WO2007083575A1 - Dispositif de circuit intégré radio - Google Patents

Dispositif de circuit intégré radio Download PDF

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Publication number
WO2007083575A1
WO2007083575A1 PCT/JP2007/050309 JP2007050309W WO2007083575A1 WO 2007083575 A1 WO2007083575 A1 WO 2007083575A1 JP 2007050309 W JP2007050309 W JP 2007050309W WO 2007083575 A1 WO2007083575 A1 WO 2007083575A1
Authority
WO
WIPO (PCT)
Prior art keywords
wireless
radiation plate
chip
circuit board
power supply
Prior art date
Application number
PCT/JP2007/050309
Other languages
English (en)
Japanese (ja)
Inventor
Yuya Dokai
Noboru Kato
Satoshi Ishino
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2007531524A priority Critical patent/JP4123306B2/ja
Publication of WO2007083575A1 publication Critical patent/WO2007083575A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/40—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by components specially adapted for near-field transmission
    • H04B5/48—Transceivers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components

Definitions

  • the present invention relates to a wireless IC device, and more particularly to a wireless IC device used for an RFID (Radio Frequency Identification) system.
  • RFID Radio Frequency Identification
  • an antenna pattern 101 is provided on a plastic film 100, and a wireless IC chip 110 is attached to one end of the antenna pattern 101.
  • An antenna pattern 121 and a radiation electrode 122 are provided thereon, and a wireless IC chip 110 is attached to a predetermined portion of the antenna pattern 121.
  • the wireless IC chip 110 is connected to and mounted on the antenna patterns 101 and 121 in a DC manner using Au bumps.
  • the IC chip 110 needs to be positioned.
  • the resonance frequency characteristics of the antenna also change when the antenna patterns 101 and 121 are rounded or sandwiched between dielectrics (for example, sandwiched in a book).
  • Patent Document 1 Japanese Patent Laid-Open No. 2005-136528
  • Patent Document 2 Japanese Patent Laid-Open No. 2005-244778
  • an object of the present invention is to provide a wireless IC device in which a wireless IC chip can be mounted easily and accurately, and the resonance frequency characteristic does not change.
  • a wireless IC device includes a wireless IC chip and a flexible substrate, is mounted with the wireless IC chip, and the wireless IC chip A power supply circuit board having a power supply circuit connected to the power supply circuit board, and a radiation plate that is directly or close to the power supply circuit board and is electromagnetically coupled to the power supply circuit.
  • a wireless IC device includes a wireless IC chip made of a flexible semiconductor, the wireless IC chip mounted thereon, and connected to the wireless IC chip.
  • the power supply circuit board includes a power supply circuit board, and a radiation plate that is directly or close to the power supply circuit board and is electromagnetically coupled to the power supply circuit.
  • the power feeding circuit is provided on the power feeding circuit board and is electromagnetically coupled to the radiation plate by electromagnetic coupling.
  • the wireless IC chip is connected to a power supply circuit board provided with a power supply circuit, and the power supply circuit board has a considerably small area, so that the wireless IC chip can be mounted with extremely high accuracy.
  • the power supply circuit is provided on the power supply circuit board, the resonance frequency characteristics do not change even if the wireless IC device is rolled or sandwiched between dielectrics.
  • the resonance frequency of the signal emitted from the radiation plate substantially corresponds to the self-resonance frequency of the power feeding circuit, and the maximum gain of the signal is It is substantially determined by at least one of the size and shape of the circuit, the distance between the feeding circuit and the radiation plate, and the medium.
  • the electrical length of the radiation plate should be an integral multiple of half the wavelength at the resonance frequency.
  • the feeder circuit board can be formed of a flexible board. If the wireless IC chip or the power supply circuit board is flexible, it is easy to handle without being cracked or chipped. Furthermore, the radiation plate is preferably formed of a flexible metal film. ,. This flexible metal film is held by a flexible film.
  • the power supply circuit board can be composed of a multilayer substrate formed by laminating a plurality of dielectric layers or magnetic layers, and the power supply circuit can be easily incorporated in the multilayer substrate.
  • the power supply circuit should be composed of an LC resonance circuit that also has an inductance element and a capacitance element force built into the multilayer substrate.
  • the inductance element can be formed by a coiled electrode pattern made of a conductor.
  • the coiled electrode pattern constituting the inductance element may have a winding axis formed substantially parallel to the radiation plate or may be formed substantially perpendicularly. In the latter case, it is preferable that the winding width of the coiled electrode pattern is gradually increased toward the radiation plate.
