JP2009027291A - Wireless ic device - Google Patents

Wireless ic device Download PDF

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JP2009027291A
JP2009027291A JP2007186438A JP2007186438A JP2009027291A JP 2009027291 A JP2009027291 A JP 2009027291A JP 2007186438 A JP2007186438 A JP 2007186438A JP 2007186438 A JP2007186438 A JP 2007186438A JP 2009027291 A JP2009027291 A JP 2009027291A
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wireless ic
electrode
radiation
ic device
circuit board
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JP4867830B2 (en
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Nobuo Ikemoto
Akiyoshi Kawamura
明義 川村
伸郎 池本
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Murata Mfg Co Ltd
株式会社村田製作所
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Abstract

<P>PROBLEM TO BE SOLVED: To configure a wireless IC device which can be easily manufactured and has stable characteristics. <P>SOLUTION: A power feed circuit board 4 is configured in such a way that first externally coupled electrodes 41, 42 are formed on the top surface, second externally coupled electrodes 43, 44 are formed in the inside and a matching circuit 40 consisting of the externally coupled electrodes and inductors L1-L3 is formed. A wireless IC chip 5 is mounted on the top surface of the power feed circuit board 4, and is covered with a protective film 6, thereby configuring an electromagnetically coupling module 1. The coupling amount between the externally coupled electrodes 41-44 and radiation electrodes 21, 22 is set to be substantially the same even if the electromagnetically coupling module 1 is disposed with any one of first and second main surfaces facing a radiation plate 2 comprising the radiation electrodes 21, 22 formed on a base material 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

この発明は、電磁波により非接触でデータ通信を行うRFID(Radio Frequency Identification)システムに適用する無線ICデバイスおよびその製造方法に関するものである。 This invention relates to a wireless IC device and a manufacturing method thereof applied to an RFID (Radio Frequency Identification) system for performing data communication in a non-contact manner by electromagnetic wave.

近年、物品の管理システムとして、誘導電磁界を発生するリーダライタと物品に付された所定の情報を記憶したRFIDタグとで非接触通信し、情報を伝達するRFIDシステムが利用されている(特許文献1参照)。 Recently, as the management system of the article, an induction field non-contact communication with the RFID tag storing predetermined information attached to the reader-writer and an article that generates, RFID systems for transmitting is using information (patent references 1).

図1はその特許文献1に示されている、ICタグ用アンテナにICタグラベルを装着した非接触ICタグ(RFIDタグ)の例を示す図である。 Figure 1 is a diagram showing the example of the patent are shown in Reference 1, the non-contact IC tag mounted IC tag label the IC tag antenna (RFID tag).

このRFIDタグT0は、誘電体基板84の片面に、左右一対の主アンテナ素子81,81と、補助アンテナ素子82と、左右一対の整合部83,83とが形成されてなる。 The RFID tag T0 is on one surface of the dielectric substrate 84, a pair of left and right main antenna 81, an auxiliary antenna element 82, and the pair of the matching portion 83 is formed.

主アンテナ素子81,81は、導体線がメアンダライン状に形成されたメアンダ型アンテナであって、誘電体基板84に左右対称に配置されている。 The main antenna element 81, 81, the conductor line is a meander type antenna formed in a meander line shape and is arranged symmetrically to the dielectric substrate 84. 主アンテナ素子81,81は誘電体基板84の両端エリアを占有しており、これら左右一対の主アンテナ素子81,81間に補助アンテナ素子82が配置されている。 The main antenna element 81 has occupy both ends areas of the dielectric substrate 84, the auxiliary antenna element 82 between the left and right pair of main antenna elements 81 and 81 are arranged.

各整合部83,83はメアンダライン状に形成された導体線(インダクタ)である。 Each matching section 83 is a conductor wire formed in a meander line form (inductor). 整合部83,83の各一端部はそれぞれ主アンテナ素子81,81の内側端部に接続されていて、この整合部83,83の各他端部に無線ICチップ86が搭載されている。 Each respective one end of the matching portion 83 be connected to the inner end of the main antenna 81, the wireless IC chip 86 is mounted on the other end of the matching section 83.
特開2005−244778号公報 JP 2005-244778 JP

しかし、特許文献1の非接触ICタグには以下のような問題点がある。 However, the non-contact IC tag of Patent Document 1 has the following problems.
(a)ICチップと主アンテナ(整合部)とは電気的に導通しなければならないので、ICチップの実装電極側を主アンテナ側に向けるように揃える必要がある。 (A) Since the IC chip and the main antenna (matching unit) must be electrically conductive, it is necessary to align to direct mounting electrodes of the IC chip on the main antenna side. そのため、ICチップの実装上の自由度が低い。 Therefore, a low degree of freedom of the IC chip implementation.

(b)また、そのために高い実装精度が要求され、高価な実装機が必要になり、また実装に時間が掛かるので、コスト高になる。 (B) In addition, its high mounting accuracy is required for, requires expensive mounting apparatus, and because it takes time to implement, increases the cost.

(c)ICチップがむき出しになり、RFIDタグとしての機械的強度や耐環境性が悪い。 (C) IC chip is exposed, poor mechanical strength and environmental resistance as RFID tags.

そこで、この発明の目的は、製造が容易で安定した特性を有する無線ICデバイスを提供することにある。 Accordingly, an object of the present invention is to provide a wireless IC device having a production stable easy characteristics.

