JPH10171954A - Non-contact type ic card - Google Patents

Non-contact type ic card

Info

Publication number
JPH10171954A
JPH10171954A JP8325431A JP32543196A JPH10171954A JP H10171954 A JPH10171954 A JP H10171954A JP 8325431 A JP8325431 A JP 8325431A JP 32543196 A JP32543196 A JP 32543196A JP H10171954 A JPH10171954 A JP H10171954A
Authority
JP
Japan
Prior art keywords
ic card
non
coil
contact type
winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP8325431A
Other languages
Japanese (ja)
Inventor
Ryuzo Fukao
Kyoichi Kohama
Kazuo Takasugi
京一 小浜
隆三 深尾
和夫 高杉
Original Assignee
Hitachi Maxell Ltd
日立マクセル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd, 日立マクセル株式会社 filed Critical Hitachi Maxell Ltd
Priority to JP8325431A priority Critical patent/JPH10171954A/en
Publication of JPH10171954A publication Critical patent/JPH10171954A/en
Application status is Withdrawn legal-status Critical

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact type IC card which is thin and has excellent productivity.
SOLUTION: A coil and an IC chip are mounted on a substrate, and an IC card is formed by electrically connecting a connecting part of the coil to a circuit pattern that is formed on the substrate and a terminal part of the IC chip to the circuit pattern respectively. The coil 10 which is mounted on the IC card consists of a winding wire part 12 that is formed by winding a coated wire 104 in a curled way, single wire parts 14 that separate from the winding wire part and cross an internal space 13 and fixing parts 15 that overlap on plural coated wires which constitute the winding wire part, and a connecting part 11 is formed at a central part of the single wire part. Each coated wire 104 with each other is adhered with binder that is coated on the coated wire part. Also, a marker 16 for positioning can be shown on the part 11 or its adjacent part.
COPYRIGHT: (C)1998,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、コイルを利用した電磁結合方式の非接触式ICカードに係り、特に基体上に搭載されるコイルの構造に関する。 The present invention relates to relates to a non-contact IC card of the electromagnetic coupling method using a coil, coil structure relating to a particular mounted on a substrate.

【0002】 [0002]

【従来の技術】従来より、基体上にICチップとコイルとを搭載して成り、リーダ・ライタからの電力の受給やリーダ・ライタとの間の情報のやり取りをコイル間の電磁結合を利用して行う非接触式ICカードが種々提案されている。 Conventionally, made by mounting the IC chip and a coil on a substrate, the exchange of information between the power receiving and reader-writer from the reader-writer by using electromagnetic coupling between the coils non-contact type IC cards carried out have been proposed. この種の非接触式ICカードは、例えば預金情報、保険情報、医療情報、定期券情報、運転免許証情報、身分証明情報等の個人情報の記憶や、工場における製品管理情報や商品流通業界における商品管理情報等の産業情報の記憶等に使用されるか、あるいは使用が検討されている。 Non-contact IC card of this type, for example deposit information, insurance information, medical information, commuter pass information, driver's license information, memory and personal information such as identification information, in product management information and goods distribution industry in factory or it is used to store such as industry information, such as product management information, or the use has been studied.

【0003】図12は従来よりこの種の非接触式ICカードに搭載されているコイルの一例を示す平面図、図1 [0003] Figure 12 is a plan view showing an example of a coil mounted on the non-contact IC card of this kind conventionally 1
3は当該コイルの要部断面図、図14は当該コイルを構成する被覆導線の断面図である。 3 is a fragmentary sectional view of the coil, FIG. 14 is a sectional view of a coated conductive wire constituting the coils. これらの図から明らかなように、本例のコイル100は、導線101の周囲に絶縁塗料102及びバインダ103が2重に被覆された被覆導線104を渦巻状に巻回し、相隣接する被覆導線104間をバインダ103にて接着して成る。 As is apparent from these figures, the coil 100 of the present example, coated conductive wire insulation coatings 102 and a binder 103 around the conductor 101 is wound has been coated conductive wire 104 coated spirally double, adjacent phase 104 between formed by bonding in the binder 103. また、被覆導線104の両端部104a,104bは、渦巻状巻回部105の外周側に折り曲げられ、渦巻状巻回部10 Further, both end portions 104a of the coated conductive wire 104, 104b is bent to the outer peripheral side of the spiral winding portion 105, spiral winding portion 10
5の外周より外側に突出した先端部の絶縁塗料102及びバインダ103が剥離されて、導線101が露出された接続部106が形成されている。 Insulating varnish 102 and the binder 103 of the distal end portion projecting outwardly from the outer periphery of 5 is peeled off, the connection portion 106 which conductor 101 is exposed is formed.

【0004】このコイル100は、図15に示すように、基体110の表面に形成された回路パターン111 [0004] The coil 100, as shown in FIG. 15, the circuit formed on the surface of the substrate 110 pattern 111
の端子部111aに接続部106を電気的に接続することにより基体110上に搭載されるか、或いは図16に示すように、ICチップ120の端子部121に接続部106が電気的に接続されたICモジュールを基体11 If mounted on the base 110 by electrically connecting the connecting portion 106 to the terminal portion 111a, or as shown in FIG. 16, the connecting portion 106 is electrically connected to the terminal portion 121 of the IC chip 120 the base 11 of the IC module
0上に設置することによって基体110と一体化される。 0 is integrated with the substrate 110 by placing on.

