JPH10171954A - Non-contact type ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact type IC card which is thin and has excellent productivity. SOLUTION: A coil and an IC chip are mounted on a substrate, and an IC card is formed by electrically connecting a connecting part of the coil to a circuit pattern that is formed on the substrate and a terminal part of the IC chip to the circuit pattern respectively. The coil 10 which is mounted on the IC card consists of a winding wire part 12 that is formed by winding a coated wire 104 in a curled way, single wire parts 14 that separate from the winding wire part and cross an internal space 13 and fixing parts 15 that overlap on plural coated wires which constitute the winding wire part, and a connecting part 11 is formed at a central part of the single wire part. Each coated wire 104 with each other is adhered with binder that is coated on the coated wire part. Also, a marker 16 for positioning can be shown on the part 11 or its adjacent part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic coupling type non-contact type IC card using a coil, and more particularly to a structure of a coil mounted on a base.

[0002]

2. Description of the Related Art Conventionally, an IC chip and a coil are mounted on a substrate, and power is received from a reader / writer and information is exchanged with the reader / writer using electromagnetic coupling between the coils. Various non-contact type IC cards have been proposed. This type of non-contact type IC card is used for storing personal information such as deposit information, insurance information, medical information, commuter pass information, driver's license information, identification information, etc., product management information in factories, and in the product distribution industry. It is used for storage of industrial information such as merchandise management information or the like, or its use is being studied.

FIG. 12 is a plan view showing an example of a coil conventionally mounted on a non-contact type IC card of this type.
3 is a cross-sectional view of a main part of the coil, and FIG. 14 is a cross-sectional view of a covered conductor forming the coil. As is clear from these figures, the coil 100 of the present example is configured such that a covered conductor 104 in which an insulating paint 102 and a binder 103 are double-coated is wound around a conductor 101 in a spiral shape, and the adjacent covered conductor 104 The space is bonded by a binder 103. Further, both ends 104a and 104b of the covered conductor 104 are bent toward the outer peripheral side of the spirally wound portion 105, and the spirally wound portion 10 is formed.
The insulating paint 102 and the binder 103 at the tips protruding outward from the outer periphery of 5 are peeled off to form the connection portions 106 where the conductive wires 101 are exposed.

[0005] As shown in FIG. 15, the coil 100 has a circuit pattern 111 formed on the surface of a base 110.
The connection portion 106 is mounted on the base 110 by electrically connecting the connection portion 106 to the terminal portion 111a, or the connection portion 106 is electrically connected to the terminal portion 121 of the IC chip 120 as shown in FIG. To the base 11
By mounting on the base 110, it is integrated with the base 110.

[0005]

However, in the conventional coil 100 shown in FIG. 12, the distal end of the insulated wire 104 on which the connecting portion 106 is formed is not fixed to the spirally wound portion 105, and is free. Because it is at the end,
6 is difficult to efficiently connect to the terminal section 111a of the circuit pattern 111 or the terminal section 121 of the IC chip 120, and the total cost of the IC card is high.

That is, if the distal end of the covered conductor 104 is a free end, it is easily deformed by receiving only a small external force. Also, the connecting portion 106 is likely to deviate from a required position in a transporting stage or an IC card assembling stage, and when connecting the circuit pattern 111 or the IC chip 120 to the coil 100, the connecting portion 106 is connected to the terminal portion 111a or 121. It becomes difficult to supply those arranged at intervals equal to the intervals. Therefore, before connecting the connecting portion 106 to the terminal portion 111a of the circuit pattern 111 or the terminal portion 121 of the IC chip 120, the tip of the covered conductor 104 on which the connecting portion 106 is formed is reshaped or covered. The connecting operation must be performed while correcting the distal end of the insulated wire 104 so that the distal end of the conductive wire 104 matches the terminal portion 111a or 121 to be connected, and the connection of the coil 100 becomes inefficient. The total cost of the IC card becomes expensive. In particular, thin IC
In the card, the inconvenience described above becomes more remarkable because the wire diameter of the coated conductive wire 104 used becomes thinner and the rigidity of the coil 100 further decreases.

The present invention has been made to solve such a problem, and an object of the present invention is to provide a non-contact type IC card which is thin and excellent in productivity.