前記課題を解決するために、この発明の無線ICデバイスは次のように構成する。 In order to solve the above problems, the wireless IC device of the present invention is configured as follows.
(1)無線ICチップと、 (1) and the wireless IC chip,
基材に放射電極を形成してなる放射板と、 A radiation plate obtained by forming a radiation electrode on the substrate,
前記放射電極と電磁界結合する外部結合電極、および前記無線ICチップと前記放射電極との間のインピーダンス整合をとる整合回路を有する給電回路基板と、 A feed circuit board having a matching circuit for taking impedance matching between the radiation electrode and the electromagnetic field coupling to the external coupling electrode, and the wireless IC chip and the radiation electrode,
を備えた無線ICデバイスであって、 A wireless IC device comprising,
前記無線ICチップと前記給電回路基板とからなる電磁結合モジュールを前記放射板上に配置した状態で、前記電磁結合モジュールの第1・第2主面のいずれの主面を前記放射板側にしても、前記外部結合電極と前記放射電極との電磁結合量がほぼ等しくなるように、前記給電回路基板での前記外部結合電極の位置または形状を定めたことを特徴としている。 In a state where the electromagnetic coupling module consisting of the wireless IC chip and the feeder circuit board is arranged on the radiation plate, and the one main surface of the first and second main surfaces of the electromagnetic coupling module on the radiation plate side also, the as the amount of electromagnetic coupling between the external coupling electrode and the radiation electrode are substantially equal, it is characterized in that defining the position or shape of the external coupling electrode in the feeder circuit board.

(2)前記給電回路基板内には例えば共振回路を備える。 (2) to said feeder circuit board comprising a resonant circuit, for example.
(3)前記外部結合電極は、例えば前記給電回路基板内で当該給電回路基板の第1・第2主面の近傍にそれぞれ配置され、前記放射電極と容量結合する平板電極とする。 (3) The external coupling electrode, for example the respective near the first and second main surfaces of the feeder circuit board is arranged at the feed circuit board, and the radiation electrode and the capacitive coupling plate electrodes.

(4)前記給電回路基板の第1・第2主面の近傍にそれぞれ配置された前記外部結合電極同士は例えばビアホールを介して接続する。 (4) The external coupling electrodes are disposed respectively in the vicinity of the first and second main surface of the feeder circuit board are connected via a via hole, for example.

(5)前記外部結合電極は、例えば前記放射電極と電磁界結合するインダクタ電極である。 (5) The external coupling electrode is, for example the a radiation electrode and the inductor electrode to electromagnetic coupling.

(6)前記無線ICチップと前記給電回路基板は、その両方または一方を保護膜で覆ってもよい。 (6) the wireless IC chip and the feeder circuit board may cover both, or one with a protective film.

(7)前記給電回路基板の第1の主面に凹部を備え、当該凹部に前記無線ICチップを配置してもよい。 (7) comprises a recess in the first main surface of the feeder circuit board may be disposed the wireless IC chip to the recess.

(8)前記放射電極は、例えば前記基材の表面に形成し、前記電磁結合モジュールを前記基材の内部に配置する。 (8) the radiation electrode, for example, is formed on the surface of the substrate, placing the electromagnetic coupling module inside the base material.

(9)前記放射電極は前記基材の両面に形成してもよい。 (9) The radiation electrode may be formed on both surfaces of the substrate.

(10)前記放射板は、例えば第1・第2の少なくとも2つの放射板からなり、当該2つの放射板の間に前記電磁結合モジュールを配置する。 (10) The radiating plate is made of, for example, first and second at least two radiating plates, placing the electromagnetic coupling module to the two radiation plates.

(11)前記電磁結合モジュールを囲むように前記2つの放射板同士を貼り合わせてもよい。 (11) may be attached to the two radiation plates are to surround the electromagnetic coupling module.

(12)前記給電回路基板は、例えば電極パターンを形成した複数の誘電体層を積層した多層基板で構成する。 (12) the power supply circuit board is composed of a multilayer substrate formed by laminating a plurality of dielectric layer formed, for example, the electrode pattern.

(13)前記電磁結合モジュールの第1・第2主面に方向識別用の表示を形成してもよい。 (13) may be formed display for direction identified first and second main surfaces of the electromagnetic coupling module.

この発明によれば、次のような効果を奏する。 According to the present invention, the following effects.
(1)電磁結合モジュールの上下面が反転してもRFIDタグとして作用し、且つ放射特性を同特性にできる。 (1) act as an RFID tag even upper and lower surfaces are inverted electromagnetic coupling module, and possible radiation characteristics in the characteristic. したがって、無線ICデバイスを物品に取り付ける際に、方向性を無くすことができ、無線ICデバイスの供給テープなどへの装着時も含めて取り扱いが容易になり、トータルに低コスト化できる。 Therefore, when mounting the wireless IC device to an article, it is possible to eliminate directionality, when mounted to such supply tape of the wireless IC device is also easier to handle, including, can cost in total.

(2)前記給電回路基板内に共振回路を設けることによって、周波数の選択性が高まり、自己共振周波数により無線ICデバイスの動作周波数をほぼ決定することができる。 (2) By providing a resonant circuit on the feed circuit board, increases the selectivity of the frequency, it is possible to substantially determine the operating frequency of the wireless IC device by the self-resonant frequency. それにともない、RFIDシステムで用いる周波数の信号のエネルギーの授受(送受信)を高効率のもとで行うことができる。 Correspondingly, it is possible to perform transfer of energy at a frequency of a signal used in the RFID system (transmission and reception) under high efficiency. また、放射体の形状やサイズを考慮して最適な共振周波数に設定することができ、これにより無線ICデバイスの放射特性を向上させることができる。 Further, it is possible to set the optimum resonance frequency in consideration of the shape and size of the radiator, thereby improving the radiation characteristics of the wireless IC device.

(3)給電回路基板の第1・第2主面の近傍に、放射電極と容量結合する平板電極を設けることにより、無線ICデバイスの第1・第2主面のいずれの面が放射板に向いても高い放射特性を得ることができる。 (3) in the vicinity of the first and second main surfaces of the feeder circuit board, by providing a plate electrode of the radiation electrode and the capacitive coupling, either side of the first and second major surface of the wireless IC device to the radiation plate even facing it is possible to obtain high radiation characteristics. また、放射電極と無線ICチップとを電気的に絶縁して配置することができ、無線ICチップが静電破壊されることなく、静電気に対する耐性を高めることができる。 Moreover, can be arranged electrically insulated from the radiation electrode and the wireless IC chip, without the wireless IC chip is damaged by static it is possible to improve resistance to static electricity.

