of an IC element mounted on the non-contact IC tag system according to the first embodiment.

【図5】第2実施形態例に係る非接触ICタグ装置の断面図である。 5 is a cross-sectional view of the non-contact IC tag system according to the second embodiment.

【図6】第2実施形態例に係る非接触ICタグ装置に備えられる絶縁部材の表面図である。 6 is a top plan view of an insulating member provided to the contactless IC tag system according to the second embodiment.

【図7】第2実施形態例に係る非接触ICタグ装置に備えられる絶縁部材の表面側から裏面側を見た透視図である。 7 is a perspective view of the back side from the front surface side of the insulating member provided to the contactless IC tag system according to the second embodiment.

【図8】第3実施形態例に係る非接触ICタグ装置の断面図である。 8 is a cross-sectional view of the non-contact IC tag system according to the third embodiment.

【図9】第3実施形態例に係る非接触ICタグ装置に備えられる絶縁部材の表面図である。 9 is a top plan view of an insulating member provided to the contactless IC tag system according to the third embodiment.

【図10】第3実施形態例に係る非接触ICタグ装置に備えられる絶縁部材の表面側から裏面側を見た透視図である。 10 is a perspective view of the back side from the front surface side of the non-contact IC tag device provided is an insulating member according to a third embodiment.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 アンテナコイル 2 IC素子 3 ブースタコイル 3a 第1コイル 3b 第2コイル 4a,4b 静電容量接続パッド 5 絶縁部材 6 チップコンデンサ 3表面パターン 7 絶縁部材 8 カバーシート 9 接着剤層 11〜14,16,17 スルーホール 15 リード 18 静電容量形成用導体 1 antenna coil 2 IC element 3 booster coil 3a first coil 3b second coil 4a, 4b capacitance connection pads 5 insulating member 6 chip capacitors 3 surface pattern 7 insulating member 8 cover sheet 9 adhesive layer 11~14,16, 17 through hole 15 leads 18 capacitance forming conductor

───────────────────────────────────────────────────── フロントページの続き (72)発明者 深尾 隆三 大阪府茨木市丑寅一丁目1番88号 日立マ クセル株式会社内 Fターム(参考) 2C005 MA18 MA40 MB06 NA08 NB03 PA18 5B035 BA03 BB09 CA01 CA23 5K012 AA01 AA07 AB03 AC06 ────────────────────────────────────────────────── ─── front page of the continuation (72) inventor Ryuzo FUKAO Ibaraki, Osaka Ushitora chome No. 1 No. 88 Hitachi Maxell, Ltd. in the F-term (reference) 2C005 MA18 MA40 MB06 NA08 NB03 PA18 5B035 BA03 BB09 CA01 CA23 5K012 AA01 AA07 AB03 AC06