【0005】 [0005]

【発明が解決しようとする課題】ところが、図12に示した従来のコイル100は、接続部106が形成される被覆導線104の先端部が渦巻状巻回部105に固定されておらず、自由端になっているので、当該接続部10 [SUMMARY OF THE INVENTION However, conventional coil 100 shown in FIG. 12, the distal end portion of the coated conductive wire 104 is not fixed to spirally winding portion 105 connection portion 106 is formed, the free since the turned end, the connecting portion 10
6を回路パターン111の端子部111a又はICチップ120の端子部121に効率良く接続することが困難で、ICカードのトータルコストが高価になるという問題がある。 6 is difficult to be connected efficiently to the terminal portion 121 of the terminal portion 111a or IC chip 120 of the circuit patterns 111, the total cost of the IC card has a problem that it becomes expensive.

【0006】即ち、被覆導線104の先端部が自由端になっていると、僅かな外力を受けただけで容易に変形するため、仮にコイル100の製造段階において高精度のものが製造できたとしても、搬送段階或いはICカードの組立段階等において接続部106が所要の位置からずれやすく、回路パターン111又はICチップ120とコイル100とを接続する際に、接続部106が端子部111a又は121の間隔と相等しい間隔で配置されたものを供給することが困難になる。 Namely, when the leading end portion of the coated conductive wire 104 is a free end, as to easily deformed only by receiving a slight external force, is assumed that high precision in the manufacturing stage of the coil 100 can be manufactured also, the connecting portion 106 in the assembly stage or the like of the transport stage or IC card easily displaced from the required position, when connecting the circuit patterns 111 or the IC chip 120 and the coil 100, the connection unit 106 of the terminal portion 111a or 121 it becomes difficult to supply that are arranged at intervals and a phase equal intervals. このため、回路パターン111の端子部111a又はICチップ120の端子部121に接続部106を接続するに先立って、接続部106が形成された被覆導線104の先端部を整形し直すか、或いは被覆導線104の先端部が接続しようとする端子部111a又は121に合致するように被覆導線104の先端部を矯正しながら接続作業を行わなくてはならず、コイル100の接続が非効率になってICカードのトータルコストが高価になる。 Thus, either prior to connecting the connecting portion 106 to the terminal portion 121 of the terminal portion 111a or IC chip 120 of the circuit patterns 111, reshape the tip of the coated conductive wire 104 to the connecting portion 106 is formed, or coating must not without connection work while correcting the tip of the coated conductive wire 104 so that the tip portion of the wire 104 matches the terminal portions 111a or 121 attempts to connect, the connection of the coil 100 becomes inefficient total cost of the IC card becomes expensive. 特に、薄形のIC In particular, thin form of IC
カードにおいては、使用される被覆導線104の線径が細くなり、コイル100の剛性が一層低下するので、上記の不都合がますます顕著になる。 In the card, wire diameter of the coated conductive wire 104 to be used becomes thinner, the rigidity of the coil 100 is lowered further, the above disadvantages become increasingly pronounced.

【0007】本発明は、かかる課題を解決するためになされたものであって、その目的は、薄形にして生産性に優れた非接触式ICカードを提供することにある。 [0007] The present invention, which has been made to solve the above problems, its object is to provide a non-contact type IC card which is excellent in productivity by the thin.

【0008】 [0008]

【課題を解決するための手段】本発明は、前記課題を解決するため、基体上にICチップとリーダ・ライタ側に備えられたコイルと電磁結合するためのコイルとを搭載してなる非接触式ICカードにおいて、前記コイルとして、被覆導線を巻回した巻線コイルであって、その両端部が巻線部に固定され、当該巻線部より自由端となって突出する部分を除く前記被覆導線の一部に、前記基体に形成された回路パターン又は前記ICチップとの接続部が形成されたものを用いるという構成にした。 The present invention SUMMARY OF THE INVENTION In order to solve the above problems, it incorporates a coil for coil electromagnetically coupled provided in IC chip and the reader-writer on a substrate a non-contact in formula IC card, as said coil, a winding coil formed by winding the coated conductive wire, both end portions are fixed to the winding portion, said cover except a portion projecting free ends from the winding portion some of the wires were to configure that used as the connection portion of the circuit pattern or the IC chip is formed on the substrate is formed.

【0009】より具体的には、被覆導線の両端部が巻線部と重なりあう方向に折り曲げられて当該巻線部を構成する複数の被覆導線に固定され、当該固定部の全部又は一部に接続部が形成されたコイルを用いることもできるし、被覆導線の両端側に巻線部から離れて当該巻線部の内部空間を横断する単線部が形成され、その先端部が前記巻線部を構成する複数の被覆導線に固定され、単線部の一部に接続部が形成されたコイルを用いることもできる。 More specifically [0009] Both ends of the coated conductive wire is bent in a direction overlapping the winding portion is fixed to a plurality of insulated conductive wires constituting the winding unit, in whole or part of the fixed part it can also be used a coil connection portion is formed, a single wire portions crossing the internal space of the winding portion remote from the winding section on both end sides of the coated conductive wire is formed, the distal end is the winding unit the fixed multiple coating lead constituting, it is also possible to use a coil connection portion is formed in a part of the single line section. これらのコイルとしては、ICカードの薄形に好適であることから、被覆導線を渦巻状に巻回し、巻線部の断面形状が扁平なリング状に形成されたものを用いることが特に好ましい。 These coils, since it is suitable for thin IC card, winding a coated conductive wire spirally, it is particularly preferable to use a cross-sectional shape of the winding portion is formed in a flat ring shape.