[0008]

In order to solve the above-mentioned problems, the present invention provides a non-contact type in which an IC chip and a coil provided on a reader / writer side are mounted on a substrate and a coil for electromagnetic coupling is mounted. In the formula IC card, the coil is a wound coil in which a covered wire is wound, wherein both ends of the coil are fixed to a winding portion and a portion excluding a portion protruding from the winding portion as a free end is provided. A configuration in which a circuit pattern formed on the base or a connection portion with the IC chip is formed on a part of the conductive wire is used.

More specifically, both ends of the covered conductor are bent in a direction overlapping with the winding part and fixed to a plurality of covering conductors constituting the winding part. It is also possible to use a coil in which a connection portion is formed, or a single wire portion is formed at both ends of the covered conductor that is separated from the winding portion and crosses the internal space of the winding portion, and the tip portion is the winding portion. And a coil having a connection portion formed in a part of the single wire portion may be used. Since these coils are suitable for thin IC cards, it is particularly preferable to use a coil in which a covered conductor is spirally wound and the cross-sectional shape of a winding portion is formed in a flat ring shape.

As described above, when the both ends of the insulated wire are fixed to the winding portion and the connection portion is formed in a part of the insulated wire except a portion which is a free end and protrudes from the winding portion, the connection portion is formed. Since it is difficult for the forming part of the coil to be deformed by receiving an external force in the transporting step or the assembling step of the IC card, etc. Connection with the pattern or the IC chip can be easily and reliably performed, and the total cost of the IC card can be reduced.

[0011] A marker can be displayed on the coil or at or near the connection to facilitate positioning of the connection with the circuit pattern or IC chip during connection. In addition, in order to improve the handleability of the coil, it is preferable that each of the coated conductors constituting the winding portion, and the winding portion and both ends of the coated conductor are bonded to each other via a binder. it can.

On the other hand, as the mounting structure of the coil and the IC chip on the base, each of these mounted components can be mounted on the base alone and connected via a circuit pattern formed on the base. Then, an IC module in which the IC chip is connected to the connection portion of the coil can be mounted on the base. Further, the coil and the IC chip may be bonded to a common sheet-shaped member different from the base to form a module, and the modularized coil and IC chip may be mounted on the base. In this case, it is preferable to use a sheet having a high permeability of an adhesive resin, for example, a nonwoven fabric or a mesh sheet of a synthetic fiber, in order to enhance the adhesiveness to the substrate and prevent interfacial peeling.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a non-contact IC according to the present invention
A configuration example of the card will be described with reference to FIGS. 1 is a sectional view of a non-contact type IC card according to the first embodiment, FIG. 2 is a cross-sectional view of a non-contact type IC card according to the second embodiment, and FIG. 3 is a non-contact type according to the third embodiment. It is sectional drawing of a formula IC card.

As shown in FIG. 1, the non-contact type IC card according to the first embodiment has a coil 10 and an IC 10 on a circuit pattern forming surface of a first base 30a on which a circuit pattern 31 is formed.
The C chip 20 is mounted, and the connection part 11 of the coil 10 and the terminal part 31a of the circuit pattern 31 and the terminal part 21 of the IC chip 20 and the terminal part 31b of the circuit pattern 31 are electrically connected respectively. The component mounting surface of the first base 30a is covered with a second base 30b, and the front and back surfaces of the first base 30a and the second base 30b are
Cover sheets 40 and 41 are attached.

A non-contact type IC according to the second embodiment.
In the card, as shown in FIG. 2, a substrate 32 on which an electrically connected coil 10 and an IC chip 20 are mounted is sandwiched between a first base 30a and a second base 30b. The cover sheets 40 and 41 are attached to the front and back surfaces of the second base 30b. In addition,
The substrate 32 can be formed using any material as long as it can stably hold the mounted components.
In order to prevent interfacial separation between the base 30a and the second base 30b, it is preferable to use a resin-permeable sheet, such as a nonwoven fabric or a synthetic fiber mesh sheet, which can penetrate the bonding resin.

A non-contact type IC according to the third embodiment.
As shown in FIG. 3, the card 10 includes a coil 10 and an IC chip 20 which are electrically connected to each other.
The first base 30 is sandwiched by the base 30b.
a and cover sheets 40 on both sides of the second base 30b.
41 are attached.