(4)前記給電回路基板の第1・第2主面の近傍の外部結合電極同士を、ビアホールを介して接続することにより、整合回路から見た2つの外部結合電極を等価的に同じ電極として扱うことができ、整合回路の設計が容易となり、且つ第1・第2主面のいずれの面が放射板に向いても同特性の無線ICデバイスが得られる。 (4) The external coupling electrodes of the vicinity of the first and second main surface of the feeder circuit board, by connecting through a via hole, the two outer coupling electrodes as viewed from the matching circuit equivalently as the same electrode can be handled, it is easy to design the matching circuit, and one side of the first and second main surfaces wireless IC device of the same characteristics facing the radiation plate can be obtained.

(5)外部結合電極を、放射電極と電磁界結合するインダクタ電極とすることによって、結合部がループ形状になるため、搭載方向の違いによる結合度の差が小さくなる。 (5) The external coupling electrode by the radiation electrode and the electromagnetic coupling inductor electrodes, since the coupling portion is loop-shaped, the difference in the degree of coupling due to a difference in mounting direction is reduced. また、保護膜や接着剤などによる導電率の変化の影響を受けにくくなる。 Also, less susceptible to changes in conductivity due to the protective film and adhesive. さらに、放射電極が誘導性である場合にインピーダンス整合がとりやすくなる。 Furthermore, it impedance matching is easily taken when the radiation electrode is inductive.

(6)無線ICチップと給電回路基板は、その両方または一方を保護膜で覆うことによって電磁結合モジュールの機械的強度および耐環境性を向上させることができる。 (6) a wireless IC chip and the feeder circuit board can be improved mechanical strength and environmental resistance of the electromagnetic coupling module by covering the both or one with a protective film.

(7)給電回路基板の第1の主面に凹部を備え、当該凹部に無線ICチップを配置することによって電磁結合モジュールの機械的強度や耐環境性が向上する。 (7) with a recess on the first main surface of the feeder circuit board, the mechanical strength and environmental resistance of the electromagnetic coupling module is improved by placing a wireless IC chip in the concave portion.

(8)放射電極を基材の表面に形成し、電磁結合モジュールを放射板の基材の内部に配置することによって電磁結合モジュールの機械的強度や耐環境性が向上する。 (8) The radiation electrode is formed on the surface of the substrate, mechanical strength and environmental resistance of the electromagnetic coupling module is improved by placing the electromagnetic coupling module to the inside of the base material of the radiation plate.

(9)放射電極を基材の両面に形成することによって、RFIDタグとしての放射特性を向上させることができる。 (9) by forming a radiation electrode on both sides of the substrate, it is possible to improve the radiation characteristics of the RFID tag. また、一方の面の放射電極と他方の面の放射電極とを異なる方向に配置すれば指向性を制御することも可能となる。 It is also possible to control the radiation electrode and the other surface of the radiation electrode and the different directions the arrangement them if the directivity of the one surface.

(10)2つの放射板の間に電磁結合モジュールを配置する場合も、RFIDタグとしての放射特性を向上させることができる。 (10) may place the electromagnetic coupling module to the two radiation plates, thereby improving the radiation characteristics of the RFID tag. また、一方の面の放射電極と他方の面の放射電極とを異なる方向に配置すれば指向性を制御することが可能となる。 Further, it is possible to control the directivity by arranging in different directions and the radiation electrode of the radiation electrode and the other surface of the one surface.

(11)電磁結合モジュールを囲むように2つの放射板同士を貼り合わせることによって、機械的強度と耐環境性が向上する。 (11) by bonding the two radiation plates are to surround the electromagnetic coupling module, the mechanical strength and environmental resistance is improved. また平板部分が一層となり、取り扱いが容易となる。 Also it To further has flat portions, it is easy to handle.

(12)給電回路基板を、電極パターンを形成した誘電体層を積層してなる多層基板で構成することにより、電磁結合モジュールを小型化でき、多様な物品に適用できる。 (12) a feed circuit board, by forming a multilayer substrate formed by laminating a dielectric layer to form electrode pattern, can reduce the size of the electromagnetic coupling module can be applied to various articles.

(13)電磁結合モジュールの両主面に方向識別用の表示(マーク)を形成することにより、表裏どちら向きに実装しても電磁結合モジュールの左右端を識別することが可能となる。 (13) By forming the display for the direction identifying (mark) on both main surfaces of the electromagnetic coupling module, it is possible to be mounted on the front and back both directions to identify the right and left ends of the electromagnetic coupling module.

《第1の実施形態》 "The first embodiment"
第1の実施形態に係る無線ICデバイスの構成を図2・図3を参照して説明する。 The configuration of a wireless IC device according to a first embodiment will be described with reference to FIGS. 2 and 3.
図2は2つの無線ICデバイスの構成を示す断面図である。 Figure 2 is a sectional view showing a configuration of two of the wireless IC device. 図2において符号1は電磁結合モジュールであり、給電回路基板4および無線ICチップ5を備えている。 Reference numeral 1 in FIG. 2 is an electromagnetic coupling module includes a power supply circuit board 4 and the wireless IC chip 5.