  • the wireless IC chip can be mounted on the feeder circuit board with extremely high accuracy.
  • the feeder circuit is provided on the feeder circuit board, the resonance frequency characteristics do not change even if the wireless IC device is rolled or sandwiched between dielectrics.
  • FIG. 1 is a perspective view showing a first embodiment of a wireless IC device according to the present invention.
  • FIG. 2 is a sectional view of the first embodiment.
  • FIG. 3 is an equivalent circuit diagram of the first embodiment.
  • FIG. 4 is an exploded perspective view showing the feeder circuit board of the first embodiment.
  • FIG. 5 is a perspective view showing a second embodiment of the wireless IC device according to the present invention.
  • FIG. 6 is a cross-sectional view showing a third embodiment of the wireless IC device according to the present invention.
  • FIG. 7 is an equivalent circuit diagram showing a fourth embodiment of the wireless IC device according to the present invention.
  • FIG. 8 is an equivalent circuit diagram showing a fifth embodiment of a wireless IC device according to the present invention.
  • FIG. 9 is an equivalent circuit diagram showing a sixth embodiment of a wireless IC device according to the present invention.
  • FIG. 10 is a sectional view showing a seventh embodiment of a wireless IC device according to the present invention.
  • FIG. 11 is an equivalent circuit diagram of the seventh embodiment.
  • FIG. 12 is an exploded perspective view showing a feeder circuit board of the seventh embodiment.
  • FIG. 13 is an equivalent circuit diagram showing an eighth embodiment of the wireless IC device according to the present invention.
  • FIG. 14 is an equivalent circuit diagram showing a ninth embodiment of a wireless IC device according to the present invention.
  • FIG. 15 is an exploded perspective view showing a power supply circuit board according to the ninth embodiment.
  • FIG. 16 is a perspective view showing a tenth embodiment of a wireless IC device according to the present invention.
  • FIG. 17 is a sectional view showing an eleventh embodiment of the wireless IC device according to the present invention.
  • FIG. 18 is an exploded perspective view showing the feeder circuit board of the eleventh embodiment.
  • FIG. 19 is a plan view showing a first example of a conventional wireless IC device.
  • FIG. 20 is a plan view showing a second example of a conventional wireless IC device.
  • FIGS. 1 to 4 Refer to the first embodiment, FIGS. 1 to 4.
  • the wireless IC device la is a monopole type, and as shown in FIGS. 1 and 2, a wireless IC chip 5 and a feeder circuit board 10 having the wireless IC chip 5 mounted on the upper surface, It is composed of a radiation plate 20 to which the feeder circuit board 10 is attached.
  • the wireless IC chip 5 has the necessary information power and is directly connected to the power supply circuit 16 built in the power supply circuit board 10.
  • the power feeding circuit board 10 incorporates a power feeding circuit 16 configured by an LC series resonance circuit that also has an inductance element L and a capacitance element C force.
  • the feeder circuit board 10 is formed by laminating and adhering flexible sheets 11A to 11G having dielectric strength such as polyimide or liquid crystal polymer, and forming the connection electrodes 12 and via-hole conductors 13a.
  • the sheets 11A to 11G are made of a dielectric or magnetic flexible material having a thickness of about 10 / zm, and a conductor pattern and a via-hole conductor can be formed on each sheet by a thick film forming process. Also laminated those sheets
  • the power supply circuit board 10 can be easily obtained by bonding by thermocompression bonding or the like.
  • the inductance element L whose winding axis is parallel to the radiation plate 20
  • the capacitor electrode 14b is connected to both ends of the inductance element L
  • the capacitor electrode 14a A capacitance element C is formed in which is connected to the connection electrode 12 via the via-hole conductor 13a. Then, the connection electrode 12 is connected to the wireless IC chip 5 via the solder bump 6.
  • a transmission signal is fed from the inductance element, which is a coiled electrode pattern, to the radiation plate 20 via a magnetic field, and the reception signal from the radiation plate 20 is also received. Is fed to the inductance element L via a magnetic field. Therefore, it is preferable that the power feeding circuit board 10 be laid out so that the inductance element is close to the radiation plate 20 among the inductance elements and capacitance elements constituting the resonance circuit.
  • the radiation plate 20 is a long body having nonmagnetic strength such as an aluminum foil, that is, a metal body with both ends open, and is formed on an insulating flexible film 21 such as PET.
  • the lower surface of the power supply circuit board 10 is stuck on the radiation plate 20 via an adhesive 17.
  • the wireless IC chip 5 has a thickness of 50 to 100 ⁇ m
  • the solder bump 6 has a thickness of about 20 m