【0010】このように、被覆導線の両端部を巻線部に固定し、当該巻線部より自由端となって突出する部分を除く前記被覆導線の一部に接続部を形成すると、接続部の形成部が搬送段階或いはICカードの組立段階等で外力を受けて変形しにくくなるので、コイルの製造段階において接続部を高精度に位置決めして形成しておくことによって、当該接続部と回路パターン又はICチップとの接続を容易かつ確実に行うことができ、ICカードのトータルコストを低減できる。 [0010] In this manner, the both end portions of the coated conductive wire is fixed to the winding unit to form a connection to a portion of the coated conductive wire except a portion projecting free ends from the winding portion, the connecting portion since formation of is hardly deformed by an external force in the assembly stage or the like of the transport stage or IC card, by forming positions the connecting portion with high accuracy in the manufacturing stage of the coil, the connecting portion and the circuit the connection between the pattern or the IC chip can be easily and reliably, thereby reducing the total cost of the IC card.

【0011】なお、前記コイルには、接続時における前記接続部と回路パターン又はICチップとの位置決めを容易にするため、前記接続部又はその近傍にマーカーを表示することができる。 [0011] Incidentally, the coil, in order to facilitate positioning of the connecting portion and the circuit pattern or IC chip at the time of connection, it is possible to display the connection or markers near the. また、前記コイルの取扱性を良好なものにするため、前記巻線部を構成する各被覆導線どうし、及び前記巻線部と前記被覆導線の両端部とをバインダを介して互いに接着することができる。 Also, since the handling of the coil favorable, the coated conductive wire each other to constitute the winding portion, and both end portions of the coated conductive wire and the winding part can be bonded together via a binder it can.

【0012】一方、前記基体に対するコイル及びICチップの搭載構造としては、これらの各搭載部品を夫々単体で前記基体上に搭載し、当該基体に形成された回路パターンを介して接続することもできるし、前記コイルの接続部に前記ICチップを接続してなるICモジュールを基体上に搭載することもできる。 Meanwhile, as a structure for mounting a coil and an IC chip to said substrate, may be the respective mounting parts mounted in each alone on the substrate, connected via a circuit pattern formed on the substrate and, an IC module formed by connecting the IC chip to the connecting portion of the coil may be mounted on the substrate. さらには、前記コイル及びICチップを前記基体とは異なる共通のシート状部材に接着してモジュール化し、当該モジュール化されたコイル及びICチップを前記基体上に搭載することもできる。 Furthermore, it is also possible to the coil and the IC chip and modularized by bonding different common sheet-like member and the substrate is mounted the modular coil and the IC chip on the substrate. この場合、前記シート状部材としては、基体との接着性を高めて界面剥離を防止するため、接着用樹脂の浸透性が高いシート、例えば不織布又は合成繊維のメッシュシート等を用いることが好ましい。 In this case, as the sheet-like member, to prevent interfacial peeling to enhance the adhesion to the substrate, a high permeability of the adhesive resin sheet, it is preferable to use, for example, of a nonwoven or synthetic fiber mesh sheet.

【0013】 [0013]

【発明の実施の形態】まず、本発明に係る非接触式IC DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, the non-contact IC according to the present invention
カードの構成例を、図1〜図3に基づいて説明する。 A configuration example of a card will be described with reference to FIGS. 図1は第1実施形態例に係る非接触式ICカードの断面図、図2は第2実施形態例に係る非接触式ICカードの断面図、図3は第3実施形態例に係る非接触式ICカードの断面図である。 Figure 1 is a sectional view of a non-contact type IC card according to a first embodiment, FIG. 2 is a sectional view of a non-contact type IC card according to a second embodiment, FIG. 3 is a non-contact according to the third embodiment it is a cross-sectional view of the formula IC card.

【0014】第1実施形態例に係る非接触式ICカードは、図1に示すように、回路パターン31が形成された第1基体30aの回路パターン形成面にコイル10とI [0014] Non-contact type IC card according to the first embodiment, as shown in FIG. 1, the coil 10 in the circuit pattern formation surface of the first substrate 30a on which a circuit pattern 31 is formed I
Cチップ20とが搭載され、コイル10の接続部11と回路パターン31の端子部31a及びICチップ20の端子部21と回路パターン31の端子部31bとが夫々電気的に接続されている。 C chip 20 and are mounted, are the terminal portions 31b Togaotto s electrically connected to terminals 21 and the circuit pattern 31 of the connecting portion 11 and the circuit pattern 31 terminal portion 31a and the IC chip 20 of the coil 10. また、当該第1基体30aの部品搭載面は、第2基体30bにて覆われており、これら第1基体30a及び第2基体30bの表裏両面には、 Further, the component mounting surface of the first substrate 30a is covered by the second substrate 30b, the front and rear surfaces of the first substrate 30a and second substrate 30b,
カバーシート40,41が被着されている。 Cover sheet 40 and 41 have been deposited.

【0015】また、第2実施形態例に係る非接触式IC Further, non-contact IC in accordance with the second embodiment
カードは、図2に示すように、電気的に接続されたコイル10とICチップ20とが搭載された基板32が、第1基体30a及び第2基体30bにてサンドイッチされ、これら第1基体30a及び第2基体30bの表裏両面にカバーシート40,41が被着されている。 Card, as shown in FIG. 2, the substrate 32 and the IC chip 20 coil 10 which is electrically connected is mounted, it is sandwiched by the first substrate 30a and second substrate 30b, these first substrate 30a and the cover sheet 40 and 41 on both surfaces of the second substrate 30b is adhered. なお、 It should be noted that,
前記基板32は、搭載部品を安定に保持可能なものであれば任意の材料を用いて形成することができるが、第1 The substrate 32 may be formed using any material as long as it can stably hold the mounting component, the first
基体30a及び第2基体30bとの間の界面剥離を防止するため、例えば不織布や合成繊維のメッシュシートなど、接着用樹脂を浸透可能な樹脂浸透性シートを用いて形成することが好ましい。 To prevent interfacial peeling between the substrate 30a and second substrate 30b, such as a mesh sheet of nonwoven fabric or synthetic fibers, it is preferably formed using a permeable resin permeable sheet adhesive resin.