As the material forming the first base 30a and the second base 30b, any material can be used as long as it can stably hold the mounted components, but an IC card having a predetermined shape and a predetermined structure can be used. Because it can be manufactured with high efficiency, for example, a non-woven fabric impregnated with a thermosetting resin,
It is particularly preferable to use a thermocompression bonded body of a woven fabric, a knitted fabric or a nonwoven fabric having thermocompression bonding properties. In addition, a plastic sheet can be used as the first base 30a, and a package resin that covers the component mounting surface of the first base 30a can be used as the second base 30b. Further, the periphery of each electrical connection portion can be fixed with a mold resin for preventing disconnection.

In the case where a flexible material is used in the assembling process of the mounted components, such as a thermocompression-bonded woven fabric, knitted fabric or non-woven fabric having a thermocompression bonding property,
Since the mounted components can be embedded in one base, the second base 30b can be omitted. Also, both or one of the cover sheets 40 and 41 can be omitted as necessary.

As a method for connecting the coil 10 and the circuit pattern 31 in the non-contact type IC card according to the first embodiment, soldering or ultrasonic fusion welding can be used. Also,
IC in the non-contact type IC card according to the first embodiment
The connection method between the chip 20 and the circuit pattern 31 is as follows.
The IC chip 20 is attached to the first base 30a by the face-up method.
For IC cards of the type to be mounted on the top, wire bonding connection, face-down IC chip 20
The direct connection using a conductive paste, an anisotropic conductive film, or the like can be used for an IC card of a type in which is mounted on the first base 30a. Furthermore, as a method for connecting the coil 10 and the IC chip 20 in the non-contact type IC cards according to the second and third embodiments, soldering or ultrasonic fusion welding can be used.

Next, an example of the configuration of the coil 10 according to the present invention will be described with reference to FIGS. 4 is a plan view of the coil according to the first embodiment, FIG. 5 is a side view of the coil according to the first embodiment, FIG. 6 is a plan view of the coil according to the second embodiment, and FIG. FIG. 8 is a plan view of the coil according to the embodiment, and FIG. 8 is a side view of the coil according to the third embodiment. In addition, as a covered conductor which is a material of the coil 10,
As with the conventional coil, an insulating paint 1
02 and the binder 103 are coated twice.
00 (see FIG. 14).

The coil 10 according to the first embodiment is shown in FIG.
As shown in FIG. 5, a flat elliptical ring-shaped winding portion 12 formed by spirally winding the covered conductor 104, and the inside of the winding portion 12 apart from the winding portion 12. The fixed portion 1 that is overlapped with the single wire portion 14 that traverses the space 13 and the plurality of covered wires 104 that constitute the winding portion 12
The connecting portion 11 formed by exposing the insulating paint 102 and the binder 103 and exposing the conductive wire 101 is provided at the central portion of the single wire portion 14. Insulated wire 10 adjacent to winding portion 12
The four covered wires 104 overlapped with each other at the fixing portion 15 are bonded by a binder 103 covered by the covered wire 104. In addition, the connection part 11
Can be coated with solder. In addition, a marker 16 for facilitating the positioning of the connection portion 11 with respect to the terminal portion 31a of the circuit pattern 31 or the terminal portion 21 of the IC chip 20 is provided on the connection portion 11 or in the vicinity thereof.
Can be displayed using colored ink or the like.

The coil 10 according to the second embodiment is shown in FIG.
As shown in (1), a plurality of single wires 14 and fixing portions 15 are formed at both ends of the covered conductor 104, respectively. The other parts are the same as those of the coil according to the first embodiment, so that the description will be omitted to avoid duplication.

The coil 10 according to the third embodiment is shown in FIG.
As shown in FIG. 8, a flat elliptical ring-shaped winding portion 12 formed by spirally winding a covered conductor 104, and both ends thereof are folded back on the upper surface side of the winding portion 12 and fixed. And the fixing portion 15
Next, the connecting portion 11 formed by exfoliating the insulating paint 102 and the binder 103 and exposing the conductive wire 101 is formed.
Is provided. The other parts are the same as those of the coil according to the first embodiment, so that the description will be omitted to avoid duplication.