放射板2は基材20に対して2つの放射電極21,22を形成してなる。 Radiating plate 2 is formed by forming two radiation electrodes 21 and 22 with respect to the substrate 20. 電磁結合モジュール1は、その外部結合電極で放射電極21,22と電界結合(容量結合)するように放射板2に対して貼着している。 Electromagnetic coupling module 1 is bonded to the radiation plate 2 so that the external coupling electrode in the radiation electrode 21 and the electric field coupling to (capacitive coupling). 図2(A)の例では、第2外部結合電極43,44が放射電極21,22の内側の端部付近に近接するように電磁結合モジュール1を放射板2に取り付けている。 In the example of FIG. 2 (A), the second external coupling electrodes 43 and 44 are mounted an electromagnetic coupling module 1 so as to approach the vicinity of the inner end of the radiation electrode 21 to the radiation plate 2. また図2(B)の例では、第1外部結合電極42,41が放射電極21,22の内側の端部付近に近接するように電磁結合モジュール1を放射板2に取り付けている。 In the example of FIG. 2 (B), the first external coupling electrode 42, 41 is mounted an electromagnetic coupling module 1 so as to approach the vicinity of the inner end of the radiation electrode 21 to the radiation plate 2.

上記放射電極21,22は電磁結合モジュール1の取り付け位置から互いに遠ざかる方向に延びる線路パターンからなり、基本的にダイポールアンテナとして作用する。 The radiation electrode 21 is made of line patterns extending in a direction away from each other from the mounting position of the electromagnetic coupling module 1, which acts essentially as a dipole antenna.

このように放射板2に対して電磁結合モジュール1の第1・第2主面のいずれの主面を向けて取り付けても、放射電極との結合量がほぼ等しくなるように給電回路基板4内の第2外部結合電極43,44の位置と、保護膜6の厚み寸法および誘電率を定めている。 Thus radiation plate be attached toward one major surface of the first and second main surfaces of the electromagnetic coupling module 1 for 2, the feeder circuit board 4 as the amount of coupling between the radiation electrodes are substantially equal It defines the position of the second external coupling electrodes 43 and 44, the thickness and dielectric constant of the protective film 6.

給電回路基板4内にはインダクタL1,L2,L3からなる整合回路40を設けている。 The feed circuit substrate 4 is provided with a matching circuit 40 consisting of inductors L1, L2, L3. この整合回路40は無線ICチップ5と放射電極21,22との間のインピーダンス整合をとる。 The matching circuit 40 takes an impedance matching between the wireless IC chip 5 and the radiation electrodes 21 and 22. また、整合回路40は共振回路の機能を兼ねていてもよい。 The matching circuit 40 may also serve the function of the resonant circuit. 例えばUHF帯などの周波数になるようにインダクタンス値を調整することにより、無線ICデバイスとしての動作周波数に合わせることができる。 For example, by adjusting the inductance value such that the frequency of such UHF band, it is possible to match the operating frequency of the wireless IC device.

図3は電磁結合モジュール1の内部の構成を示す分解斜視図である。 Figure 3 is an exploded perspective view showing the internal configuration of the electromagnetic coupling module 1. 電磁結合モジュール1は多層基板からなる給電回路基板4、無線ICチップ5、および保護膜6から構成している。 Electromagnetic coupling module 1 is feed circuit board 4 consisting of a multilayer substrate, constitute the wireless IC chip 5, and the protective film 6.

給電回路基板4は、それぞれに電極パターンを形成した複数の誘電体層を積層してなる多層基板であり、最上層の誘電体層41Aには無線ICチップ実装用ランド35a〜35dおよび第1外部結合電極41,42を形成している。 The power supply circuit board 4 is a multilayer substrate formed by laminating a plurality of dielectric layers provided with electrode patterns, respectively, the uppermost layer of the dielectric layer 41A wireless IC chip mounting land 35a~35d and the first external to form a coupling electrode 41. 誘電体層41Bにはインダクタ電極45a,46a,47aを形成している。 In the dielectric layer 41B inductor electrodes 45a, 46a, to form a 47a. 誘電体層41Cにはインダクタ電極45b,46b,47bを形成している。 In the dielectric layer 41C inductor electrodes 45b, 46b, to form a 47b. 誘電体層41Dにはインダクタ電極45c,46c,47cを形成している。 The dielectric layer 41D inductor electrode 45 c, 46c, and forms a 47c. 誘電体層41Eにはインダクタ電極45d,46d,47dを形成している。 The dielectric layer 41E inductor electrodes 45d, 46d, and forms a 47d. 誘電体層41Fにはインダクタ電極45e,46e,47eを形成している。 The dielectric layer 41F inductor electrode 45 e, 46e, to form a 47e. さらに誘電体層41Gには第2外部結合電極43,44を形成している。 Forming a second external coupling electrodes 43 and 44 to further dielectric layer 41G. 各誘電体層の電極同士は図3に示すようにビアホールを介して接続している。 Electrodes of the dielectric layers are connected via a via hole as shown in FIG.

なお、保護膜6の表面には電磁結合モジュールの左右の向きを判別するための方向識別マーク61を形成している。 Incidentally, the surface of the protective film 6 forms a direction identification mark 61 for identifying the left and right orientation of the electromagnetic coupling module. また、誘電体層41Gの裏面にも、電磁結合モジュールの左右の向きを判別するための、方向識別マーク61と同様の方向識別マーク62を形成している。 Further, also the back surface of the dielectric layer 41G, for determining the left and right orientation of the electromagnetic coupling module to form a direction identification mark 62 similar to the direction identification mark 61. この例では無線ICデバイスの左右で放射パターンなどに特性差があって、それを考慮してこの無線ICデバイスを物品に実装する際、電磁結合モジュールの左右方向を識別するために利用する。 In this example there is a characteristic difference such as the radiation pattern in the left and right of the wireless IC device, in consideration of it when implementing the wireless IC device to an article, utilized to identify the left and right direction of the electromagnetic coupling module.