【0016】また、第3実施形態例に係る非接触式IC Further, non-contact IC according to a third embodiment
カードは、図3に示すように、電気的に接続されたコイル10とICチップ20が直接第1基体30a及び第2 Card, as shown in FIG. 3, electrically connected to the coil 10 and the IC chip 20 is directly first substrate 30a and the second
基体30bにてサンドイッチされ、これら第1基体30 Sandwiched by substrates 30b, these first substrate 30
a及び第2基体30bの表裏両面にカバーシート40, Cover sheet 40 on both surfaces of a and the second base 30b,
41が被着されている。 41 has been deposited.

【0017】第1基体30a及び第2基体30bを構成する材料としては、搭載部品を安定に保持可能なものであれば任意の材料を用いることができるが、所定形状及び所定構造のICカードを高能率に製造できることから、例えば熱硬化性樹脂が含浸された不織布のように、 [0017] As the material constituting the first substrate 30a and second substrate 30b, which may be made of any material as long as it can stably hold the mounting component, the IC card having a predetermined shape and a predetermined structure because it can manufacture a high efficiency, as for example nonwoven fabric thermosetting resin is impregnated,
熱圧着性を有する織物、編物又は不織布の熱圧着体を用いることが特に好ましい。 Fabric with heat-bondable, it is particularly preferable to use the thermocompression bonding of the knitted or nonwoven fabric. また、第1基体30aとしてプラスチックシートを用いると共に、第2基体30bとして第1基体30aの部品搭載面を覆うパッケージ樹脂を用いることもできる。 In addition, it with a plastic sheet as the first substrate 30a, also possible to use a package resin as the second base 30b to cover the component mounting surface of the first substrate 30a. さらに、各電気的接続部の周囲を断線防止用のモールド樹脂で固定することもできる。 Furthermore, it is also possible to fix the periphery of the electrical connections in a mold resin for preventing disconnection.

【0018】なお、基体材料として、熱圧着性を有する織物、編物又は不織布の熱圧着体のように搭載部品の組立工程において柔軟性を有するものを用いる場合には、 [0018] As the substrate material, fabric with heat-bondable, when using a material having flexibility in the assembly process of mounting components as thermocompression bonding of fabric or nonwoven fabric,
1枚の基体内に搭載部品を埋設することが可能であるため、第2基体30bを省略することもできる。 Since it is possible to bury the mounted components on one the base, it is possible to omit the second substrate 30b. また、カバーシート40,41についても、必要に応じて、その両方又はいずれか一方を省略することができる。 Further, the cover sheet 40 and 41 also, if desired, can be omitted one or both or either.

【0019】第1実施形態例に係る非接触式ICカードにおけるコイル10と回路パターン31との接続方法としては、はんだ付けや超音波融接を利用できる。 [0019] As a method of connecting the coil 10 and the circuit pattern 31 in the non-contact type IC card according to the first embodiment, it can be utilized soldering or ultrasonic fusion welding. また、 Also,
第1実施形態例に係る非接触式ICカードにおけるIC IC in a non-contact type IC card according to a first embodiment
チップ20と回路パターン31との接続方法としては、 The method of connecting the chip 20 and the circuit pattern 31,
フェースアップ方式でICチップ20を第1基体30a The first base 30a of the IC chip 20 in the face-up method
上に取り付けるタイプのICカードについてはワイヤボンディング接続、フェースダウン方式でICチップ20 The type of IC card attached to the upper wire bonding connection, IC chip 20 in a face-down method
を第1基体30a上に取り付けるタイプのICカードについては導電ペーストや異方導電性フィルム等を用いた直接接続を利用することができる。 The information about the types of IC cards for mounting on the first substrate 30a can utilize a direct connection using a conductive paste or anisotropic conductive film. さらに、第2及び第3実施形態例に係る非接触式ICカードにおけるコイル10とICチップ20との接続方法としては、はんだ付けや超音波融接を利用できる。 Further, as the method of connecting the coil 10 and the IC chip 20 in the non-contact IC card according to the second and third embodiment, it can use soldering or ultrasonic fusion welding.

【0020】次に、本発明に係るコイル10の構成例を、図4〜図8に基づいて説明する。 Next, a configuration example of a coil 10 according to the present invention will be described with reference to FIGS. 4-8. 図4は第1実施形態例に係るコイルの平面図、図5は第1実施形態例に係るコイルの側面図、図6は第2実施形態例に係るコイルの平面図、図7は第3実施形態例に係るコイルの平面図、図8は第3実施形態例に係るコイルの側面図である。 Figure 4 is a plan view of a coil according to the first embodiment, FIG. 5 is a side view of a coil according to the first embodiment, FIG. 6 is a plan view of a coil according to a second embodiment, FIG. 7 is a third plan view of a coil according to the embodiment, FIG. 8 is a side view of a coil according to the third embodiment. なお、コイル10の素材である被覆導線としては、 As coated conductive wire which is a material of the coil 10,
従来のコイルと同様に、導線101の周囲に絶縁塗料1 Like the conventional coil, insulation around the conductors 101 Paint 1
02とバインダ103とが2重に被覆された被覆導線1 02 and coated conductive wire 1 and the binder 103 is covered doubly
00(図14参照)が用いられる。 00 (see FIG. 14) is used.