As described above, when the both ends of the insulated wire 104 are fixed to the winding portion 12 and the connecting portion 11 is formed on the fixing portion 15 or the single wire portion 14, the connecting portion 11 is moved in the transport stage or at the I-stage.
Since it is difficult to be deformed even when an external force is applied in a C card assembling stage or the like, by positioning the connecting portion 11 with high precision in the manufacturing stage of the coil 10, the connecting portion 11
And the circuit pattern 31 or the IC chip 20 can be easily and reliably connected, and the total cost of the IC card can be reduced.

In each of the above embodiments, only the elliptical coil has been described as an example. However, the winding shape of the coil 10 is not limited to this, and may be wound into any other shape. Of course, it can be turned.

Hereinafter, a method for manufacturing an IC card according to the present invention will be described.

<First Example of Manufacturing Method> A first example of the manufacturing method relates to the method of manufacturing the IC card according to the first embodiment. First, as shown in FIG. 9, a frame 51 having a predetermined shape and a predetermined size is placed on a surface plate 50, and the lower cover sheet 40 is stored in the frame 51. This lower cover sheet 4
On the first substrate 30a on which the circuit pattern 31 is formed.
Is stored with the circuit pattern 31 facing upward. The coils 10 and I
The C chip 20 is positioned and mounted, and the connection between the coil 10 and the circuit pattern 31 and the connection between the IC chip 20 and the circuit pattern 31 are performed by the connection method described above. Next, the nonwoven fabric 53 serving as the base of the second base 30b is stacked from above the coil 10 and the IC chip 20. Next, after filling the bonding resin into the frame body 51, the second
The upper cover sheet 41 is stacked on the nonwoven fabric 53 on which the base 30b is based. Then, a compression plate 54 larger than the frame 51 is pressed against the upper surface of the frame 51 to spread the resin over the entire frame 51 and discharge excess resin. Thereafter, the nonwoven fabrics 52 and 53 are thermocompression-bonded, and the frame 5
A thermocompression-bonded body having the same shape as the inner surface shape of 1 is manufactured. Finally, the peripheral portion of the thermocompression bonding body is cut to obtain an IC card having a predetermined size. In this example, for ease of explanation, a case where one IC card is manufactured one by one has been described as an example. However, by increasing the size of the frame 51, a large number of IC cards can be obtained. It is of course possible to do so.

<Second Example of Manufacturing Method> A second example of the manufacturing method relates to the method of manufacturing an IC card according to the second embodiment. First, the coil 10 and the IC chip 20 that are electrically connected are mounted on a substrate 32 formed using a resin permeable sheet such as a mesh sheet of a nonwoven fabric or a synthetic fiber, and the IC module 60 is manufactured. Then, FIG.
As shown in the figure, a frame 51 having a predetermined shape and a predetermined size is placed on the surface plate 50, and the lower cover sheet 40 is placed in the frame 51.
To store. On the lower cover sheet 40, the first base 3
0a and the IC module 6
0 and the nonwoven fabric 53 that forms the base of the second base 30b are stacked in this order. Next, after filling the bonding resin into the frame 51, the nonwoven fabric 5 serving as the base of the second base 30b is formed.
3 and the upper cover sheet 41 is stacked. Then, a compression plate 54 larger than the frame 51 is pressed against the upper surface of the frame 51 to spread the resin over the entire frame 51 and discharge excess resin. Thereafter, the nonwoven fabric 52,
53 is thermocompression-bonded to produce a thermocompression-bonded body having the same shape as the inner surface of the frame 51. Finally, the peripheral portion of the thermocompression bonding body is cut to obtain an IC card having a predetermined size. Also in the IC card manufacturing method of the present example, a large number of IC cards can be obtained by enlarging the frame body 51. Also, the IC module 60 does not necessarily need to be manufactured individually. As shown in FIG. 11, the coil 1 electrically connected to the ribbon-shaped long substrate 32
It is also possible to prepare a device having the IC chip 20 mounted at equal intervals and wind it in a hoop shape, cut out the end portion to a required length while sequentially feeding it out, and use it. According to this method, the production of the IC card can be made more efficient. Also, the IC card according to the third embodiment can be manufactured by applying the manufacturing method of FIG.