上記インダクタ電極45a〜45eによってインダクタL1を構成している。 Constitute the inductor L1 by the inductor electrodes 45a to 45e. またインダクタ電極46a〜46eによってインダクタL2を構成している。 Also constituting an inductor L2 by the inductor electrodes 46 a to 46 e. さらにインダクタ電極47a〜47eによってインダクタL3を構成している。 Constitute the inductor L3 by further inductor electrode 47A~47e. これらのインダクタL1,L2,L3による整合回路は図2に示したとおりである。 These inductors L1, L2, L3 by the matching circuit is as shown in FIG.

上記各誘電体層は誘電体セラミックであり、それらを積層し一体焼成することによってセラミック多層基板を構成する。 Each dielectric layer is a dielectric ceramic, constituting a ceramic multilayer substrate by integrally sintered by stacking them. セラミック以外に液晶ポリマー(LCP)等の樹脂材料を用いることもできる。 It is also possible to use a resin material such as liquid crystal polymer (LCP) in addition to the ceramic.

給電回路基板4上に前記無線ICチップ5を搭載してなる無線ICデバイス1は、図示しないリーダライタから放射される高周波信号(例えばUHF周波数帯)を放射電極21,22で受信し、給電回路基板4内の共振回路を共振させ、所定の周波数帯の受信信号のみを無線ICチップ5に供給する。 Wherein on the feed circuit board 4 wireless IC device 1 formed by mounting the wireless IC chip 5 receives the high frequency signal radiated from a reader writer (not shown) (e.g. UHF frequency band) in the radiation electrodes 21 and 22, the feeder circuit a resonant circuit in the substrate 4 to resonate, and supplies only a reception signal in a predetermined frequency band to the wireless IC chip 5. 一方、この受信信号から所定のエネルギーを取り出し、このエネルギーを駆動源として無線ICチップ5にメモリされている情報を、共振回路にて所定の周波数に整合させた後、放射電極21,22に伝え、該放射電極21,22からリーダライタに送信・転送する。 On the other hand, extracts predetermined energy from the reception signal, after the information stored in the wireless IC chip 5 this energy as a driving source, and is matched to a predetermined frequency in the resonant circuit, conveyed to the radiation electrodes 21 and 22 transmits and transfer from the radiation electrodes 21 and 22 to the reader writer.

給電回路基板4においては、インダクタンス素子L1,L2,L3とその浮遊容量とで構成される共振回路にて共振周波数が決定される。 In the feed circuit board 4, the resonance frequency is determined by the resonant circuit composed by the inductance elements L1, L2, L3 and floating capacitance. 放射電極21,22から放射される信号の周波数は、共振回路の自己共振周波数によって実質的に決まる。 Frequency of a signal radiated from the radiation electrode 21 is substantially determined by the self-resonant frequency of the resonant circuit.

《第2の実施形態》 "The second embodiment"
図4は第2の実施形態に係る無線ICデバイスで用いる電磁結合モジュールの主要部の断面図である。 Figure 4 is a cross-sectional view of a main part of the electromagnetic coupling module used in a wireless IC device according to a second embodiment. 図2に示した例では給電回路基板に第1・第2の外部結合電極を設けたが、図4に示す例では給電回路基板4の内部に一組の外部結合電極51,52のみを形成している。 In the example shown in FIG. 2 provided with first and second external coupling electrodes to the power supply circuit board, in the example shown in FIG. 4 forming only the external coupling electrodes 51 and 52 inside of a pair of feeder circuit board 4 doing. この外部結合電極51,52の位置は、電磁結合モジュール11の第1・第2のいずれの主面を放射板に向けて取り付けても放射電極との結合量がほぼ等しくなるように定めている。 The position of the external coupling electrodes 51 and 52 are set such that binding of the first and second one of the principal radiation be mounted toward the radiation plate electrodes of the electromagnetic coupling module 11 is substantially equal to .

放射板の放射電極と外部結合電極51,52との間に生じるキャパシタンスが小さくなる分、インダクタL1,L2,L3からなる整合回路40の回路定数は異なるが基本的な構成は第1の実施形態の場合と同様である。 Capacitance smaller amount occurring between the radiation electrode and the external coupling electrodes 51 and 52 of the radiating plate, the circuit constants of the matching circuit 40 consisting of inductors L1, L2, L3 are different basic structure to the first embodiment is the same as in the case of.

《第3の実施形態》 "Third Embodiment"
図5は第3の実施形態に係る無線ICデバイスの主要部の断面図である。 Figure 5 is a sectional view of a main part of a wireless IC device according to a third embodiment. この例では給電回路基板4の内部にヘリカル状の外部結合電極48を構成し、その外部結合電極48と無線ICチップ5との間に、インダクタL1,L3およびキャパシタC1からなる整合回路50を設けている。 In this example constitutes the external coupling electrode 48 helical inside the feed circuit board 4, between the external coupling electrode 48 and the wireless IC chip 5 is provided with a matching circuit 50 consisting of inductors L1, L3 and the capacitor C1 ing.

図5では矩形ヘリカル上の外部結合電極48の断面が現れている。 Cross-section of the external coupling electrode 48 in FIG. 5, the rectangular helical has appeared. この外部結合電極48の一端は、整合回路50のインダクタL1とキャパシタC1との接続点に接続し、外部結合電極48の他端は、整合回路50のインダクタL3とキャパシタC1との接続点に接続している。 One end of the external coupling electrode 48 is connected to the connection point between the inductor L1 and the capacitor C1 of the matching circuit 50, the other end of the external coupling electrode 48 is connected to a connection point between the inductor L3 and the capacitor C1 of the matching circuit 50 doing.

無線ICチップ5は給電回路基板4の上面に搭載し、無線ICチップ5の周囲および給電回路基板4の上面に保護膜6を被覆している。 The wireless IC chip 5 is mounted on the upper surface of the feeder circuit board 4, and covers the protective film 6 on the upper surface of the periphery and the feeder circuit board 4 of the wireless IC chip 5. 外部結合電極48の給電回路基板4の底面からの位置(高さ)と保護膜6の上面からの距離はほぼ等しくしている。 Distance positions from the bottom surface of the feeder circuit board 4 of the external coupling electrode 48 and the (height) from the upper surface of the protective film 6 is approximately equal.