【0021】第1実施形態例に係るコイル10は、図4 [0021] The coil 10 according to the first embodiment, FIG. 4
及び図5に示すように、被覆導線104を渦巻状に巻回することによって形成された扁平な楕円リング状の巻線部12と、当該巻線部12から離れて当該巻線部12の内部空間13を横断する単線部14と、巻線部12を構成する複数の被覆導線104と重ね合わされた固定部1 And FIG. 5, the winding unit 12 has been in flat elliptical ring shape formed by winding the coated conductive wire 104 in a spiral shape, inside of the winding portion 12 away from the winding portion 12 a single wire section 14 across the space 13, the fixed part 1 superimposed with a plurality of coated conductive wire 104 constituting the winding part 12
5とから構成され、前記単線部14の中央部分に、絶縁塗料102及びバインダ103を剥離し、導線101を露出させることによって形成される接続部11が設けられている。 It consists 5 which, in the central portion of the single-wire portion 14, stripping the insulation coating 102 and the binder 103, the connecting portion 11 which is formed by exposing the conductor 101 is provided. 巻線部12において相隣接する被覆導線10 Coated conductive wire 10 adjacent to each in the winding section 12
4どうし、及び固定部15において互いに重ねあわされた各被覆導線104どうしは、被覆導線104に被覆されたバインダ103にて接着される。 4 What happened, and what was each coated conductive wire 104 are superposed each other at the fixing portion 15 is adhered by binder 103 coated on the coated conductive wire 104. なお、接続部11 In addition, the connecting portion 11
には、はんだを被着しておくこともできる。 The, it is also possible to have deposited the solder. また、当該接続部11又はその近傍部分には、回路パターン31の端子部31a又はICチップ20の端子部21に対する接続部11の位置決めを容易化するためのマーカー16 Further, the connection portion 11 or its vicinity of the marker for facilitating the positioning of the connecting portion 11 with respect to the terminal portion 21 of the terminal portion 31a or the IC chip 20 of the circuit pattern 31 16
を、着色インク等をもって表示することもできる。 And it may be displayed with a color ink or the like.

【0022】第2実施形態例に係るコイル10は、図6 [0022] The coil 10 according to a second embodiment, FIG. 6
に示すように、被覆導線104の両端部をもって夫々複数個の単線部14と固定部15とを形成したことを特徴とする。 As shown in, characterized in that with the end portions of the coated conductive wire 104 to form a fixing portion 15 and the respective plurality of single-line portion 14. その他の部分については、第1実施形態例に係るコイルと同じであるので、重複を避けるために説明を省略する。 Since the other portions are the same as the coil according to the first embodiment, the description thereof is omitted to avoid duplication.

【0023】第3実施形態例に係るコイル10は、図7 [0023] The coil 10 according to the third embodiment, FIG. 7
及び図8に示すように、被覆導線104を渦巻状に巻回することによって形成された扁平な楕円リング状の巻線部12と、その両端部を巻線部12の上面側に折り返して固定した固定部15とから構成され、前記固定部15 And FIG. 8, the winding portion 12 of the formed flat oval ring shape by winding the coated conductive wire 104 spirally fixed folding both ends thereof on the upper surface of the winding part 12 consists the fixed portion 15. the fixed portion 15
に、絶縁塗料102及びバインダ103を剥離し、導線101を露出させることによって形成される接続部11 The insulating paint 102 and binder 103 is peeled off, the connection portion 11 formed by exposing the conductor 101
が設けられている。 It is provided. その他の部分については、第1実施形態例に係るコイルと同じであるので、重複を避けるために説明を省略する。 Since the other portions are the same as the coil according to the first embodiment, the description thereof is omitted to avoid duplication.

【0024】このように、被覆導線104の両端部を巻線部12に固定し、当該固定部15又は単線部14に接続部11を形成すると、接続部11が搬送段階或いはI [0024] Thus, the both end portions of the coated conductive wire 104 is fixed to the winding portion 12, to form a connecting portion 11 to the fixing section 15 or the single-wire unit 14, the connecting portion 11 is conveyed out or I
Cカードの組立段階等で外力を受けても変形しにくくなるので、コイル10の製造段階において接続部11を高精度に位置決めしておくことによって、当該接続部11 Also becomes difficult to deform by an external force in C assembly stage such as a card, by keeping positioning the connecting portion 11 with high accuracy at the manufacturing stage of the coil 10, the connecting portion 11
と回路パターン31又はICチップ20との接続を容易かつ確実に行うことができ、ICカードのトータルコストを低減できる。 And the connection between the circuit pattern 31 or the IC chip 20 can be easily and reliably, thereby reducing the total cost of the IC card.

【0025】なお、前記各実施形態例においては、楕円状コイルのみを例に挙げて説明したが、コイル10の巻回形状についてはこれに限定されるものではなく、他の任意の形状に巻回できることは勿論である。 It should be noted, in the above respective embodiments, although only elliptical coil is described as an example, it is not limited thereto for winding shape of the coil 10, wound in any other shape it is a matter of course that can times.

【0026】以下、本発明に係るICカードの製造方法について説明する。 [0026] Hereinafter, a method for manufacturing an IC card according to the present invention.