  • the feeder circuit board 10 has a thickness of 200 to 500 111
  • the thickness of the adhesive 17 is 0.1 to: LO ⁇ m
  • the thickness of the radiation plate 20 is 1 to 50 ⁇ m
  • the thickness of the Finolem 21 is 10 to: LOO ⁇ m.
  • the size (area) of the wireless IC chip 5 is various, such as 0.4 mm X O. 4 mm, 0.9 mm 0.8 mm.
  • the size (area) of the power supply circuit board 10 can be configured from the same size as the wireless IC chip 5 to a size of about 3 mm ⁇ 3 mm.
  • FIG. 3 shows an equivalent circuit of the wireless IC device la.
  • the wireless IC device la receives a high-frequency signal (for example, UHF frequency band) that is also radiated with a reader / writer force (not shown) by the radiation plate 20, and includes a feeding circuit 16 that is mainly magnetically coupled to the radiation plate 20. Resonate and supply only the received signal in the predetermined frequency band to the wireless IC chip 5.
  • predetermined energy is extracted from this received signal, information stored in the wireless IC chip 5 is matched with a predetermined frequency by the power feeding circuit 16 using this energy as a driving source, and the inductance of the power feeding circuit 16 is matched.
  • a transmission signal is transmitted from the element to the radiation plate 20 through magnetic field coupling, and transferred from the radiation plate 20 to the reader / writer.
  • the power feeding circuit 16 and the radiation plate 20 may be coupled via a magnetic field (mainly electromagnetic field coupling), which is mainly coupled via a magnetic field.
  • the wireless IC chip 5 is directly connected to the feeder circuit board 10 including the feeder circuit 16, and the feeder circuit board 10 has a considerably small area. Therefore, it is possible to position and mount the wireless IC chip 5 with extremely high accuracy rather than mounting on a film having a large area as in the past.
  • the resonance frequency characteristic of the power feeding circuit 16 is determined by the inductance element L and the capacitance element C.
  • the resonance frequency of the signal radiated from the radiation plate 20 substantially corresponds to the self-resonance frequency of the feeder circuit 16, and the maximum gain of the signal is the size and shape of the feeder circuit 16, the feeder circuit 16 and the radiation plate 20, And at least one of the distance and the medium.
  • the electrical length of the radiation plate 20 is 1Z2 having a wavelength ⁇ corresponding to the resonance frequency.
  • the electrical length of the radiation plate 20 may not be an integer multiple of ⁇ 2.
  • the frequency of the signal radiated from the radiation plate is substantially determined by the resonance frequency of the power feeding circuit constituting the resonance circuit, and therefore the frequency characteristic is substantially equal to the electrical length of the radiation plate. Does not depend on. It is preferable that the electrical length of the radiation plate is an integral multiple of ⁇ 2 because the gain is maximized.
  • the resonance frequency characteristics of the power feeding circuit 16 are determined by the inductance element L and the capacitance element C built in the power feeding circuit board 10 as described above, the wireless IC device 1a is sandwiched between books. However, the resonance frequency characteristic does not change. Further, even if the wireless device la is rounded or the size of the radiation plate 20 is changed, the resonance frequency characteristic does not change.
  • the coiled electrode pattern constituting the inductance element L has the advantage that the center frequency does not fluctuate because the winding axis is formed in parallel with the radiation plate 20. Further, since the capacitance element C is inserted in the subsequent stage of the wireless IC chip 5, the low frequency surge can be cut by this element C, and the surge resistance of the wireless IC chip 5 can be protected.
  • the feeder circuit board 10 is a flexible board
  • the radiation plate 20 is formed of a flexible metal film held by the flexible film 21, so that, for example, a soft bag made of plastic film or a pet is used. Any obstacle to the cylindrical body like a bottle It can be stuck without.
  • the feeder circuit board 10 by manufacturing the feeder circuit board 10 with an organic material, it is possible to manufacture the feeder circuit board 10 at a low cost without the need for a baking process, and it is possible to reduce the height of the wireless IC device la by making the board thin overall. .
  • the wireless IC chip 5 is made of a flexible semiconductor, handling becomes easier and the number of objects to which the wireless IC device la is attached can be increased.
  • the wireless IC device lb As shown in FIG. 5, the wireless IC device lb according to the second embodiment has a wide area radiation plate 20 formed of aluminum foil or the like on a flexible plastic film 21 having a large area of insulation. A feeding circuit board 10 on which the wireless IC chip 5 is mounted is bonded to an arbitrary position of the radiation plate 20.