図6は図5に示した電磁結合モジュール12を放射板に取り付けた状態および放射電極のパターンの例を示す図である。 6 is a diagram showing an example of a pattern of electromagnetic state coupling module 12 attached to the radiation plate and the radiation electrode shown in FIG. 放射電極25a,25bは長尺状をなし、この2つの放射電極25a,25b同士をループ状の放射電極25cで接続している。 Radiation electrode 25a, 25b forms a long shape, and connects the two radiation electrodes 25a, 25b, together with the loop-shaped radiation electrode 25c. 図中破線Bで囲んだ部分が電磁結合モジュール12の載置位置であり、電磁結合モジュール12の外部結合電極48と放射電極25cとが磁界結合する。 Portion surrounded by broken line in the drawing B a mounting position of the electromagnetic coupling module 12, an external coupling electrode 48 of the electromagnetic coupling module 12 and the radiation electrode 25c is magnetically coupled.

図6(A)に示した状態で、基材20および放射電極25からなる放射板に電磁結合モジュール12を裏返して取り付けても外部結合電極48と放射電極25cとの磁界結合の結合量はほぼ等しい。 In the state shown in FIG. 6 (A), the amount of coupling magnetic coupling be fitted upside down the electromagnetic coupling module 12 to the radiation plate made of a base material 20 and the radiation electrode 25 and the external coupling electrode 48 and the radiation electrode 25c is substantially equal.

《第4の実施形態》 "Fourth Embodiment"
図7は第4の実施形態に係る2つの無線ICデバイスの主要部の断面図である。 Figure 7 is a cross-sectional view of a main portion of the two wireless IC device according to a fourth embodiment.
図7(A)の例では、給電回路基板4の上面に凹部を形成し、その凹部内に無線ICチップ5を実装し、凹部を保護膜6で覆っている。 In the example of FIG. 7 (A), a recess on the upper surface of the feeder circuit board 4, to implement the wireless IC chip 5 on the recess, covering the recess with a protective film 6. 給電回路基板4の内部には図2に示したものと同様に整合回路40を設けるとともに第1外部結合電極41,42および第2外部結合電極43,44を設けて電磁結合モジュール13を構成している。 Inside the feed circuit board 4 provided with a first external coupling electrode 41 and the second external coupling electrodes 43 and 44 provided with a matching circuit 40 in the same manner as shown in FIG. 2 and an electromagnetic coupling module 13 ing.

また図7(B)の例では、給電回路基板4の内部に整合回路40、第1外部結合電極41,42、および第2外部結合電極43,44とともに無線ICチップ5を設けて電磁結合モジュール14を構成している。 In the example of FIG. 7 (B), the electromagnetic coupling module internal to the matching circuit 40 of the power supply circuit board 4, the first external coupling electrodes 41 and 42, and with the second external coupling electrodes 43 and 44 is provided a wireless IC chip 5 constitute a 14.

なお、図7(B)の構造の場合、無線ICチップ5の直上の面にも第1外部結合電極41,42を形成できるため、放射電極との間の容量を大きくすることができる。 In the case of the structure of FIG. 7 (B), since it is possible to form the first external coupling electrode 41 to the surface immediately above the wireless IC chip 5, it is possible to increase the capacitance between the radiation electrode.

いずれの構成でも電磁結合モジュールの厚み寸法を小さくでき、これらの電磁結合モジュールを放射板同士の間に配置したり、放射板内に配置したりする際に電磁結合モジュール取り付け位置の膨らみを抑えることができる。 Can also reduce the thickness of the electromagnetic coupling module In either configuration, these electromagnetic coupling module or is arranged between the radiation plate to each other, to suppress the bulge of the electromagnetic coupling module mounting location in or arranged in the radiation plate can.

《第5の実施形態》 "Fifth Embodiment"
図8は第5の実施形態に係る2つの無線ICデバイスの構成を示す断面図である。 Figure 8 is a sectional view showing a configuration of two wireless IC device according to a fifth embodiment.
図8(A)の例では、基材20の内部に電磁結合モジュール1を配置し、基材20の上面に形成した放射電極21,22と電磁結合モジュール1の外部結合電極とが電界結合するように互いの位置関係を定めている。 In the example of FIG. 8 (A), place the electromagnetic coupling module 1 inside the substrate 20, and the external coupling electrode and the radiation electrode 21 formed on the upper surface of the base member 20 electromagnetic coupling module 1 field coupling It defines a mutual positional relationship as.

図8(B)の例では基材20の上面に放射電極21,22、下面に放射電極23,24をそれぞれ形成し、この基材20の内部に電磁結合モジュール1を配置している。 Figure 8 radiation electrodes 21 and 22 on the upper surface of the substrate 20 in the example of (B), the radiation electrodes 23 and 24 formed respectively on the lower surface are arranged electromagnetic coupling module 1 inside the substrate 20. 放射電極21,22,23,24は電磁結合モジュール1の外部結合電極とそれぞれ電界結合して放射電極として作用する。 Radiation electrode 21, 22, 23, 24 acts as a radiation electrode with each electric field coupling and the external coupling electrode of the electromagnetic coupling module 1. そのため、RFIDタグとしての放射特性を向上させることができる。 Therefore, it is possible to improve the radiation characteristics of the RFID tag. 放射電極21〜24は基材20を挟んで平行に配置してもよく、また異なった方向に延びるように形成してもよい。 Radiation electrodes 21 to 24 may be formed as may be parallel to each other across the substrate 20, extending or different directions. このことにより放射電極の指向性パターンを設定することもできる。 It is also possible to set the directional pattern of the radiation electrode by this.