【0027】〈製造方法の第1例〉製造方法の第1例は、前記第1実施形態例に係るICカードの製造方法に関する。 The first example of the manufacturing method <first example of the manufacturing method> The method for producing an IC card according to the first embodiment. まず、図9に示すように、定盤50上に所定形状及び所定寸法の枠体51を載置し、当該枠体51内に下カバーシート40を収納する。 First, as shown in FIG. 9, by placing the frame member 51 having a predetermined shape and a predetermined size on the surface plate 50, housing the lower cover sheet 40 to the frame body 51. この下カバーシート4 The lower cover sheet 4
0上に、回路パターン31が形成された第1基体30a On 0, the first substrate 30a on which a circuit pattern 31 is formed
のもとになる不織布52を、回路パターン31を上向きにして収納する。 The nonwoven fabric 52 made under the houses and the circuit pattern 31 upward. 当該不織布52上にコイル10及びI Coils on the non-woven fabric 52 10 and I
Cチップ20を位置決めして搭載し、前記した接続方法により、コイル10と回路パターン31との接続、及びICチップ20と回路パターン31との接続を行う。 Mounted by positioning the C chips 20, carried by the connection method described above, connection between the coil 10 and the circuit pattern 31, and the connection between the IC chip 20 and the circuit pattern 31. 次いで、コイル10及びICチップ20の上方より第2基体30bのもとになる不織布53を積み重ねる。 Then, stacked coils 10 and nonwoven 53 to be under the second substrate 30b from above the IC chip 20. 次いで、枠体51内に接着用の樹脂を充填した後、前記第2 Then, after filling the resin for the adhesive in the frame 51, the second
基体30bのもとになる不織布53の上に上カバーシート41を積み重ねる。 Stacking the upper cover sheet 41 onto the nonwoven fabric 53 made under the base 30b. そして、枠体51の上面に当該枠体51よりも大型の圧縮板54を押しつけ、枠体51の全体に樹脂を行きわたらすと共に、余剰の樹脂を排出する。 Then, pressing a large compression plate 54 than the frame 51 on the upper surface of the frame 51, along with to span go the resin to the entire frame 51, to discharge the excess resin. しかる後に、不織布52,53を熱圧着し、枠体5 Thereafter, the nonwoven fabric 52 and 53 by thermal compression bonding, the frame 5
1の内面形状と同一形状の熱圧着体を作製する。 Making thermocompression bonding of the first inner surface the same shape. 最後に、熱圧着体の周辺部を切断して、所定寸法のICカードを得る。 Finally, by cutting the peripheral portion of the thermocompression bonding material, to obtain an IC card of a predetermined size. なお、本例においては、説明を容易にするため、ICカードを1枚ずつ作製する場合を例にとって説明したが、枠体51を大型化することによって、複数枚のICカードを多数個取りできるようにすることも勿論可能である。 In the present embodiment, for ease of description, a case has been described of manufacturing an IC card one by one as an example, by increasing the size of the frame 51, can be a large number of multiple IC cards-piece it is of course also possible to so.

【0028】〈製造方法の第2例〉製造方法の第2例は、前記第2実施形態例に係るICカードの製造方法に関する。 The second example of the manufacturing method <second example of the manufacturing method> The method for producing an IC card according to the second embodiment. まず、不織布や合成繊維のメッシュシートなどの樹脂浸透性シートを用いて形成された基板32上に電気的に接続されたコイル10とICチップ20とを搭載して、ICモジュール60を作製する。 First, by mounting the coil 10 and the IC chip 20 electrically connected on the substrate 32 formed of a resin permeable sheet such as a mesh sheet of nonwoven fabric or synthetic fibers, to produce the IC module 60. 次いで、図10 Then, 10
に示すように、定盤50上に所定形状及び所定寸法の枠体51を載置し、当該枠体51内に下カバーシート40 As shown in, placing the frame 51 having a predetermined shape and a predetermined size on the platen 50, the lower cover sheet 40 to the frame body 51
を収納する。 The houses. この下カバーシート40上に、第1基体3 On the lower cover sheet 40, the first substrate 3
0aのもとになる不織布52と、前記ICモジュール6 A non-woven fabric 52 to be under 0a, the IC module 6
0と、第2基体30bのもとになる不織布53とをこの順に積み重ねる。 0, stacking the nonwoven fabric 53 made under the second substrate 30b in this order. 次いで、枠体51内に接着用の樹脂を充填した後、前記第2基体30bのもとになる不織布5 Then, after filling the resin for the adhesive in the frame 51, made under the second substrate 30b nonwoven 5
3の上に上カバーシート41を積み重ねる。 3 stacked on the cover sheet 41 on top of the. そして、枠体51の上面に当該枠体51よりも大型の圧縮板54を押しつけ、枠体51の全体に樹脂を行きわたらすと共に、余剰の樹脂を排出する。 Then, pressing a large compression plate 54 than the frame 51 on the upper surface of the frame 51, along with to span go the resin to the entire frame 51, to discharge the excess resin. しかる後に、不織布52, Thereafter, non-woven fabric 52,
53を熱圧着し、枠体51の内面形状と同一形状の熱圧着体を作製する。 53 was thermocompression bonding to produce a heat bonding of the inner surface the same shape of the frame 51. 最後に、熱圧着体の周辺部を切断して、所定寸法のICカードを得る。 Finally, by cutting the peripheral portion of the thermocompression bonding material, to obtain an IC card of a predetermined size. なお、本例のICカード製造方法においても、枠体51を大型化することによって、複数枚のICカードを多数個取りすることができる。 Also in IC card manufacturing method of this embodiment, by increasing the size of the frame 51, it can be a large number of multiple IC cards-piece. また、ICモジュール60についても、必ずしも個々に製造する必要はなく、図11に示すように、リボン状の長大な基板32上に電気的に接続されたコイル1 Also, the IC module 60 is also not necessarily be manufactured separately, as shown in FIG. 11, the coil 1 is electrically connected onto a ribbon-like long substrate 32
0とICチップ20を等間隔に搭載してなるものを作製してフープ状に巻回しておき、端部を順次繰り出しつつ必要な長さに切断して使用するようにすることもできる。 0 and advance wound fabricated hoop one made by mounting at equal intervals IC chip 20 can be adapted for use by cutting the required length while sequentially feeding the end. この方法によれば、ICカードの製造をより効率化できる。 According to this method, it can be more efficient production of IC card. また、前記第3実施形態例に係るICカードについても、図10の製造方法を応用することによって製造することができる。 As for the IC card according to the third embodiment can be manufactured by applying the manufacturing method of FIG. 10.