  • the other configuration of the wireless IC device lb that is, the internal configuration of the feeder circuit board 10 is the same as that of the first embodiment. Therefore, the operational effects of the second embodiment are basically the same as those of the first embodiment.
  • the wireless IC device lc of the third embodiment has an adhesive 17 applied to the entire surface of the film 21 via a radiation plate 20. With this adhesive 17, the wireless IC device lc can be attached to any part of the article.
  • the other configuration of the wireless IC device lc that is, the internal configuration of the feeder circuit board 10 is the same as that of the first embodiment. Therefore, the operational effects of the third embodiment are basically the same as those of the first embodiment.
  • the wireless IC device Id includes an inductance element L that also has a coiled electrode pattern force as a power feeding circuit 16 on an antenna substrate.
  • the capacitance element C constituting the LC resonance circuit is formed as a stray capacitance (distributed constant type capacitance) between the conductor patterns of the inductance element L.
  • the wireless IC device le is a device including a dipole type power feeding circuit 16 and a radiation plate 20, and a pair of LC parallel resonant circuits on the power feeding circuit board 10.
  • Power supply circuits 16a and 16b that have power are incorporated.
  • the power feeding circuit 16a is connected to the hot side of the wireless IC chip 5, and the power feeding circuit 16b is connected to the ground side of the wireless IC chip 5, and faces the radiation plates 20 and 20, respectively.
  • the end of the feeder circuit 16a is an open end.
  • the operation of the power supply circuits 16a and 16b having such LC parallel resonance circuit force is the same as that of the power supply circuit 16 including the LC series resonance circuit, and basically has the same effect as the first embodiment.
  • the wireless IC device If according to the sixth embodiment is a device including a dipole-type power feeding circuit 16 and a radiation plate 20, and a pair of LC series resonance circuits on the power feeding circuit board 10.
  • Power supply circuits 16a and 16b that have power are incorporated.
  • Each feeder circuit 16a, 16b is opposed to the radiation plates 20, 20, and the capacitance element C is connected to the ground.
  • the operation of the power supply circuits 16a and 16b having such LC series resonance circuit force is the same as that of the power supply circuit 16 including the LC series resonance circuit, and basically has the same effect as that of the first embodiment.
  • the wireless IC device lg according to the seventh embodiment is a monopole type, and a power supply circuit having an LC series resonance circuit force with an inductance element L and a capacitance element C built in the power supply circuit board 10. 16 is composed.
  • the coiled electrode pattern constituting the inductance element L has a winding axis formed perpendicular to the radiation plate 20, and the feeder circuit 16 is mainly magnetically coupled to the radiation plate 20. .
  • the feeder circuit board 10 is formed by laminating and adhering flexible sheets 31A to 31F made of a dielectric material such as polyimide or liquid crystal polymer.
  • sheet 31D multiple sheets
  • sheet 31E multiple sheets
  • sheet 31F force on which conductor pattern 35c is formed are also provided.
  • an inductance element L whose winding axis is perpendicular to the radiation plate 20, and an LC resonance circuit force in which a capacitance element C is connected in series with the inductance element L are also obtained.
  • a feed circuit 16 is obtained.
  • the capacitor electrode 34a is connected to the connection electrode 32 via the via-hole conductor 33a, and further connected to the wireless IC chip 5 via the solder bump 6, and one end of the inductance element L is connected to the connection electrode 32 via the via-hole conductor 33b. And is further connected to the wireless IC chip 5 via the solder bump 6.
  • the operation of the power supply circuit 16 having the LC series resonance circuit force is the same as that of the power supply circuit 16 having the LC series resonance circuit force, and basically has the same effect as the first embodiment.
  • the coiled electrode pattern has its winding axis formed perpendicular to the radiation plate 20, so that the magnetic flux component to the radiation plate 20 increases and the transmission efficiency of signal energy increases. It has the advantage of being improved and having a large gain.
  • the wireless IC device lh according to the eighth embodiment has a winding width (coil diameter) of the coiled electrode pattern of the inductance element L shown in the seventh embodiment as shown in FIG. 13 as an equivalent circuit. It is gradually formed larger. Other configurations are the same as those of the seventh embodiment.
  • the eighth embodiment has the same effect as the seventh embodiment, and the winding width (coil diameter) of the coiled electrode pattern of the inductance element L gradually increases toward the radiation plate 20. Since it is formed large, signal transmission efficiency is improved.