《第6の実施形態》 "Sixth Embodiment"
図9(A)は第6の実施形態に係る無線ICデバイスの主要部の断面図、図9(B)はその基材に形成した放射パターンの例を示す図である。 Figure 9 (A) is a sectional view of a main part of a wireless IC device according to the sixth embodiment, FIG. 9 (B) is a diagram showing an example of a radiation pattern formed on the substrate.

図9(A)に示すように、基材20の上面には放射電極26a,26b,26cを形成し、下面には放射電極25a,25b,25cを形成している。 As shown in FIG. 9 (A), on the upper surface of the base material 20 to form the radiation electrode 26a, 26b, a 26c, the lower surface forms the radiation electrodes 25a, 25b, a 25c. 電磁結合モジュール12は基材20の内部に配置し、電磁結合モジュール12の外部結合電極48とループ状放射電極25c,26cとが磁界結合するようにそれらの位置関係を定めている。 Electromagnetic coupling module 12 is disposed within the substrate 20, external coupling electrode 48 and the loop-shaped radiation electrode 25c of the electromagnetic coupling module 12, and the 26c defines their positional relationship such that magnetic field coupling. 電磁結合モジュール12の構成は図5に示したものと同様である。 Configuration of the electromagnetic coupling module 12 is the same as that shown in FIG.

基材20の両面に形成した放射電極25,26は、それぞれの長尺状をなす部分(25a,25b,26a,26bを、基材20を挟んで平行に形成してもよく、異なった方向に延びるように形成してもよい。これにより指向性パターンを設定することもできる。 Radiation electrodes 25 and 26 formed on both sides of the substrate 20, the portion constituting the respective elongate (25a, 25b, 26a, 26b and may be formed in parallel across the substrate 20, different directions it may be formed to extend in. Thus it is possible to set the directivity pattern.

《第7の実施形態》 "Seventh embodiment"
図10は第7の実施形態に係る無線ICデバイスの主要部の断面図である。 Figure 10 is a sectional view of a main part of a wireless IC device according to a seventh embodiment.
図10(A)の例では、基材20に放射電極21,22を形成してなる放射板2と、基材30に放射電極31,32を形成してなる放射板3と、を用い、この2つの放射板2,3の間に電磁結合モジュール1を配置し、放射板2の放射電極21,22および放射板3の放射電極31,32と電磁結合モジュール1の外部結合電極とがそれぞれ結合するようにそれらの位置関係を定めている。 In the example of FIG. 10 (A), the use of the radiation plate 2 obtained by forming a radiation electrode 21 on the substrate 20, and the radiation plate 3 obtained by forming the radiation electrode 31 to the substrate 30, a, the electromagnetic coupling module 1 is disposed between the two radiation plates 2 and 3, and the external coupling electrode of the radiation electrode 31 and the electromagnetic coupling module 1 of the radiation electrode 21 and the radiation plate 3 of the radiation plate 2, respectively defines their positional relationship such that binding to. 電磁結合モジュール1の構成は図2に示したものと同様である。 Configuration of the electromagnetic coupling module 1 is the same as that shown in FIG.

図10(B)の例は、図10(A)に示した2つの放射板2,3同士を、電磁結合モジュール1を囲むように電磁結合モジュール1の近傍で互いに貼り合わせたものである。 Example of FIG. 10 (B), two radiation plates 2 and 3 to each other as shown in FIG. 10 (A), is formed by bonding together in the vicinity of the electromagnetic coupling module 1 so as to surround the electromagnetic coupling module 1. この構造によれば機械的強度と耐環境性が向上する。 Mechanical strength and environmental resistance is improved according to this structure. また平板部分が一層となり、取り扱いが容易となる。 Also it To further has flat portions, it is easy to handle.

特許文献1に示されている無線ICデバイスの構成を示す図である。 It is a diagram showing a configuration of a wireless IC device described in Patent Document 1. 第1の実施形態に係る無線ICデバイスの主要部の断面図である。 It is a cross-sectional view of a main part of a wireless IC device according to a first embodiment. 同無線ICデバイスの電磁結合モジュールの構成を示す分解斜視図である。 It is an exploded perspective view showing a configuration of an electromagnetic coupling module of the same wireless IC device. 第2の実施形態に係る無線ICデバイスに用いる電磁結合モジュールの主要部の断面図である。 It is a cross-sectional view of a main part of the electromagnetic coupling module used in a wireless IC device according to a second embodiment. 第3の実施形態に係る無線ICデバイスに用いる電磁結合モジュールの主要部の断面図である。 It is a cross-sectional view of a main part of the electromagnetic coupling module used in a wireless IC device according to a third embodiment. 同無線ICデバイスの主要部の断面図、および放射板上の放射電極の形状を示す平面図である。 Sectional view of a main part of the wireless IC device, and is a plan view showing the shape of the radiation electrode on the radiation plate. 第4の実施形態に係る無線ICデバイスに用いる電磁結合モジュールの主要部の断面図である。 It is a cross-sectional view of a main part of the electromagnetic coupling module used in a wireless IC device according to a fourth embodiment. 第5の実施形態に係る無線ICデバイスの主要部の断面図である。 It is a cross-sectional view of a main part of a wireless IC device according to a fifth embodiment. 第6の実施形態に係る無線ICデバイスの主要部の断面図、および放射板上の放射電極の形状を示す平面図である。 The sixth main part of the cross-sectional view of a wireless IC device according to the embodiment, and is a plan view showing the shape of the radiation electrode on the radiation plate. 第7の実施形態に係る無線ICデバイスの主要部の断面図である。 It is a cross-sectional view of a main part of a wireless IC device according to a seventh embodiment.