【0029】 [0029]

【発明の効果】以上説明したように、本発明によると、 As described in the foregoing, according to the present invention,
被覆導線の両端部を巻線部に固定し、当該巻線部より自由端となって突出する部分を除く被覆導線の一部に接続部を形成したので、接続部の形成部が搬送段階或いはI Both end portions of the coated conductive wire is fixed to the winding portion, so to form a connection to a portion of the coated conductive wire except a portion projecting free ends from the winding portion, forming part of the connecting portion is conveyed out or I
Cカードの組立段階等で外力を受けて変形しにくい。 Hardly deformed by an external force in C card assembly stage or the like. よって、コイルの製造段階において接続部を高精度に位置決めして形成しておくことによって、当該接続部と回路パターン又はICチップとの接続を容易かつ確実に行うことができ、ICカードのトータルコストを低減できる。 Therefore, By forming positions the connecting portion with high accuracy in the manufacturing stage of the coil, it is possible to make a connection between the connection portion and the circuit pattern or IC chip easily and reliably, the total cost of the IC card It can be reduced.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】第1実施形態例に係る非接触式ICカードの断面図である。 1 is a cross-sectional view of a non-contact type IC card according to the first embodiment.

【図2】第2実施形態例に係る非接触式ICカードの断面図である。 2 is a cross-sectional view of a non-contact type IC card according to a second embodiment.

【図3】第3実施形態例に係る非接触式ICカードの断面図である。 3 is a cross-sectional view of a non-contact type IC card according to the third embodiment.

【図4】第1実施形態例に係るコイルの平面図である。 4 is a plan view of a coil according to the first embodiment.

【図5】第1実施形態例に係るコイルの側面図である。 5 is a side view of a coil according to the first embodiment.

【図6】第2実施形態例に係るコイルの平面図である。 6 is a plan view of a coil according to the second embodiment.

【図7】第3実施形態例に係るコイルの平面図である。 7 is a plan view of a coil according to the third embodiment.

【図8】第3実施形態例に係るコイルの側面図である。 8 is a side view of a coil according to the third embodiment.

【図9】本発明に係るICカード製造方法の第1例を示す断面図である。 It is a sectional view showing a first example of the IC card manufacturing method according to the present invention; FIG.

【図10】本発明に係るICカード製造方法の第2例を示す断面図である。 It is a sectional view showing a second example of the IC card manufacturing method according to the invention; FIG.

【図11】ICモジュールの構成例を示す平面図である。 11 is a plan view showing a configuration example of an IC module.

【図12】従来よりこの種の非接触式ICカードに搭載されているコイルの一例を示す平面図である。 12 is a plan view showing an example of a coil mounted conventionally in this type of non-contact type IC card.

【図13】図11に示したコイルの要部断面図である。 13 is a fragmentary cross-sectional view of the coil shown in FIG. 11.

【図14】被覆導線の断面図である。 14 is a cross-sectional view of a coated conductive wire.

【図15】従来例に係るICカードのコイル搭載面を示す平面図である。 15 is a plan view showing a coil mounting surface of the IC card according to a conventional example.

【図16】従来例に係るICカードの他のコイル搭載面を示す平面図である。 16 is a plan view showing another coil mounting surface of the IC card according to a conventional example.

【符号の説明】 DESCRIPTION OF SYMBOLS

10 コイル 11 接続部 12 巻線部 13 内部空間 14 単線部 15 固定部 16 マーカー 20 ICチップ 21 端子部 30a 第1基体 30b 第2基体 31 端子部 40,41 カバーシート 50 定盤 51 枠体 52,53 不織布 60 ICモジュール 101 導線 102 絶縁塗料 103 バインダ 104 被覆導線 10 coil 11 connecting portion 12 winding part 13 the inner space 14 single-wire portion 15 fixed portion 16 markers 20 IC chip 21 terminal portion 30a first base 30b second base 31 terminal portions 40 and 41 cover sheet 50 surface plate 51 frame body 52, 53 nonwoven 60 IC module 101 conductors 102 insulating coating 103 binder 104 coated conductive wire