[0029]

As described above, according to the present invention,
Both ends of the insulated wire are fixed to the winding portion, and the connection portion is formed in a part of the insulated wire excluding a portion that is a free end and protrudes from the winding portion. I
It is hard to be deformed by receiving external force at the stage of assembling the C card. Therefore, by positioning and forming the connecting portion with high precision in the coil manufacturing stage, the connecting portion and the circuit pattern or the IC chip can be easily and reliably connected, and the total cost of the IC card is reduced. Can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view of a non-contact type IC card according to a first embodiment.

FIG. 2 is a sectional view of a non-contact type IC card according to a second embodiment.

FIG. 3 is a sectional view of a non-contact type IC card according to a third embodiment.

FIG. 4 is a plan view of a coil according to the first embodiment.

FIG. 5 is a side view of the coil according to the first embodiment.

FIG. 6 is a plan view of a coil according to a second embodiment.

FIG. 7 is a plan view of a coil according to a third embodiment.

FIG. 8 is a side view of a coil according to a third embodiment.

FIG. 9 is a sectional view showing a first example of the IC card manufacturing method according to the present invention.

FIG. 10 is a sectional view showing a second example of the IC card manufacturing method according to the present invention.

FIG. 11 is a plan view showing a configuration example of an IC module.

FIG. 12 is a plan view showing an example of a coil conventionally mounted on a non-contact type IC card of this type.

FIG. 13 is a sectional view of a main part of the coil shown in FIG. 11;

FIG. 14 is a cross-sectional view of a covered conductor.

FIG. 15 is a plan view showing a coil mounting surface of an IC card according to a conventional example.

FIG. 16 is a plan view showing another coil mounting surface of the IC card according to the conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Coil 11 Connection part 12 Winding part 13 Internal space 14 Single wire part 15 Fixed part 16 Marker 20 IC chip 21 Terminal part 30a First base 30b Second base 31 Terminal part 40, 41 Cover sheet 50 Surface plate 51 Frame 52, 53 Nonwoven fabric 60 IC module 101 Conductor 102 Insulating paint 103 Binder 104 Coated conductor

Claims (10)

[Claims] 1. A non-contact type IC card in which an IC chip, a coil provided on a reader / writer side, and a coil for electromagnetic coupling are mounted on a base, a covered conductive wire is wound as the coil. A wound coil, both ends of which are fixed to the winding portion, a part of the covered conductor except for a portion protruding as a free end from the winding portion, a circuit pattern formed on the base, or A non-contact type IC card characterized in that a connection portion with the IC chip is formed. 2. The non-contact type IC card according to claim 1, wherein the coil is a wound coil in which a covered conductor is spirally wound and a cross section of a winding portion is formed in a flat ring shape. A non-contact type IC card, characterized by being used. 3. The non-contact type IC card according to claim 1, wherein both ends of the covered conductor are bent in a direction overlapping with the winding to constitute the winding. A non-contact type IC card which is fixed to a plurality of covered conductors, and wherein the connection portion is formed on all or a part of the fixing portion. 4. The non-contact type IC card according to claim 1, wherein a single wire portion which is separated from the winding portion and traverses an internal space of the winding portion at both ends of the coated conductor. Wherein the leading end is fixed to a plurality of covered conductors constituting the winding portion, and the connection portion is formed in a part of the single wire portion. 5. The non-contact type IC card according to claim 1, wherein said coil is connected to a circuit pattern formed on said base or said IC chip at or near said connection portion. A non-contact type IC card characterized by displaying a marker used for positioning. 6. The non-contact type IC card according to claim 1, wherein each of the covered conductors constituting the winding portion, and both ends of the winding portion and the covered conductor are: A non-contact type IC card which is adhered to each other via a binder. 7. The non-contact type IC card according to claim 1, wherein the coil and the IC chip are individually mounted on the base and via a circuit pattern formed on the base. A non-contact type IC card which is connected. 8. The non-contact IC card according to claim 1, wherein said IC is connected to a connection portion of said coil.
A non-contact type IC card, wherein an IC module formed by connecting chips is mounted on the base. 9. The non-contact type IC card according to claim 8, wherein the IC module is adhered to a sheet-like member different from the base to form a module. 10. The non-contact type IC card according to claim 9, wherein a non-woven fabric or a synthetic fiber mesh sheet having a high permeability of an adhesive resin is used as the sheet-shaped member. IC card.