符号の説明 DESCRIPTION OF SYMBOLS

1,11,12,13,14−電磁結合モジュール 2,3−放射板 4−給電回路基板 5−無線ICチップ 6−保護膜 20,30−基材 21,22,23,24,25−放射電極 40,50−整合回路 41,42−第1外部結合電極 43,44−第2外部結合電極 45,46,47−インダクタ電極 48,51,52−外部結合電極 61,62−方向識別マーク 1,11,12,13,14- electromagnetic coupling module 2,3 radiating plate 4 feeder circuit board 5 through wireless IC chip 6 protective film 20,30- substrate 21,22,23,24,25- radiation electrode 40,50- matching circuit 41,42- first external coupling electrode 43,44- second external coupling electrodes 45,46,47- inductor electrode 48,51,52- external coupling electrode 61,62- direction identification mark

Claims (13)

  1. 無線ICチップと、 And the wireless IC chip,
    基材に放射電極を形成してなる放射板と、 A radiation plate obtained by forming a radiation electrode on the substrate,
    前記放射電極と電磁界結合する外部結合電極、および前記無線ICチップと前記放射電極との間のインピーダンス整合をとる整合回路を有する給電回路基板と、 A feed circuit board having a matching circuit for taking impedance matching between the radiation electrode and the electromagnetic field coupling to the external coupling electrode, and the wireless IC chip and the radiation electrode,
    を備えた無線ICデバイスであって、 A wireless IC device comprising,
    前記無線ICチップと前記給電回路基板とからなる電磁結合モジュールを前記放射板上に配置した状態で、前記電磁結合モジュールの第1・第2主面のいずれの主面を前記放射板側にしても、前記外部結合電極と前記放射電極との電磁結合量がほぼ等しくなるように、前記給電回路基板での前記外部結合電極の位置または形状を定めた無線ICデバイス。 In a state where the electromagnetic coupling module consisting of the wireless IC chip and the feeder circuit board is arranged on the radiation plate, and the one main surface of the first and second main surfaces of the electromagnetic coupling module on the radiation plate side also, the external coupling electrode and the like the amount of electromagnetic coupling between the radiation electrodes are substantially equal, the power supply circuit and the external coupling electrode wireless IC device that defines the position or shape of the substrate.
  2. 前記給電回路基板内に共振回路を備えたことを特徴とする請求項1に記載の無線ICデバイス。 The wireless IC device according to claim 1, further comprising a resonant circuit to the power supply circuit board.
  3. 前記外部結合電極は前記放射電極と容量結合する平板電極であり、当該外部結合電極を前記給電回路基板内で当該給電回路基板の第1・第2主面の近傍にそれぞれ配置した請求項1または2に記載の無線ICデバイス。 The external coupling electrode is a flat electrode to the radiation electrode and the capacitive coupling, the external coupling electrode of the power supply circuit according to claim 1 or respectively arranged in the vicinity of the first and second main surface of the feed circuit board in the board the wireless IC device according to 2.
  4. 前記給電回路基板の第1・第2主面の近傍にそれぞれ配置された前記外部結合電極同士を接続した請求項3に記載の無線ICデバイス。 The wireless IC device according to claim 3 which is connected to the external coupling electrodes are disposed respectively in the vicinity of the first and second main surface of the feeder circuit board.
  5. 前記外部結合電極は、前記給電回路基板内に配置され、前記放射電極と電磁界結合するインダクタ電極である、請求項1または2に記載の無線ICデバイス。 The external coupling electrode is on the feeder circuit board, wherein a radiation electrode and the inductor electrode to electromagnetic coupling, a wireless IC device according to claim 1 or 2.
  6. 前記無線ICチップと前記給電回路基板の両方または一方を保護膜で覆った請求項1〜5のいずれかに記載の無線ICデバイス。 The wireless IC device according to claim 1, the wireless IC chip and one or both of the feeder circuit board is covered with a protective film.
  7. 前記給電回路基板の第1の主面に凹部を備え、当該凹部に前記無線ICチップを配置した請求項1〜5のいずれかに記載の無線ICデバイス。 First with a recess on the main surface, the wireless IC device according to any of claims 1 to 5 arranged the wireless IC chip on the concave portion of the feeder circuit board.
  8. 前記放射電極を前記基材の表面に形成し、前記電磁結合モジュールを前記基材の内部に配置した請求項1〜7のいずれかに記載の無線ICデバイス。 It said radiation electrode is formed on the surface of the substrate, the wireless IC device according to the electromagnetic coupling module to claim 1 which is disposed in the substrate.
  9. 前記放射電極を前記基材の両面に形成した請求項8に記載の無線ICデバイス。 The wireless IC device according to claim 8, the radiation electrode is formed on both surfaces of the substrate.
  10. 前記放射板は第1・第2の少なくとも2つの放射板からなり、当該2つの放射板の間に前記電磁結合モジュールを配置した請求項1〜7のいずれかに記載の無線ICデバイス。 The radiating plate consists of first and second at least two of the radiation plate, the wireless IC device according to any of claims 1 to 7 by placing the electromagnetic coupling module to the two radiation plates.
  11. 前記電磁結合モジュールを囲むように前記2つの放射板同士を貼り合わせた請求項10に記載の無線ICデバイス。 The wireless IC device according to claim 10 obtained by bonding the two radiating plates are to surround the electromagnetic coupling module.
  12. 前記給電回路基板は、電極パターンを形成した複数の誘電体層を積層した多層基板で構成した請求項1〜11のいずれかに記載の無線ICデバイス。 The feeder circuit board, the wireless IC device according to any one of claims 1 to 11 configured in a multilayer substrate formed by laminating a plurality of dielectric layers provided with electrode patterns.
  13. 前記電磁結合モジュールの第1・第2主面に方向識別用の表示を形成したことを特徴とする請求項1〜12のいずれかに記載の無線ICデバイス。 The wireless IC device according to any one of claims 1 to 12, characterized in that the formation of the display for the direction identified first and second main surfaces of the electromagnetic coupling module.
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