Claims (10)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 基体上にICチップとリーダ・ライタ側に備えられたコイルと電磁結合するためのコイルとを搭載してなる非接触式ICカードにおいて、前記コイルとして、被覆導線を巻回した巻線コイルであって、その両端部が巻線部に固定され、当該巻線部より自由端となって突出する部分を除く前記被覆導線の一部に、前記基体に形成された回路パターン又は前記ICチップとの接続部が形成されたものを用いることを特徴とする非接触式ICカード。 1. A formed by mounting a coil to coil electromagnetically coupled provided in IC chip and the reader-writer on a substrate a non-contact IC card, as said coil, by winding a coated conductive wire a winding coil, both ends are fixed to the winding unit, a part of the coated conductive wire except a portion projecting free ends from the winding portion, the circuit pattern formed on the substrate or non-contact type IC card, characterized in that used as the connection portion between the IC chip is formed.
  2. 【請求項2】 請求項1に記載の非接触式ICカードにおいて、前記コイルとして、被覆導線を渦巻状に巻回し、巻線部の断面形状が扁平なリング状に形成された巻線コイルを用いたことを特徴とする非接触式ICカード。 2. A non-contact type IC card according to claim 1, as the coil, winding a coated conductive wire spirally winding coil cross section is formed into a flat ring-shaped winding unit non-contact type IC card characterized by using.
  3. 【請求項3】 請求項1又は2のいずれかに記載の非接触式ICカードにおいて、前記被覆導線の両端部が、前記巻線部と重なりあう方向に折り曲げられて当該巻線部を構成する複数の被覆導線に固定され、当該固定部の全部又は一部に前記接続部が形成されていることを特徴とする非接触式ICカード。 3. A non-contact type IC card according to claim 1 or 2, both end portions of the coated conductive wire constitutes the winding portion bent in a direction overlapping with the winding unit It is fixed to a plurality of insulated conductive wires, the non-contact type IC card, wherein the connecting portion to the whole or part of the fixed portion is formed.
  4. 【請求項4】 請求項1又は2のいずれかに記載の非接触式ICカードにおいて、前記被覆導線の両端側に、前記巻線部から離れて当該巻線部の内部空間を横断する単線部が形成され、その先端部が前記巻線部を構成する複数の被覆導線に固定され、前記単線部の一部に前記接続部が形成されていることを特徴とする非接触式ICカード。 4. A non-contact type IC card according to claim 1 or 2, at both ends of the coated conductive wire, solid wire portions crossing the internal space of the winding portion remote from the winding unit There is formed, is fixed to a plurality of insulated conductive wires whose tip constitutes the winding unit, the non-contact type IC card, wherein the connecting portion on a part of the single-wire portion.
  5. 【請求項5】 請求項1〜4のいずれかに記載の非接触式ICカードにおいて、前記接続部又はその近傍に、当該コイルを前記基体に形成された回路パターン又は前記ICチップと接続する際の位置決めに使用するマーカーが表示されていることを特徴とする非接触式ICカード。 5. A non-contact type IC card according to claim 1, wherein the connection portion or in the vicinity thereof, when the coil to be connected to the circuit pattern or the IC chip is formed on the substrate non-contact type IC card marker used to positioning is characterized in that it is displayed.
  6. 【請求項6】 請求項1〜5のいずれかに記載の非接触式ICカードにおいて、前記巻線部を構成する各被覆導線どうし、及び前記巻線部と前記被覆導線の両端部とが、バインダを介して互いに接着されていることを特徴とする非接触式ICカード。 6. The non-contact type IC card according to claim 1, each coated conductive wire each other to constitute the winding portion, and both end portions of the coated conductive wire and the winding unit, non-contact type IC card, characterized in that through the binder are bonded to each other.
  7. 【請求項7】 請求項1〜6のいずれかに記載の非接触式ICカードにおいて、前記コイル及びICチップが夫々単体で前記基体上に搭載され、前記基体に形成された回路パターンを介して接続されていることを特徴とする非接触式ICカード。 7. The non-contact type IC card according to claim 1, wherein the coil and the IC chip is mounted on said substrate at each alone, through a circuit pattern formed on the substrate non-contact type IC card, characterized in that it is connected.
  8. 【請求項8】 請求項1〜6のいずれかに記載の非接触式ICカードにおいて、前記コイルの接続部に前記IC 8. The non-contact IC card according to claim 1, wherein the IC to the connection portion of the coil
    チップを接続してなるICモジュールが前記基体上に搭載されていることを特徴とする非接触式ICカード。 Non-contact type IC card IC module formed by connecting the chip is characterized in that it is mounted on the substrate.
  9. 【請求項9】 請求項8に記載の非接触式ICカードにおいて、前記ICモジュールが前記基体とは異なるシート状部材に接着されてモジュール化されていることを特徴とする非接触式ICカード。 9. The non-contact IC card according to claim 8, the non-contact type IC card in which the IC module is characterized in that it is has been modularized bonded to different sheet-like member and the substrate.
  10. 【請求項10】 請求項9に記載の非接触式ICカードにおいて、前記シート状部材として、接着用樹脂の浸透性が高い不織布又は合成繊維のメッシュシートを用いたことを特徴とする非接触式ICカード。 10. A non-contact type IC card according to claim 9, as the sheet member, the non-contact type characterized by using a mesh sheet of high permeability of the adhesive resin nonwoven fabric or synthetic fibers IC card.
JP8325431A 1996-12-05 1996-12-05 Non-contact type ic card Withdrawn JPH10171954A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8325431A JPH10171954A (en) 1996-12-05 1996-12-05 Non-contact type ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8325431A JPH10171954A (en) 1996-12-05 1996-12-05 Non-contact type ic card

Publications (1)

Publication Number Publication Date
JPH10171954A true JPH10171954A (en) 1998-06-26

Family

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Application Number Title Priority Date Filing Date
JP8325431A Withdrawn JPH10171954A (en) 1996-12-05 1996-12-05 Non-contact type ic card

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JP (1) JPH10171954A (en)

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