  • the wireless IC device li according to the ninth embodiment is a dipole type as shown in FIG. 14 as an equivalent circuit, and includes a power supply circuit board 10 including a pair of power supply circuits 16 a and 16 b that also have a pair of LC series resonance circuit forces. It is.
  • the feeder circuit board 10 is formed by laminating and adhering flexible sheets 41A to 41F made of a dielectric material such as polyimide liquid crystal polymer. And a sheet 41A on which via-hole conductors 43a are formed, and a sheet on which capacitor electrodes 44a are formed.
  • an inductance element L whose winding axis is perpendicular to the radiation plate 20 and an LC resonance circuit force in which a capacitance element C is connected in series with the inductance element L are also obtained.
  • Feed circuits 16a and 16b are obtained.
  • the capacitor electrode 44a is connected to the connection electrode 42 via the via hole conductor 43a, and further connected to the wireless IC chip 5 via the solder bump.
  • the wireless IC device lj is a device in which a power feeding circuit 56 having a coiled electrode pattern force is provided on the surface of a flexible power feeding circuit board 50 made of heat-resistant grease. is there. Both ends of the power feeding circuit 56 are directly connected to the wireless IC chip 5 via solder bumps, and the power feeding circuit board 50 is adhered to the film 21 holding the radiation plate 20 with an adhesive.
  • the conductor patterns 56a, 56b, and 56c that constitute the power feeding circuit 56 that intersect with each other are separated by an insulating film (not shown).
  • the feeder circuit 56 is mainly magnetically coupled to the radiation plate 20. Accordingly, as in the above embodiments, the high-frequency signal emitted from the reader / writer is received by the radiation plate 20, the power feeding circuit 56 is resonated, and only the received signal in a predetermined frequency band is supplied to the wireless IC chip 5. . On the other hand, a predetermined energy is extracted from this received signal, and information stored in the wireless IC chip 5 using this energy as a drive source is matched to a predetermined frequency by the power feeding circuit 56, and A transmission signal is transmitted from the inductance element to the radiation plate 20 through magnetic field coupling, and then transmitted from the radiation plate 20 to the reader / writer.
  • the front side of the feeder circuit 56 is provided on the feeder circuit board 50 having a small area. As in the first embodiment, the positioning accuracy is good, and the wireless IC chip 5 can be connected by solder bumps.
  • the wireless IC device lk has a coil-shaped electrode pattern of the power feeding circuit 56 built in the power feeding circuit board 50.
  • the feeder circuit board 50 is formed by laminating and adhering flexible sheets 51A to 51D having a dielectric force such as polyimide or liquid crystal polymer, and forming a connection electrode 52 and a via hole conductor 53a.
  • a power supply circuit board 50 having a coil-shaped power supply circuit 56 is obtained, and the connection electrodes 52 located at both ends of the power supply circuit 56 are connected to the solder bump 6.
  • the connection electrodes 52 located at both ends of the power supply circuit 56 are connected to the solder bump 6.
  • wireless IC device is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist thereof.
  • the details of the internal configuration of the feeder circuit board and the details of the radiation plate and the resin film are arbitrary.
  • processing other than solder bumps may be used to connect the wireless IC chip on the power supply circuit board.
  • the force feeder circuit board may be disposed at a position close to the radiation plate.
  • the present invention is useful for a wireless IC device used in an RFID system, and particularly excellent in that a wireless IC chip can be easily and accurately mounted and the resonance frequency characteristics do not change. ing.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne un dispositif de circuit intégré (CI) radio sur lequel une puce CI radio peut être facilement et précisément montée et dans lequel une caractéristique de fréquence de résonance n'est pas modifiée. Le dispositif CI radio comprend: une puce CI radio (5); un substrat de circuit d'alimentation (10) sur lequel la puce CI radio (5) est montée; un circuit d'alimentation intégré (16) connecté à la puce CI radio (5) via un bossage de soudure (6); et une plaque d'émission (20) fixée à la surface inférieure du substrat de circuit d'alimentation (10) et électromagnétiquement couplée au circuit d'alimentation (16) par couplage électromagnétique. Le substrat de circuit d'alimentation (10) est formé par chevauchement de couches souples et le circuit d'alimentation (16) est formé par un circuit de résonance comprenant un élément d'inductance (L) et un élément de capacité (C).
PCT/JP2007/050309 2006-01-19 2007-01-12 Dispositif de circuit intégré radio WO2007083575A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007531524A JP4123306B2 (ja) 2006-01-19 2007-01-12 無線ｉｃデバイス