Claims (7)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 アンテナコイルが一体形成されたIC素子と、前記IC素子に一体形成されたアンテナコイルとリーダライタに備えられたアンテナコイルとの電磁結合を強化するブースタコイルと、これらIC素子及びブースタコイルを担持する絶縁部材とを備えた非接触ICタグ装置において、前記ブースタコイルを、前記IC素子に一体形成されたアンテナコイルと主に電磁結合する第1コイルと、当該第1コイルと電気的に接続され、前記リーダライタに備えられたアンテナコイルと主に電磁結合する第2コイルとから構成し、前記第1コイルの外径を前記第2コイルの内径よりも大きく形成したことを特徴とする非接触ICタグ装置。 And 1. A IC antenna coil are integrally formed element, and the booster coil to enhance electromagnetic coupling between the antenna coil provided in the antenna coil and the reader-writer which is integrally formed on the IC element, and these IC elements in the non-contact IC tag system that includes a dielectric member for carrying the booster coil, the booster coil, the first coil which mainly electromagnetically coupled to the antenna coil formed integrally with the IC device, the first coil and the electrical are connected, characterized in that the consist of a second coil which mainly electromagnetically coupled to the antenna coil provided in the reader-writer, and the outer diameter of said first coil is formed larger than the inner diameter of the second coil non-contact IC tag system according to.
  2. 【請求項2】 請求項1に記載の非接触ICタグ装置において、前記絶縁基板の表面に前記第2コイルを渦巻き状に形成し、当該絶縁基板の表面の前記第2コイルの内部に前記第1コイルの一部を渦巻き状に形成すると共に、前記絶縁基板の裏面に前記第1コイルの他の一部を渦巻き状に形成し、当該第1コイルの他の一部の外周を前記第2コイルの内周よりも大きく形成したことを特徴とする非接触ICタグ装置。 In the non-contact IC tag system according to the claim 1, the second coil on the surface of the insulating substrate is formed in a spiral shape, wherein the inside of the second coil of the surface of the insulating substrate a portion of first coil so as to form a spiral, the other portion of the first coil on the back surface of the insulating substrate is formed in a spiral shape, another portion of said periphery second of the first coil non-contact IC tag system being characterized in that formed larger than the inner circumference of the coil.
  3. 【請求項3】 請求項1に記載の非接触ICタグ装置において、前記絶縁基板の表面に前記第2コイルを渦巻き状に形成し、当該絶縁基板の表面の前記第2コイルの外部に前記第1コイルを渦巻き状に形成すると共に、前記絶縁基板の裏面に前記第1コイルと前記第2コイルとを接続するリードを形成したことを特徴とする非接触IC In the non-contact IC tag system according to the claim 1, further comprising: a second coil on the surface of the insulating substrate is formed in a spiral shape, wherein the outside of the second coil of the surface of the insulating substrate non-contact IC that to form a first coil spirally, characterized in that the formation of the leads connecting to the first coil to the back surface of the insulating substrate and said second coil
    タグ装置。 Tag device.
  4. 【請求項4】 請求項1乃至3のいずれかに記載の非接触ICタグ装置において、前記第1コイルと第2コイルとの間に静電容量を直列に挿入したことを特徴とする非接触ICタグ装置。 4. The non-contact IC tag system according to any one of claims 1 to 3, non-contact, characterized in that the insertion of the capacitance in series between the first coil and the second coil IC tag device.
  5. 【請求項5】 請求項1に記載の非接触ICタグ装置において、前記絶縁基板の表面に前記第2コイルを渦巻き状に形成し、当該絶縁基板の表面の前記第2コイルの外部に前記第1コイルを渦巻き状に形成すると共に、前記絶縁基板の裏面に、前記絶縁基板の表面側から見て巻線方向が前記第2コイルと逆向きの導線を前記第2コイルと対向に形成したことを特徴とする非接触ICタグ装置。 5. The non-contact IC tag system according to claim 1, the second coil on the surface of the insulating substrate is formed in a spiral shape, wherein the outside of the second coil of the surface of the insulating substrate to form a first coil in a spiral shape, and the the back surface of the insulating substrate, wherein the winding direction when viewed from the surface side of the insulating substrate to form a second conductor of the coil and opposite to the counter and the second coil non-contact IC tag system according to claim.
  6. 【請求項6】 請求項1乃至5のいずれかに記載の非接触ICタグ装置において、前記第1コイル及び/又は第2コイルの一辺の長さを5mmとし、前記ブースタコイルの長さを50mmにしたことを特徴とする非接触IC In the non-contact IC tag system according to any one of claims 6] claims 1 to 5, the length of one side of the first coil and / or the second coil and 5 mm, 50 mm length of the booster coil non-contact IC, characterized in that the
    タグ装置。 Tag device.
  7. 【請求項7】 請求項1乃至6のいずれかに記載の非接触ICタグ装置において、前記第1コイルの一辺の長さを前記IC素子に一体形成されたアンテナコイルの一辺の長さの2倍乃至3倍に形成したことを特徴とする非接触ICタグ装置。 7. claim in a non-contact IC tag system according to any one of 1 to 6, 2 to the length of one side of the first coil of the length of one side of the antenna coil which is integrally formed on the IC element non-contact IC tag and wherein the formed double or triple.
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