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006011626 2006-01-19
JP2006-011626 2006-01-19
JP2006-238373 2006-09-01
JP2006238373 2006-09-01

Publications (1)

Publication Number Publication Date
WO2007083575A1 true WO2007083575A1 (fr) 2007-07-26

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Application Number Title Priority Date Filing Date
PCT/JP2007/050309 WO2007083575A1 (fr) 2006-01-19 2007-01-12 Dispositif de circuit intégré radio

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JP (1) JP4123306B2 (fr)
WO (1) WO2007083575A1 (fr)

Cited By (79)

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JP2009027291A (ja) * 2007-07-18 2009-02-05 Murata Mfg Co Ltd 無線ｉｃデバイス
JP2009053741A (ja) * 2007-08-23 2009-03-12 Murata Mfg Co Ltd 無線ｉｃデバイス及びその製造方法
JP2009080600A (ja) * 2007-09-26 2009-04-16 Murata Mfg Co Ltd 無線ｉｃデバイス
JP2009080599A (ja) * 2007-09-26 2009-04-16 Murata Mfg Co Ltd 無線ｉｃデバイス
WO2009110381A1 (fr) * 2008-03-03 2009-09-11 株式会社村田製作所 Dispositif à ci sans fil et système de communication sans fil
WO2009110382A1 (fr) * 2008-03-03 2009-09-11 株式会社村田製作所 Antenne composite
WO2009145218A1 (fr) * 2008-05-28 2009-12-03 株式会社村田製作所 Dispositif à circuit intégré sans fil et composant pour dispositif à circuit intégré sans fil
WO2010050361A1 (fr) * 2008-10-29 2010-05-06 株式会社村田製作所 Dispositif à circuit intégré (ci) sans fil
WO2010119854A1 (fr) * 2009-04-14 2010-10-21 株式会社村田製作所 Composant pour dispositif de ci sans fil et dispositif de ci sans fil
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